Crystal cutting device

Abstract

Some embodiments of the specification provide a crystal cutting device, comprising: a clamping assembly for clamping and moving a crystal, the clamping assembly comprising a rotating mechanism for driving the crystal to rotate; the cutting assembly comprises an inner circle cutting blade, a supporting main body and a material receiving piece, the inner circle cutting blade is used for rotationally cutting a crystal to obtain a wafer or a crystal section, the rotating direction of the inner circle cutting blade is opposite to that of the rotating mechanism, the inner circle cutting blade is arranged at the top of the supporting main body, and a containing cavity is formed in the supporting main body; the material receiving part is arranged in the containing cavity and used for receiving the wafer or the wafer segment, the supporting body is provided with an opening communicated with the containing cavity, and the material receiving part can enter or move out of the containing cavity through the opening.

Description

Technical Field

[0001] The present invention relates to the field of crystal cutting technology, and in particular to a crystal cutting device. Background Art

[0002] Crystal materials are generally brittle and hard materials with high value and large crystal size. At present, the inner circle cutting method is generally used for crystal cutting. However, since the crystal may have irregular shapes such as bending, twisting, and elliptical, it will make the crystal difficult to clamp. In addition, the inner circle cutting machine for crystal cutting generally does not have a material removal port. The cut wafers or crystal segments are still in the tool holder. If the machine is stopped to remove the material, the time of stopping and starting the equipment will be wasted, resulting in reduced processing efficiency. If the material is removed without stopping the machine, whether it is taken directly by tools or by the operator's hands, there will be safety risks.

[0003] Based on the above reasons, this specification provides a crystal cutting device, which can clamp the crystal through the designed clamping component to facilitate subsequent cutting processing, and the designed cutting component can safely remove the material without stopping the equipment, thereby improving processing efficiency and reducing the risk of material removal. Utility Model Content

[0004] Some embodiments of the present specification provide a crystal cutting device, comprising: a clamping assembly, the clamping assembly is used to clamp the crystal, the clamping assembly includes a rotating mechanism, the rotating mechanism is used to drive the crystal to rotate; a cutting assembly, the cutting assembly includes: an inner circle cutting blade, a supporting body and a material receiving piece, the inner circle cutting blade is used to rotationally cut the crystal to obtain a wafer or a crystal segment, the rotation direction of the inner circle cutting blade is opposite to the rotation direction of the rotating mechanism, the inner circle cutting blade is arranged on the top of the supporting body; a accommodating cavity is provided in the supporting body, the material receiving piece is arranged in the accommodating cavity, the material receiving piece is used to receive the wafer or the crystal segment, the supporting body is provided with an opening connected to the accommodating cavity, and the material receiving piece can enter or move out of the accommodating cavity through the opening. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] This specification will be further described in the form of exemplary embodiments, which will be described in detail by the accompanying drawings. These embodiments are not restrictive, and in these embodiments, the same number represents the same structure, wherein:

[0006] Figure 1 is a simplified module schematic diagram of a crystal cutting device according to some embodiments of this specification;

[0007] Figure 2 is a schematic diagram of the structure of a clamping assembly according to some embodiments of this specification;

[0008] Figure 3 is a schematic diagram of the structure of a crystal cutting device according to some embodiments of this specification;

[0009] Figure 4 is a simplified structural schematic diagram of a clamping assembly according to some embodiments of this specification;

[0010] Figure 5 is a schematic diagram of the structure of the inner circle cutting blade connected to the supporting body according to some embodiments of this specification;

[0011] Figure 6 It is a schematic diagram of the structure of the connection between the detection component and the material taking component and the material receiving member according to some embodiments of this specification;

[0012] Figure 7 is a schematic diagram of the structure of a crystal cutting device according to other embodiments of this specification;

[0013] Figure 8 yes Figure 7 Schematic diagram of the structure inside the shell.

[0014] Reference numerals: crystal cutting device 100; clamping assembly 11; mounting plate 111; rotating mechanism 112; rotating driving part 1121; rotating transmission part 1122; rotating shaft 11221; pin 11222; coupling 11223; adapter 11224; connecting bearing 1123; connecting nut 1124; clamping mechanism 113; chuck 1131; clamping jaw 1132; horizontal moving mechanism 114; horizontal moving mounting seat 1141; first translation mechanism 1142; first translation motor 11421; first translation lead screw 11422; height adjustment mechanism 115; linear driving part 1151; linear transmission part 1152; lead screw 11521; lead screw nut 11522; housing 116; slide groove 1161; slider 1162; The second hook structure 11621; the spring 1163; the positioning hole 1164; the adjustment mechanism 117; the cutting assembly 12; the supporting body 121; the accommodating chamber 1211; the material receiving piece 122; the connecting part 1221; the first hook structure 12211; the connecting pin 12212; the material receiving part 1222; the opening 123; the first opening 1231; the second opening 1232; the inner circle cutting blade 124; the first center hole 1241; the cutter disc 125; the blade fixing hole 1251; the material picking mechanism 126; the material picking guide rail 1261; the material picking slide 1262; the material picking drive part 1263; the material picking screw 1264; the detection assembly 13; the weight sensor 131; the cooling assembly 14; the liquid reservoir 141; the liquid spray pipe 142; the controller 15; the crystal 200. DETAILED DESCRIPTION

[0015] In order to more clearly illustrate the technical solution of the present application, the following is a brief introduction to the drawings required for the description of the embodiments. Obviously, the drawings described below are only some examples or embodiments of the present specification. For ordinary technicians in this field, the present specification can also be applied to other similar scenarios based on these drawings without creative work. Unless it is obvious from the language environment or otherwise explained, the same reference numerals in the figures represent the same structure or operation.

[0016] As shown in this specification and claims, unless the context clearly indicates an exception, the words "a", "an", "an" and / or "the" do not refer to the singular and may also include the plural, unless the context clearly indicates an exception. Generally speaking, the terms "include" and "comprise" only indicate the inclusion of clearly identified steps and elements, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements. The term "based on" means "at least partially based on". The term "some embodiments" means "at least one embodiment"; the term "other embodiments" means "at least one other embodiment", and the relevant definitions of other terms will be given in the description below.

[0017] In some schemes, the cutting process of crystals generally adopts the inner circle cutting method. The irregular shape of the crystal to be cut (such as a crystal rod) may make it difficult to clamp and fix the crystal, which affects the cutting efficiency to a certain extent. In addition, the tool holder of the inner circle cutting machine for crystal cutting is generally not equipped with a material removal port. The cut wafers or crystal segments are still in the tool holder. If the machine is stopped to remove the material, the time of stopping and starting the equipment will be wasted, resulting in reduced processing efficiency. If the material is removed without stopping the machine, there may be safety risks.

[0018] Some embodiments of the present specification provide a crystal cutting device, which at least includes a clamping component and a cutting component. The clamping component is configured to clamp a crystal (such as a crystal rod) and drive the crystal to rotate in a clamped state for cutting. The cutting component is configured to cut the crystal to obtain a wafer or a crystal segment, and the cutting component includes an inner circle cutting blade for cutting the crystal, a material receiving member for receiving the wafer or the crystal segment, and a supporting body. The rotation direction of the inner circle cutting blade is opposite to the direction in which the rotating mechanism drives the crystal to rotate, thereby increasing the relative cutting speed and shortening the cutting time. The supporting body is provided with a receiving cavity for taking the material, and the material receiving member can be operated to enter or move out of the receiving cavity, and will not contact the structure of the cutting crystal (such as a blade) during the process of entering or moving out of the receiving cavity, so that the wafer or the crystal segment can be safely taken out of the receiving cavity. The crystal cutting device provided in the present specification can clamp the crystal through the clamping component, which is more convenient for moving the crystal and adjusting the clamping angle of the crystal, thereby facilitating subsequent cutting processing. In addition, the design of the cutting assembly in this specification allows the cut wafers or crystal segments to be safely removed without stopping the equipment, which not only improves processing efficiency but also reduces the risk of material removal.

[0019] Figure 1 is a simplified module schematic diagram of a crystal cutting device according to some embodiments of this specification; Figure 2 is a schematic diagram of the structure of a clamping assembly according to some embodiments of this specification; Figure 3 It is a schematic diagram of the structure of a crystal cutting device according to some embodiments of this specification. Figure 4 is a schematic diagram of the structure of the inner circle cutting blade connected to the support body according to some embodiments of this specification. Figure 1-Figure 4As shown, the crystal cutting device 100 includes a clamping assembly 11 and a cutting assembly 12. The clamping assembly 11 is used to clamp the crystal 200. The clamping assembly 11 includes a rotating mechanism 112. The rotating mechanism is used to drive the crystal 200 to rotate. The cutting assembly 12 includes an inner circle cutting blade 124, a supporting body 121, and a material receiving member 122. The inner circle cutting blade 124 is used to rotate and cut the crystal 200 to obtain a wafer or a crystal segment. The rotation direction of the inner circle cutting blade 124 is opposite to the rotation direction of the rotating mechanism 112. The inner circle cutting blade 124 is arranged on the top of the supporting body 121. The supporting body 121 is provided with a receiving cavity 1211. The material receiving member 122 is used to receive the wafer or the crystal segment. The material receiving member 122 is arranged in the receiving cavity 1211. The supporting body 121 is provided with an opening 123 connected to the receiving cavity 1211. The material receiving member 122 can enter or move out of the receiving cavity 1211 through the opening 123. In this embodiment, the crystal 200 to be cut can be clamped by the clamping assembly 11, and the clamped crystal can be moved to the specified cutting position (for example, the top of the cutting assembly 12) driven by the clamping assembly 11, and then the crystal is cut by the inner circle cutting blade 124, and the cut wafer or crystal segment will fall into the accommodating cavity 1211 of the supporting body 121, and will be received by the receiving piece 122 arranged in the accommodating cavity 1211. Since the receiving piece 122 can enter or move out of the accommodating cavity 1211 through the opening, the receiving piece 122 receiving the wafer or crystal segment can be taken out of the accommodating cavity 1211 without stopping the machine, thereby reducing the safety risk of taking materials. In addition, since the rotation directions of the crystal 200 and the inner circle cutting blade 124 are opposite, the relative cutting speed can be increased and the cutting time can be shortened.

[0020] In some embodiments, in combination Figure 2 and Figure 3As shown, the clamping assembly 11 may include a height adjustment mechanism 115, a clamping mechanism 113, and a horizontal movement mechanism 114 that are connected in a transmission manner. The height adjustment mechanism 115 is used to control the clamping mechanism 113 to move in a direction close to or away from the inner circle cutting blade 124 along the height direction of the support body 121, and the horizontal movement mechanism 114 is used to control the clamping mechanism 113 to move in a direction parallel to the plane where the inner circle cutting blade 124 is located. In this embodiment, since the height adjustment mechanism 115, the horizontal movement mechanism 114, and the clamping mechanism 113 are connected in a transmission manner, after the crystal 200 is clamped on the clamping mechanism 113, the distance between the end face of the crystal 200 and the inner circle cutting blade 124 can be adjusted by the height adjustment mechanism 115, thereby adjusting the length of the cut crystal 200 (i.e., the length of the obtained wafer or crystal segment). In addition, the clamping mechanism 113 can be controlled by the horizontal moving mechanism 114 to move in a direction parallel to the plane where the inner circle cutting blade 124 is located, so as to control the crystal 200 to approach or move away from the inner circle cutting blade 124, thereby achieving the feeding and removal of the crystal 200 relative to the inner circle cutting blade 124.

[0021] In some embodiments, the rotating mechanism 112 may include a rotating driving unit 1121 and a rotating transmission unit 1122, the rotating driving unit is connected to the rotating transmission unit 1122, the rotating driving unit 1121 is configured to generate a driving force, and the rotating transmission unit 1122 can drive the clamping mechanism 113 to rotate under the drive of the rotating driving unit 1121. In some embodiments, the rotating driving unit 1121 may include a servo motor, a battery, a motor, etc. In some embodiments, the rotating transmission unit 1122 may include a first connecting member, a rotating shaft 11221, and a second connecting member. The first connecting member 1221 is configured to connect the rotating shaft 11221 and the rotating driving unit 1121, and the second connecting member is configured to connect the rotating shaft 11221 and the clamping mechanism 113. In some embodiments, the first connecting member may include a pin 11222 and a coupling 11223, the rotating shaft 11221 is connected to the pin 11222 via the coupling 11223, the pin 11222 is connected to the output shaft of the rotating drive unit 1121 (e.g., a servo motor), and the rotating drive unit 1121 may drive the rotating shaft 11221 to rotate by driving the pin 11222 to rotate. In some embodiments, the second connecting member may include an adapter 11224, one end of the adapter 11224 is connected to the rotating shaft 11221, and the other end is connected to the clamping mechanism 113, and when the rotating shaft 11221 rotates, the clamping mechanism 113 may be driven to rotate synchronously.

[0022] In some embodiments, the rotating mechanism 112 may also include a connecting bearing 1123 sleeved on the rotating shaft 11221, a connecting nut 1124 arranged at the upper and lower ends of the connecting bearing 1123, and a limiting spring 1125 arranged at the lower end of the connecting bearing 1123. The connecting bearing 1123 can rotate relative to the rotating shaft 11221, and the connecting nuts 1124 at both ends of the connecting bearing 1123 are used to limit the range of axial movement of the connecting bearing 1123 along the rotating shaft 11221. The limiting spring 1125 can abut against the connecting nut 1124 at the lower end to provide a buffer for the connecting bearing 1123 and avoid collision damage between the connecting bearing 1123 and the connecting nut 1124.

[0023] In some embodiments, a second reducer (not shown in the figure) can be further provided between the rotational driving unit 1121 and the rotational transmission unit 1122. For example, when the rotational driving unit 1121 is a servo motor, the output shaft of the servo motor can be connected to the input shaft of the second reducer, and the output shaft of the second reducer can be connected to the pin 11222. The second reducer can reduce the rotation speed of the output shaft of the servo motor, thereby increasing the torque output by the servo motor.

[0024] In some embodiments, the clamping mechanism 113 may include a chuck 1131 and a jaw 1132 . The jaw 1132 is disposed on the chuck 1131 . The chuck 1131 may be connected to the adapter 11224 of the rotating mechanism 112 . The jaw 1132 is configured to clamp the crystal 200 .

[0025] In some embodiments, the horizontal movement mechanism 114 may include a horizontal movement mounting seat 1141, a first direction translation mechanism 1142, and a second direction translation mechanism (not shown in the figure). The first direction translation mechanism 1142 includes a first translation motor 11421, a first translation screw 11422, and a first translation screw nut (not shown in the figure) disposed on the first translation screw 11422. The extension direction of the first translation screw 11422 may be aligned with the width direction of the support body 121 (e.g., Figure 4 The first translation screw nut is matched with the thread on the first translation screw 11422 and connected to the clamping mechanism 113. When the first translation screw nut moves, it can drive the clamping mechanism 113 to perform linear motion along the width direction of the support body 121. Similarly, the second direction translation mechanism includes a second translation motor, a second translation screw and a second translation screw nut (not shown in the figure) arranged on the second translation screw. The extension direction of the second translation screw is parallel to the length direction of the support body 121 (perpendicular to Figure 4The second translation screw is connected to the horizontal movable mounting seat 1141 of the clamping assembly 11, and the second translation screw nut cooperates with the thread on the second translation screw and is connected to the first translation motor 11421. When the second translation nut moves, it can drive the first translation mechanism to perform linear motion along the second direction, and then drive the clamping mechanism 113 to perform linear motion along the length direction of the support body 121. Through the cooperation of the first direction translation mechanism 1142 and the second direction translation mechanism, the clamping mechanism 113 can be realized in the height direction perpendicular to the support body 121 (such as Figure 4 Move on a plane (in the direction indicated by the arrow X).

[0026] In some embodiments, the height adjustment mechanism 115 may include a linear drive unit 1151 and a linear transmission unit 1152, wherein the linear drive unit 1151 is in transmission connection with the linear transmission unit 1152, wherein the linear drive unit 1151 is configured to generate a driving force, and the linear transmission unit 1152 can drive the clamping mechanism 113 to move toward or away from the inner circle cutting blade 124 under the drive of the linear drive unit 1151. In some embodiments, the linear drive unit 1151 may include a servo motor, a battery, a motor, etc. The linear transmission unit 1152 may include a ball screw mechanism, a worm gear mechanism, a screw nut mechanism, etc. As an example only, taking the linear transmission unit 1152 as a screw nut mechanism, the screw slider mechanism includes a screw 11521 and a screw nut 11522 disposed on the screw 11521, the screw nut 11522 cooperates with the thread on the screw 11521 and is connected to the clamping mechanism 113, and the output shaft of the linear drive unit 1151 (such as a servo motor) is in transmission connection with the screw 11521. When the output shaft of the servo motor rotates, it can drive the screw rod 11521 to rotate around its own axis, and then drive the screw nut 11522 to move linearly along the spiral line direction of the screw rod 11521. When the screw nut 11522 moves, it can drive the clamping mechanism 113 to move linearly in the direction close to or away from the inner circle cutting blade 124.

[0027] In some embodiments, a first reducer (not shown in the figure) can also be provided between the linear drive unit 1151 and the linear transmission unit 1152. For example, when the linear drive unit 1151 is a servo motor and the linear transmission unit 1152 is a screw-nut mechanism, the output shaft of the servo motor can be connected to the input shaft of the first reducer, and the output shaft of the first reducer can be connected to the screw. The first reducer can reduce the rotation speed of the output shaft of the servo motor, thereby increasing the torque output by the servo motor.

[0028] In some embodiments, the lead screw 11521 of the height adjustment mechanism 115 can be set on the horizontal movable mounting seat 1141, and the setting direction of the lead screw 11521 is parallel to the height direction of the horizontal movable mounting seat 1141.

[0029] In some embodiments, the rotating mechanism 112 can be connected to the height adjustment mechanism 115 through a connecting bearing 1123. As an example only, taking the linear transmission part 1152 as a screw nut mechanism as an example, the clamping assembly 11 may include a third connecting member, the third connecting member may include a mounting plate 111, or the third connecting member may be connected to the mounting plate 111, the mounting plate 111 is arranged on the screw nut 11522 of the linear transmission part 1152, the connecting bearing 1123 on the rotating shaft 11221 is connected to the mounting plate 111, and when the screw nut 11522 moves relative to the screw 11521, the rotating mechanism 112 and the clamping mechanism 113 connected to the rotating mechanism 112 can be driven to move.

[0030] In some embodiments, in combination Figure 2 and Figure 3 As shown, adjusting the posture of the clamping assembly 11 may include adjusting the direction of the central axis of the rotating shaft 11221 of the rotating mechanism 112, thereby adjusting the clamping angle of the crystal 200 clamped on the clamping mechanism 113. The clamping angle of the crystal 200 may be the angle between the central axis of the crystal 200 (for example, the crystal 200 may be a regular shape such as a cylinder, a prism, a cube, etc.) and the plane where the inner circle cutting blade 124 is located. After the adjustment mechanism 117 is set, the angle relationship between the crystal 200 and the plane where the inner circle cutting blade 124 is located may be adjusted by the adjustment mechanism 117, so that after each cutting of the crystal 200, the end face of the crystal 200 close to the inner circle cutting blade 124 can be parallel to the inner circle cutting blade 124, thereby ensuring that the volume of the crystal 200 is substantially unchanged for the next cutting, improving the quality of the obtained wafer or crystal segment, and reducing material loss.

[0031] In some embodiments, the adjustment mechanism 117 can be connected to the horizontally movable mounting seat 1141. Since the clamping mechanism 113 is connected to the horizontally movable mounting seat 1141 through the height adjustment mechanism 115, the clamping mechanism 113 can move relative to the horizontally movable mounting seat 1141 along the screw 11521. Therefore, the central axis direction of the rotating shaft 11221 of the rotating mechanism 112 can be regarded as parallel to the extension direction of the screw 11521. Therefore, by controlling the adjustment mechanism 117, the clamping angle of the crystal 200 on the clamping mechanism 113 can be adjusted, thereby adjusting the angle between the central axis of the crystal 200 and the plane where the inner circle cutting blade 124 is located.

[0032] It should be noted that Figure 2 The schematic diagram of the structure of the clamping assembly is shown as an example. Figure 3 Shows Figure 2 A schematic diagram of the structure of the clamping assembly at another angle. Figure 2 The adjustment mechanism 117 is not shown. Figure 3The adjustment mechanism 117 is shown but the horizontal movement mechanism 114 (eg, the horizontal movement mounting seat 1141) is not shown. Figure 3 The proximity of the adjustment mechanism 117 and the rotation drive unit 1121 does not mean that Figure 3 The two in the illustrated embodiment are connected.

[0033] In some embodiments, the adjustment mechanism 117 may include a fixing frame, a plurality of adjustment bolts, and a plurality of adjustment nuts (the fixing frame, the adjustment bolts, and the adjustment nuts are not shown in the figure). Figure 3 ). The fixing frame is configured to install the entire clamping assembly 11, and a plurality of adjusting bolts are arranged on the fixing frame. One end of the adjusting bolt can be connected to the horizontal movable mounting seat 1141 (such as being installed on the top of the horizontal movable mounting seat 1141). The operator can adjust the clamping angle of the crystal 200 by rotating the adjusting nut at the corresponding position.

[0034] In other embodiments, the adjustment mechanism 117 can be a swing arm (not shown in the figure), which can be directly connected to the top of the horizontal movable mount 1141. The swing arm can be a universal shaft swing arm that can swing with multiple degrees of freedom. By controlling the movement of the swing arm, the horizontal movable mount 1141 can be driven to swing, and then the clamping assembly 11 connected to the horizontal movable mount 1141 can be driven to swing, thereby adjusting the clamping angle of the crystal 200, thereby adjusting the angle between the center axis of the crystal 200 and the plane where the inner circle cutting blade 124 is located.

[0035] In some embodiments, the inner circle cutting blade 124 is provided with a first center hole 1241, and the inner circle cutting blade 124 can rotate relative to the support body 121 along the center axis of the first center hole 1241. In some embodiments, the support body 121 can be a tool holder, and the tool holder can support the inner circle cutting blade 124. For example, the support body 121 can be a tool holder, and the tool holder includes a tool holder body and a cavity structure surrounded by the tool holder body. At least a part of the cavity structure of the tool holder can be used to form a receiving cavity 1211. The inner circle cutting blade 124 can be arranged on the top of the tool holder body, and an opening is arranged on the top of the tool holder body. The opening is connected to the receiving cavity 1211, and the position of the opening corresponds to the position of the first center hole 1241 of the inner circle cutting blade 124, so that the cut wafer or crystal segment can directly enter the receiving cavity 1211 from the opening. During the cutting process, the inner circle cutting blade 124 can rotate counterclockwise or clockwise along the central axis of the first center hole 1241. The clamping assembly 11 clamps the crystal 200 and extends it into the first center hole 1241 of the inner circle cutting blade 124 to directly make the crystal 200 contact with the edge of the first center hole 1241 to achieve cutting of the crystal 200, or clamps the crystal 200 and extends it into the first center hole 1241 of the inner circle cutting blade 124 to drive it to rotate in the opposite direction relative to the inner circle cutting blade 124, and then contacts with the edge of the first center hole 1241 to achieve cutting of the crystal 200.

[0036] In some embodiments, the cutting assembly 12 may further include a cutter disc 125, the cutter disc 125 is disposed on the support body 121 (e.g., a cutter holder), and the inner circle cutting blade 124 is connected to the support body 121 through the cutter disc 125. For example, the inner circle cutting blade 124 and the cutter disc 125 are both annular, the cutter disc 125 has a second center hole, the cutter disc 125 is fixed to the top of the support body 121, a blade fixing hole 1251 is provided on the cutter disc 125, the base of the inner circle cutting blade 124 can be fixedly connected to the cutter disc 125 through the blade fixing hole 1251, and the inner circle cutting blade 124 can rotate relative to the base along the central axis of the first center hole 1241.

[0037] In some embodiments, in combination Figure 4-Figure 5 As shown, the opening may include a first opening 1231 provided on a side wall of the supporting body 121 , and the receiving piece 122 may enter or move out of the accommodating cavity 1211 through the first opening 1231 .

[0038] In some embodiments, the distance between the first opening 1231 and the top of the support body 121 is a first distance, and the distance between the first opening 1231 and the bottom of the support body 121 is a second distance, and the first distance is greater than the second distance, so that there is enough space between the receiving member 122 and the inner circle cutting blade 124 to receive the wafer or crystal segment obtained by cutting. The distance between the first opening 1231 and the top of the support body 121 refers to the distance between the top of the first opening 1231 (i.e., the side of the first opening 1231 close to the top of the support body 121) and the top of the support body 121. For example, when the first opening 1231 is a rectangle, the first distance is the distance between the top edge of the rectangle and the top of the support body 121. The distance between the first opening 1231 and the bottom of the support body 121 refers to the distance between the bottom of the first opening 1231 (i.e., the side of the first opening 1231 close to the bottom of the support body 121) and the bottom of the support body 121. For example, when the first opening 1231 is a rectangle, the second distance is the distance between the bottom side of the rectangle and the bottom of the support body 121. For ease of understanding, the first distance can be expressed as Figure 4 The second distance can be expressed by L1 in Figure 4 It is represented by L2 in .

[0039] In some embodiments, in order to facilitate the material receiving piece 122 receiving the wafer or crystal segment to enter or move out of the accommodating cavity 1211, the size of the first opening 1231 needs to be designed, and the size of the first opening 1231 includes the height of the first opening 1231 and the width of the first opening 1231. In some embodiments, the shape of the first opening 1231 may include circular, semicircular, rectangular, body-shaped, etc.

[0040] In some specific embodiments, the shape of the first opening 1231 may be rectangular, such as a rectangle. The height of the first opening 1231 refers to the maximum distance of the first opening 1231 in the height direction of the support body 121. The height direction of the support body 121 can be Figure 4 For example, when the first opening 1231 is a circle, the height of the first opening 1231 is the diameter of the circle. For another example, when the first opening 1231 is a rectangle and the bottom and top of the rectangle are parallel to the bottom and top of the support body 121, respectively, the height of the first opening 1231 is the distance from the bottom to the top of the first opening 1231. Figure 4 In some embodiments, the height of the first opening 1231 is between 1 mm and 200 mm. In some embodiments, the height of the first opening 1231 is between 10 mm and 150 mm. In some embodiments, the height of the first opening 1231 is between 50 mm and 100 mm.

[0041] The width of the first opening 1231 refers to the maximum distance of the first opening 1231 in the width direction of the support body 121. Figure 4 For example, when the first opening 1231 is a rectangle and the bottom and top sides of the rectangle are parallel to the bottom and top sides of the support body 121, respectively, the width of the first opening 1231 is the distance between the two sides of the rectangle. Figure 4 As shown in L4 in . In some embodiments, the first opening 1231 can be set on a side close to the bottom of the support body 121. In some embodiments, the ratio of the width of the first opening 1231 to the width of the support body 121 is 0.5-1, so that the first opening 1231 can allow a larger size of the receiving piece 122 to pass through, thereby improving the receiving efficiency. In some embodiments, the ratio of the width of the first opening 1231 to the width of the support body 121 is 0.6-1. In some embodiments, the ratio of the width of the first opening 1231 to the width of the support body 121 is 0.75-1.

[0042] In some embodiments, the material receiving member 122 can be pushed and pulled through the first opening 1231 to enter or move out of the accommodating chamber 1211. A material guide groove (not shown in the figure) is provided in the accommodating chamber 1211. One end of the material guide groove is located below the opening of the supporting body 121 (for example, corresponding to the position below the first central hole 1241), and the other end is located above the first opening 1231. The material guide groove has a certain slope and its surface is smooth, so that the cut wafers or crystal segments can slide along the material guide groove to the material receiving member 122. Before cutting the crystal 200, the operator can manually push the material receiving member 122 into the first opening 1231. The cut wafers or crystal segments will fall into the material guide groove and slide into the material receiving member 122 under the action of gravity. When it is necessary to take out the material, the material receiving member 122 can be directly pulled out to take out the material. The entire material receiving member 122 will not come into contact with the inner circle cutting blade 124, so there is no need to stop the machine and there is no safety risk. In some embodiments, a plurality of holes are provided on the material guiding trough, and the plurality of holes can discharge the waste liquid in the material guiding trough.

[0043] Figure 6 is a schematic diagram of the structure of the connection between the detection component and the material picking mechanism and the material receiving member according to some embodiments of this specification. Figure 1-Figure 6 As shown, a material taking mechanism 126 is provided in the accommodating chamber 1211, and the material taking mechanism 126 is in transmission connection with the material receiving member 122, and the material taking mechanism 126 can drive the material receiving member 122 to enter or move out of the accommodating chamber 1211 through the first opening 1231. By providing the material taking mechanism 126, the material receiving member 122 can be automatically transported into the accommodating chamber 1211 or moved out of the accommodating chamber 1211 through the first opening 1231, which can save manpower and improve efficiency.

[0044] In some embodiments, the material picking mechanism 126 may include a material picking transmission part, which may include a material picking guide rail 1261 fixed in the accommodating chamber 1211, and a material picking sliding member 1262 slidably connected to the material picking guide rail 1261, and the material picking sliding member 1262 is connected to the material receiving member 122. For example, one end of the material picking guide rail 1261 is located below the opening of the support body 121, and the other end is located at the first opening 1231. The material picking sliding member 1262 can drive the material receiving member 122 to move between the opening of the support body 121 and the first opening 1231, thereby realizing material picking and picking. In some embodiments, the material picking mechanism 126 may include a material picking driving part 1263, and the material picking driving part 1263 can drive the material picking sliding member 1262 to move along the material picking guide rail 1261, thereby driving the material receiving member 122 to enter or move out of the accommodating chamber 1211 through the first opening 1231. As an example only, the material picking drive unit 1263 can be a servo motor, the output shaft of the servo motor is connected to the material picking screw 1264, and the material picking slide 1262 is provided on the material picking screw 1264. When the output shaft of the servo motor rotates, it drives the material picking screw 1264 to rotate, and then drives the material picking slide 1262 to move along the material picking screw 1264. When the material picking slide 1262 moves, it drives the material receiving member 122 to move along the material picking slide rail 1261.

[0045] In some embodiments, the material picking mechanism 126 can drive the material receiving member 122 through the opening to enter or move out of the accommodating chamber 1211 in other ways. For example, the material picking transmission part can include a pulley and a transmission belt connected to the pulley, one end of the transmission belt is located below the opening of the support body 121, and the other end is located at the first opening 1231. The material receiving member 122 can be connected to the transmission belt, and the material picking drive part 1263 can rotate by driving the pulley, and drive the material receiving member 122 to move between the bottom of the opening of the support body 121 and the first opening 1231 through the transmission belt.

[0046] Figure 7 is a schematic diagram of the structure of a crystal cutting device according to other embodiments of this specification; Figure 8 yes Figure 7 In some embodiments, combined with Figure 7-Figure 8As shown, the opening may include a second opening 1232 provided at the top of the support body 121, and the material receiving piece 122 may enter or move out of the accommodating chamber 1211 through the second opening 1232; the crystal 200 is cut in the second opening 1232. In this embodiment, the wafer or crystal segment and the material receiving piece 122 both enter the accommodating chamber 1211 from the same opening, which can reduce the number of openings on the support body 121 without affecting the material collection, reduce the process difficulty, and reduce the manufacturing cost. For example, the position of the first center hole 1241 corresponds to the position of the second opening 1232, the material receiving piece 122 enters the accommodating chamber 1211 through the first center hole 1241 and the second opening 1232, and the crystal 200 extends into the first center hole 1241 and is cut by the inner circle cutting blade 124, and the wafer or crystal segment obtained by cutting enters the accommodating chamber 1211 through the second opening 1232, and then falls on the material receiving piece 122.

[0047] In some embodiments, the material receiving member 122 may include a connecting portion 1221 and a material receiving portion 1222, the connecting portion 1221 is detachably connected to the clamping assembly 11, and the material receiving member 122 is configured as follows: when the connecting portion 1221 is connected to the clamping assembly 11, the material receiving portion 1222 is located in the accommodating cavity 1211, and when the connecting portion 1221 is disconnected from the clamping assembly 11, the material receiving portion 1222 can enter or move out of the accommodating cavity 1211 through the second opening 1232. In this embodiment, before cutting the crystal 200, the connecting portion 1221 can be connected to the clamping assembly 11, and when the clamping assembly 11 drives the crystal 200 to move toward the bottom of the accommodating cavity 1211, it also drives the material receiving portion 1222 to move toward the bottom of the accommodating cavity 1211, ensuring that sufficient space can be reserved between the material receiving portion 1222 and the crystal to accommodate a wafer or crystal segment. After the cutting is completed, the connection between the connecting portion 1221 and the clamping assembly 11 can be released. Since the clamping assembly 11 and the cutting assembly 12 will not interfere with the movement of the receiving portion 1222, the receiving portion 1222 can be moved out of the accommodating cavity 1211 through the second opening 1232.

[0048] In some embodiments, the connecting portion 1221 may be a connecting rod or a connecting plate, etc. In some embodiments, the receiving portion 1222 may include a disc-shaped structure with a depression on the surface (for example, a receiving plate), or a plate-shaped structure with a flat surface (for example, a receiving plate), etc. The surface of the receiving portion 1222 that receives the wafer or crystal segment may be referred to as a receiving surface. For example, when the receiving portion 1222 is a receiving plate with a depression on the surface, the plane where the opening end of the depression is located is the receiving surface of the receiving plate. For another example, when the receiving portion 1222 is a receiving plate, the surface of the receiving plate is the receiving surface. In some embodiments, the receiving surface of the receiving portion 1222 is parallel or approximately parallel to the inner circle cutting blade 124. Approximately parallel means that the angle between the two surfaces is less than a preset value (for example, the preset value may be 5 degrees, 3 degrees, 1 degree, etc.). In some embodiments, the receiving surface of the receiving portion 1222 is parallel or approximately parallel to the surface of the inner circle cutting blade 124, and the distance between the receiving surface of the receiving portion 1222 and the inner circle cutting blade 124 is between 5 mm and 500 mm, so as to reserve space for accommodating a wafer or a crystal segment. The distance between the receiving surface of the receiving portion 1222 and the inner circle cutting blade 124 can be determined according to the height of the support body 121, the height of the accommodating cavity 1211, and the volume of the wafer body or crystal segment to be received. For example, the greater the height of the support body 121 and the height of the accommodating cavity 1211, the greater the maximum distance between the receiving surface of the receiving portion 1222 and the inner circle cutting blade 124. Conversely, the smaller the height of the support body 121 and the height of the accommodating cavity 1211, the smaller the maximum distance between the receiving surface of the receiving portion 1222 and the inner circle cutting blade 124. For another example, the larger the volume of the wafer or crystal segment received, the greater the distance between the receiving surface of the receiving portion 1222 and the inner circle cutting blade 124. Conversely, the smaller the volume of the wafer or crystal segment received, the smaller the distance between the receiving surface of the receiving portion 1222 and the inner circle cutting blade 124. In some embodiments, the receiving surface of the receiving portion 1222 is parallel or approximately parallel to the surface of the inner circle cutting blade 124, and the distance between the receiving surface of the receiving portion 1222 and the inner circle cutting blade 124 is between 5 mm and 200 mm. In some embodiments, the receiving surface of the receiving portion 1222 is parallel or approximately parallel to the surface of the inner circle cutting blade 124, and the distance between the receiving surface of the receiving portion 1222 and the inner circle cutting blade 124 is less than 100 mm. It should be noted that in the embodiments of the present specification, since the thickness of the inner circle cutting blade 124 is relatively thin, the distance between the receiving surface of the material receiving portion 1222 and the surface of the inner circle cutting blade 124 on the side away from the material receiving portion 1222 and the surface of the inner circle cutting blade 124 on the side close to the material receiving portion 1222 can be approximately equal.

[0049] In some embodiments, the maximum size of the receiving surface of the material receiving portion 1222 is smaller than the minimum size of the first center hole 1241 of the inner circle cutting blade 124, so that the material receiving portion 1222 can smoothly pass through the first center hole 1241 of the inner circle cutting blade 124. For example, if the receiving surface of the material receiving portion 1222 and the first center hole 1241 are both circular, the diameter of the receiving surface of the material receiving portion 1222 is smaller than the diameter of the first center hole 1241. For another example, if the receiving surface of the material receiving portion 1222 is square and the first center hole 1241 is circular, the diagonal length of the receiving surface of the material receiving portion 1222 is smaller than the diameter of the first center hole 1241.

[0050] In some embodiments, in combination Figure 7-Figure 8 As shown, the clamping assembly 11 may include a housing 116, a slide groove 1161 is provided in the housing 116, a slider 1162 is provided in the slide groove 1161, the slider 1162 can move along the extension direction of the slide groove 1161, and the slider 1162 is detachably connected to the connecting portion 1221. In this embodiment, before cutting the crystal 200, the extension direction of the slide groove 1161 can be set to be perpendicular to the inner circle cutting blade 124, and the slider 1162 is adjusted to a certain position in the slide groove 1161 and then fixed. After the slider 1162 is connected to the connecting portion 1221, when the clamping assembly 11 drives the crystal 200 to move toward the bottom of the accommodating cavity 1211 for cutting, the clamping assembly 11 can drive the connecting portion 1221 and the material receiving portion 1222 to move synchronously, so that enough space can be reserved between the material receiving portion 1222 and the crystal 200 to receive the cut wafer or crystal segment. After the cutting is completed, the connecting portion 1221 can be removed from the slider 1162 so that the receiving portion 1222 and the wafer or wafer segment can be taken out of the accommodating cavity 1211 .

[0051] In some embodiments, a first hook structure 12211 is provided at one end of the connecting portion 1221 away from the material receiving portion 1222, the first hook structure 12211 is arranged toward the material receiving portion 1222, a connecting pin 12212 is provided on the first hook structure 12211, the connecting pin 12212 is connected to the first hook structure 12211 by a screw, the length direction of the connecting pin 12212 is parallel to the length direction of the connecting portion 1221, and the connecting pin 12212 can move relative to the connecting portion 1221 along the length direction of the connecting portion 1221. For example, the connecting pin 12212 can be a sliding latch, the slider 1162 is provided with a second hook structure 11621, the second hook structure 11621 is arranged toward the top of the slide slot 1161, and the slider 1162 is also provided with a connecting socket (not shown in the figure) adapted to the connecting pin 12212, and the length direction of the connecting socket is parallel to the length direction of the connecting portion 1221. Before cutting the crystal 200, the material receiving member 122 can be lifted to hook the first hook structure 12211 onto the second hook structure 11621, and then the connecting pin 12212 can be inserted into the connecting socket, and the slider 1162 and the connecting portion 1221 can be fixed together by the cooperation between the connecting pin 12212 and the connecting socket and the cooperation between the first hook structure 12211 and the second hook structure 11621. When the connection between the connecting portion 1221 and the slider 1162 needs to be released, the connecting pin 12212 is first removed from the connecting socket, and then the connecting portion 1221 is lifted to separate the first hook structure 12211 from the second hook structure 11621, and the material receiving portion 1222 can be removed.

[0052] In some embodiments, a spring 1163 is provided in the slide groove 1161, the top of the spring 1163 is connected to the top of the slide groove 1161, the bottom of the spring 1163 is in contact with the slider 1162, and the spring 1163 applies a force from the top of the slide groove 1161 to the bottom of the slide groove 1161 to the slider 1162. In this embodiment, after the material receiving member 122 is connected to the slider 1162, under the gravity of the material receiving member 122, the slider 1162 will slide to the bottom of the slide groove 1161, the spring 1163 is in the maximum size state, and at this time the material receiving tray is located in the accommodating chamber 1211. During the cutting process of the crystal 200, after the crystal 200 completes one cutting, the crystal 200 needs to move down a small section to perform the next cutting, and accordingly, the housing 116 and the material receiving portion 1222 also move down a small section. When the receiving portion 1222 moves down to abut against the bottom of the accommodating cavity 1211 (for example, the bottom of the supporting body 121), if the shell 116 continues to move down, the slider 1162 can move upward relative to the slide groove 1161 to prevent the receiving piece 122 from excessively squeezing the bottom of the supporting body 121 and damaging the supporting body 121 or the receiving piece 122.

[0053] In other embodiments, a spring 1163 is provided in the slide groove 1161, the top of the spring 1163 is connected to the top of the slide groove 1161, the bottom of the spring 1163 is abutted against the slider 1162, and the spring 1163 applies a force to the slider 1162 from the bottom of the slide groove 1161 to the top of the slide groove 1161. In this embodiment, after the material receiving piece 122 is connected to the slider 1162, the elastic force provided by the spring 1163 can be balanced with the gravity of the connecting portion 1221 and the material receiving portion 1222, so that the slider 1162 is located between the bottom and the top of the slide groove 1161. As the volume of the chip or crystal segment received by the material receiving portion 1222 increases, the slider 1162 gradually moves toward the bottom of the slide groove 1161, the spring 1163 stretches, and the distance between the material receiving portion 1222 and the inner circle cutting blade 124 gradually increases, thereby ensuring that sufficient space is reserved between the material receiving portion 1222 and the inner circle cutting blade 124 to receive the chip or crystal segment.

[0054] In some embodiments, scale lines (not shown in the figure) are provided on the shell 116, and the setting direction of the scale lines is parallel to the extension direction of the slide groove 1161. The scale lines can be used to determine the position of the slider 1162 in the slide groove 1161, thereby determining the position of the material receiving portion 1222, so that the material receiving portion 1222 can reserve sufficient space to accommodate chips or crystal segments of corresponding volumes.

[0055] In some embodiments, the housing 116 is provided with a plurality of positioning holes 1164, and the position of each positioning hole 1164 corresponds to each scale of the scale line. The positioning pin can pass through any positioning hole 1164, and the moving range of the slider 1162 is limited between the top of the slide slot 1161 and the positioning pin. In this embodiment, before installing the material receiving member 122, the positioning pin can be inserted into the corresponding positioning hole 1164 according to the length of the cut material. At this time, the slider 1162 will abut against the positioning pin under the action of the spring 1163, and then the material receiving member 122 is connected to the slider 1162, so that the housing 116 and the material receiving member 122 remain relatively still, so that when the clamping assembly 11 moves toward the bottom of the accommodating cavity 1211, a space can be reserved between the material receiving portion 1222 and the clamped crystal 200 to receive the wafer or crystal segment.

[0056] In some embodiments, the housing 116 may be connected to the height adjustment mechanism 115, the rotation mechanism 112, or the horizontal movement mechanism 114 in other embodiments of the present specification. In some embodiments, the housing 116 may be a part of the height adjustment mechanism 115, the rotation mechanism 112, or the horizontal movement mechanism 114 in other embodiments of the present specification. For example, the housing 116 may be Figure 2 The housing of the rotating mechanism 112 is connected to the third connecting member (such as the mounting plate 111).

[0057] In some application scenarios, the end face of the crystal 200 near the bottom of the accommodating cavity 1211 after the first cutting should be parallel to the inner circle cutting blade 124, and when the crystal 200 completes one cutting, the clamping assembly 11 drives the crystal 200 to move the same distance toward the bottom of the accommodating cavity 1211, so that the length of the wafer or crystal segment after subsequent cutting is theoretically consistent, that is, the quality of the wafer or crystal segment remains basically unchanged. However, the clamping assembly 11 may also have a movement direction deviation during the movement process. For crystals 200 of certain structures (such as rectangular parallelepiped crystals 200), the end face of the crystal 200 near the bottom of the accommodating cavity 1211 after the first cutting is parallel to the inner circle cutting blade 124, but the length direction of the crystal 200 during the movement is not parallel to the cutting center axis (i.e., the rotation axis 11221 line of the inner circle cutting blade 124). Such cutting will cause the quality of the wafer or crystal segment to be different each time, reduce the quality of the wafer or crystal segment, and increase material loss.

[0058] In some embodiments, the detection component 13 may include a weight sensor 131, which is configured to detect the weight of the wafer or crystal segment on the material receiving member 122 to generate a weight signal, and compare the weight of the wafer or crystal segment on the material receiving member 122 with a preset weight. When the difference between the weight of the wafer or crystal segment and the preset weight and the ratio of the preset weight are within a preset range, the quality of the wafer or crystal segment is determined to be qualified. When the difference between the weight of the wafer or crystal segment and the preset weight and the ratio of the preset weight exceed the preset range, the quality of the wafer or crystal segment is determined to be unqualified. As an example only, for a crystal 200 with a regular shape but curved shape, the weight sensor 131 can directly compare the mass of the cut crystal 200 with the preset weight (the preset weight is related to the shape of the crystal 200 and the distance of the crystal 200 extending into the accommodating cavity 1211 before each cutting) to determine whether the cut crystal 200 is qualified. In another example, for an irregularly shaped and curved crystal 200, the weight sensor 131 may fit the quality of the wafer or crystal segment after cutting within a preset time period to determine whether the quality of the wafer or crystal segment is qualified. The weight sensor 131 may determine that the wafer or crystal segment is of unqualified quality when the mass change rate corresponding to the time point within the preset time period exceeds the preset weight. In some embodiments, the preset range may be -0.5 to 0.5. In some embodiments, the preset range may be -0.1 to 0.1. In some embodiments, the preset range may be -0.01 to 0.01.

[0059] In some embodiments, when the detection component 13 determines that the quality of the wafer or crystal segment is unqualified, the detection component 13 can issue an early warning to the operator so that the operator can adjust the adjustment mechanism 117 in time, thereby adjusting the clamping angle of the crystal 200.

[0060] In some embodiments, when the detection component 13 determines that the quality of the wafer or crystal segment is unqualified, the detection component can directly adjust the control adjustment mechanism 117 to adjust the clamping angle of the crystal 200. As an example only, for a regular but curved crystal 200, the weight sensor 131 can send an adjustment instruction to the adjustment mechanism 117 to adjust the posture of the adjustment mechanism 117. For example, the adjustment mechanism 117 can include an adjustment mechanical arm, and the weight sensor 131 can send an adjustment signal to the adjustment mechanical arm to control the adjustment mechanism 117 to adjust the posture of the clamping component 11 by adjusting the mechanical arm (for example, by adjusting the mechanical arm to control the rotation of the adjustment nut at the corresponding position to adjust the clamping angle of the clamping component 11), thereby adjusting the clamping angle of the crystal 200.

[0061] In some cases, by setting up the detection component 13, the cut crystal 200 can be initially inspected, which can not only quickly identify unqualified crystals 200, but also timely control the adjustment mechanism 117 according to the detection results to adjust the clamping angle of the crystal 200, thereby ensuring processing efficiency, improving the pass rate and reducing material loss.

[0062] In some embodiments, the detection component 13 can be used in combination with the material taking mechanism 126 in other embodiments of the present specification, so that the material receiving member 122 can automatically move out of the accommodating chamber 1211 after receiving the wafer or crystal segment to take the material, so as to avoid the newly cut wafer or crystal segment from colliding with the previously cut wafer or crystal segment after it falls, and automatically return to the corresponding position in the accommodating chamber 1211 after taking the material to take the next cut wafer or crystal segment. As an example only, after the weight sensor 131 generates a weight signal, it can send a signal to the material taking drive unit 1263 of the material taking mechanism 126, so that the material taking mechanism 126 can pull the material receiving member 122 out of the accommodating chamber 1211 in time according to the preset speed. When the weight sensor 131 receives the weight on the material receiving piece 122 and it returns to zero, it can output a signal to the material picking drive unit 1263 of the material picking mechanism 126, so that the material picking mechanism 126 can transport the material receiving piece 122 to the bottom of the first center hole 1241 in the accommodating cavity 1211 according to a preset speed and wait for the next material receiving, and output a signal to the linear drive unit 1151 of the height adjustment mechanism 115, so that the height adjustment mechanism 115 drives the clamping mechanism 113 to move the crystal 200 toward the bottom of the accommodating cavity 1211 a preset distance according to a preset speed for the next cutting.

[0063] In some embodiments, the cooling assembly 14 may include a liquid cooling assembly, which may include a liquid reservoir 141 and a liquid spraying pipe 142, the liquid spraying pipe 142 being in fluid communication with the liquid reservoir 141, and a valve (e.g., a solenoid valve) being provided on the liquid spraying pipe 142. When the valve is opened, the cooling liquid (e.g., water, ethylene glycol aqueous solution, pure ethylene glycol, silicone oil, etc.) in the liquid reservoir 141 may be sprayed onto the crystal 200 through the liquid spraying pipe 142 to cool the crystal 200, and when the valve is closed, the liquid spraying pipe 142 stops spraying the cooling liquid. In some embodiments, the speed of the cooling liquid sprayed from the liquid spraying pipe 142 may be controlled by controlling the degree of opening and closing of the valve. As an example only, the cooling component 14 can be connected to the rotating drive unit 1121 in other embodiments of the present specification in communication. For example, the controller 15 described later can be connected to the rotating drive unit 1121 in communication, and the rotation speed of the crystal 200 during the cutting process can be obtained from the rotating drive unit 1121, and then the opening and closing degree of the valve can be controlled according to the rotation speed of the crystal 200. When the rotation speed of the crystal 200 is faster, the opening and closing degree of the valve can be increased, and then the speed of the spray pipe 142 spraying the coolant can be increased. When the rotation speed of the crystal 200 is slower, the opening and closing degree of the valve can be reduced, and then the speed of the spray pipe 142 spraying the coolant can be reduced, which can avoid defects such as notches and cracks when cutting the crystal 200, and can also avoid the waste of coolant. In some embodiments, the cooling component 14 can also be an air-cooled component, which is configured to spray cold air to the crystal 200 to cool the crystal 200.

[0064] In some embodiments, one or more components of the crystal cutting device 100 can perform corresponding functions by manual operation. For example, during the cutting process, the operator can manually control the clamping assembly 11 to move toward the bottom of the accommodating cavity 1211 to perform cutting. In another example, the operator can manually remove the material receiving piece 122 from the first opening, and manually put the material receiving piece 122 from the first opening 1231 into the accommodating cavity 1211.

[0065] In some embodiments, one or more components of the crystal cutting apparatus 100 may be controlled by other components to perform corresponding functions. Figure 1-Figure 5As shown, the crystal cutting device 100 may also include a controller 15, which may be used to control one or more mechanisms, components or devices in the aforementioned embodiments to perform corresponding functions. Exemplarily, the controller 15 may control the height adjustment mechanism 115 to drive the clamping mechanism 113 to drive the crystal 200 to move toward the bottom of the accommodating chamber 1211. In some embodiments, the controller 15 may uniformly manage the relevant information during the cutting process of the crystal 200, for example, the rotation speed of the crystal 200, whether the quality of the wafer or crystal segment is qualified, the injection speed of the liquid injection pipe 142, etc. In some embodiments, the crystal cutting device 100 may also include a host computer (not shown in the figure), which may refer to a computer capable of issuing a control command (for example, a work instruction), such as a computer, a tablet, etc. The host computer may be connected / communicated with the controller 15, and by sending the work instruction to the controller 15, the controller 15 is instructed to drive the corresponding mechanism, component or device to work. In some embodiments, the host computer may be manually controlled, for example, the operator may manually operate the host computer software in the host computer to issue a work instruction. In other embodiments, the host computer may control the crystal cutting device 100 through a control program or software. In some embodiments, the host computer may include a display device, such as a display screen.

[0066] The beneficial effects that may be brought about by the crystal cutting device in the embodiments of this specification include but are not limited to: (1) by designing a clamping component, the crystal can be better clamped and the clamping angle can be adjusted to facilitate subsequent cutting processing; (2) by setting a material taking mechanism, the cut wafers or crystal segments can be taken out through the material taking mechanism, which does not require stopping the machine, improves the processing efficiency, and greatly reduces the risk of material taking; (3) by setting a detection component, the cut wafers or crystal segments can be preliminarily detected, which can not only quickly determine unqualified crystals, but also timely control the adjustment mechanism according to the detection results to adjust the clamping angle of the crystal, thereby ensuring processing efficiency, improving the pass rate and reducing material loss; (4) the setting of the weight sensor can be used to quickly determine whether there are wafers or crystal segments on the material receiving part. In conjunction with the material taking mechanism, the material receiving part can automatically move out of the accommodating cavity after receiving the wafer or crystal segment for material taking, and automatically return to the corresponding position in the accommodating cavity after taking the material to receive the next wafer or crystal segment obtained by cutting.

[0067] The basic concepts have been described above. Obviously, for those skilled in the art, the above detailed disclosure is only for example and does not constitute a limitation of this specification. Although not explicitly stated here, those skilled in the art may make various modifications, improvements and corrections to this specification. Such modifications, improvements and corrections are suggested in this specification, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of this specification.

Claims

1. A crystal cutting device, characterized in that: include: A clamping assembly, the clamping assembly is used to clamp the crystal, the clamping assembly includes a rotating mechanism, and the rotating mechanism is used to drive the crystal to rotate; A cutting assembly, the cutting assembly comprising: an inner circular cutting blade, a supporting body and a material receiving piece, the inner circular cutting blade being used for rotationally cutting the crystal to obtain a wafer or a crystal segment, the rotation direction of the inner circular cutting blade being opposite to the rotation direction of the rotating mechanism, the inner circular cutting blade being arranged on the top of the supporting body; a receiving cavity being provided in the supporting body, the material receiving piece being arranged in the receiving cavity, the material receiving piece being used for receiving the wafer or the crystal segment, the supporting body being provided with an opening communicating with the receiving cavity, the material receiving piece being able to enter or move out of the receiving cavity through the opening.

2. The crystal cutting device according to claim 1, characterized in that: The opening includes a first opening arranged on the side wall of the support body, and the material receiving piece enters or moves out of the accommodating cavity through the first opening; the distance between the first opening and the top of the support body is greater than the distance between the first opening and the bottom of the support body.

3. The crystal cutting device according to claim 2, characterized in that: The height of the first opening is 1 mm-200 mm; the ratio of the width of the first opening to the width of the supporting body is 0.75-1.

4. The crystal cutting device according to claim 2, characterized in that: A material taking mechanism is arranged in the accommodating cavity, and the material taking mechanism is transmission-connected with the material receiving member, and the material taking mechanism can drive the material receiving member to enter or move out of the accommodating cavity through the first opening.

5. The crystal cutting device according to claim 4, characterized in that: The material taking mechanism comprises a material taking guide rail fixed in the accommodating cavity, and a material taking sliding member slidably connected to the guide rail, and the material taking sliding member is connected to the material receiving member.

6. The crystal cutting device according to claim 4, characterized in that: The material picking mechanism also includes a material picking drive unit, which is transmission-connected to the material receiving member to provide power for the movement of the material receiving member.

7. The crystal cutting device according to claim 1, characterized in that: The opening further comprises a second opening arranged at the top of the supporting body, and the receiving piece enters or moves out of the accommodating cavity through the second opening; the crystal is cut in the second opening.

8. The crystal cutting device according to claim 7, characterized in that: The material receiving piece includes a connecting portion and a material receiving portion, the connecting portion is detachably connected to the clamping assembly, and the material receiving piece is configured as follows: when the connecting portion is connected to the clamping assembly, the material receiving portion is located in the accommodating cavity; when the connecting portion is disconnected from the clamping assembly, the material receiving portion can enter or move out of the accommodating cavity through the second opening.

9. The crystal cutting device according to claim 8, characterized in that: The clamping assembly comprises a shell, a slide groove is arranged in the shell, a slider is arranged in the slide groove, the slider can move along the extension direction of the slide groove, and the slider is detachably connected to the connecting part.

10. The crystal cutting device according to claim 1, characterized in that: The crystal cutting device further comprises a detection component connected to the material receiving member, and the detection component is used to detect whether the wafer or crystal segment received by the material receiving member is qualified.

11. The crystal cutting device according to claim 1, characterized in that: The clamping assembly includes a height adjustment mechanism, a horizontal movement mechanism and a clamping mechanism connected by a transmission. The height adjustment mechanism is used to control the clamping mechanism to move along the height direction of the support body toward or away from the inner circle cutting blade, and the horizontal movement mechanism is used to control the clamping mechanism to move in a direction parallel to the plane where the inner circle cutting blade is located.

12. The crystal cutting device according to claim 1, characterized in that: The clamping assembly also includes an adjusting mechanism for adjusting the posture of the clamping assembly.

13. The crystal cutting device according to claim 1, characterized in that: The crystal cutting device also includes a cooling component, which is used to cool the crystal.

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