IGBT module
By using terminal CLIP parts in the IGBT module to electrically connect multiple external terminals at the same time and enhance heat dissipation capabilities, the problem of existing IGBT modules being easily damaged during high current driving is solved, and stable signal transmission and reliable connection are achieved.
Patent Information
- Application Number
- CN202421589501.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-05
- Publication Date
- 2025-05-16
- Estimated Expiration
- 2034-07-05
AI Technical Summary
When driving at high current, existing IGBT modules are easily damaged by a large amount of heat generated at the electrical connection parts, and the connection between the external terminals and the IGBT power unit is prone to problems such as false welding and missing welding, resulting in failure of some external terminals.
An IGBT module is designed, using a terminal CLIP piece to electrically connect multiple external terminals at the same time, and a terminal CLIP piece formed by bent rectangular copper sheets to ensure stable transmission of electrical signals and increase heat dissipation capabilities.
The chip electrode signal is stable to the external terminal, which enhances the heat dissipation ability, avoids damage to the IGBT module due to heat accumulation, and improves the reliability of the connection.
Smart Images
Figure CN222883535U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of semiconductors, in particular to an IGBT module. Background Art
[0002] IGBT (Insulated Gate Bipolar Transistor), an insulated gate bipolar transistor, is a composite fully controlled voltage-driven power semiconductor device composed of a bipolar junction transistor (BJT) and an insulated gate field effect transistor (MOS). It has the advantages of high input impedance of a metal-oxide-semiconductor field-effect transistor (MOSFET) and low on-state voltage drop of a power transistor (Giant Transistor, GTR). GTR has a low saturation voltage drop and a large current density, but a large drive current; MOSFET has a very small drive power and a fast switching speed, but a large on-state voltage drop and a small current density. IGBT combines the advantages of the above two devices, with low drive power and low saturation voltage drop. It is very suitable for use in converter systems with a DC voltage of 600V and above, such as AC motors, inverters, switching power supplies, lighting circuits, traction drives, and other fields.
[0003] The IGBT module includes an IGBT chip and an FRD diode chip, and the IGBT power module generally welds the IGBT chip and the diode chip on a heat dissipation substrate with a circuit, and then electrically connects the chip electrodes and the corresponding conductive structures on the circuit through bonding wires or bridge components such as CLIP.
[0004] For high-current IGBT devices, the IGBT power unit inside generally has multiple IGBT chips and multiple RFD chips. For this purpose, a temperature sensor is generally provided for temperature control. In such IGBT devices, in order to facilitate heat dissipation, the external terminal is generally provided on the outside of the IGBT power unit and has a certain distance from the IGBT power unit. In order to facilitate the connection between the external terminal and the IGBT power unit, a special electrical connector is often required to be welded to the external terminal and the conductive sheet of the IGBT power unit respectively, so as to electrically connect the external terminal and the conductive sheet of the IGBT power unit together. However, such electrical connectors connecting the external terminal and the IGBT power unit are often one external terminal corresponding to one electrical connector. When problems such as cold welding and leaking welding occur between the conductive sheet of the IGBT power unit and the electrical connector, some external terminals are often rendered ineffective. Moreover, since the current flowing through some external terminals is relatively large, it is easy to generate a large amount of heat at the electrical connector, causing damage to the IGBT power unit.
[0005] Therefore, there is an urgent need for an IGBT module that can solve the above problems. Utility Model Content
[0006] The utility model aims to provide an IGBT module, which can stably transmit the electrode signal of the chip to the external terminal and has good heat dissipation capability to prevent the IGBT module from being damaged when driven by a large current.
[0007] In order to achieve the above-mentioned purpose, the utility model provides an IGBT module, comprising a shell, external terminals mounted on a frame around the shell, a heat sink mounted in a cavity of the shell, a conductive sheet laid on the heat sink, a chipset welded on the conductive sheet, a CLIP connection structure electrically connecting the conductive sheet and the chipset, and a terminal CLIP member electrically connecting the external terminals and the conductive sheet; the ends of the external terminals extend into the cavity of the shell and form terminal welding sheets, and the conductive sheets are provided with terminal welding areas opposite to each of the external terminals along the front-back or left-right direction; the The terminal CLIP piece is arranged along the front and back or left and right, and its front end is welded to the terminal welding piece of the external terminal, and the rear end is welded to the terminal welding area; at least one of the conductive sheets has multiple terminal welding areas adjacent to each other, and the multiple external terminals corresponding to the multiple terminal welding areas adjacent to each other on the same conductive sheet are called an external terminal group, one external terminal group corresponds to one terminal CLIP piece, and the front end of the terminal CLIP piece is welded to the terminal welding piece of each external terminal in the external terminal group, and the rear end is bent and extended to the terminal welding area and welded to the terminal welding area.
[0008] Preferably, the terminal CLIP piece is formed by bending a rectangular copper sheet, the front end width of the terminal CLIP piece matches the arrangement width of the multiple terminal welding pieces in the external terminal group, and the end end width matches the arrangement width of multiple terminal welding areas located on the same conductive sheet and adjacent to each other.
[0009] Preferably, one of the external terminal groups has two or three external terminals.
[0010] Preferably, the conductive sheet includes a first conductive sheet, a second conductive sheet, a third conductive sheet, a fourth conductive sheet and a fifth conductive sheet, the second conductive sheet, the third conductive sheet, the fourth conductive sheet and the fifth conductive sheet are arranged in sequence from front to back to form a first area, the first conductive sheet is located on the left side of the first area, and the chip group includes three first IGBT chips and three first FRD chips welded in sequence on the first conductive sheet along the front-to-back direction, a second IGBT chip and a second FRD chip welded in sequence on the second conductive sheet and the third conductive sheet along the front-to-back direction, and a third IGBT chip and a third FRD chip welded in sequence on the fifth conductive sheet along the left-to-right direction.
[0011] Preferably, the second IGBT chip and the second FRD chip in the first region are arranged alternately, the first IGBT chip and the first FRD chip on the first conductive sheet are arranged alternately, and the second IGBT chip in the first region corresponds to the first FRD chip on the first conductive sheet in the left-right direction, and the second FRD chip in the first region corresponds to the first IGBT chip on the first conductive sheet in the left-right direction. This solution balances heat distribution and increases heat dissipation capacity.
[0012] Specifically, the conductive sheet also includes a signal conductive sheet located in a second area on a side of the first conductive sheet away from the first area and having a terminal welding area, and a signal conductive sheet located in a third area on a side of the first area away from the first conductive sheet and having a terminal welding area. The CLIP connection structure includes a first CLIP component and a second CLIP component. One end of the first CLIP component is welded to the E pole of the first IGBT chip, the second IGBT chip or the third IGBT chip, and the other end is welded to the first area or the third area or the fourth conductive sheet; one end of the second CLIP component is welded to the E pole of the first IGBT chip, the second IGBT chip or the third IGBT chip, and the other end is welded to the first area or the third area or the fourth conductive sheet.
[0013] Specifically, the CLIP connection structure includes a third CLIP component, which has three first welding parts arranged along the left-right direction and a first connecting bridge connected between two adjacent first welding parts, and the three first welding parts are respectively welded to the conductive sheet in the first area, the positive electrode of the first FRD chip and the signal conductive sheet in the second area.
[0014] Specifically, the conductive sheet also includes a signal conductive sheet located in a second area on a side of the first conductive sheet away from the first area and having a terminal welding area. The CLIP connection structure includes a fourth CLIP component and a fifth CLIP component. The two ends of the fourth CLIP component are respectively welded to the conductive sheet in the first area and an electrode of the first FRD chip. The fifth CLIP component spans the fourth CLIP component and its two ends are respectively welded to the conductive sheet in the first area and the signal conductive sheet in the second area. The bridging structure of the fourth CLIP component and the fifth CLIP component saves space and prevents cold soldering.
[0015] Preferably, the conductive sheet includes a sixth conductive sheet, a seventh conductive sheet, an eighth conductive sheet and a ninth conductive sheet, the seventh conductive sheet, the eighth conductive sheet and the ninth conductive sheet are arranged in sequence from front to back to form a fourth region, the sixth conductive sheet is located on the right side of the fourth region, the sixth conductive sheet and the fourth region are located in front of the first conductive sheet and the first region, the chip group includes three fourth FRD chips welded on the seventh conductive sheet, the eighth conductive sheet and the ninth conductive sheet in sequence along the front-to-back direction, and three fifth FRD chips welded on the sixth conductive sheet in sequence along the front-to-back direction and opposite to the three fourth FRD chips; the CLIP connection structure includes a sixth CLIP piece corresponding to the fourth FRD chip, and two ends of each of the sixth CLIP pieces are respectively welded to the electrode of the fourth FRD chip and the conductive sheet corresponding to the fourth region.
[0016] Specifically, the conductive sheet also includes a tenth conductive sheet and an eleventh conductive sheet having terminal welding areas, the tenth conductive sheet is located on the front side of the seventh conductive sheet, and the eleventh conductive sheet is integrally connected to the sixth conductive sheet and is located on the right side of the tenth conductive sheet; the CLIP connection structure also includes a seventh CLIP component, the seventh CLIP component has four second welding portions arranged along the front-to-back direction and a second connecting bridge connected between two adjacent second welding portions, and the four second welding portions are sequentially welded to the tenth conductive sheet and the electrodes of the three fifth FRD chips.
[0017] Preferably, the IGBT module further comprises a thermistor welded on the conductive sheet, and the conductive sheet welded with the thermistor is bent and extended toward a direction corresponding to the external terminal to form the terminal welding area.
[0018] Compared with the prior art, the terminal CLIP component of the utility model electrically connects multiple external terminals at the same time, and its width corresponds to the width of multiple external terminals. It can not only stably transmit the electrode signal of the chip to the external terminal, but also has excellent heat dissipation capacity, preventing a large amount of heat from being generated when a large current flows through the external terminal to damage the IGBT module. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a three-dimensional diagram of the IGBT module of the utility model with the upper cover opened.
[0020] Figure 2 yes Figure 1 A cross-sectional view at an angle.
[0021] Figure 3 yes Figure 1 A cross-sectional view from another angle.
[0022] Figure 4 yes Figure 1 Enlarged view of part a.
[0023] Figure 5 yes Figure 1 Enlarged view of part b.
[0024] Figure 6 It is a structural diagram of a chip set welded on a heat sink plate provided with a conductive sheet according to the utility model.
[0025] Figure 7 It is a structural diagram of a circuit board composed of a heat dissipation plate and a conductive sheet of the utility model. DETAILED DESCRIPTION
[0026] In order to explain the technical content, structural features, achieved objectives and effects of the present invention in detail, the following is a detailed description in conjunction with the implementation modes and the accompanying drawings.
[0027] refer to Figures 1 to 4 The utility model provides an IGBT module 100, comprising a housing 10, a heat sink 14 (such as Figure 3 As shown), a conductive sheet 20 laid on the heat sink 14, a chipset 50 welded on the conductive sheet 20, a CLIP connection structure 30 electrically connecting the conductive sheet 20 and the chipset 50, an external terminal 13, and a terminal CLIP part 61 electrically connecting the external terminal 13 and the conductive sheet 20, the external terminal 13 is installed on the surrounding frame of the shell 10 and its end extends into the cavity to form a terminal welding sheet 131.
[0028] refer to Figure 6 and Figure 7The conductive sheet 20 is formed with a terminal welding area 201 which is opposite to each of the external terminals 13 along the front and rear or left and right directions. Figures 1 to 4 The terminal CLIP piece 61 is arranged front to back or left to right, and its end is welded to the terminal welding area 201 and its front end is welded to the terminal welding piece 131 of the external terminal 13 .
[0029] At least one of the conductive sheets 20 has a plurality of adjacent terminal welding areas 201 (see Figure 6 The tenth conductive sheet 71 and the eleventh conductive sheet 72 in the conductive sheet 20 are respectively provided as the tenth conductive sheet 71 and the eleventh conductive sheet 72 in the conductive sheet 20, and the plurality of external terminals 13 corresponding to the plurality of terminal welding areas 201 located on the same conductive sheet 20 and adjacent to each other are referred to as an external terminal group. One external terminal group corresponds to one terminal CLIP piece 61. The width of the front end 611 of the terminal CLIP piece 61 matches the arrangement width of the plurality of terminal welding pieces 131 in the corresponding group of the external terminal group and is welded to the terminal welding piece 131 of each of the external terminals in the corresponding external terminal group. The end is bent and extended to the terminal welding area 201. The width of the end matches the arrangement width of the plurality of terminal welding areas 201 located on the same conductive sheet 20 and adjacent to each other and is welded to the plurality of terminal welding areas 201 at the same time. In this embodiment, the terminal CLIP piece 61 is formed by bending a rectangular copper sheet.
[0030] Among them, reference Figure 1 The width of the front end 611 of the terminal CLIP piece 61 matches the width of the corresponding group of external terminals, which means that the width of the front end 611 of the terminal CLIP piece 61 is greater than a preset value so that the front end 611 of the terminal CLIP piece 61 can be welded to most areas of the terminal welding pieces 131 of all the external terminals 13 in the external terminal group at the same time. Figure 1 and Figure 2 In this embodiment, the external terminal group corresponding to one of the terminal CLIP pieces 61 has two or three external terminals 13 .
[0031] refer to Figure 7The conductive sheet 20 includes a first conductive sheet 21, a second conductive sheet 22, a third conductive sheet 23, a fourth conductive sheet 24 and a fifth conductive sheet 25, wherein the second conductive sheet 22, the third conductive sheet 23, the fourth conductive sheet 24 and the fifth conductive sheet 25 are arranged from front to back to form a first region 301, and the first conductive sheet 21 is located on the left side of the first region 301. The chip group 50 includes three first IGBT chips 511 and three first FRD chips 521 soldered sequentially on the first conductive sheet 21 in the front-to-back direction, a second IGBT chip 512 and a second FRD chip 522 soldered sequentially on the second conductive sheet 22 and the third conductive sheet 23 in the front-to-back direction, and a third IGBT chip 513 and a third FRD chip 523 soldered sequentially on the fifth conductive sheet 25 in the left-to-right direction.
[0032] Preferably, the second IGBT chip 512 and the second FRD chip 522 of the first region 301 are alternately arranged, the first IGBT chip 511 and the first FRD chip 521 on the first conductive sheet 21 are alternately arranged, and the second IGBT chip 512 of the first region corresponds to the first FRD chip 521 on the first conductive sheet 21 in the left-right direction, and the second FRD chip 522 of the first region 301 corresponds to the first IGBT chip 511 on the first conductive sheet 21 in the left-right direction.
[0033] refer to Figure 7 The conductive sheet 20 also includes a signal conductive sheet 621 located in the second area 302 on the side of the first conductive sheet 21 away from the first area 301 and having a terminal welding area 201, and a signal conductive sheet 622 located in the third area 303 on the side of the first area 301 away from the first conductive sheet 21 and having a terminal welding area 201.
[0034] refer to Figure 5 The CLIP connection structure 30 includes a first CLIP component 31 and a second CLIP component 32 .
[0035] refer to Figure 5 Part of the first CLIP parts 31 are arranged along the left-right direction and their two ends are respectively welded on the E pole of the first IGBT chip 511 and the signal conductive sheet 621 of the second region 302; part of the second CLIP parts 32 are arranged along the left-right direction and their two ends are respectively welded on the G pole of the first IGBT chip 511 and the signal conductive sheet 621 of the second region 302.
[0036] refer to Figure 5Part of the first CLIP component 31 is arranged along the left-right direction and its two ends are respectively welded to the E pole of the second IGBT chip 512 and the signal conductive sheet 622 of the third region 303, and part of the second CLIP component 32 is arranged along the left-right direction and its two ends are respectively welded to the G pole of the second IGBT chip 512 and the signal conductive sheet 622 of the third region 303.
[0037] refer to Figure 5 Part of the first CLIP piece 31 is arranged along the front-to-back direction and its two ends are respectively welded on the E pole of the third IGBT chip 513 and the fourth conductive sheet 24, and part of the second CLIP piece 32 is arranged along the front-to-back direction and its two ends are respectively welded on the G pole of the third IGBT chip 513 and the fourth conductive sheet 24.
[0038] refer to Figure 5 The conductive sheet 20 also includes a signal conductive sheet 621 located in the second area 302 on the side of the first conductive sheet 21 away from the first area 301 and having a terminal welding area 201. The CLIP connection structure 30 includes a third CLIP component 33. The third CLIP component 33 has three first welding portions 331 arranged along the left-right direction and a first connecting bridge 332 connected between two adjacent first welding portions 331. The three first welding portions 331 are respectively welded to the second conductive sheet 22, an electrode of the first FRD chip 521 and the signal conductive sheet 621 in the second area 302.
[0039] refer to Figure 3 and Figure 5 The conductive sheet 20 further includes a signal conductive sheet 621 located in a second region 302 on a side of the first conductive sheet 21 away from the first region 301 and having a terminal welding area 201. The CLIP connection structure 30 includes a fourth CLIP component 34 and a fifth CLIP component 36. The two ends of the fourth CLIP component 34 are respectively welded between the third conductive sheet 23 and the positive electrode of the first FRD chip 521. The fifth CLIP component 36 spans the fourth CLIP component 34 and its two ends are respectively welded to the third conductive sheet 23 and the signal conductive sheet 621 in the second region 302. The bridging structure of the fourth CLIP component 34 and the fifth CLIP component 36 saves space and prevents cold soldering.
[0040] refer to Figure 1 and Figure 4The CLIP connection structure 30 includes an eighth CLIP component 38, and two ends of a portion of the eighth CLIP component 38 are respectively welded to the electrode of the second FRD chip 522 and the signal conductive sheet 622 of the third region 303. Two ends of a portion of the eighth CLIP component 38 are respectively welded to the fourth conductive sheet 24 and the electrode of the third FRD chip 523. Two ends of a portion of the eighth CLIP component 38 are respectively welded between the first FRD chip 521 and the fifth conductive sheet 25.
[0041] refer to Figure 4 The conductive sheet 20 includes a sixth conductive sheet 26, a seventh conductive sheet 27, an eighth conductive sheet 28 and a ninth conductive sheet 29, and the seventh conductive sheet 27, the eighth conductive sheet 28 and the ninth conductive sheet 29 are arranged in the front-to-back direction to form a fourth region 304, the sixth conductive sheet 26 is located on the right side of the fourth region 304, and the sixth conductive sheet 26 and the fourth region 304 are located in front of the first conductive sheet 21 and the first region 301. The chip group 50 includes three fourth FRD chips 524 welded on the conductive sheet (seventh conductive sheet 27, eighth conductive sheet 28 or ninth conductive sheet 29) of the fourth region 304 in sequence in the front-to-back direction, and three fifth FRD chips 525 welded on the sixth conductive sheet 26 in sequence in the front-to-back direction and opposite to the three fourth FRD chips 524. The CLIP connection structure 30 includes three sixth CLIP parts 36 corresponding to the fourth FRD chip 524, and both ends of each of the sixth CLIP parts 36 are welded to the electrodes of the fourth FRD chip 524 and the conductive sheet (the seventh conductive sheet 27, the eighth conductive sheet 28 or the ninth conductive sheet 29) corresponding to the fourth region 304.
[0042] refer to Figure 4 The conductive sheet 20 also includes a tenth conductive sheet 71 and an eleventh conductive sheet 72 having a terminal welding area 201, the tenth conductive sheet 71 is located on the front side of the seventh conductive sheet 27, and the eleventh conductive sheet 72 is integrally connected with the sixth conductive sheet 26 and is located on the right side of the tenth conductive sheet 71; the CLIP connection structure 30 also includes a seventh CLIP component 37, and the seventh CLIP component 37 has four second welding portions 371 arranged along the front-to-back direction and a second connecting bridge 372 connected between two adjacent second welding portions 371, and the four second welding portions 371 are sequentially welded to the tenth conductive sheet 71 and the electrodes of the three fifth FRD chips 525.
[0043] refer to Figure 4The conductive sheet 20 further includes a twelfth conductive sheet 73 and a thirteenth conductive sheet 74 having a terminal welding area 201. The twelfth conductive sheet 73 is located in front of the thirteenth conductive sheet 74, and the thirteenth conductive sheet 74 is located in front of the first region 301. The twelfth conductive sheet 73 and the thirteenth conductive sheet 74 are located on the right side of the sixth conductive sheet 26. The thirteenth conductive sheet 74 is integrally connected to the first conductive sheet 21. The chip set includes a sixth IGBT chip 516 and a sixth FRD chip 526 welded on the twelfth conductive sheet 73, and two ends of an eighth CLP component 38 are respectively welded on electrodes of the twelfth conductive sheet 73 and the sixth FRD chip 526. A first CLIP component 31 is arranged in the front-to-back direction and its two ends are respectively welded on the E pole of the sixth IGBT chip 516 and the signal conductive sheet 623 on the side of the twelfth conductive sheet 73 away from the sixth conductive sheet 26. A second CLIP component 32 is arranged in the front-to-back direction and its two ends are respectively welded on the G pole of the sixth IGBT chip 516 and the signal conductive sheet 624.
[0044] refer to Figure 6 The IGBT module 100 further includes a thermistor 33 welded on the conductive sheet 63 , and the conductive sheet 63 welded with the thermistor 33 is bent and extended toward the direction corresponding to the external terminal 13 to form the terminal welding area 201 .
[0045] The up and down, left and right in this application are relative position relationships, not absolute position relationships. The FRD chip is a diode chip with fast recovery characteristics.
[0046] The above disclosure is only the preferred embodiment of the present invention, which certainly cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made according to the scope of the patent application of the present invention are still within the scope covered by the present invention.
Claims
1. An IGBT module, characterized in that: It includes a housing, external terminals mounted on a frame around the housing, a heat sink mounted in a cavity of the housing, a conductive sheet laid on the heat sink, a chipset welded on the conductive sheet, a CLIP connection structure electrically connecting the conductive sheet and the chipset, and a terminal CLIP piece electrically connecting the external terminals and the conductive sheet; The ends of the external terminals extend into the cavity of the housing and form terminal welding sheets, and the conductive sheets are provided with terminal welding areas opposite to each of the external terminals in the front-to-back or left-to-right direction; The terminal CLIP piece is arranged in the front-to-back or left-to-right direction, and its front end is welded to the terminal welding piece of the external terminal, and its rear end is welded to the terminal welding area; At least one of the conductive sheets has a plurality of adjacent terminal welding areas, and the plurality of external terminals corresponding to the plurality of adjacent terminal welding areas located on the same conductive sheet are called an external terminal group. One external terminal group corresponds to one terminal CLIP component, and the front end of the terminal CLIP component is welded to the terminal welding sheet of each of the external terminals in the external terminal group, and the rear end is bent and extended to the terminal welding area and welded to the terminal welding area.
2. The IGBT module according to claim 1, characterized in that: The terminal CLIP piece is formed by bending a rectangular copper sheet, and the front end width of the terminal CLIP piece matches the arrangement width of multiple terminal welding pieces in the external terminal group, and the rear end width matches the arrangement width of multiple terminal welding areas located on the same conductive sheet and adjacent to each other.
3. The IGBT module according to claim 1, characterized in that: The external terminal group has two or three external terminals.
4. The IGBT module according to claim 1, wherein: The conductive sheet includes a first conductive sheet, a second conductive sheet, a third conductive sheet, a fourth conductive sheet and a fifth conductive sheet, wherein the second conductive sheet, the third conductive sheet, the fourth conductive sheet and the fifth conductive sheet are arranged sequentially from front to back to form a first area, and the first conductive sheet is located on the left side of the first area. The chip group includes three first IGBT chips and three first FRD chips sequentially welded on the first conductive sheet in the front-to-back direction, a second IGBT chip and a second FRD chip sequentially welded on the second conductive sheet and the third conductive sheet in the front-to-back direction, and a third IGBT chip and a third FRD chip sequentially welded on the fifth conductive sheet in the left-to-right direction.
5. The IGBT module according to claim 4, characterized in that: The second IGBT chip and the second FRD chip in the first area are alternately arranged, the first IGBT chip and the first FRD chip on the first conductive sheet are alternately arranged, and the second IGBT chip in the first area corresponds to the first FRD chip on the first conductive sheet in the left-right direction, and the second FRD chip in the first area corresponds to the first IGBT chip on the first conductive sheet in the left-right direction.
6. The IGBT module according to claim 4, characterized in that: The conductive sheet also includes a signal conductive sheet located in a second area on a side of the first conductive sheet away from the first area and having a terminal welding area, and a signal conductive sheet located in a third area on a side of the first area away from the first conductive sheet and having a terminal welding area. The CLIP connection structure includes a first CLIP component and a second CLIP component. One end of the first CLIP component is welded to the E pole of the first IGBT chip, the second IGBT chip or the third IGBT chip, and the other end is welded to the first area or the third area or the fourth conductive sheet; one end of the second CLIP component is welded to the E pole of the first IGBT chip, the second IGBT chip or the third IGBT chip, and the other end is welded to the first area or the third area or the fourth conductive sheet.
7. The IGBT module according to claim 6, characterized in that: The CLIP connection structure includes a third CLIP component, which has three first welding parts arranged along the left-right direction and a first connecting bridge connected between two adjacent first welding parts, and the three first welding parts are respectively welded to the conductive sheet in the first area, the positive electrode of the first FRD chip and the signal conductive sheet in the second area.
8. The IGBT module according to claim 6, characterized in that: The CLIP connection structure includes a fourth CLIP component and a fifth CLIP component, wherein two ends of the fourth CLIP component are respectively welded to a conductive sheet of the first region and an electrode of the first FRD chip, and the fifth CLIP component spans over the fourth CLIP component and its two ends are respectively welded to a conductive sheet of the first region and a signal conductive sheet of the second region.
9. The IGBT module according to claim 4, characterized in that: The conductive sheet includes a sixth conductive sheet, a seventh conductive sheet, an eighth conductive sheet and a ninth conductive sheet, the seventh conductive sheet, the eighth conductive sheet and the ninth conductive sheet are sequentially arranged from front to back to form a fourth region, the sixth conductive sheet is located on the right side of the fourth region, the sixth conductive sheet and the fourth region are located in front of the first conductive sheet and the first region, the chip set includes three fourth FRD chips sequentially welded on the seventh conductive sheet, the eighth conductive sheet and the ninth conductive sheet in the front-to-back direction, and three fifth FRD chips sequentially welded on the sixth conductive sheet in the front-to-back direction and opposite to the three fourth FRD chips; The CLIP connection structure includes a sixth CLIP piece corresponding to the fourth FRD chip, and two ends of each of the sixth CLIP pieces are respectively welded to the electrode of the fourth FRD chip and the conductive sheet corresponding to the fourth region; The conductive sheet further includes a tenth conductive sheet and an eleventh conductive sheet having a terminal welding area, the tenth conductive sheet is located in front of the seventh conductive sheet, and the eleventh conductive sheet is integrally connected to the sixth conductive sheet and is located on the right side of the tenth conductive sheet; The CLIP connection structure also includes a seventh CLIP component, which has four second welding parts arranged along the front-to-back direction and a second connecting bridge connected between two adjacent second welding parts, and the four second welding parts are sequentially welded to the tenth conductive sheet and the electrodes of the three fifth FRD chips.
10. The IGBT module according to claim 1, characterized in that: It also includes a thermistor welded on the conductive sheet, and the conductive sheet welded with the thermistor is bent and extended toward the direction corresponding to the external terminal to form the terminal welding area.