Silicon wafer cleaning equipment

Abstract

The utility model provides silicon wafer cleaning equipment, and belongs to the technical field of silicon wafer processing. Comprising a supporting frame and a placing frame, a cleaning groove is formed in the top of the supporting frame, cleaning liquid is contained in the cleaning groove, a plurality of ultrasonic generators are horizontally arranged on the side wall of the cleaning groove at intervals, the placing frame is composed of a connecting frame and a limiting frame, and a plurality of placing grooves used for containing silicon wafers are formed in the placing frame. A first driving piece used for driving the silicon wafer to rotate is arranged on the placing frame, and a placing table is arranged on one side, located on the cleaning groove, of the supporting frame. A plurality of silicon wafers can be uniformly limited and mounted in the placement frame at intervals through the placement frame, mutual friction between the silicon wafers can be effectively avoided, and after the placement frame is rotationally sunk into the cleaning groove, the two surfaces of each silicon wafer can be effectively cleaned through the cleaning liquid and the ultrasonic generator, so that the cleaning efficiency is improved. And the effect of protecting the silicon wafer in the cleaning process is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer processing equipment, in particular to silicon wafer cleaning equipment. Background Art

[0002] Silicon wafers are the core material in semiconductor manufacturing. They are circular thin slices made from high-purity single crystal silicon or polycrystalline silicon through slicing, polishing and other processes. They are the substrate for semiconductor devices and solar cells and are widely used in integrated circuits (ICs), photovoltaics (solar cells) and other fields.

[0003] During the processing of silicon wafers, silicon rods need to be cut and thinned many times to obtain silicon wafers for chip processing. In the upstream processing of silicon wafers, after the silicon rods are cut into silicon wafers of a certain thickness, the silicon wafers need to be polished. After polishing, a large amount of polishing impurities are likely to adhere to the surface of the silicon wafers, and the silicon wafers need to be cleaned. The common cleaning method is to stack multiple silicon wafers and place them obliquely in an ultrasonic cleaning machine for cleaning. In this way, the silicon wafers are stacked tightly, which can easily cause scratches on the surface of the silicon wafers, affecting the appearance quality of the silicon wafers. Utility Model Content

[0004] In view of the above problems, the utility model provides a silicon wafer cleaning device.

[0005] In order to achieve the above-mentioned invention object, the technical solution adopted by the utility model is as follows:

[0006] Provided is a silicon wafer cleaning device, comprising a supporting frame and a placing frame, wherein a cleaning tank is arranged on the top of the supporting frame, the cleaning tank contains cleaning liquid, a plurality of ultrasonic generators are arranged horizontally at intervals on the side walls of the cleaning tank, the placing frame comprises a connecting frame and a limiting frame, the connecting frame is hingedly arranged on the supporting frame, a plurality of placing tanks for accommodating silicon wafers are arranged at intervals on the connecting frame, the limiting frame is hingedly arranged on the connecting frame, the movable end of the limiting frame is detachably connected to the connecting frame, the limiting frame is used to limit the silicon wafer from escaping from the placing tank, a first driving member for driving the silicon wafer to rotate is arranged on the placing frame, and a placing table is arranged on one side of the supporting frame located at the cleaning tank.

[0007] Further, the connecting frame includes two first connecting plates, both of which are hinged to the supporting frame, a plurality of first hollow rods are arranged along the circumference between the two first connecting plates, and a plurality of first limiting plate groups are arranged in parallel and spaced apart between the two first connecting plates, each first limiting plate group includes two limiting plates, and a placement groove for embedding the silicon wafer is formed between the two limiting plates;

[0008] The limiting frame includes two second connecting plates, one ends of the two second connecting plates are hinged on the connecting frame, a plurality of second hollow rods are arranged in a circle between the two second connecting plates, and a plurality of groups of second limiting plate groups are arranged in parallel and at intervals between the two second connecting plates, each group of second limiting plate groups includes two limiting plates, and the two limiting plates in the second limiting plate group correspond to the two limiting plates in the first limiting plate group in one-to-one position.

[0009] Furthermore, the movable end of the second connecting plate is detachably connected to the end of the first connecting plate through a connecting piece, and the connecting piece includes a bolt column vertically fixed on the side wall of the second connecting plate, and the movable end of the first connecting plate is provided with a connecting groove for the bolt column to slide into, and a butterfly nut is threadedly connected to the bolt column, and a limiting groove for matching the butterfly nut is fixedly provided on a side of the first connecting plate away from the second connecting plate.

[0010] Furthermore, when the placement rack rotates into the cleaning tank, the limit rack is located below the connecting rack, and the first driving member includes a first driving motor, a driving wheel, a driven wheel and a rotating roller. The rotating roller is rotatably arranged between two second connecting plates parallel to the second hollow rod, and the driven wheel is coaxially connected to one end of the rotating roller. The driving wheel is rotatably arranged on the inner wall of the cleaning tank, and the first driving motor is fixedly arranged on the outer wall of the cleaning tank and is transmission-connected to the driving wheel. The driving wheel is supported by the driven wheel on the placement rack rotated into the cleaning tank and is frictionally driven by the driven wheel, and the rotating roller is used for rolling contact with the edge of the silicon wafer.

[0011] Furthermore, the outer wall of the rotating roller is provided with a friction sleeve, and the friction sleeve is made of rubber material.

[0012] Furthermore, two rotating rollers are arranged in parallel on the limiting frame, two driving wheels are arranged in the cleaning tank, a synchronous belt is wound around the two driving wheels, and the two driving wheels on the placement frame rotating into the cleaning tank are in contact with the synchronous belt.

[0013] Furthermore, a connecting arm is fixedly provided on the first connecting plate, one end of the connecting arm away from the first connecting plate is hinged to the support frame, and a second driving motor for driving the connecting arm to rotate is provided on the support frame.

[0014] Furthermore, a mounting frame is arranged on the support frame above the cleaning tank, and a plurality of spray heads facing the cleaning tank are arranged on the mounting frame. The spray heads are externally connected to a liquid storage barrel containing cleaning liquid through a water pump.

[0015] The beneficial effects of the utility model are as follows: when cleaning silicon wafers, the silicon wafers are placed in each placement slot on the placement rack in turn, the limiting rack is connected to the connecting rack to limit the silicon wafers in the placement rack, and then the placement rack is flipped into the cleaning tank, and the impurities on the surface of the silicon wafer are cleaned by the cleaning liquid and the ultrasonic generator in the cleaning tank, and the rotating roller on the limiting rack rotates to drive the silicon wafer to rotate in the placement rack, thereby improving the cleaning effect of the silicon wafer, avoiding mutual friction between the silicon wafers, and protecting the silicon wafers during the cleaning process. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall structure of the cleaning equipment according to an embodiment of the present application.

[0017] Figure 2 for Figure 1 A partial enlarged schematic diagram of part A.

[0018] Figure 3 This is a structural schematic diagram of the placement rack of an embodiment of the present application cleaning silicon wafers in a cleaning tank.

[0019] Among them, 1. support frame; 11. cleaning tank; 111. ultrasonic generator; 12. placement table; 2. placement frame; 21. connecting frame; 211. first connecting plate; 212. first hollow rod; 213. first limit plate group; 22. limit frame; 221. second connecting plate; 222. second hollow rod; 223. second limit plate group; 23. placement tank; 31. first drive motor; 32. drive wheel; 33. driven wheel; 34. rotating roller; 35. synchronous belt; 41. bolt column; 42. connecting slot; 43. butterfly nut; 44. limit slot; 51. connecting arm; 52. second drive motor; 61. mounting frame; 62. sprinkler head. DETAILED DESCRIPTION

[0020] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0021] The present application discloses a silicon wafer cleaning device, referring to Figure 1 , Figure 2 and Figure 3, including a supporting frame 1 and a placing frame 2, a cleaning tank 11 is provided on the supporting frame 1, the cleaning tank 11 contains cleaning liquid, a plurality of ultrasonic generators 111 are arranged at intervals on the inner side wall of the cleaning tank 11, the placing frame 2 includes a connecting frame 21 and a limiting frame 22, the connecting frame 21 is hinged on the supporting frame 1, the limiting frame 22 is hinged on the connecting frame 21, the limiting frame 22 and the connecting frame 21 are combined to form a space for placing silicon wafers, a placing table 12 for placing the placing frame 2 is provided on one side of the cleaning tank 11 on the supporting frame 1, and the placing frame 2 can be placed in the cleaning tank 11 or on the placing table 12 by rotation.

[0022] A plurality of placement slots 23 for accommodating silicon wafers are arranged at intervals on the connecting frame 21, and the movable end of the limiting frame 22 is detachably connected to the connecting frame 21, and the limiting frame 22 is used to limit the silicon wafer from being separated from the placement slot 23. A first driving member for driving the silicon wafer to rotate is arranged on the placement frame 2. When the placement frame 2 is transferred into the cleaning tank 11, the ultrasonic generator 111 is started, and the impurities attached to the surface of the silicon wafer are fully cleaned by ultrasonic waves and cleaning liquid, and the plurality of placement slots 23 arranged at intervals on the connecting frame 21 can be used to isolate each silicon wafer, and the silicon wafer is driven to rotate by the first driving member, so that the impurities on the surface of the silicon wafer can be fully cleaned.

[0023] Specifically, the connecting frame 21 includes two first connecting plates 211, both of which are hinged to the supporting frame 1, and multiple first hollow rods 212 are arranged between the two first connecting plates 211. The multiple first hollow rods 212 are arranged on the first connecting plate 211 along the circumference, and the first connecting plate 211 and the first hollow rods 212 form a hollow frame of a semicircular groove. A plurality of first limiting plate groups 213 are also arranged in parallel and spaced apart between the two first connecting plates 211, and each first limiting plate group 213 includes two limiting plates, and a placement groove 23 for inserting silicon wafers is formed between the two limiting plates, which is used to space multiple silicon wafers.

[0024] The limiting frame 22 includes two second connecting plates 221, one end of each of the two second connecting plates 221 is hinged on the connecting frame 21, and a plurality of second hollow rods 222 are arranged circumferentially between the two second connecting plates 221. The second connecting plates 221 and the second hollow rods 222 constitute a hollow frame similar to the connecting frame 21. A plurality of second limiting plate groups 223 are arranged in parallel and spaced apart between the two second connecting plates 221, and each second limiting plate group 223 includes two limiting plates, and the two limiting plates in the second limiting plate group 223 correspond to the two limiting plates in the first limiting plate group 213 in one-to-one position. The limiting plates in the first limiting plate group 213 and the second limiting plate group 223 can both be made of PC material, and the edges of the limiting plates are rounded to prevent the limiting plates from causing wear on the rotating silicon wafer.

[0025] In the embodiment of the present application, the movable end of the second connecting plate 221 is detachably connected to the end of the first connecting plate 211 through a connecting member, and the connecting member includes a bolt column 41 vertically fixedly arranged on the side wall of the second connecting plate 221, and the movable end of the first connecting plate 211 is provided with a connecting groove 42 for the bolt column 41 to slide into, and a butterfly nut 43 is threadedly connected to the bolt column 41, and a limiting groove 44 is fixedly arranged on a side of the first connecting plate 211 away from the second connecting plate 221. When the movable end of the limiting frame 22 is connected to the connecting frame 21, the limiting frame 22 is rotated so that the threaded column on the limiting frame 22 is embedded in the connecting groove 42, and then the butterfly nut 43 is tightened so that the butterfly nut 43 matches the limiting groove 44, so that the movable end of the limiting frame 22 is connected and fixed to the movable end of the connecting frame 21.

[0026] Reference Figure 3 In the embodiment of the present application, when the placement rack 2 is rotated into the cleaning tank 11, the limit rack 22 is located below the connecting rack 21. The first driving member can be specifically composed of a first driving motor 31, a driving wheel 32, a driven wheel 33 and a rotating roller 34. The rotating roller 34 is rotatably arranged between two second connecting plates 221 parallel to the second hollow rod 222. After the limit rack 22 is combined with the connecting rack 21 and rotated into the cleaning tank 11, the silicon wafer rolls on the rotating roller 34. The driven wheel 33 is coaxially connected to one end of the rotating roller 34. The driving wheel 32 is rotatably arranged on the inner wall of the cleaning tank 11. The first driving motor 31 is fixedly installed on the outer wall of the cleaning tank 11 by bolts. The output end of the first driving motor 31 is connected to the driving wheel 32 through a toothed belt. The driving wheel 32 is supported by the driven wheel 33 on the placement rack 2 rotated into the cleaning tank 11 and is frictionally driven with the driven wheel 33. The rotating roller 34 is used to roll with the edge of the silicon wafer.

[0027] In order to enable the rotating roller 34 to support the silicon wafer more evenly and avoid the silicon wafer from contacting the surrounding first hollow rod 212 and second hollow rod 222 to cause wear of the silicon wafer, in the embodiment of the present application, two rotating rollers 34 are arranged in parallel on the limiting frame 22. In order to simultaneously support and drive the two rotating rollers 34 to rotate, two driving wheels 32 are arranged in the cleaning tank 11, and a synchronous belt 35 is wound around the two driving wheels 32. The two driving wheels 32 on the placement frame 2 that rotates into the cleaning tank 11 are both in contact with the synchronous belt 35.

[0028] In order to enable the rotating roller 34 to drive the silicon wafer to rotate more accurately, the outer wall of the rotating roller 34 may be covered with a friction sleeve made of rubber material to increase the friction between the rotating roller 34 and the silicon wafer.

[0029] In the embodiment of the present application, a connecting arm 51 is fixedly provided on the first connecting plate 211, and one end of the connecting arm 51 away from the first connecting plate 211 is hinged to the support frame 1. A second driving motor 52 for driving the connecting arm 51 to rotate is provided on the support frame 1, and the second driving motor 52 can be in transmission connection with the connecting arm 51. The second driving motor 52 can be used to drive the placement frame 2 to automatically flip into the cleaning tank 11 and automatically flip from the cleaning tank 11 to the placement table 12.

[0030] Furthermore, in order to clean the cleaning liquid containing impurities adhering to the surface of the silicon wafer when the silicon wafer is taken out of the cleaning tank, a mounting frame 61 can also be set above the cleaning tank on the support frame 1, and a plurality of spray heads 62 facing the cleaning tank are set on the mounting frame 61, and the water inlet end of the spray head 62 is connected to a liquid storage tank containing cleaning liquid through a water pump. It should be understood by those skilled in the art that although the preferred embodiments of the utility model have been described, once those skilled in the art know the basic creative concept, they can make additional changes and modifications to these embodiments. Therefore, the attached claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the utility model. Obviously, those skilled in the art can make various changes and modifications to the utility model without departing from the spirit and scope of the utility model. In this way, if these modifications and variations of the utility model fall within the scope of the claims of the utility model and their equivalent technologies, the utility model is also intended to include these modifications and variations.

Claims

1. A silicon wafer cleaning device, characterized in that: The invention comprises a support frame (1) and a placement frame (2). The top of the support frame (1) is provided with a cleaning tank (11), the cleaning tank (11) contains cleaning liquid, a plurality of ultrasonic generators (111) are arranged horizontally at intervals on the side wall of the cleaning tank (11), the placement frame (2) comprises a connecting frame (21) and a limiting frame (22), the connecting frame (21) is hingedly arranged on the support frame (1), a plurality of placement tanks (23) for accommodating silicon wafers are arranged at intervals on the connecting frame (21), the limiting frame (22) is hingedly arranged on the connecting frame (21), the movable end of the limiting frame (22) is detachably connected to the connecting frame (21), the limiting frame (22) is used to limit the silicon wafer from being separated from the placement tank (23), the placement frame (2) is provided with a first driving member for driving the silicon wafer to rotate, and a placement table (12) is arranged on one side of the cleaning tank (11) on the support frame (1).

2. A silicon wafer cleaning device according to claim 1, characterized in that: The connecting frame (21) comprises two first connecting plates (211), the two first connecting plates (211) are hinged to the supporting frame (1), a plurality of first hollow rods (212) are arranged along the circumference between the two first connecting plates (211), and a plurality of first limiting plate groups (213) are arranged in parallel and at intervals between the two first connecting plates (211), each first limiting plate group (213) comprises two limiting plates, and a placement groove (23) for embedding a silicon wafer is formed between the two limiting plates; The limiting frame (22) comprises two second connecting plates (221), one end of each of the two second connecting plates (221) is hinged on the connecting frame (21), a plurality of second hollow rods (222) are arranged in a circle between the two second connecting plates (221), and a plurality of second limiting plate groups (223) are arranged in parallel and at intervals between the two second connecting plates (221), each second limiting plate group (223) comprises two limiting plates, and the two limiting plates in the second limiting plate group (223) correspond to the two limiting plates in the first limiting plate group (213) in a one-to-one manner.

3. A silicon wafer cleaning device according to claim 2, characterized in that: The movable end of the second connecting plate (221) is detachably connected to the end of the first connecting plate (211) via a connecting piece, the connecting piece comprising a bolt column (41) vertically fixedly arranged on the side wall of the second connecting plate (221), the movable end of the first connecting plate (211) is provided with a connecting groove (42) for the bolt column (41) to slide into, a butterfly nut (43) is threadedly connected to the bolt column (41), and a limiting groove (44) for matching the butterfly nut (43) is fixedly arranged on a side of the first connecting plate (211) away from the second connecting plate (221).

4. The silicon wafer cleaning device according to claim 2, characterized in that: When the placement rack (2) rotates into the cleaning tank (11), the limit rack (22) is located below the connecting rack (21); the first driving member comprises a first driving motor (31), a driving wheel (32), a driven wheel (33) and a rotating roller (34); the rotating roller (34) is rotatably arranged between two second connecting plates (221) parallel to the second hollow rod (222); the driven wheel (33) is coaxially connected to one end of the rotating roller (34); the driving wheel (32) is rotatably arranged on the inner wall of the cleaning tank (11); the first driving motor (31) is fixedly arranged on the outer wall of the cleaning tank (11) and is transmission-connected to the driving wheel (32); the driving wheel (32) supports the driven wheel (33) on the placement rack (2) rotated into the cleaning tank (11) and is frictionally driven with the driven wheel (33); the rotating roller (34) is used for rolling contact with the edge of the silicon wafer.

5. The silicon wafer cleaning device according to claim 4, characterized in that: The outer wall of the rotating roller (34) is provided with a friction sleeve, and the friction sleeve is made of rubber.

6. The silicon wafer cleaning device according to claim 4, characterized in that: Two rotating rollers (34) are arranged in parallel on the limiting frame (22), two driving wheels (32) are arranged in the cleaning tank (11), a synchronous belt (35) is wound around the two driving wheels (32), and the two driving wheels (32) on the placement frame (2) rotating into the cleaning tank (11) are both in contact with the synchronous belt (35).

7. The silicon wafer cleaning device according to claim 4, characterized in that: A connecting arm (51) is fixedly arranged on the first connecting plate (211), one end of the connecting arm (51) away from the first connecting plate (211) is hinged to the support frame (1), and a second driving motor (52) for driving the connecting arm (51) to rotate is arranged on the support frame (1).

8. The silicon wafer cleaning device according to claim 7, characterized in that: A mounting frame (61) is arranged on the support frame (1) above the cleaning tank, and a plurality of spray heads (62) facing the cleaning tank are arranged on the mounting frame (61). The spray heads (62) are externally connected to a liquid storage barrel containing cleaning liquid through a water pump.

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