Chip testing device with temperature simulation environment

Abstract

The utility model relates to the technical field of chip testing, in particular to a chip testing device with a temperature simulation environment, which comprises a testing furnace, a furnace door movably connected to the right side of the front part of the outer surface of the testing furnace, a heating mechanism arranged in the middle of the upper end of the testing furnace, and an exhaust external connection pipe fixedly connected to the right side of the upper end of the testing furnace. The lower end of the testing furnace is fixedly connected with an equipment shell, the lower end of the equipment shell is provided with a heat dissipation mechanism and fixedly connected with four supporting legs, and the four supporting legs are distributed in an equidistant annular array mode and do not make contact with one another. According to the chip testing device with the temperature simulation environment, the heating mechanism capable of being driven to rotate is arranged at the upper part of the testing furnace, so that when the device is used, a second motor in the heating mechanism can be controlled to drive a fixed frame to rotate; and the plurality of heating lamps at the lower part of the fixed frame can heat the tested chip in the test furnace more uniformly, so that the test data can be more accurate.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to a chip testing device with a temperature simulation environment. Background Art

[0002] Some chips are used in high temperature environments and need to undergo high temperature resistance tests before use. They can only be produced and used after passing the tests. With the enhancement of integrated chip functions and the continuous expansion of integration scale, chip testing has become more and more difficult and the testing cost has also increased.

[0003] The chip temperature test needs to be carried out in a high-temperature furnace. When the existing high-temperature furnace tests the chip, it is necessary to connect the external wiring to the tested chip to obtain the test data of the chip. The external wiring needs to extend from the high-temperature furnace to the outside. The high temperature in the furnace can easily cause the external wiring to age, resulting in the interruption of the transmission of the electrode connection. It will also linger around the high-temperature furnace and affect the use of the high-temperature furnace. Therefore, we have introduced a new chip testing device with a temperature simulation environment. Utility Model Content

[0004] The main purpose of the utility model is to provide a chip testing device with a temperature simulation environment, which can effectively solve the problems in the background technology.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0006] A chip testing device with a temperature simulation environment comprises a testing furnace, wherein a furnace door is movably connected to the right side of the front surface of the testing furnace, a heating mechanism is arranged at the middle part of the upper end of the testing furnace, an exhaust external pipe is fixedly connected to the right side of the upper end of the testing furnace, the heating mechanism is not in contact with the exhaust external pipe, a device shell is fixedly connected to the lower end of the testing furnace, a heat dissipation mechanism is arranged at the lower end of the device shell and is fixedly connected to four supporting legs, the four supporting legs are equidistantly distributed in a circular array and are not in contact with each other, the heat dissipation mechanism is located between the four supporting legs and are not in contact with each other, a detection mechanism and four ventilation mechanisms are arranged on the lower wall of the testing furnace, the four ventilation mechanisms are equidistantly distributed in a circular array and are not in contact with the detection mechanism.

[0007] Preferably, the detection mechanism includes a data collector, three connection ports are opened on the front surface of the data collector, a plurality of placement slots are opened on the lower wall of the test furnace, a plurality of connection pinholes are opened on the lower walls of the placement slots, and three through holes are opened on the front surface of the device shell.

[0008] Preferably, the data collector is fixedly connected to the front of the lower end of the test furnace, and the front of the outer surface of the data collector is fitted with the front of the inner surface of the equipment shell, and the three connection ports are equidistantly distributed and correspond to the positions of the three through holes respectively.

[0009] Preferably, the plurality of placement slots are distributed in an equidistant circular array and do not contact each other, the plurality of connection pinholes are distributed in an equidistant array and do not contact each other, and the data collector is electrically connected to the plurality of connection pinholes.

[0010] Preferably, the ventilation mechanism comprises a limiting strip and a cover plate, and four circulation holes are formed on the lower wall of the test furnace.

[0011] Preferably, the four flow holes are all located between a number of placement slots, the limit strips are adjacent to the cover plate and correspond to the positions of the flow holes, the limit strips are fixedly connected to the lower wall of the test furnace, the cover plate is movably connected to the lower wall of the test furnace, and the cover plate completely covers the flow holes.

[0012] Preferably, the heat dissipation mechanism includes a first motor, a turbine blade is fixedly connected to the output end of the first motor, a movable hole is opened in the middle of the lower wall of the device shell, and three groups of air inlets are opened on the outer surface of the first motor.

[0013] Preferably, the first motor is fixedly connected to the middle part of the lower end of the equipment shell, and the output end of the first motor is movably connected to the movable hole through insertion.

[0014] Preferably, the vortex blades are located inside the equipment shell, and the vortex blades are not in contact with the equipment shell, the test furnace and the data collector. The three groups of air inlets are distributed in an equidistant circular array and are not in contact with each other. The three groups of air inlets are not in contact with the three through holes.

[0015] Preferably, the heating mechanism comprises a second motor, an output end of the second motor is fixedly connected to a fixing frame, and a lower end of the fixing frame is fixedly connected to a plurality of heating lamps.

[0016] Preferably, the second motor is fixedly connected to the middle part of the upper end of the test furnace, and the output end of the second motor passes through the upper end of the test furnace and is movably connected to the test furnace.

[0017] Preferably, the fixing frame is located on the upper side of the interior of the test furnace, the fixing frame is in contact with the inner surface of the test furnace and is slidably connected to the test furnace, and a plurality of the heating lamps are distributed in an equidistant circular array and do not contact each other.

[0018] Compared with the prior art, the utility model has the following beneficial effects:

[0019] 1. In the utility model, a detection mechanism is arranged at the lower part of the test furnace, and a data collector in the detection mechanism is located at the lower part of the test furnace. When the device is used, the data collector will not be affected by high temperature, and a placement slot in the detection mechanism for connecting with the tested chip is provided with a plurality of connection pinholes distributed in an equidistant array. Chips of different models and sizes can be placed in the placement slot for testing. During the test, the pins of the chip can be connected to the connection pinholes inside the placement slot, eliminating the operation of external wiring, which can not only avoid the aging effect of high temperature on the external wiring when the device is used, but also avoid the situation where the external wiring is entrenched around the device and affects the use of the device;

[0020] 2. In the utility model, a heat dissipation mechanism is arranged in the equipment shell at the lower part of the test furnace, and four ventilation mechanisms are arranged on the lower wall of the test furnace. After the chip test is completed using the device, the first motor in the heat dissipation mechanism can be started, so that the first motor drives the vortex blade to blow air upward, and when the vortex blade blows air upward, the cover plates in the four ventilation mechanisms are lifted up, so that the air passes through the test furnace and the hot air inside the test furnace is discharged through the exhaust external pipe, so that the temperature inside the test furnace can be quickly reduced, which is convenient for continuing the next wave of chip testing;

[0021] 3. In the utility model, a heating mechanism that can be driven to rotate is provided on the upper part of the test furnace. When the device is used, the second motor in the heating mechanism can be controlled to drive the fixed frame to rotate, so that the several heating lamps at the lower part of the fixed frame can more evenly heat the chips being tested in the test furnace, so that the test data can be more accurate. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the overall structure of a chip testing device with a temperature simulation environment according to the utility model;

[0023] Figure 2 This is a schematic diagram of the overall structure of a chip testing device with a temperature simulation environment according to the utility model;

[0024] Figure 3 This is a schematic diagram of the overall structure of a detection mechanism of a chip testing device with a temperature simulation environment according to the utility model;

[0025] Figure 4 This is a schematic diagram of the overall structure of a ventilation mechanism of a chip testing device with a temperature simulation environment according to the utility model;

[0026] Figure 5 This is a schematic diagram of the overall structure of a heat dissipation mechanism of a chip testing device with a temperature simulation environment according to the utility model;

[0027] Figure 6The utility model is a schematic diagram of the overall structure of a heating mechanism of a chip testing device with a temperature simulation environment.

[0028] In the figure: 1. test furnace; 2. furnace door; 3. heating mechanism; 4. exhaust external pipe; 5. equipment shell; 6. heat dissipation mechanism; 7. support leg; 8. detection mechanism; 9. ventilation mechanism; 81. data collector; 82. connection port; 83. placement slot; 84. connection pinhole; 85. through hole; 91. limit strip; 92. cover plate; 93. circulation hole; 61. first motor; 62. vortex blade; 63. movable hole; 64. air inlet; 31. second motor; 32. fixing bracket; 33. heating lamp. DETAILED DESCRIPTION

[0029] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0030] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0031] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] See also Figure 1-6 , the utility model provides a technical solution:

[0033] A chip testing device with a temperature simulation environment comprises a testing furnace 1, a furnace door 2 is movably connected to the right side of the front surface of the testing furnace 1, a heating mechanism 3 is arranged in the middle of the upper end of the testing furnace 1, an exhaust external pipe 4 is fixedly connected to the right side of the upper end of the testing furnace 1, the heating mechanism 3 is not in contact with the exhaust external pipe 4, a device shell 5 is fixedly connected to the lower end of the testing furnace 1, a heat dissipation mechanism 6 is arranged at the lower end of the device shell 5 and is fixedly connected to four supporting legs 7, the four supporting legs 7 are equidistantly distributed in a circular array and are not in contact with each other, the heat dissipation mechanism 6 is located between the four supporting legs 7 and are not in contact with each other, a detection mechanism 8 and four ventilation mechanisms 9 are arranged on the lower wall of the testing furnace 1, the four ventilation mechanisms 9 are equidistantly distributed in a circular array and are not in contact with the detection mechanism 8.

[0034] In this embodiment, the detection mechanism 8 includes a data collector 81, and three connection ports 82 are opened on the front surface of the data collector 81. A plurality of placement grooves 83 are opened on the lower wall of the test furnace 1. A plurality of connection pinholes 84 are opened on the lower walls of the plurality of placement grooves 83. Three through holes 85 are opened on the front surface of the device shell 5. The data collector 81 is fixedly connected to the front of the lower end of the test furnace 1, and the front surface of the data collector 81 is in contact with the front of the inner surface of the device shell 5. The three connection ports 82 are equidistantly distributed and correspond to the positions of the three through holes 85 respectively. The plurality of placement grooves 83 are equidistantly distributed in a circular array and do not contact each other. The plurality of connection pinholes 84 are equidistantly distributed in an array and do not contact each other. The data collector 81 is electrically connected to the plurality of connection pinholes 84. By providing a detection mechanism 8 that can be directly connected to the outside in the device, the operation of external wiring of the chip under test is directly omitted, which not only avoids the aging effect of high temperature on the external wiring when the device is used, but also avoids the situation where the external wiring is entrenched around the device and affects the use of the device.

[0035] In this embodiment, the ventilation mechanism 9 includes a limit strip 91 and a cover plate 92. Four flow holes 93 are provided on the inner lower wall of the test furnace 1. The four flow holes 93 are all located between the plurality of placement slots 83. The limit strip 91 is adjacent to the cover plate 92 and corresponds to the positions of the flow holes 93. The limit strip 91 is fixedly connected to the inner lower wall of the test furnace 1. The cover plate 92 is movably connected to the inner lower wall of the test furnace 1, and the cover plate 92 completely covers the flow holes 93. The heat dissipation mechanism 6 includes a first motor 61. A vortex blade 62 is fixedly connected to the output end of the first motor 61. A movable hole 63 is provided in the middle of the inner lower wall of the equipment shell 5. Three groups of air inlets 64 are provided on the outer surface of the first motor 61. The first motor 61 is fixedly connected to the middle of the lower end of the equipment shell 5. The output end of the first motor 61 is movably connected to the movable hole 63. The vortex blade 62 is located inside the equipment shell 5, and the vortex blade 62 is not in contact with the equipment shell 5, the test furnace 1 and the data collector 81. The three groups of air inlets 64 are arranged in an equidistant circular array The three groups of air inlets 64 are not in contact with the three through holes 85. The heating mechanism 3 includes a second motor 31. The output end of the second motor 31 is fixedly connected to a fixing frame 32. The lower end of the fixing frame 32 is fixedly connected to a plurality of heating lamps 33. The second motor 31 is fixedly connected to the middle part of the upper end of the test furnace 1. The output end of the second motor 31 passes through the upper end of the test furnace 1 and is movably connected to the test furnace 1. The fixing frame 32 is located on the upper side of the test furnace 1. The fixing frame 32 is attached to the inner surface of the test furnace 1 and is slidably connected to the test furnace 1. The plurality of heating lamps 33 are distributed in an equidistant circular array and do not contact each other. By providing a rotatable heating mechanism 3 on the upper part of the test furnace 1, when the device is used, the second motor 31 in the heating mechanism 3 can be controlled to drive the fixing frame 32 to rotate, so that the plurality of heating lamps 33 on the lower part of the fixing frame 32 can more evenly heat the chips being tested in the test furnace 1, so that the test data can be more accurate.

[0036] It should be noted that the utility model is a chip testing device with a temperature simulation environment. A detection mechanism 8 is arranged at the lower part of the test furnace 1. The data collector 81 in the detection mechanism 8 is located at the lower part of the test furnace 1. When the device is in use, the data collector 81 will not be affected by high temperature, and the placement slots 83 in the detection mechanism 8 for connecting with the tested chip are provided with a plurality of connection pinholes 84 distributed in an equidistant array. Chips of different models and sizes can be placed in the placement slots 83 for testing. During the test, the pins of the chip are connected to the connection pinholes 84 in the placement slots 83, eliminating the operation of external wiring. This can not only avoid the aging effect of the high temperature on the external wiring when the device is in use, but also avoid the situation where the external wiring is entrenched around the device and affects the use of the device. In addition, a rotatable heating element is arranged at the upper part of the test furnace 1. When the heating mechanism 3 is used, the second motor 31 in the heating mechanism 3 can be controlled to drive the fixed frame 32 to rotate, so that the several heating lamps 33 at the bottom of the fixed frame 32 can heat the chips being tested in the test furnace 1 more evenly, so that the test data can be more accurate. In addition, a heat dissipation mechanism 6 is provided in the equipment shell 5 at the bottom of the test furnace 1, and four ventilation mechanisms 9 are provided on the lower wall of the test furnace 1. After the chip test is completed using the device, the first motor 61 in the heat dissipation mechanism 6 can be started, so that the first motor 61 drives the vortex blades 62 to blow air upwards, and when the vortex blades 62 blow air upwards, the cover plates 92 in the four ventilation mechanisms 9 will be lifted up, so that the air passes through the test furnace 1 and the hot air inside the test furnace 1 is discharged together through the exhaust external pipe 4, so that the temperature inside the test furnace 1 can drop quickly, which is convenient for continuing the next wave of chip testing.

[0037] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A chip testing device with a temperature simulation environment, comprising a testing furnace (1), characterized in that: A furnace door (2) is movably connected to the right side of the front of the outer surface of the test furnace (1); a heating mechanism (3) is provided in the middle of the upper end of the test furnace (1); an exhaust external pipe (4) is fixedly connected to the right side of the upper end of the test furnace (1); the heating mechanism (3) and the exhaust external pipe (4) are not in contact; a device shell (5) is fixedly connected to the lower end of the test furnace (1); a heat dissipation mechanism (6) is provided at the lower end of the device shell (5) and is fixedly connected to four supporting legs (7); the four supporting legs (7) are equidistantly distributed in a circular array and are not in contact with each other; the heat dissipation mechanism (6) is located between the four supporting legs (7) and are not in contact with each other; a detection mechanism (8) and four ventilation mechanisms (9) are provided on the lower inner wall of the test furnace (1); the four ventilation mechanisms (9) are equidistantly distributed in a circular array and are not in contact with the detection mechanism (8).

2. A chip testing device with a temperature simulation environment according to claim 1, characterized in that: The detection mechanism (8) comprises a data collector (81), the outer surface front of the data collector (81) is provided with three connection ports (82), the inner lower wall of the test furnace (1) is provided with a plurality of placement slots (83), the inner lower walls of the plurality of placement slots (83) are provided with a plurality of connection pinholes (84), and the outer surface front of the device shell (5) is provided with three through holes (85).

3. A chip testing device with a temperature simulation environment according to claim 2, characterized in that: The data collector (81) is fixedly connected to the front portion of the lower end of the test furnace (1), and the front portion of the outer surface of the data collector (81) is in contact with the front portion of the inner surface of the equipment shell (5). The three connection ports (82) are equidistantly distributed and correspond to the positions of the three through holes (85) respectively.

4. The chip testing device with a temperature simulation environment according to claim 2, characterized in that: The plurality of placement slots (83) are distributed in an equidistant circular array and do not contact each other, the plurality of connection pinholes (84) are distributed in an equidistant array and do not contact each other, and the data collector (81) is electrically connected to the plurality of connection pinholes (84).

5. The chip testing device with a temperature simulation environment according to claim 1, characterized in that: The ventilation mechanism (9) comprises a limiting strip (91) and a cover plate (92), and the inner lower wall of the test furnace (1) is provided with four circulation holes (93).

6. The chip testing device with a temperature simulation environment according to claim 5, characterized in that: The four circulation holes (93) are all located between a plurality of placement grooves (83); the limiting strip (91) is adjacent to the cover plate (92) and corresponds to the position of the circulation holes (93); the limiting strip (91) is fixedly connected to the lower wall of the test furnace (1); the cover plate (92) is movably connected to the lower wall of the test furnace (1); and the cover plate (92) completely covers the circulation holes (93).

7. The chip testing device with a temperature simulation environment according to claim 1, characterized in that: The heat dissipation mechanism (6) comprises a first motor (61), the output end of the first motor (61) is fixedly connected to a turbine blade (62), a movable hole (63) is opened in the middle of the lower wall of the device shell (5), and three groups of air inlets (64) are opened on the outer surface of the first motor (61).

8. The chip testing device with a temperature simulation environment according to claim 7, characterized in that: The first motor (61) is fixedly connected to the middle portion of the lower end of the equipment shell (5), and the output end of the first motor (61) is movably connected to the movable hole (63) through insertion.

9. The chip testing device with a temperature simulation environment according to claim 7, characterized in that: The vortex blade (62) is located inside the device shell (5), and the vortex blade (62) does not contact the device shell (5), the test furnace (1) and the data collector (81); the three groups of air inlets (64) are distributed in an equidistant circular array and do not contact each other; and the three groups of air inlets (64) do not contact the three through holes (85).

10. The chip testing device with a temperature simulation environment according to claim 1, characterized in that: The heating mechanism (3) comprises a second motor (31), the output end of the second motor (31) is fixedly connected to a fixing frame (32), and the lower end of the fixing frame (32) is fixedly connected to a plurality of heating lamps (33).

11. The chip testing device with a temperature simulation environment according to claim 10, characterized in that: The second motor (31) is fixedly connected to the middle part of the upper end of the test furnace (1); the output end of the second motor (31) passes through the upper end of the test furnace (1) and is movably connected to the test furnace (1).

12. The chip testing device with a temperature simulation environment according to claim 10, characterized in that: The fixing frame (32) is located on the upper side of the interior of the test furnace (1), the fixing frame (32) is in contact with the inner surface of the test furnace (1) and is slidably connected to the test furnace (1), and a plurality of the heating lamps (33) are distributed in an equidistant circular array and do not contact each other.

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