Drilling equipment for ceramic circuit board
By designing the coordination of the slidable placement table and plywood, the problem of inconvenience in replacing ceramic circuit boards is solved, convenient replacement and stable fixation of ceramic substrates are achieved, and production efficiency is improved.
Patent Information
- Application Number
- CN202421708144.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-18
- Publication Date
- 2025-05-23
- Estimated Expiration
- 2034-07-18
AI Technical Summary
The placement of the ceramic circuit board drilling equipment is inside the machine, which makes it inconvenient to replace the ceramic circuit board.
A slidable placement table is designed to fix and replace the ceramic substrate through the cooperation of the ply plate and elastic parts, ensuring that the ceramic substrate is convenient to replace without affecting the drilling.
Through the design of the slidable placement table and plywood, the ceramic substrate is conveniently replaced, the production efficiency is improved, and the stable fixation of the ceramic substrate is ensured, avoiding inaccuracy caused by substrate movement during drilling.
Smart Images
Figure CN222890713U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of ceramic circuit board production equipment, in particular to a drilling device used for ceramic circuit boards. Background Art
[0002] Ceramic circuit boards are circuit boards that use ceramic materials as substrates to make electronic components. Unlike traditional glass fiber or plastic substrates, ceramic materials have excellent stability and reliability, can maintain stable circuit performance under high temperature and extreme environments, have excellent high temperature resistance and excellent insulation properties, and have broad application prospects in industry, military, aerospace and other fields.
[0003] The production of ceramic circuit boards requires steps such as design, substrate preparation, printing, metallization, and drilling. Drilling is the process of using drilling equipment to drill holes in the ceramic substrate to form wire through holes and mounting holes that connect different layers. Since the placement table of the ceramic circuit board drilling equipment is inside the machine, it is inconvenient to fix and remove the ceramic circuit boards. Utility Model Content
[0004] In order to overcome the disadvantage that ceramic circuit boards are inconvenient to replace, a drilling device for ceramic circuit boards that is convenient to replace is provided.
[0005] A drilling device for ceramic circuit boards includes a laser machine, an upper door, a lower door, a placement rack, a placement table, a clamp, an elastic member, a handle and a collection frame. The laser machine is provided with an upper door and a lower door, a placement rack is installed in the laser machine, a slide groove is opened on the placement rack, the placement table is slidably connected in the slide groove, a clamp is slidably connected to the front end of the placement table, a handle is fixedly connected to the front end of the clamp, an elastic member is sleeved on the clamp, one end of the elastic member is fixedly connected to the clamp, and the other end is fixedly connected to the placement table, and a collection frame is slidably connected to the bottom of the laser machine.
[0006] Furthermore, a buffer plate is included, and the buffer plate is connected to the rear end of the clamping plate.
[0007] Furthermore, it also includes a fixed block, a pressure plate, a rotating plate and a pressure spring. The fixed blocks are slidably connected to the left and right sides of the placing table, threaded rods are arranged at the front and back parts of the fixed block, a pressure plate is slidably connected to the bottom of the threaded rod, a rotating plate is threadedly connected to the top of the threaded rod, and a pressure spring is sleeved in the middle of the threaded rod, one end of the pressure spring is fixedly connected to the pressure plate, and the other end is fixedly connected to the bottom of the rotating plate.
[0008] Furthermore, it also includes an extrusion block, which is fixedly connected to the left and right sides of the placement table. The front end of the extrusion block is provided with an inclined surface, which is slidably connected to the outer end of the fixed block.
[0009] Furthermore, a protective plate is included, which is slidably connected to the front part of the placement rack and contacts the front end of the placement table.
[0010] Furthermore, it also includes a filter plate, which is arranged in the collection frame.
[0011] The beneficial effects of the utility model are:
[0012] The utility model uses a slidable placement table to move the material replacement position outward, and fixes the ceramic substrate through the clamping plate, so as to achieve the purpose of conveniently replacing the ceramic substrate without affecting the drilling. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.
[0014] Figure 2 It is a three-dimensional structural sectional view of the utility model.
[0015] Figure 3 The utility model is a schematic diagram of the connection structure of the clamping plate, the buffer plate and the elastic member.
[0016] Figure 4 It is a schematic diagram of the connection structure of the pressing plate, the rotating plate and the pressure spring of the utility model.
[0017] Figure 5 It is a schematic diagram of the connection structure of the fixing block, the extrusion block and the protective plate of the utility model.
[0018] In the accompanying drawings: 1_laser machine, 101_upper door, 102_lower door, 2_placing rack, 201_slide, 3_placing table, 4_clamp, 5_buffer plate, 6_elastic member, 7_handle, 8_fixing block, 9_pressing plate, 10_turning plate, 11_pressure spring, 12_extrusion block, 13_protective plate, 14_collection frame, 15_filter plate. DETAILED DESCRIPTION
[0019] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments.
[0020] Embodiment: A drilling device for a ceramic circuit board, such as Figure 1-Figure 3As shown, it includes a laser machine 1, an upper door 101, a lower door 102, a placement rack 2, a placement table 3, a splint 4, an elastic member 6, a handle 7 and a collection frame 14. The laser machine 1 includes a shell and a laser emitting device, and a controller for setting a cutting route. The upper door 101 and the lower door 102 are installed on the laser machine 1. The placement rack 2 is installed in the laser machine 1. A slide groove 201 is opened on the placement rack 2. The placement table 3 is slidably connected in the slide groove 201. The placement rack 2 and the placement table 3 are interference fit. The front end of the placement table 3 is slidably connected with a splint 4. The front end of the splint 4 is fixedly connected with a handle 7. An elastic member 6 is sleeved on the splint 4. One end of the elastic member 6 is fixedly connected to the splint 4, and the other end is fixedly connected to the placement table 3. A collection frame 14 is slidably connected to the bottom of the laser machine 1.
[0021] like Figure 3 As shown, a buffer plate 5 is also included, and the buffer plate 5 is connected to the rear end of the clamping plate 4.
[0022] The staff opens the upper door 101. Since the placement rack 2 and the placement table 3 are interference-connected, the placement table 3 needs to be manually pulled out from the placement rack 2. Then, the ceramic substrate to be drilled is placed on the placement table 3. The rear end of the ceramic substrate is against the rear end of the placement table 3. The handle 7 is pulled to move the clamp 4 outward and compress the elastic member 6, so that the front end of the ceramic substrate can fall. After releasing the handle 7, the elastic member 6 rebounds to clamp the ceramic substrate. After pushing the placement table 3 in, the upper door 101 is closed, and the laser machine 1 is turned on to drill the ceramic substrate according to the set route. Since the final product specifications are different, multiple final products need to be reasonably planned on a ceramic substrate. The drilling process The waste material in the process falls into the collection frame 14. After the processing is completed, the lower door 102 is opened to clean the collection frame 14. After the drilling of the ceramic substrate is completed, the laser machine 1 is turned off, the upper door 101 is opened, and the placement table 3 is pulled out by the handle 7. When the front end of the placement table 3 contacts the placement frame 2, the handle 7 is continued to be pulled. At this time, the elastic member 6 is compressed, and the clamp 4 is separated from the ceramic substrate. The ceramic substrate after drilling is removed, and the ceramic substrate to be drilled is placed. After the material replacement is completed, the handle 7 is released, and the elastic member 6 rebounds to make the clamp 4 fix the ceramic substrate, and then drilling is performed. Moreover, when the clamp 4 is fixing the ceramic substrate, the buffer plate 5 at the rear end of the clamp 4 is compressed to further optimize the fixing effect of the ceramic substrate.
[0023] like Figure 4 As shown, it also includes a fixed block 8, a pressure plate 9, a rotating plate 10 and a pressure spring 11. The fixed blocks 8 are slidably connected to the left and right sides of the placement table 3, and threaded rods are arranged at the front and back parts of the fixed block 8. The pressure plate 9 is slidably connected to the bottom of the threaded rod, and the rotating plate 10 is threadedly connected to the top of the threaded rod. A pressure spring 11 is sleeved in the middle of the threaded rod, and one end of the pressure spring 11 is fixedly connected to the pressure plate 9, and the other end is fixedly connected to the bottom of the rotating plate 10.
[0024] like Figure 5 As shown, an extrusion block 12 is also included. The extrusion blocks 12 are fixedly connected to the left and right sides of the placement table 3. The front end of the extrusion block 12 is provided with an inclined surface, which is slidably connected to the outer end of the fixed block 8.
[0025] like Figure 5 As shown, a protective plate 13 is also included. The protective plate 13 is slidably connected to the front of the placement rack 2 and contacts the front end of the placement table 3.
[0026] When fixing the ceramic substrate, the fixing block 8 moves to the left and right sides. After the clamping plate 4 fixes the ceramic substrate, the fixing block 8 is pushed toward the middle and the pressure plate 9 is lifted so that the pressure plate 9 is located above the ceramic substrate. After the fixing block 8 is in contact with the ceramic substrate, the rotating plate 10 is rotated to compress the pressure spring 11. The pressure spring 11 presses down the pressure plate 9, thereby clamping both sides of the ceramic substrate. When the placement rack 2 controls the placement table 3 to move, the ceramic substrate will not move. When the placement table 3 is pushed inward, the outer side of the fixing block 8 contacts the extrusion block 12, which can limit the fixing block 8 from moving outward. Therefore, when the placement rack 2 controls the placement table 3 to move, the ceramic substrate will not be pulled due to the movement of the fixing block 8, and the movement of the ceramic substrate is further limited to ensure that its position will not change. After the placement table 3 is fully pushed in, the protective plate 13 is inserted. The protrusions on the placement rack 2 can further limit the sliding of the placement table 3, and the ceramic substrate is more stable during processing.
[0027] like Figure 2 As shown, a filter plate 15 is also included. The filter plate 15 is arranged in the collection frame 14. Coolant is used during the drilling process. The coolant remains on the filter plate 15, while debris is blocked by the filter plate 15, thereby achieving solid-liquid separation and facilitating subsequent cleaning.
[0028] The above is a detailed introduction to the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for general technical personnel in this field, according to the idea of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.
Claims
1. A drilling device for ceramic circuit boards, characterized in that: The invention comprises a laser machine (1), an upper door (101), a lower door (102), a placement frame (2), a placement table (3), a clamp (4), an elastic member (6), a handle (7) and a collection frame (14); the upper door (101) and the lower door (102) are installed on the laser machine (1); the placement frame (2) is installed in the laser machine (1); a slide groove (201) is opened on the placement frame (2); the placement table (3) is slidably connected in the slide groove (201); a clamp (4) is slidably connected to the front end of the placement table (3); a handle (7) is fixedly connected to the front end of the clamp (4); an elastic member (6) is sleeved on the clamp (4); one end of the elastic member (6) is fixedly connected to the clamp (4) and the other end is fixedly connected to the placement table (3); and a collection frame (14) is slidably connected to the bottom of the laser machine (1).
2. The drilling device for ceramic circuit boards according to claim 1, characterized in that: It also includes a buffer plate (5), which is connected to the rear end of the clamping plate (4).
3. The drilling device for ceramic circuit boards according to claim 2, characterized in that: The utility model also comprises a fixed block (8), a pressure plate (9), a rotating plate (10) and a pressure spring (11). The fixed block (8) is slidably connected to the left and right sides of the placing platform (3). Threaded rods are arranged at the front and rear parts of the fixed block (8). The bottom of the threaded rod is slidably connected to the pressure plate (9). The top of the threaded rod is threadedly connected to the rotating plate (10). A pressure spring (11) is sleeved in the middle of the threaded rod. One end of the pressure spring (11) is fixedly connected to the pressure plate (9) and the other end is fixedly connected to the bottom of the rotating plate (10).
4. The drilling device for ceramic circuit boards according to claim 3, characterized in that: It also includes an extrusion block (12) which is fixedly connected to the left and right sides of the placement platform (3). The front end of the extrusion block (12) is provided with an inclined surface which is slidably connected to the outer end of the fixed block (8).
5. The drilling device for ceramic circuit boards according to claim 4, characterized in that: It also includes a protection plate (13), which is slidably connected to the front of the placement rack (2) and contacts the front end of the placement table (3).
6. The drilling device for ceramic circuit boards according to claim 5, characterized in that: It also includes a filter plate (15), which is arranged in the collection frame (14).