Cable connector and circuit board

Abstract

The utility model discloses a cable connector which comprises an insulation body and a circuit board, the circuit board comprises a first metal layer, a first insulation layer and a second metal layer which are stacked in the vertical direction, and golden fingers of the first metal layer comprise a first pair of signal golden fingers and a second pair of signal golden fingers which are adjacent to each other. The plurality of welding pads of the first metal layer comprise a first pair of signal welding pads and a second pair of signal welding pads which are adjacent, the conductive traces of the first metal layer comprise a pair of first signal traces through which the first pair of signal golden fingers and the first pair of signal welding pads are connected, and the second metal layer comprises a pair of second signal traces through which the first pair of signal golden fingers and the second pair of signal welding pads are connected. The second pair of signal gold fingers and the second pair of signal pads are connected by a second signal trace. The distance between the first signal trace and the second signal trace which are adjacent to each other is increased by staggering the first signal trace and the second signal trace which are adjacent to each other in the vertical direction, so that crosstalk between the first signal trace and the second signal trace which are adjacent to each other can be effectively reduced.

Description

[Technical field]

[0001] The utility model relates to a cable connector and a circuit board, in particular to a cable connector and a circuit board capable of reducing crosstalk. [Background technology]

[0002] The Chinese patent application number CN202221609636.2 discloses a cable connector 100, which includes an insulating body 1 and a circuit board 2. The circuit board 2 includes a first layer 23 and a second layer 25 opposite to each other, and two intermediate layers 24 located between the first layer 23 and the second layer 25. The first layer 23 is provided with a plurality of front pads 231, a plurality of rear pads 232, a first shielding member 235 located between the front pads 231 and the rear pads 232, and a second shielding member 236 located at an end of the rear pads 232 away from the first shielding member 235. The intermediate layer 24 is provided with a plurality of signal conductive lines 241 connecting the front signal pads 2311 and the rear signal pads 2321.

[0003] The above structure has the following problems:

[0004] Since the two adjacent pairs of signal conductive lines are both in the middle layer, the distance between the two adjacent pairs of signal conductive lines is short, and the crosstalk between the two adjacent pairs of signal conductive lines is large, which affects the high-frequency performance of the circuit board.

[0005] Therefore, it is necessary to design a new cable connector and circuit board to overcome the above problems. [Contents of the utility model]

[0006] In response to the problems faced by the background technology, the purpose of the invention is to provide a cable connector that can effectively reduce the crosstalk between adjacent first signal traces and second signal traces by staggering adjacent first signal traces and second signal traces in the up and down directions to increase the distance between the adjacent first signal traces and the second signal traces.

[0007] In order to achieve the above purpose, the utility model adopts the following technical means:

[0008] A cable connector, characterized in that it includes: an insulating body; a circuit board, including a docking portion exposed outside the insulating body and a fixed portion fixed in the insulating body, and also includes a first metal layer, a first insulating layer, and a second metal layer stacked in the up and down directions; the first metal layer includes a plurality of gold fingers located in the front and a plurality of solder pads located in the rear, and a plurality of conductive traces located between the gold fingers and the solder pads, the plurality of gold fingers are located in the docking portion, the plurality of solder pads are located in the fixed portion, the plurality of gold fingers and the plurality of solder pads are all exposed from the outer surface of the circuit board, the plurality of gold fingers include grounding gold fingers and two adjacent pairs of signal gold fingers, the two pairs of signal gold fingers include a first pair of signal gold fingers and a second pair of signal gold fingers fingers, the grounding gold finger is located between the adjacent first pair of signal gold fingers and the second pair of signal gold fingers, the multiple pads include a grounding pad and two adjacent pairs of signal pads, the two pairs of signal pads include a first pair of signal pads and a second pair of signal pads, the grounding pad is located between the adjacent first pair of signal pads and the second pair of signal pads, the conductive trace includes a grounding trace and a pair of first signal traces, the grounding gold finger and the grounding pad are connected through the grounding trace, the first pair of signal gold fingers and the first pair of signal pads are connected through the first signal trace, the second metal layer is located in the inner layer of the circuit board, includes a pair of second signal traces, the second pair of signal gold fingers and the second pair of signal pads are connected through the second signal trace.

[0009] Furthermore, the conductive traces include multiple ground traces and multiple pairs of first signal traces, a ground trace is located between two adjacent pairs of first signal traces, the circuit board includes multiple ground vias, the second metal layer also includes multiple first ground layers and multiple pairs of second signal traces, the first ground layer is connected to the ground traces through the ground vias, a first ground layer is located between two adjacent pairs of second signal traces, a pair of first signal traces are projected into the first ground layer along the up and down directions, and a pair of second signal traces are projected into the ground trace along the up and down directions.

[0010] Furthermore, the circuit board includes a plurality of grounding vias, the second metal layer also includes a plurality of first grounding layers, the first grounding layers are connected to the grounding traces through the grounding vias, two adjacent grounding vias connecting the grounding gold fingers have a first spacing, two adjacent grounding vias connecting the grounding pads have a second spacing, two adjacent grounding vias connecting the grounding traces have a third spacing, the first spacing is greater than the second spacing, and the third spacing is greater than the first spacing.

[0011] Furthermore, the circuit board also includes a plurality of grounding vias, the second metal layer also includes a plurality of first grounding layers and a plurality of windows, the plurality of windows include a plurality of first windows and a plurality of second windows, the first grounding layer is connected to the grounding trace through the grounding vias, a pair of second signal traces, the first window and the second window are located between two adjacent first grounding layers, the projection of the second pair of signal gold fingers along the up and down directions is located in the first window, the projection of the second pair of signal pads along the up and down directions is located in the second window, and the first window and the second window are connected.

[0012] Furthermore, the second metal layer also includes a plurality of windows, and the projection of a pair of signal pads along the up and down directions is located within one window. The circuit board also includes a second insulating layer, a third metal layer, a third insulating layer and a fourth metal layer stacked in the up and down directions. The third metal layer includes a plurality of first shielding portions and a plurality of first openings. When observed along the up and down directions, the first shielding portions and the first openings are exposed in the same window. The fourth metal layer includes a plurality of second shielding portions. When observed along the up and down directions, the second shielding portions cover the first openings. When observed along the up and down directions, the first shielding portions and the second shielding portions jointly cover the same window.

[0013] A circuit board, characterized in that it includes: a first metal layer, a first insulating layer, and a second metal layer stacked in an up-down direction, the first metal layer includes a plurality of gold fingers located in the front and a plurality of solder pads located in the rear, and a plurality of conductive traces located between the gold fingers and the solder pads, the plurality of gold fingers and the plurality of solder pads all expose the outer surface of the circuit board, the plurality of gold fingers include grounding gold fingers and two adjacent pairs of signal gold fingers, the two pairs of signal gold fingers include a first pair of signal gold fingers and a second pair of signal gold fingers, the grounding gold fingers are located between the adjacent first pair of signal gold fingers and the second pair of signal gold fingers, the plurality of solder pads include grounding solder pads and two adjacent pairs of signal solder pads, the two pairs of signal solder pads include a first pair of signal solder pads and a second pair of signal solder pads, the grounding solder pads are located between the adjacent first pair of signal solder pads and the second pair of signal solder pads, the conductive traces include grounding traces and a pair of first signal traces, the grounding gold fingers and the grounding solder pads are connected through the grounding traces, the first pair of signal gold fingers and the first pair of signal solder pads are connected through the first signal traces, and the second metal layer is located in the inner layer of the circuit board, includes a pair of second signal traces, the second pair of signal gold fingers and the second pair of signal solder pads are connected through the second signal traces.

[0014] Furthermore, the conductive traces include multiple ground traces and multiple pairs of first signal traces, a ground trace is located between two adjacent pairs of first signal traces, the circuit board includes multiple ground vias, the second metal layer also includes multiple first ground layers and multiple pairs of second signal traces, the first ground layer is connected to the ground traces through the ground vias, a first ground layer is located between two adjacent pairs of second signal traces, a pair of first signal traces are projected into the first ground layer along the up and down directions, and a pair of second signal traces are projected into the ground trace along the up and down directions.

[0015] Furthermore, the circuit board includes a plurality of grounding vias, the second metal layer also includes a plurality of first grounding layers, the first grounding layers are connected to the grounding traces through the grounding vias, two adjacent grounding vias connecting the grounding gold fingers have a first spacing, two adjacent grounding vias connecting the grounding pads have a second spacing, two adjacent grounding vias connecting the grounding traces have a third spacing, the first spacing is greater than the second spacing, and the third spacing is greater than the first spacing.

[0016] Furthermore, the circuit board also includes a plurality of grounding vias, the second metal layer also includes a plurality of first grounding layers and a plurality of windows, the plurality of windows include a plurality of first windows and a plurality of second windows, the first grounding layer is connected to the grounding trace through the grounding vias, a pair of second signal traces, the first window and the second window are located between two adjacent first grounding layers, the projection of the second pair of signal gold fingers along the up and down directions is located in the first window, the projection of the second pair of signal pads along the up and down directions is located in the second window, and the first window and the second window are connected.

[0017] Furthermore, the second metal layer also includes a plurality of windows, and the projection of a pair of signal pads along the up and down directions is located within one window. The circuit board also includes a second insulating layer, a third metal layer, a third insulating layer and a fourth metal layer stacked in the up and down directions. The third metal layer includes a plurality of first shielding portions and a plurality of first openings. When observed along the up and down directions, the first shielding portions and the first openings are exposed in the same window. The fourth metal layer includes a plurality of second shielding portions. When observed along the up and down directions, the second shielding portions cover the first openings. When observed along the up and down directions, the first shielding portions and the second shielding portions jointly cover the same window.

[0018] Compared with the prior art, the utility model has the following beneficial effects:

[0019] The first pair of signal gold fingers and the first pair of signal pads are connected through a first signal trace, and the second pair of signal gold fingers and the second pair of signal pads are connected through a second signal trace. Since the first signal trace is located in the first metal layer and the second signal trace is located in the second metal layer, the distance between adjacent first signal traces and second signal traces is increased by staggering adjacent first signal traces and second signal traces in the up and down directions, thereby effectively reducing crosstalk between adjacent first signal traces and second signal traces and improving high-frequency effects.

Brief Description of the Drawings

[0020] Figure 1 This is an exploded perspective view of the cable connector of the utility model;

[0021] Figure 2 This is a three-dimensional diagram of the circuit board of the utility model;

[0022] Figure 3 It is an exploded stereogram of the first metal layer, the second metal layer, the third metal layer, the fourth metal layer, the fifth metal layer, and the sixth metal layer of the circuit board of the utility model;

[0023] Figure 4 It is a partial top view of the circuit board of the utility model;

[0024] Figure 5 A three-dimensional diagram of the circuit board of the utility model from another perspective;

[0025] Figure 6A partial stereoscopic diagram of the circuit board of the utility model from another perspective;

[0026] Description of the accompanying drawings for the specific implementation:

[0027] Cable Connector 100 Insulation body 1 Circuit Board 2 Docking part 21 Fixing portion 22 First metal layer 23 Gold Finger 231 Grounding Gold Finger 2311 Signal Goldfinger 2312 The first pair of signal gold fingers 2312a The second pair of signal gold fingers 2312b Solder pad 232 Ground pad 2321 Signal pad 2322 The first pair of signal pads 2322a The second pair of signal pads 2322b Conductive trace 233 Ground trace 2331 First signal trace 2332 The second metal layer 24 The first ground layer 241 Second signal trace 242 Window 243 First Window 2431 Second Window 2432 The third metal layer 25 The second ground layer 251 The first shielding part 2511 First port 252 Fourth metal layer 26 The third ground layer 261 The second shielding portion 2611 Second port 262 Fifth metal layer 27 Sixth metal layer 28 Ground via 29 The first insulating layer C1 The second insulating layer C2 The third insulating layer C3 Fourth insulating layer C4 Fifth insulation layer C5 Cable 200 [Specific implementation method]

[0028] In order to facilitate a better understanding of the purpose, structure, characteristics and functions of the present invention, the present invention is further described in conjunction with the accompanying drawings and specific implementation methods.

[0029] like Figure 1 As shown, the cable connector 100 of the present invention is used to electrically connect a docking element to a cable 200. The docking element is preferably a docking connector (not shown). The insertion direction of the cable connector 100 into the docking element is defined as the X-axis, the width direction of the cable connector 100 is the Y-axis, and the height direction of the cable connector 100 is the Z-axis.

[0030] like Figure 1 As shown, the cable connector 100 includes an insulating body 1 and a circuit board 2 fixed on the insulating body 1 .

[0031] like Figures 2 to 3 As shown, the circuit board 2 includes a docking portion 21 exposed outside the insulating body 1 and a fixing portion 22 fixed inside the insulating body 1. The circuit board 2 also includes a first metal layer 23, a first insulating layer C1, a second metal layer 24, a second insulating layer C2, a third metal layer 25, a third insulating layer C3, a fourth metal layer 26, a fourth insulating layer C4, a fifth metal layer 27, a fifth insulating layer C5, a sixth metal layer 28 and a plurality of grounding through holes 29 stacked up and down.

[0032] like Figure 3 to Figure 4As shown, the first metal layer 23 includes a plurality of gold fingers 231 located in the front and a plurality of solder pads 232 located in the rear, and a plurality of conductive traces 233 located between the gold fingers 231 and the solder pads 232. The plurality of gold fingers 231 are located in the docking portion 21, and the plurality of solder pads 232 are located in the fixing portion 22. The plurality of gold fingers 231 and the plurality of solder pads 232 are exposed from the outer surface of the circuit board 2. The plurality of gold fingers 231 include a plurality of grounding gold fingers 2311 and a plurality of pairs of signal gold fingers 2312. In other embodiments, the plurality of gold fingers 231 include a grounding gold finger 2311 and two adjacent pairs of signal gold fingers 2312. The two adjacent pairs of signal gold fingers 2312 include a first pair of signal gold fingers 2312a and a second pair of signal gold fingers 2312b, and the grounding gold finger 2311 is located between the adjacent first pair of signal gold fingers 2312a and the second pair of signal gold fingers 2312b. The plurality of pads 232 include a plurality of ground pads 2321 and a plurality of pairs of signal pads 2322. In other embodiments, the plurality of pads 232 include a ground pad 2321 and two adjacent pairs of signal pads 2322. The two adjacent pairs of signal pads 2322 include a first pair of signal pads 2322a and a second pair of signal pads 2322b, and the ground pad 2321 is located between the adjacent first pair of signal pads 2322a and the second pair of signal pads 2322b. The conductive traces 233 include a plurality of ground traces 2331 and a plurality of pairs of first signal traces 2332. In other embodiments, the conductive traces 233 include a ground trace 2331 and a pair of first signal traces 2332. A ground trace 2331 is located between two adjacent pairs of first signal traces 2332. The grounding gold finger 2311 and the grounding pad 2321 are connected via a grounding trace 2331 , and the first pair of signal gold fingers 2312 a and the first pair of signal pads 2322 a are connected via a first signal trace 2332 .

[0033] like Figure 3As shown, the second metal layer 24 is located in the inner layer of the circuit board 2, and includes a plurality of first ground layers 241, a plurality of pairs of second signal traces 242, and a plurality of windows 243. In other embodiments, the second metal layer 24 includes a first ground layer 241, a pair of second signal traces 242, and two windows 243. The first ground layer 241 is located between two adjacent pairs of second signal traces 242. The first ground layer 241 is connected to the ground trace 2331 through the grounding via 29, the two adjacent grounding vias 29 connecting the grounding gold finger 2311 have a first spacing d1, the two adjacent grounding vias 29 connecting the grounding pad 2321 have a second spacing d2, and the two adjacent grounding vias 29 connecting the grounding trace 2331 have a third spacing d3, the first spacing d1 is greater than the second spacing d2, and the third spacing d3 is greater than the first spacing d1. The second pair of signal gold fingers 2312b and the second pair of signal pads 2322b are connected through the second signal trace 242. A pair of first signal traces 2332 are projected in the first ground layer 241 along the up-down direction, and a pair of second signal traces 242 are projected in the ground traces 2331 along the up-down direction. A pair of signal gold fingers 2312 are projected in one window 243 along the up-down direction, and a pair of signal pads 2322 are projected in another window 243 along the up-down direction.

[0034] like Figure 3 As shown, the plurality of windows 243 include a plurality of first windows 2431 and a plurality of second windows 2432. A pair of second signal traces 242, the first window 2431 and the second window 2432 are located between two adjacent first ground layers 241, the projection of the second pair of signal gold fingers 2312b in the up-down direction is located in the first window 2431, the projection of the second pair of signal pads 2322b in the up-down direction is located in the second window 2432, and the first window 2431 and the second window 2432 are connected.

[0035] like Figure 3 and Figure 6 As shown, the third metal layer 25 includes a second grounding layer 251 and a plurality of first through holes 252. The second grounding layer 251 is connected to the first grounding layer 241 through the grounding through holes 29, and the second grounding layer 251 includes a plurality of first shielding portions 2511. The first shielding portions 2511 and the first through holes 252 are exposed in the same window 243 when viewed from top to bottom.

[0036] like Figure 3 and Figure 6As shown, the fourth metal layer 26 includes a third grounding layer 261 and a plurality of second through holes 262. The third grounding layer 261 is connected to the second grounding layer 251 through the grounding through hole 29, and the third grounding layer 261 includes a plurality of second shielding portions 2611. When viewed in the up-down direction, the second shielding portions 2611 shield the first through holes 252, and the first shielding portions 2511 and the second shielding portions 2611 shield the same window 243 in the up-down direction.

[0037] like Figures 5 and 6 As shown, the sixth metal layer 28 is similar to the first metal layer 23, and also includes a plurality of gold fingers 231 located at the front and a plurality of solder pads 232 located at the rear, and a plurality of conductive traces 233 located between the gold fingers 231 and the solder pads 232. The plurality of gold fingers 231 are located at the docking portion 21, and the plurality of solder pads 232 are located at the fixing portion 22, and the plurality of gold fingers 231 and the plurality of solder pads 232 are exposed from the outer surface of the circuit board 2.

[0038] The plurality of gold fingers 231 include a plurality of ground gold fingers 2311 and a plurality of pairs of signal gold fingers 2312. In other embodiments, the plurality of gold fingers 231 include a ground gold finger 2311 and two adjacent pairs of signal gold fingers 2312. The two adjacent pairs of signal gold fingers 2312 include a first pair of signal gold fingers 2312a and a second pair of signal gold fingers 2312b, and the ground gold finger 2311 is located between the first pair of adjacent signal gold fingers 2312a and the second pair of adjacent signal gold fingers 2312b. The plurality of pads 232 include a plurality of ground pads 2321 and a plurality of pairs of signal pads 2322. In other embodiments, the plurality of pads 232 include a ground pad 2321 and two adjacent pairs of signal pads 2322. The two adjacent pairs of signal pads 2322 include a first pair of signal pads 2322a and a second pair of signal pads 2322b, and the ground pad 2321 is located between the first pair of adjacent signal pads 2322a and the second pair of adjacent signal pads 2322b. The conductive trace 233 includes a plurality of ground traces 2331 and a plurality of pairs of first signal traces 2332. In other embodiments, the conductive trace 233 includes a ground trace 2331 and a pair of first signal traces 2332. A ground trace 2331 is located between two adjacent pairs of first signal traces 2332. The grounding gold finger 2311 and the grounding pad 2321 are connected through the grounding trace 2331, and the first pair of signal gold fingers 2312a and the first pair of signal pads 2322a are connected through the first signal trace 2332.

[0039] like Figure 3As shown, the fifth metal layer 27 is similar to the second metal layer 24. The fifth metal layer 27 is located in the inner layer of the circuit board 2 and also includes a plurality of first grounding layers 241, a plurality of pairs of second signal traces 242 and a plurality of windows 243. In other embodiments, the fifth metal layer 27 includes a first grounding layer 241, a pair of second signal traces 242 and two windows 243. The first grounding layer 241 is located between two adjacent pairs of second signal traces 242. The first grounding layer 241 of the fifth metal layer 27 is connected to the grounding trace 2331 of the sixth metal layer 28 through the grounding via 29. The two adjacent grounding vias 29 connecting the grounding gold finger 2311 have a first spacing d1, the two adjacent grounding vias 29 connecting the grounding pad 2321 have a second spacing d2, and the two adjacent grounding vias 29 connecting the grounding trace 2331 have a third spacing d3. The first spacing d1 is greater than the second spacing d2, and the third spacing d3 is greater than the first spacing d1. The second pair of signal gold fingers 2312b of the sixth metal layer 28 and the second pair of signal pads 2322b of the sixth metal layer 28 are connected through the second signal trace 242 of the fifth metal layer 27. The pair of first signal traces 2332 of the sixth metal layer 28 are projected in the first ground layer 241 of the fifth metal layer 27 along the up-down direction, and the pair of second signal traces 242 of the fifth metal layer 27 are projected in the ground trace 2331 of the sixth metal layer 28 along the up-down direction. The pair of signal gold fingers 2312 of the sixth metal layer 28 are projected in one window 243 of the fifth metal layer 27 along the up-down direction, and the pair of signal pads 2322 of the sixth metal layer 28 are projected in another window 243 of the fifth metal layer 27 along the up-down direction.

[0040] In summary, the electrical connector of the utility model has the following beneficial effects:

[0041] (1) The first pair of signal gold fingers 2312a and the first pair of signal pads 2322a are connected via the first signal traces 2332, and the second pair of signal gold fingers 2312b and the second pair of signal pads 2322b are connected via the second signal traces 242. Since the first signal traces 2332 are located on the first metal layer 23 and the second signal traces 242 are located on the second metal layer 24, the distance between the adjacent first signal traces 2332 and the second signal traces 242 is increased by displacing the adjacent first signal traces 2332 and the second signal traces 242 in the vertical direction, which can effectively reduce the crosstalk between the adjacent first signal traces 2332 and the second signal traces 242 and improve the high frequency performance.

[0042] (2) The first grounding layer 241 is connected to the grounding trace 2331 through the grounding through hole 29 to achieve common grounding. Compared with the background technology in which the adjacent first signal traces and the second signal traces are on the same layer, the adjacent first signal traces 2332 and the second signal traces 242 are on different layers. Not only is the distance increased, but also because the grounding trace 2331 is on the first metal layer 23 and the second grounding layer 251 is on the second metal layer 24, the shielding area is also increased, which is beneficial to reduce crosstalk and improve high-frequency performance.

[0043] (3) A pair of first signal traces 2332 are projected into the first ground layer 241 along the up-down direction, which is beneficial to shielding the electromagnetic signal emitted by the first signal trace 2332 and reducing crosstalk. A first ground layer 241 is located between two adjacent pairs of second signal traces 242. A pair of second signal traces 242 are projected into the ground trace 2331 along the up-down direction, which is beneficial to shielding the electromagnetic signal emitted by the first signal trace 2332 and reducing crosstalk.

[0044] (4) The projection of the second pair of signal gold fingers 2312b in the up-down direction is located in the first window 2431, which can reduce the area facing the second pair of signal gold fingers 2312b and the second metal layer 24. According to the formula (C is capacitance, ε is the dielectric constant of the transmission medium, and S is the facing area), the facing area S of the second pair of signal gold fingers 2312b and the second metal layer 24 is reduced, and the capacitance C is reduced. It can be seen that the characteristic impedance Z of the second pair of signal gold fingers 2312b increases. The projection of the second pair of signal pads 2322b in the up-down direction is located in the second window 2432. The second window 2432 can also reduce the area of ​​the second pair of signal pads 2322b facing the second metal layer 24, thereby increasing the characteristic impedance Z of the second pair of signal pads 2322b, avoiding the impedance mismatch that indirectly generates electromagnetic wave signal reflection, and improving its high-frequency performance. The first window 2431 and the second window 2432 are connected, further reducing the area of ​​the second pair of signal gold fingers 2312b and the second pair of signal pads 2322b facing the second metal layer 24, thereby further improving the high-frequency performance.

[0045] (5) The second metal layer 24 also includes a plurality of windows 243. The projection of a pair of signal pads 2322 in the up-down direction is located in one window 243, which can reduce the area facing the signal pads 2322 and the second metal layer 24. According to the formula (C is capacitance, ε is the dielectric constant of the transmission medium, and S is the facing area), the facing area S of the signal pad 2322 and the second metal layer 24 is reduced, and the capacitance C is reduced. It can be seen that the characteristic impedance Z of the signal pad 2322 increases, which can avoid the impedance mismatch that indirectly generates electromagnetic wave signal reflection, thereby improving its high-frequency performance. The third metal layer 25 includes a plurality of first shielding portions 2511 and a plurality of first through openings 252. The provision of the first through openings 252 can also reduce the area directly facing the signal pad 2322 and the second metal layer 24, thereby increasing the characteristic impedance Z of the signal pad 2322, which can avoid the impedance mismatch that indirectly generates electromagnetic wave signal reflection, thereby improving its high-frequency performance. Observing from the up and down directions, the first shielding portion 2511 and the second shielding portion 2611 jointly shield the same window 243. While ensuring that the characteristic impedance Z of the signal pad 2322 increases, it can also ensure that the signal crosstalk of the signal pad 2322 is shielded, thereby further improving the high-frequency performance.

[0046] The above detailed description is only an explanation of the preferred embodiment of the utility model, and does not limit the patent scope of the utility model. Therefore, all equivalent technical changes made by using the description and illustrations of this creation are included in the patent scope of this creation.

Claims

1. A cable connector, characterized in that: include: Insulation body; The circuit board includes a docking portion exposed outside the insulating body and a fixing portion fixed inside the insulating body, and also includes a first metal layer, a first insulating layer and a second metal layer stacked in the up-down direction; The first metal layer includes a plurality of gold fingers located in the front and a plurality of solder pads located in the rear, and a plurality of conductive traces located between the gold fingers and the solder pads, the plurality of gold fingers are located in the docking portion, the plurality of solder pads are located in the fixing portion, the plurality of gold fingers and the plurality of solder pads are exposed from the outer surface of the circuit board, the plurality of gold fingers include grounding gold fingers and two adjacent pairs of signal gold fingers, the two pairs of signal gold fingers include a first pair of signal gold fingers and a second pair of signal gold fingers, the grounding gold fingers are located between the adjacent first pair of signal gold fingers and the second pair of signal gold fingers, the plurality of solder pads include grounding solder pads and two adjacent pairs of signal solder pads, the two pairs of signal solder pads include a first pair of signal solder pads and a second pair of signal solder pads, the grounding solder pads are located between the adjacent first pair of signal solder pads and the second pair of signal solder pads, the conductive traces include grounding traces and a pair of first signal traces, the grounding gold fingers and the grounding solder pads are connected through the grounding traces, the first pair of signal gold fingers and the first pair of signal solder pads are connected through the first signal traces, The second metal layer is located on the inner layer of the circuit board and includes a pair of second signal traces. The second pair of signal gold fingers and the second pair of signal pads are connected through the second signal traces.

2. The cable connector according to claim 1, wherein: The conductive traces include multiple ground traces and multiple pairs of first signal traces, a ground trace is located between two adjacent pairs of first signal traces, the circuit board includes multiple ground vias, the second metal layer also includes multiple first ground layers and multiple pairs of second signal traces, the first ground layer is connected to the ground traces through the ground vias, a first ground layer is located between two adjacent pairs of second signal traces, a pair of first signal traces are projected in the first ground layer along the up and down directions, and a pair of second signal traces are projected in the ground trace along the up and down directions.

3. The cable connector according to claim 1, wherein: The circuit board includes multiple grounding vias, and the second metal layer also includes multiple first grounding layers. The first grounding layers are connected to grounding traces through grounding vias. Two adjacent grounding vias connecting grounding gold fingers have a first spacing, two adjacent grounding vias connecting grounding pads have a second spacing, and two adjacent grounding vias connecting grounding traces have a third spacing. The first spacing is greater than the second spacing, and the third spacing is greater than the first spacing.

4. The cable connector according to claim 1, wherein: The circuit board also includes multiple grounding vias, the second metal layer also includes multiple first grounding layers and multiple windows, the multiple windows include multiple first windows and multiple second windows, the first grounding layer is connected to the grounding trace through the grounding vias, a pair of second signal traces, the first window and the second window are located between two adjacent first grounding layers, the projection of the second pair of signal gold fingers along the up and down directions is located in the first window, the projection of the second pair of signal pads along the up and down directions is located in the second window, and the first window and the second window are connected.

5. The cable connector according to claim 1, wherein: The second metal layer also includes a plurality of windows, and the projection of a pair of signal pads along the up and down directions is located within one window. The circuit board also includes a second insulating layer, a third metal layer, a third insulating layer and a fourth metal layer stacked in the up and down directions. The third metal layer includes a plurality of first shielding portions and a plurality of first openings. When observed along the up and down directions, the first shielding portions and the first openings are exposed in the same window. The fourth metal layer includes a plurality of second shielding portions. When observed along the up and down directions, the second shielding portions cover the first openings. When observed along the up and down directions, the first shielding portions and the second shielding portions jointly cover the same window.

6. A circuit board, characterized in that: include: A first metal layer, a first insulating layer, and a second metal layer stacked in a vertical direction, The first metal layer includes a plurality of gold fingers located in the front and a plurality of solder pads located in the rear, and a plurality of conductive traces located between the gold fingers and the solder pads, the plurality of gold fingers and the plurality of solder pads are exposed from the outer surface of the circuit board, the plurality of gold fingers include grounding gold fingers and two adjacent pairs of signal gold fingers, the two pairs of signal gold fingers include a first pair of signal gold fingers and a second pair of signal gold fingers, the grounding gold fingers are located between the adjacent first pair of signal gold fingers and the second pair of signal gold fingers, the plurality of solder pads include grounding solder pads and two adjacent pairs of signal solder pads, the two pairs of signal solder pads include a first pair of signal solder pads and a second pair of signal solder pads, the grounding solder pads are located between the adjacent first pair of signal solder pads and the second pair of signal solder pads, the conductive traces include grounding traces and a pair of first signal traces, the grounding gold fingers and the grounding solder pads are connected through the grounding traces, the first pair of signal gold fingers and the first pair of signal solder pads are connected through the first signal traces, The second metal layer is located on the inner layer of the circuit board and includes a pair of second signal traces. The second pair of signal gold fingers and the second pair of signal pads are connected through the second signal traces.

7. The circuit board according to claim 6, wherein: The conductive traces include multiple ground traces and multiple pairs of first signal traces, a ground trace is located between two adjacent pairs of first signal traces, the circuit board includes multiple ground vias, the second metal layer also includes multiple first ground layers and multiple pairs of second signal traces, the first ground layer is connected to the ground traces through the ground vias, a first ground layer is located between two adjacent pairs of second signal traces, a pair of first signal traces are projected in the first ground layer along the up and down directions, and a pair of second signal traces are projected in the ground trace along the up and down directions.

8. The circuit board according to claim 6, wherein: The circuit board includes multiple grounding vias, and the second metal layer also includes multiple first grounding layers. The first grounding layers are connected to grounding traces through grounding vias. Two adjacent grounding vias connecting grounding gold fingers have a first spacing, two adjacent grounding vias connecting grounding pads have a second spacing, and two adjacent grounding vias connecting grounding traces have a third spacing. The first spacing is greater than the second spacing, and the third spacing is greater than the first spacing.

9. The circuit board according to claim 6, wherein: The circuit board also includes multiple grounding vias, the second metal layer also includes multiple first grounding layers and multiple windows, the multiple windows include multiple first windows and multiple second windows, the first grounding layer is connected to the grounding trace through the grounding vias, a pair of second signal traces, the first window and the second window are located between two adjacent first grounding layers, the projection of the second pair of signal gold fingers along the up and down directions is located in the first window, the projection of the second pair of signal pads along the up and down directions is located in the second window, and the first window and the second window are connected.

10. The circuit board according to claim 6, wherein: The second metal layer also includes a plurality of windows, and the projection of a pair of signal pads along the up and down directions is located within one window. The circuit board also includes a second insulating layer, a third metal layer, a third insulating layer and a fourth metal layer stacked in the up and down directions. The third metal layer includes a plurality of first shielding portions and a plurality of first openings. When observed along the up and down directions, the first shielding portions and the first openings are exposed in the same window. The fourth metal layer includes a plurality of second shielding portions. When observed along the up and down directions, the second shielding portions cover the first openings. When observed along the up and down directions, the first shielding portions and the second shielding portions jointly cover the same window.

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