Photovoltaic silicon wafer scribing mechanism

Abstract

The utility model relates to the technical field of photovoltaic silicon wafers, in particular to a photovoltaic silicon wafer scribing mechanism which comprises a base, a bearing platform is fixedly installed on the base, two placing plates are fixedly installed on the bearing platform, the placing plates are square plates, a moving mechanism is installed on the bearing platform, and the moving mechanism is arranged on the bearing platform. A support is installed on the moving mechanism, the support is in an arch shape, an air cylinder is fixedly installed at the top end of the support, a piston rod end of the air cylinder penetrates through the support and is fixedly provided with a box body, an adjusting mechanism is installed in the box body, and a laser transmitter is installed on the adjusting mechanism. According to the utility model, the two placing plates are arranged and matched with the moving mechanism, so that the photovoltaic silicon wafer can be conveniently and alternately scribed, the scribing efficiency can be improved, the time waste caused by replacing the photovoltaic silicon wafer can be reduced, and the position of the laser transmitter can be conveniently adjusted and the scribing of the photovoltaic silicon wafer can be facilitated by arranging the adjusting mechanism.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaic silicon wafers, in particular to a photovoltaic silicon wafer scribing mechanism. Background Art

[0002] Photovoltaic silicon wafers, that is, solar-grade monocrystalline silicon wafers, are important materials for preparing photovoltaic crystalline silicon cells. They are located in the middle of the photovoltaic industry chain, with silicon materials upstream and battery cells downstream.

[0003] With the rapid development of the photovoltaic industry, higher requirements are placed on the processing accuracy and efficiency of photovoltaic silicon wafers. Existing photovoltaic silicon wafers are diced using lasers, but when the photovoltaic silicon wafers are replaced, the dicing mechanism needs to be stopped, resulting in a waste of time and reduced efficiency. Utility Model Content

[0004] The utility model aims to solve the above-mentioned shortcomings in the prior art and proposes a photovoltaic silicon wafer scribing mechanism.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A photovoltaic silicon wafer scribing mechanism is designed, comprising a base, a support platform is fixedly mounted on the base, a placement plate is fixedly mounted on the support platform, two placement plates are in the shape of square plates, a moving mechanism is mounted on the support platform, a bracket is mounted on the moving mechanism, the bracket is in the shape of an arch, a cylinder is fixedly mounted on the top of the bracket, a piston rod end of the cylinder passes through the bracket and is fixedly mounted on a box body, an adjustment mechanism is mounted in the box body, and a laser emitter is mounted on the adjustment mechanism.

[0007] Furthermore, the moving mechanism includes a first motor, the first motor is fixedly mounted on the support platform, a first screw rod is fixedly mounted on the rotating shaft end of the first motor, and the bracket is threadedly connected to the first screw rod.

[0008] Furthermore, a vertical plate is fixedly mounted on the support platform, the vertical plate is in the shape of a square plate, and the first screw rod is rotatably connected to the side surface of the vertical plate through a bearing.

[0009] Furthermore, a sliding rod is fixedly mounted on the support platform, and the bracket slides on the surface of the sliding rod, and the shape of the sliding rod is arched.

[0010] Furthermore, the adjustment mechanism includes a second motor, and the second motor is fixedly installed in the box.

[0011] Furthermore, a second screw rod is fixedly mounted on the rotating shaft end of the second motor, and one end of the second screw rod is rotatably connected to the inner wall of the box body through a bearing.

[0012] Furthermore, a slider is threadedly connected to the second screw rod, and the slider is in the shape of a square block. The slider slides in the box, and the laser transmitter is fixedly mounted on the slider.

[0013] The utility model proposes a photovoltaic silicon wafer scribing mechanism, which has the beneficial effects that: the utility model is provided with two placement plates, which cooperate with the moving mechanism to facilitate alternate scribing of photovoltaic silicon wafers, which is beneficial to improving the scribing efficiency and reducing the time waste caused by replacing photovoltaic silicon wafers. By providing an adjustment mechanism, the position of the laser emitter is easily adjusted, which is beneficial to the scribing of photovoltaic silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0015] Figure 2 This is a rear view of the overall structure of the utility model;

[0016] Figure 3 It is a top view of the overall structure of the utility model;

[0017] Figure 4 It is a schematic diagram of the box body of the present utility model.

[0018] In the figure: 1. base; 21. vertical plate; 22. first screw rod; 23. sliding rod; 24. first motor; 31. second motor; 32. second screw rod; 33. sliding block; 4. bracket; 5. box; 6. cylinder; 7. placement plate; 8. support platform; 9. laser transmitter. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0020] Reference Figure 1-4A photovoltaic silicon wafer scribing mechanism includes a base 1, characterized in that: a support platform 8 is fixedly installed on the base 1, and the support platform 8 is provided to facilitate the installation of a placement plate 7, and a placement plate 7 is fixedly installed on the support platform 8. The number of the placement plates 7 is two, and the photovoltaic silicon wafer is placed on the placement plates 7 for sliding. By providing two placement plates 7 and cooperating with a moving mechanism, it is convenient to alternately scribing the photovoltaic silicon wafer, which is beneficial to improving the scribing efficiency. The placement plate 7 is in the shape of a square plate, and a moving mechanism is installed on the support platform 8. By providing the moving mechanism, it is convenient to move the bracket, thereby realizing the movement of the laser emitter 9, which is beneficial to the scribing of the photovoltaic silicon wafer. A bracket 4 is installed on the moving mechanism. The shape of the bracket 4 is arched. The bracket 4 is provided to facilitate the installation of the cylinder 6. The cylinder 6 is fixedly installed on the top of the bracket 4. The setting of the cylinder 6 is convenient for adjusting the height of the laser emitter 9. The piston rod end of the cylinder 6 passes through the bracket 4 and is fixedly installed with a box 5. The bottom end of the box 5 is opened, and the shape of the box 5 is a square box. An adjusting mechanism is installed in the box 5. The adjusting mechanism is provided to facilitate the position of the laser emitter 9, which is beneficial to the scribing of photovoltaic silicon wafers. A laser emitter 9 is installed on the adjusting mechanism. The laser emitter 9 is used to emit a high-energy laser beam to achieve the purpose of scribing.

[0021] In detail, the moving mechanism includes a first motor 24, which is fixedly mounted on the support platform 8. The first motor 24 has forward and reverse rotation functions. The first motor 24 drives the first screw rod 22 to rotate. The first screw rod 22 is fixedly mounted on the shaft end of the first motor 24. The first screw rod 22 drives the bracket 4 to slide linearly along the surface of the slide rod 23. The bracket 4 is threadedly connected to the first screw rod 22. A vertical plate 21 is fixedly mounted on the support platform 8. The vertical plate 21 is in the shape of a square plate. The setting of the vertical plate 21 is convenient for receiving the rotation of the first screw rod 22. The first screw rod 22 is rotatably connected to the side of the vertical plate 21 through a bearing. A slide rod 23 is fixedly mounted on the support platform 8. The slide rod 23 It serves the purpose of limiting the movement of the bracket 4. The bracket 4 slides on the surface of the slide bar 23. The slide bar 23 is arched. When the photovoltaic silicon wafer on the plate 7 on one side is sliced, the first motor 24 is started. The first motor 24 drives the first screw rod 22 to rotate. The first screw rod 22 drives the bracket 4 to slide linearly along the surface of the slide bar 23. When the bracket 4 moves, it will drive the laser emitter 9 to move until the laser emitter 9 moves to the top of the plate 7 on the other side, so as to slice the photovoltaic silicon wafer on the plate 7 on the other side. During the slicing process, the photovoltaic silicon wafer that has been processed is replaced. Through the above-mentioned arrangement, the time waste caused by replacing the photovoltaic silicon wafer is reduced.

[0022] In more detail, the adjustment mechanism includes a second motor 31, which is fixedly installed in the box body 5. The second motor 31 has forward and reverse rotation functions. The second motor 31 drives the second screw rod 32 to rotate. The second screw rod 32 is fixedly installed on the shaft end of the second motor 31. One end of the second screw rod 32 is rotatably connected to the inner wall of the box body 5 through a bearing. The second screw rod 32 drives the slider 33 to slide linearly along the inner wall of the box body 5. The second screw rod 32 is threaded with the slider 33. The slider 33 is in the shape of a square block. The slider 33 slides in the box body 5. The laser emitter 9 is fixedly installed on the slider 33. When the photovoltaic silicon wafer is diced, the laser emitter 9 is started, and the second motor 31 is started at the same time. The second motor 31 drives the second screw rod 32 to rotate. The second screw rod 32 drives the slider 33 to slide linearly along the inner wall of the box body 5. The slider 33 will drive the laser emitter 9 to move linearly, thereby achieving the purpose of dicing the photovoltaic silicon wafer.

[0023] Working mode: When working, two photovoltaic silicon wafers are placed on the placement plate 7 respectively, and then the laser emitter 9 is started, and the second motor 31 is started at the same time. The second motor 31 drives the second screw rod 32 to rotate, and the second screw rod 32 drives the slider 33 to slide linearly along the inner wall of the box body 5. During the movement of the slider 33, it will drive the laser emitter 9 to move linearly. During the movement, the laser emitter 9 will emit a high-energy laser beam to achieve the purpose of scribing the photovoltaic silicon wafer.

[0024] When the photovoltaic silicon wafer on the placement board 7 on one side is sliced, the first motor 24 is started, the first motor 24 drives the first screw rod 22 to rotate, and the first screw rod 22 drives the bracket 4 to slide linearly along the surface of the slide bar 23. When the bracket 4 moves, it will drive the laser emitter 9 to move until the laser emitter 9 moves to the top of the placement board 7 on the other side, so as to slice the photovoltaic silicon wafer on the placement board 7 on the other side. During the slicing process, the photovoltaic silicon wafer that has been processed is replaced. Through the above arrangement, the time waste caused by replacing the photovoltaic silicon wafer is reduced.

[0025] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A photovoltaic silicon wafer scribing mechanism, comprising a base (1), characterized in that: A support platform (8) is fixedly mounted on the base (1), a placement plate (7) is fixedly mounted on the support platform (8), the number of the placement plates (7) is two, the placement plates (7) are in the shape of a square plate, a moving mechanism is mounted on the support platform (8), a bracket (4) is mounted on the moving mechanism, the bracket (4) is in the shape of an arch, a cylinder (6) is fixedly mounted on the top of the bracket (4), the piston rod end of the cylinder (6) passes through the bracket (4) and is fixedly mounted on a box (5), an adjustment mechanism is mounted inside the box (5), and a laser emitter (9) is mounted on the adjustment mechanism.

2. A photovoltaic silicon wafer scribing mechanism according to claim 1, characterized in that: The moving mechanism comprises a first motor (24), the first motor (24) is fixedly mounted on the support platform (8), a first screw rod (22) is fixedly mounted on the rotating shaft end of the first motor (24), and the bracket (4) is threadedly connected to the first screw rod (22).

3. A photovoltaic silicon wafer scribing mechanism according to claim 2, characterized in that: A vertical plate (21) is fixedly mounted on the support platform (8), and the vertical plate (21) is in the shape of a square plate. The first screw rod (22) is rotatably connected to the side surface of the vertical plate (21) via a bearing.

4. A photovoltaic silicon wafer scribing mechanism according to claim 1, characterized in that: A sliding rod (23) is fixedly mounted on the support platform (8), and the bracket (4) slides on the surface of the sliding rod (23). The shape of the sliding rod (23) is arched.

5. A photovoltaic silicon wafer scribing mechanism according to claim 4, characterized in that: The adjustment mechanism comprises a second motor (31), and the second motor (31) is fixedly installed in the box (5).

6. A photovoltaic silicon wafer scribing mechanism according to claim 5, characterized in that: A second screw rod (32) is fixedly mounted on the rotating shaft end of the second motor (31), and one end of the second screw rod (32) is rotatably connected to the inner wall of the box body (5) via a bearing.

7. A photovoltaic silicon wafer scribing mechanism according to claim 6, characterized in that: A slider (33) is threadedly connected to the second screw rod (32). The slider (33) is in the shape of a square block. The slider (33) slides in the box (5). The laser transmitter (9) is fixedly mounted on the slider (33).

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