FPC false double-sided board structure and CCS acquisition system of battery module

Abstract

The utility model provides an FPC false double-sided board structure and a CCS acquisition system of a battery module. The FPC false double-sided board structure comprises a base material surface layer, two sides of which are respectively provided with a first circuit layer and a second circuit layer; the first circuit layer comprises a first pure glue layer, a first circuit surface layer and a first circuit protection film which are sequentially arranged on the first side of the base material surface layer; the second circuit layer comprises a second pure glue layer, a second circuit surface layer and a second circuit protection film which are sequentially arranged on the second side of the base material surface layer. Compared with a traditional double-sided board which is high in via hole machining cost and high in reject ratio due to the fact that via holes exist, the double-sided board is free of via hole design, the machining difficulty is consistent with that of a single-sided board, the reliability and the stability are higher than those of the double-sided board, the wiring space is two times that of the single-sided board, and therefore the design requirements of an ultra-long board and an ultra-large number of collection points can be met.

Description

Technical Field

[0001] The utility model relates to an FPC false double-panel structure and a CCS acquisition system of a battery module, belonging to the technical field of the CCS acquisition system of an FPC battery. Background Art

[0002] The CCS of FPC battery is a key electrical connection structure in the battery module and is part of the BMS. CCS integrates information collection components such as wiring harness, PCB, FPC, FFC, plastic components, aluminum bars and other components into the battery module to achieve functions such as high-voltage series and parallel connection of battery cells, temperature sampling of batteries, voltage sampling of battery cells and overcurrent fusing. Existing FPC batteries have increasingly higher requirements for the collection accuracy of information collection components, especially the temperature monitoring performance has very high requirements for the accuracy of battery temperature.

[0003] In particular, existing FPC batteries usually need to be fully sampled, that is, a temperature sensor is arranged on each battery cell and the temperature signal of each battery cell is read. Each temperature sensor needs to be arranged with two transmission circuits for transmitting the analog temperature signal. In addition, each battery cell also requires a voltage collection line. Therefore, as the integration of battery cells continues to increase, the circuits used for signal transmission are becoming more and more numerous and complex.

[0004] Traditional circuit implementation solutions, including pure wiring harness solutions, single-sheet single-layer FPC solutions, and traditional double-sided board solutions, all have problems such as difficult via processing, high product risk, and reduced reliability and stability as the complexity of the FPC battery increases. Traditional circuit implementation solutions have become increasingly difficult to meet the design requirements of ultra-long versions and ultra-many collection points. Therefore, this technical problem needs to be solved urgently. Utility Model Content

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a FPC pseudo double-panel structure and a CCS acquisition system for a battery module.

[0006] According to the implementation scheme of the utility model, a first solution is provided: an FPC false double-sided board structure, comprising:

[0007] A substrate surface layer, wherein a first circuit layer and a second circuit layer are respectively arranged on both sides of the substrate surface layer; the first circuit layer includes a first pure glue layer, a first circuit surface layer and a first circuit protection film sequentially arranged on the first side of the substrate surface layer; the second circuit layer includes a second pure glue layer, a second circuit surface layer and a second circuit protection film sequentially arranged on the second side of the substrate surface layer.

[0008] Furthermore, a temperature collection NTC wiring is arranged on the second circuit surface layer, and a voltage collection wiring is arranged on the first circuit surface layer.

[0009] Furthermore, the second circuit surface layer is provided with temperature collection NTC wiring and residual voltage collection wiring, the first circuit surface layer is provided with main voltage collection wiring, and the sum of the main voltage collection wiring and the residual voltage collection wiring is the voltage collection wiring;

[0010] Or, a main body temperature collection NTC wiring is arranged on the second circuit surface, a voltage collection wiring and a residual temperature collection NTC wiring are arranged on the first circuit surface, and the sum of the main body temperature collection NTC wiring and the residual temperature collection NTC wiring is the temperature collection NTC wiring.

[0011] Furthermore, the temperature collection NTC wiring on the second circuit surface layer extends to the rearmost end of the FPC device and is connected through a second connector on the pad.

[0012] Furthermore, the second connector is a plug-in connector or a patch connector.

[0013] Furthermore, the second connector is provided with a second reinforcement plate on the FPC device, the second reinforcement plate of the patch type connector is on the reverse side of the second connector pad surface, and the second reinforcement plate of the plug-in type connector is on the front and reverse sides of the second connector pad surface.

[0014] Furthermore, the voltage collection wiring on the first circuit surface layer extends to the rearmost end of the FPC device and is aggregated through a first connector on the pad.

[0015] Furthermore, the first connector is a plug-in connector or a patch connector.

[0016] Furthermore, the first connector is provided with a first reinforcement plate on the FPC device, the first reinforcement plate of the patch connector is on the reverse side of the first connector pad surface, and the first reinforcement plate of the plug-in connector is on the front and reverse sides of the first connector pad surface.

[0017] According to the implementation scheme of the utility model, using the FPC false double-sided board structure in the first solution provided by the utility model, a second solution is provided:

[0018] A CCS acquisition system for a battery module includes any FPC false double-panel structure.

[0019] Compared with the prior art, the technical solution provided by the present application has the following unique beneficial effects: the present solution provides a new FPC pseudo double-sided structure, which realizes the double-sided structure by arranging the first circuit layer and the second circuit layer on both sides of the substrate surface layer. The circuit layout is more reasonable by arranging the circuits on both sides. At the same time, sharing one substrate surface layer can also save the material cost of the FPC and further reduce the product thickness. In particular, compared with the traditional double-sided board, which has high via processing cost and high defect rate due to the presence of vias, the present solution has no via design, and the processing difficulty is the same as that of the single-sided board. The reliability and stability are higher than those of the double-sided board, and the wiring space is twice that of the single-sided board, thereby meeting the design requirements of super-long boards and super-many collection points. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] in:

[0022] Figure 1 A schematic diagram of the structure of a FPC fake double-sided board in one embodiment;

[0023] Figure 2 A schematic diagram of the structure of a single FPC panel in one embodiment;

[0024] Figure 3 A schematic diagram of the connector position of an FPC fake double-sided board in one embodiment;

[0025] Figure 4 A partial schematic diagram of a connector of an FPC fake double-sided board in one embodiment.

[0026] Reference numerals:

[0027] 100-single-sided board substrate surface layer; 210-single-sided board pure glue layer; 220-single-sided board circuit surface layer; 230-single-sided board circuit protection film; 10-substrate surface layer; 21-first pure glue layer; 22-first circuit surface layer; 23-first circuit protection film; 31-second pure glue layer; 32-second circuit surface layer; 33-second circuit protection film; 41-first reinforcement plate; 42-first connector; 51-second reinforcement plate; 52-second connector. DETAILED DESCRIPTION

[0028] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of this application. Embodiment 1

[0029] Existing FPC batteries usually need to be fully sampled, that is, a temperature sensor is arranged for each battery cell and the temperature signal of each battery cell is read. Each temperature sensor needs to be arranged with two transmission circuits to transmit the analog temperature signal. In addition, each battery cell also needs a voltage acquisition line. Therefore, as the integration of battery cells continues to increase, the circuits used for signal transmission are becoming more and more numerous and more complex. Traditional circuit implementation solutions, including pure wiring harness solutions, single-sheet single-layer FPC solutions, and traditional double-sided board solutions, all have problems such as difficult via processing, high product risks, and reduced reliability and stability as the complexity of FPC batteries increases. Traditional circuit implementation solutions have become increasingly difficult to meet the design requirements of ultra-long versions and ultra-multiple acquisition points.

[0030] Specifically, the existing FPC single-panel structure is as follows Figure 2 As shown, a single-panel pure glue layer 210, a single-panel circuit surface layer 220 and a single-panel circuit protection film 230 are sequentially arranged on one side of the single-panel substrate surface layer 100, wherein temperature collection NTC wiring and voltage collection wiring are arranged on the single-panel circuit surface layer 220. The defect is that since there is only one circuit surface, the space is limited. When the integration of the battery cell continues to increase, the circuit layout space cannot meet the design requirements, and the line width is not enough, and the current carrying capacity is insufficient. Based on the existing high-integration battery cells, full collection cannot be achieved and the common line circuit problem cannot be solved.

[0031] In the existing FPC double-sided board structure, the upper and lower circuits need to have vias designed to connect the cross-wiring circuits from the upper circuit to the lower circuit. The overall thickness of the FPC panel structure is very thin, and the via design of the upper and lower circuits is difficult and costly, and is prone to open circuits, resulting in high product risks.

[0032] In order to solve the above technical problems, this embodiment provides a FPC fake double-sided board structure. Figure 1 Shown include:

[0033] A substrate surface layer 10, wherein a first circuit layer and a second circuit layer are respectively disposed on two sides of the substrate surface layer 10;

[0034] The first circuit layer includes a first pure glue layer 21, a first circuit surface layer 22 and a first circuit protection film 23 sequentially arranged on the first side of the substrate surface layer 10; the second circuit layer includes a second pure glue layer 31, a second circuit surface layer 32 and a second circuit protection film 33 sequentially arranged on the second side of the substrate surface layer 10.

[0035] The second circuit surface layer 32 is provided with temperature collection NTC wiring, the first circuit surface layer 22 is provided with voltage collection wiring, and circuit layers are arranged on both sides of the substrate surface layer 10, and the circuits between the layers are not interconnected. Since the FPC can be flipped, it can be agreed that the topmost circuit surface layer facing the window where the voltage collection nickel sheet and the temperature collection NTC are located is the first circuit layer, or the top circuit layer, and the other circuit surface layer is the second circuit layer, or the bottom circuit layer.

[0036] This solution provides a new FPC pseudo double-sided structure, such as Figure 1 As shown, a double-sided structure is realized by arranging the first circuit layer and the second circuit layer on both sides of the substrate surface layer 10. Arranging the circuits on both sides has made it more reasonable to layout the circuits. At the same time, sharing one substrate surface layer 10 can also save the material cost of the FPC and further reduce the product thickness. In particular, compared with the traditional double-sided board, which has high via processing cost and high defect rate due to the presence of vias, this solution has no via design, and the processing difficulty is the same as that of the single-sided board. The reliability and stability are higher than those of the double-sided board, and the wiring space is twice that of the single-sided board, thereby meeting the design requirements of super-long boards and super-many collection points. Embodiment 2

[0037] In a preferred embodiment, an FPC pseudo double-sided board structure includes a substrate surface layer 10, and a first circuit layer and a second circuit layer are respectively arranged on both sides of the substrate surface layer 10; the first circuit layer includes a first pure glue layer 21, a first circuit surface layer 22 and a first circuit protective film 23 sequentially arranged on the first side of the substrate surface layer 10; the second circuit layer includes a second pure glue layer 31, a second circuit surface layer 32 and a second circuit protective film 33 sequentially arranged on the second side of the substrate surface layer 10.

[0038] Furthermore, a temperature collection NTC wiring is arranged on the second circuit surface layer 32 , and a voltage collection wiring is arranged on the first circuit surface layer 22 .

[0039] The voltage acquisition circuit and the temperature acquisition NTC circuit are routed in the upper and lower layers respectively. The temperature acquisition NTC circuit will not be blocked by the pad or line of the voltage acquisition nickel sheet. The NTC circuit in the battery module can be continuously connected with the next NTC negative electrode to achieve only one NTC negative electrode common node, that is, the negative electrode of the NTC temperature sensor is connected to the same transmission circuit. In the case of the same size and the same acquisition point, fewer lines are used, and the number of connector PINs required is reduced, and the number of connectors used is reduced. At the same time, in the case of the same acquisition point, the temperature acquisition NTC circuit has fewer lines, which can free up more space for the voltage acquisition circuit, and the overall FPC has a stronger overcurrent capacity.

[0040] Furthermore, the second circuit surface layer 32 is provided with temperature collection NTC wiring and residual voltage collection wiring, and the first circuit surface layer 22 is provided with main voltage collection wiring, and the sum of the main voltage collection wiring and the residual voltage collection wiring is the voltage collection wiring;

[0041] Or, a main body temperature collection NTC wiring is arranged on the second circuit surface, a voltage collection wiring and a residual temperature collection NTC wiring are arranged on the first circuit surface, and the sum of the main body temperature collection NTC wiring and the residual temperature collection NTC wiring is the temperature collection NTC wiring.

[0042] According to actual needs, part of the temperature acquisition NTC wiring can be moved to the top line or part of the voltage acquisition wiring can be moved to the bottom line to make full use of the space or connector interface. The wiring space of the top and bottom layers can be fully utilized, and the unique stacking structure design allows the lines of different layers to be on the same side before welding, ensuring the integrated design of the voltage acquisition nickel sheet and the temperature acquisition NTC.

[0043] like Figure 3 , Figure 4 As shown, the temperature collection NTC wiring on the second circuit surface layer 32 extends to the rear end of the FPC device and is connected through the second connector 52 on the pad. The second connector 52 is a plug-in connector or a patch connector. The second connector 52 is provided with a second reinforcement plate 51 on the FPC device. The second reinforcement plate 51 of the patch connector is on the reverse side of the second connector 52 pad surface, and the second reinforcement plate 51 of the plug-in connector is on the front and reverse sides of the second connector 52 pad surface.

[0044] The voltage collection wiring on the first circuit surface layer 22 extends to the rear end of the FPC device and is collected through the first connector 42 on the pad. The first connector 42 is a plug-in connector or a surface mount connector. The first connector 42 is provided with a first reinforcement plate 41 on the FPC device. The first reinforcement plate 41 of the surface mount connector is on the reverse side of the pad surface of the first connector 42, and the first reinforcement plate 41 of the plug-in connector is on the front and reverse sides of the pad surface of the first connector 42.

[0045] Weld the voltage collection circuit and temperature collection circuit on different sides to the same side. The voltage collection nickel sheet and temperature collection NTC are integrated while routing on both sides. The integration of the voltage collection nickel sheet and the temperature collection NTC is very necessary. First, the nickel sheet protects the NTC, and second, the nickel sheet acts as a heat conductor. If the voltage collection nickel sheet and the temperature collection NTC cannot be integrated, it is necessary to add independent nickel sheet protection and heat conduction, which increases the cost. The reverse side circuit of the traditional design can only be welded to the front side through a through hole, which is risky. Or single-sided routing, small space.

[0046] The fake double-sided board design has no vias, so the processing difficulty is basically the same as that of a single-sided board. It has no via processing steps, high reliability and stability, and the wiring space is twice that of a single-sided board. This feature allows the fake double-sided board to be made longer, meeting the design requirements of ultra-long boards and solutions with many collection points. Embodiment 3

[0047] The present embodiment provides a CCS acquisition system for a battery module, including an FPC pseudo double-sided board structure, the FPC pseudo double-sided board structure including: a substrate surface layer 10, a first circuit layer and a second circuit layer are respectively arranged on both sides of the substrate surface layer 10; the first circuit layer includes a first pure glue layer 21, a first circuit surface layer 22 and a first circuit protective film 23 sequentially arranged on the first side of the substrate surface layer 10; the second circuit layer includes a second pure glue layer 31, a second circuit surface layer 32 and a second circuit protective film 33 sequentially arranged on the second side of the substrate surface layer 10.

[0048] This design is not limited by the connector type and the allocation of upper and lower voltage acquisition lines and temperature acquisition lines. All double-sided routing can achieve local or global same-side welding and pseudo double-sided panel structures without through-hole design, which fall within the scope of protection of this application.

[0049] The technical features of the above embodiments can be combined arbitrarily. In order to make the description concise, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification. The above embodiments only express several implementation methods of the present application, and their descriptions are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of this application. It should be pointed out that for ordinary technicians in this field, without departing from the concept of this application, several variations and improvements can be made, which all belong to the scope of protection of this application.

[0050] It should be noted that when an element is referred to as being "fixed on" or "disposed on" another component, it may be directly on the other component or indirectly disposed on the other component; when a component is referred to as being "connected to" another component, it may be directly connected to the other component or indirectly connected to the other component. It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0051] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "multiple" and "several" mean two or more, unless otherwise clearly and specifically defined.

[0052] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions under which this application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the effects and purposes that can be achieved by this application.

Claims

1. An FPC false double-sided board structure, characterized in that: include: A substrate surface layer, with a first circuit layer and a second circuit layer respectively disposed on both sides of the substrate surface layer; The first circuit layer includes a first pure glue layer, a first circuit surface layer and a first circuit protection film which are sequentially arranged on a first side of the substrate surface layer; The second circuit layer includes a second pure glue layer, a second circuit surface layer and a second circuit protection film which are sequentially arranged on the second side of the substrate surface layer.

2. The FPC pseudo double-sided board structure according to claim 1, characterized in that: The second circuit surface layer is provided with temperature collection NTC wiring, and the first circuit surface layer is provided with voltage collection wiring.

3. The FPC pseudo double-sided board structure according to claim 1, characterized in that: The second circuit surface layer is provided with temperature collection NTC wiring and residual voltage collection wiring, and the first circuit surface layer is provided with main voltage collection wiring, and the sum of the main voltage collection wiring and the residual voltage collection wiring is the voltage collection wiring; Or, a main body temperature collection NTC wiring is arranged on the second circuit surface, a voltage collection wiring and a residual temperature collection NTC wiring are arranged on the first circuit surface, and the sum of the main body temperature collection NTC wiring and the residual temperature collection NTC wiring is the temperature collection NTC wiring.

4. The FPC pseudo double-sided board structure according to claim 2, characterized in that: The temperature collection NTC wiring on the second circuit surface layer extends to the rearmost end of the FPC device and is connected through the second connector on the pad.

5. The FPC pseudo double-sided board structure according to claim 4, characterized in that: The second connector is a plug-in connector or a patch connector.

6. The FPC pseudo double-sided board structure according to claim 5, characterized in that: The second connector is provided with a second reinforcement plate on the FPC device. The second reinforcement plate of the patch connector is on the reverse side of the second connector pad surface, and the second reinforcement plate of the plug-in connector is on the front and reverse sides of the second connector pad surface.

7. The FPC pseudo double-sided board structure according to claim 2, characterized in that: The voltage collection wiring on the first circuit surface layer extends to the rearmost end of the FPC device and is collected through the first connector on the pad.

8. The FPC pseudo double-sided board structure according to claim 7, characterized in that: The first connector is a plug-in connector or a patch connector.

9. The FPC pseudo double-sided board structure according to claim 8, characterized in that: The first connector is provided with a first reinforcement plate on the FPC device. The first reinforcement plate of the patch connector is on the reverse side of the first connector pad surface, and the first reinforcement plate of the plug-in connector is on the front and reverse sides of the first connector pad surface.

10. A CCS acquisition system for a battery module, characterized in that: It includes any one of the FPC false double-sided board structures as described in claims 1-9.

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