Clamp for wafer laser precision cutting

Abstract

The utility model discloses a clamp for wafer laser precision cutting, which relates to the technical field of wafer processing and comprises a base plate, a sucker mounted at the top of a connecting rod, a connecting piece fixedly connected to the bottom of the connecting rod, a rebound piece fixedly connected to the bottom of a cavity, and a spring mounted on the sleeve at the bottom of the connecting rod. Side plates are fixedly connected to the two sides of the sleeve, telescopic rods are installed in the side plates, springs are arranged on the surfaces of the telescopic rods in a sleeving mode, trapezoidal clamping blocks are fixedly connected to the positions, located at the output ends of the telescopic rods, of one ends of the springs, and the trapezoidal clamping blocks are located in the sleeve and movably connected with the sleeve. According to the clamp for wafer laser precision cutting, wafers with different diameters can be fixed by arranging the connecting pieces and the rebounding pieces, meanwhile, the number of the used connecting rods can be flexibly adjusted according to the specifications of the wafers, and therefore waste of energy of an air extracting pump is avoided, and the work efficiency is improved. And the problem that a wafer with a larger specification cannot be fixed in the prior art is further solved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a fixture for wafer laser precision cutting. Background Art

[0002] A wafer is a circular thin sheet used in the manufacture of semiconductor devices, generally made of single crystal silicon. In the modern electronics manufacturing industry, wafers are usually used as production materials for semiconductor products, so the wafers need to be processed and treated multiple times. These processing techniques require fine precision control of the wafers and guarantee of processing accuracy to ensure product performance. Therefore, laser precision cutting is required. When cutting it, a clamp is generally required to fix it to prevent it from shifting during the cutting process, thereby affecting the cutting accuracy.

[0003] After searching, the Chinese patent with the existing authorization announcement number CN216680756U discloses a fixture for wafer laser precision cutting, which fixes the wafer by adopting negative pressure to prevent the surface of the wafer from being scratched during the clamping or pressing process. However, in the above-mentioned prior art, multiple groups of wafers to be cut are placed on the surface of the abutment column in sequence, and the diameter of the top of the abutment column is a fixed style. Therefore, it can only fix wafers of specified specifications, and cannot fix wafers with slightly larger diameters, which is quite restrictive. Utility Model Content

[0004] In view of the problem that the prior art can only fix wafers of specified specifications but cannot fix wafers with slightly larger diameters, which is quite restrictive, the present utility model is proposed.

[0005] Therefore, the purpose of the utility model is to provide a fixture for wafer laser precision cutting, the purpose of which is to solve the problem that it can only fix wafers of specified specifications and cannot fix wafers with slightly larger diameters, which is quite restrictive.

[0006] In order to solve the above technical problems, the utility model provides the following technical solutions: a fixture for wafer laser precision cutting, which includes a substrate, a chamber installed on the top of the substrate, a top cover installed on the top of the chamber, and a connecting rod movably sleeved inside the chamber, a suction cup is installed on the top of the connecting rod, a connecting piece is fixedly connected to the bottom of the connecting rod, a rebound piece is fixedly connected to the bottom of the chamber, the connecting piece includes a sleeve installed at the bottom of the connecting rod, side plates are fixedly connected on both sides of the sleeve, a telescopic rod is installed inside the side plate, a spring is sleeved on the surface of the telescopic rod, a trapezoidal block is fixedly connected to one end of the spring and located at the output end of the telescopic rod, the trapezoidal block is located inside the sleeve and movably connected to the sleeve.

[0007] As a preferred solution of the fixture for wafer laser precision cutting described in the utility model, wherein: an isolation plate is installed inside the chamber, the isolation plate is located at the bottom of the top cover, the connecting rod is located inside the isolation plate and movably connected to the isolation plate, and the connecting piece is located at the bottom of the isolation plate.

[0008] As a preferred solution of the fixture for wafer laser precision cutting described in the utility model, the rebound member includes a fixed column fixed inside the chamber, a rebound ring is movably sleeved on the surface of the fixed column, and an arc plate is fixedly connected to the top of the fixed column.

[0009] As a preferred solution of the fixture for wafer laser precision cutting described in the utility model, the outer diameters of the fixed column, the rebound ring and the arc plate are consistent, and a positioning piece is provided on the top of the top cover.

[0010] As a preferred solution of the wafer laser precision cutting fixture described in the utility model, the positioning member includes a first positioning plate and a second positioning plate movably connected to the top of the top cover, the inner sides of the first positioning plate and the second positioning plate are fixedly connected with protrusions, the outer surface of the connecting rod and the top of the sleeve are provided with a groove, the protrusion is located inside the groove and is movably connected to it.

[0011] As a preferred solution of the fixture for wafer laser precision cutting described in the utility model, wherein: the first positioning plate and the second positioning plate are respectively connected to the two sides of the sliding rod and the two-way bolt, the first positioning plate, the second positioning plate and the sliding rod are movably sleeved, the first positioning plate, the second positioning plate are threadedly connected with the two-way bolt, one end of the two-way bolt is located on one side of the second positioning plate and is rotatably connected to a limiting block, and the bottom of the limiting block is fixedly connected to the top cover.

[0012] As a preferred solution of the wafer laser precision cutting fixture described in the utility model, wherein: the bottom of the first positioning plate and the second positioning plate are fixedly connected with a slider, the top of the top cover is provided with a slide groove, the slider is located inside the slide groove and movably connected thereto.

[0013] Beneficial effects of the utility model:

[0014] 1. By providing connecting parts and rebound parts, wafers of different diameters can be fixed, and the number of connecting rods used can be flexibly adjusted according to the specifications of the wafers, thereby avoiding the waste of energy of the vacuum pump, and further solving the problem that slightly larger wafers cannot be fixed in the prior art.

[0015] 2. By providing positioning parts, the use of connecting parts and rebound parts can facilitate the stable fixation of wafers of different diameters and specifications, ensuring the stability of the wafers during cutting. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0017] Figure 1 The figure is a schematic diagram of the overall structure of the fixture for wafer laser precision cutting according to the present invention.

[0018] Figure 2 This is a cross-sectional view of the overall structure of the fixture for wafer laser precision cutting of the present invention.

[0019] Figure 3 This is a diagram showing the overall structure of the fixture for wafer laser precision cutting of the present invention.

[0020] Figure 4 The utility model is a schematic diagram of the position relationship of the connecting rod, suction cup, connecting part and rebound part of the fixture for wafer laser precision cutting.

[0021] Figure 5 This is an exploded view of the connector structure of the fixture for wafer laser precision cutting of the present invention.

[0022] Figure 6 The figure is a schematic diagram showing the position relationship between the top cover and the positioning member of the fixture for wafer laser precision cutting of the present invention.

[0023] Figure 7 This is an exploded view of the positioning component structure of the fixture for wafer laser precision cutting of the utility model.

[0024] Description of reference numerals:

[0025] 1. substrate; 2. chamber; 21. top cover; 22. isolation plate;

[0026] 3. Connecting rod; 31. Suction cup;

[0027] 32. Connecting piece; 321. Sleeve; 322. Side plate; 323. Telescopic rod; 324. Spring; 325. Trapezoidal block;

[0028] 33. rebound member; 331. fixed column; 332. rebound ring; 333. arc plate;

[0029] 4. Positioning member; 41. First positioning plate; 42. Second positioning plate; 43. Protrusion; 44. Groove; 45. Sliding rod; 46. Two-way bolt; 47. Limiting block; 48. Sliding block; 49. Sliding groove. DETAILED DESCRIPTION

[0030] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0031] Reference Figure 1-7 , which is the first embodiment of the utility model, provides a fixture for wafer laser precision cutting, the fixture for wafer laser precision cutting includes a substrate 1, a chamber 2 installed on the top of the substrate 1, a top cover 21 installed on the top of the chamber 2, and a connecting rod 3 movably sleeved inside the chamber 2. An air pump is installed on the surface of the substrate 1 and on one side of the chamber 2, and is connected to the inside of the chamber 2 through a pipeline. This is a prior art and will not be elaborated on here. A suction cup 31 is installed on the top of the connecting rod 3, a connecting piece 32 is fixedly connected to the bottom of the connecting rod 3, and a rebound piece 33 is fixedly connected to the bottom of the chamber 2. The connecting piece 321 and the rebound piece 33 are both arranged in a ring array and correspond to the connecting rod 3 one by one. The suction cup 31 can generate a certain negative pressure while contacting the wafer, so that the wafer is more firmly fixed on the top of the connecting rod 3, and reduce slight deviations during movement, thereby improving the positioning accuracy of cutting;

[0032] The connecting member 32 includes a sleeve 321 installed at the bottom of the connecting rod 3, and side plates 322 are fixedly connected to both sides of the sleeve 321. A telescopic rod 323 is installed inside the side plate 322. A spring 324 is sleeved on the surface of the telescopic rod 323. One end of the spring 324 and the output end of the telescopic rod 323 are fixedly connected to a trapezoidal block 325. The trapezoidal block 325 is located inside the sleeve 321 and is movably connected to it. The bottom inclined surface of the trapezoidal block 325 is set, one end of the telescopic rod 323 is fixed inside the side plate 322, and its output end is fixedly connected to the trapezoidal block 325, and the two ends of the spring 324 are respectively connected to the trapezoidal block 325 and the fixed end of the telescopic rod 323 Fixed connection, through the telescopic characteristics of the telescopic rod 323, the spring 324 can be briefly squeezed or stretched, so as to facilitate the connection and cancellation of the connection with the rebound member 33. At the same time, the inside of the side plate 322 and the two sides of the sleeve 321 are provided with limit grooves for facilitating the movement of the telescopic rod 323, the spring 324, and the trapezoidal block 325, which can limit them and ensure their stability during movement. In addition, the sleeve 32 and the connecting rod 3 are both hollow, which can facilitate the operation of the vacuum pump. At the same time, a sealing ring is installed on the inner side of the bottom of the sleeve 321 to ensure that when it is connected to the rebound member 33, the vacuum pump will not draw air through it, thereby achieving the purpose of saving the vacuum pump energy. The sealing ring is not shown in the figure.

[0033] An isolation plate 22 is installed inside the chamber 2, and the isolation plate 22 is located at the bottom of the top cover 21. The connecting rod 3 is located inside the isolation plate 22 and is movably connected to it. The connecting piece 32 is located at the bottom of the isolation plate 22. The setting of the isolation plate 22 can ensure the sealing of the inside of the chamber 2, and at the same time limit the connecting rod 3 and maintain its stability when it is raised or lowered.

[0034] The rebound member 33 includes a fixed column 331 fixed inside the chamber 2, and a rebound ring 332 is movably sleeved on the surface of the fixed column 331. An arc plate 333 is fixedly connected to the top of the fixed column 331. The setting of the arc plate 333 can limit the rebound ring 332 to prevent it from being disconnected from the fixed column 331, and at the same time facilitate the movement of the trapezoidal block 325. The inclined surface at the bottom of the trapezoidal block 325 and the arc of the arc plate 333 can prevent the connecting member 32 and the rebound member 33 from getting stuck during the connection process, and facilitate the connection between the two.

[0035] The outer diameters of the fixed column 331, the rebound ring 332, and the arc plate 333 are consistent, and a positioning member 4 is provided on the top of the top cover 21. Figure 5 As shown, the outer surface of the fixing column 331 and the bottom of the rebound ring 332 are arc-shaped, and the top and bottom of the rebound ring 332 are also arc-shaped, which can facilitate the movement of the trapezoidal block 325.

[0036] The positioning member 4 includes a first positioning plate 41 and a second positioning plate 42 movably connected to the top of the top cover 21, and a protrusion 43 is fixedly connected to the inner side of the first positioning plate 41 and the second positioning plate 42;

[0037] A groove 44 is provided on the outer surface of the connecting rod 3 and at the top of the sleeve 321. The protrusion 43 is located inside the groove 44 and is movably connected thereto. This facilitates the positioning of the connecting rod 3 and prevents it from falling due to the weight of the wafer or its own weight. The groove 44 is located at the top of the top cover 21.

[0038] The first positioning plate 41 and the second positioning plate 42 are connected to two sides thereof with a sliding rod 45 and a bidirectional bolt 46 respectively;

[0039] The first positioning plate 41 and the second positioning plate 42 are movably connected with the slide bar 45, and the first positioning plate 41 and the second positioning plate 42 are threadedly connected with the bidirectional bolt 46;

[0040] One end of the bidirectional bolt 46 is rotatably connected to a limit block 47 on one side of the second positioning plate 42. The bottom of the limit block 47 is fixedly connected to the top cover 21. The diameters of both ends of the sliding rod 45 are larger than the diameter of the sliding rod 45 itself, and its bottom is fixedly connected to the top cover 21, which can limit the first positioning plate 41 and the second positioning plate 42 to prevent the two from sliding too much and causing the three to separate. At the same time, it can provide a supporting force for the sliding rod 45. The first positioning plate 41 and the second positioning plate 42 are both arc-shaped, which can facilitate the limitation of the connecting rod 3.

[0041] Sliders 48 are fixedly connected to the bottoms of the first positioning plate 41 and the second positioning plate 42. A chute 49 is opened at the top of the top cover 21. The sliders 48 are located inside the chute 49 and are movably connected thereto, which can ensure the stability of the first positioning plate 41 and the second positioning plate 42 during movement, and each group of positioning members 4 corresponds to each group of connecting rods 3 one by one.

[0042] During the use process, the wafer to be cut can be placed with the middle connecting rod 3 as the center point, and the unused connecting rods 3 can be pressed according to the specifications of the wafer or regular wafers such as hexagons. Before pressing the connecting rod 3, the bidirectional bolt 46 can be rotated reversely to drive the first positioning plate 41 and the second positioning plate 42 to move away from each other, and the convex blocks 43 on the inner sides of the two are disconnected from the grooves 44 on the outer surface of the connecting rod 3, so that the positioning of the connecting rod 3 can be cancelled;

[0043] Subsequently, pressure is applied to the unused connecting rod 3 to drive the sleeve 321 to move towards the fixed column 331. During this process, the trapezoidal block 325 inside the sleeve 321 will first contact the arc-shaped plate 333. When the inclined surface at the bottom of the trapezoidal block 3255 contacts the arc surface on the surface of the arc-shaped plate 333, the trapezoidal block 325 will move towards the outside of the sleeve 321, and at the same time, the telescopic rod 323 is squeezed to perform a retraction operation, and the spring 324 is squeezed as the telescopic rod 323 moves until one end of the trapezoidal block 325 is completely located inside the limit grooves on both sides of the sleeve 321, and the sleeve 321 can be completely sleeved on the outside of the fixed column 331;

[0044] At the same time, when the sleeve 321 continues to descend, the trapezoidal block 325 will slowly move to the bottom of the arc-shaped plate 333. When the trapezoidal block 325 is located at the bottom of the arc-shaped plate 333, the spring 324 will restore its deformation, and drive the telescopic rod 323 and the trapezoidal block 325 to move towards the outer surface of the fixed column 331 through the sleeve 321 until one end of the trapezoidal block 325 is located on the outer surface of the fixed column 331. At this time, the trapezoidal block 325 is still located at the bottom of the arc-shaped plate 333, and the adjustment of the connecting rod 3 can be completed, further saving the energy of the air pump, thereby reducing the time waste and downtime during work;

[0045] When fixing a wafer of a larger size, the connecting rod 3 fixed by the connecting piece 32 and the rebound piece 33 is pressed again to repeat the above operation, and the trapezoidal clamping block 325 is located at the bottom of the rebound ring 332. Since both sides of the rebound ring 332 are arc-shaped, and the outer diameters of the fixed column 331, the rebound ring 332, and the arc plate 333 are consistent, the trapezoidal clamping block 325 can make the rebound ring 332 contact with the arc plate 333 and make the outer diameters of the two fit together. In this way, the trapezoidal clamping block 325 can directly cancel the connection with the fixed column 331, and then the connecting rod 3 can be positioned by the positioning piece 4. In this way, the number of connecting rods 3 in use can be flexibly adjusted, and the flexibility of the connecting rod 3 is further improved.

[0046] After the unused number of connecting rods 3 is adjusted, the vacuum pump is started to extract the air inside the chamber 2 through the pipe, so that a negative pressure is formed inside the chamber 2, and the air inside the connecting rod 3 is extracted through the sleeve 321, so that the suction cup 31 firmly adsorbs the wafer on its surface. At the same time, the isolation plate 22 can layer the inside of the chamber 2 to prevent more air from flowing, thereby achieving the purpose of fixing wafers of different specifications, further solving the problem that the prior art can only fix wafers of specified specifications and has great limitations.

[0047] It should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.

Claims

1. A fixture for wafer laser precision cutting, comprising a substrate (1), a chamber (2) mounted on the top of the substrate (1), a top cover (21) mounted on the top of the chamber (2), and a connecting rod (3) movably sleeved inside the chamber (2), characterized in that: A suction cup (31) is installed on the top of the connecting rod (3), a connecting piece (32) is fixedly connected to the bottom of the connecting rod (3), and a rebound piece (33) is fixedly connected to the bottom of the chamber (2); The connecting member (32) comprises a sleeve (321) installed at the bottom of the connecting rod (3), both sides of the sleeve (321) are fixedly connected with side plates (322), a telescopic rod (323) is installed inside the side plate (322), a spring (324) is sleeved on the surface of the telescopic rod (323), one end of the spring (324) and the output end of the telescopic rod (323) is fixedly connected with a trapezoidal block (325), and the trapezoidal block (325) is located inside the sleeve (321) and is movably connected thereto.

2. The fixture for wafer laser precision cutting according to claim 1, characterized in that: An isolation plate (22) is installed inside the chamber (2), and the isolation plate (22) is located at the bottom of the top cover (21). The connecting rod (3) is located inside the isolation plate (22) and is movably connected thereto. The connecting piece (32) is located at the bottom of the isolation plate (22).

3. The fixture for wafer laser precision cutting according to claim 2, characterized in that: The rebound member (33) comprises a fixed column (331) fixed inside the chamber (2), a rebound ring (332) is movably sleeved on the surface of the fixed column (331), and an arc plate (333) is fixedly connected to the top of the fixed column (331).

4. The fixture for wafer laser precision cutting according to claim 3, characterized in that: The outer diameters of the fixing column (331), the rebound ring (332), and the arc-shaped plate (333) are consistent, and a positioning piece (4) is provided on the top of the top cover (21).

5. The fixture for wafer laser precision cutting according to claim 4, characterized in that: The positioning member (4) comprises a first positioning plate (41) and a second positioning plate (42) movably connected to the top of the top cover (21), and the inner sides of the first positioning plate (41) and the second positioning plate (42) are fixedly connected with a protrusion (43); A groove (44) is provided on the outer surface of the connecting rod (3) and located at the top of the sleeve (321), and the protrusion (43) is located inside the groove (44) and is movably connected thereto.

6. The fixture for wafer laser precision cutting according to claim 5, characterized in that: The first positioning plate (41) and the second positioning plate (42) are respectively connected to two sides with a sliding rod (45) and a bidirectional bolt (46); The first positioning plate (41) and the second positioning plate (42) are movably sleeved with the slide bar (45), and the first positioning plate (41) and the second positioning plate (42) are threadedly connected with the bidirectional bolt (46); One end of the bidirectional bolt (46) is rotatably connected to a limiting block (47) located on one side of the second positioning plate (42), and the bottom of the limiting block (47) is fixedly connected to the top cover (21).

7. The fixture for wafer laser precision cutting according to claim 6, characterized in that: The bottoms of the first positioning plate (41) and the second positioning plate (42) are fixedly connected with sliders (48), the top of the top cover (21) is provided with a slide groove (49), and the slider (48) is located inside the slide groove (49) and is movably connected thereto.

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