Solder resist exposure device for Mini LED metal substrate

Abstract

The utility model relates to the technical field of metal substrates, and provides a solder resist exposure device for a Mini LED metal substrate, which comprises a protection plate, and a metal substrate body is arranged at the top of the protection plate; the top of the protective plate is provided with a solder resist exposure device, the solder resist exposure device comprises a fixed plate, the side surface of the fixed plate is fixedly connected with the side surface of the protective plate, the side surface of the fixed plate is fixedly connected with a motor, an output shaft of the motor is fixedly connected with a rotating rod, and one end of the rotating rod is fixedly connected with a reciprocating screw rod. By means of the technical scheme, the problems that in the prior art, it is difficult to achieve the effect that the surface of the metal substrate body is evenly coated with the solder resist film, it is difficult to achieve the effect that the metal substrate is baked, the product quality and stability are reduced, the production efficiency is reduced, and it is difficult to ensure that the solder resist film rapidly reaches the needed hardness and adhesive force after being processed are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of metal substrates, and specifically, to a solder resist exposure device for a Mini LED metal substrate. Background Art

[0002] Metal substrate is a common basic material in electronic devices. It is mainly used to support and connect electronic components while providing heat dissipation and mechanical support. In LED display technology, especially in the application of Mini LED technology, metal substrate plays an important role.

[0003] According to a disclosed Mylar exposure device for solder mask (publication number: CN211123619U), it includes: an exposure table for placing the solder mask; a negative film, which is superimposed on the solder mask; a support bar, which has air holes or air grooves on the left and right sides of the support bar, is placed on the exposure table, distributed around the solder mask and has a certain distance between the solder mask; a Mylar sheet is placed on the exposure table, the negative film and the support bar. In a vacuum environment, part of the Mylar sheet located in the area between the support bar and the solder mask is concave downward and does not fit with the exposure table, forming a positioning contour in the area around the negative film and the solder mask for precise positioning to prevent the position from being opposite. The offset is corrected, and the support bar can help the film and the solder mask share most of the pressure from the Mylar sheet. Since the part of the Mylar sheet located in the area between the support bar and the solder mask is not in contact with the exposure table, the pressure on the solder mask is very small, and the extrusion effect is not obvious, which prevents the film print on the solder mask. However, in the above-mentioned device, through the cooperation of components such as the solder mask, the film and the exposure table, it is difficult to achieve the effect of uniformly applying the solder mask on the surface of the metal substrate body, and it is difficult to achieve the effect of baking the metal substrate, which reduces product quality and stability, reduces production efficiency, and is difficult to ensure that the solder mask quickly reaches the required hardness and adhesion after processing, which needs to be improved. Utility Model Content

[0004] The utility model provides a solder resist exposure device for a Mini LED metal substrate.

[0005] The technical solution of the utility model is as follows: A solder resist exposure device for a Mini LED metal substrate comprises a protective plate, a metal substrate body is arranged on the top of the protective plate;

[0006] A solder resist exposure device is arranged on the top of the protective plate, and the solder resist exposure device includes a fixed plate, a side surface of the fixed plate is fixedly connected to the side surface of the protective plate, a motor is fixedly connected to the side surface of the fixed plate, a rotating rod is fixedly connected to the output shaft of the motor, a reciprocating screw is fixedly connected to one end of the rotating rod, a threaded block is threadedly connected to the circumferential surface of the reciprocating screw, a cylindrical rod is rotatably connected to the side surface of the threaded block, and a roller brush is fixedly connected to the circumferential surface of the cylindrical rod.

[0007] The circumferential surface of the rotating rod is fixedly connected with a gear, the side of the fixed plate is rotatably connected with the rotating rod, the circumferential surface of the rotating rod is fixedly connected with a gear plate, the end of the rotating rod away from the fixed plate is fixedly connected with a threaded rod, the circumferential surface of the threaded rod is threadedly connected with a threaded sleeve, and the bottom of the threaded sleeve is fixedly connected with an electric heating plate.

[0008] A limiting rod is passed through the side surface of the threaded block, and one end of the limiting rod is fixedly connected to the side surface of the fixing plate.

[0009] The bottom of the fixed plate is fixedly connected to a mounting plate, the side of the mounting plate is rotatably connected to a fixing rod, the end of the fixing rod away from the mounting plate is fixedly connected to a clamping plate, the circumferential surface of the fixing rod is fixedly connected to a gear B, the side of the mounting plate is fixedly connected to a driving motor, the output shaft of the driving motor is fixedly connected to a spring telescopic rod, and the telescopic end of the spring telescopic rod is fixedly connected to a rotating gear.

[0010] The side surface of the threaded sleeve is fixedly connected with an extrusion rod, the rotating gear is located on the movement track of the extrusion rod, and the shape of the extrusion rod is set to be L-shaped.

[0011] A torsion spring is fixedly connected to the side surface of the threaded block, and one end of the torsion spring away from the threaded block is fixedly connected to the circumferential surface of the cylindrical rod.

[0012] The initial state of the torsion spring is a relaxed state, the gear B is located on the motion trajectory of the rotating gear, and the side surface of the gear is meshed with the side surface of the gear plate.

[0013] The number of the mounting plates is set to two, and they are symmetrical to each other along the vertical center axis of the protective plate, and the electric heating plate is located at the bottom of the metal base plate body.

[0014] The number of the fixing rods is set to two, and they are symmetrical to each other along the vertical center axis of the protective plate. The number of the clamping plates is set to two, and they are symmetrical to each other along the vertical center axis of the protective plate.

[0015] The side surface of the threaded sleeve passes through a limiting column, and one end of the limiting column is fixedly connected to the side surface of the fixing plate.

[0016] The working principle and beneficial effects of the utility model are:

[0017] 1. In the utility model, the force of the rotating rod driven by the motor cooperates with the limit rod, threaded sleeve, threaded block and other components in the solder mask exposure device, so that the roller brush is driven to move by the displacement of the cylindrical rod, and the solder mask is evenly applied to the surface of the metal substrate body. The electric heating plate is driven to move by the displacement of the threaded sleeve, and the metal substrate is baked. The curing speed of the solder mask is accelerated, and it can be ensured that the solder mask has a consistent thickness and coverage on the entire substrate surface, thereby improving product quality and stability. Rapid curing can shorten the production cycle, improve production efficiency, and ensure that the solder mask quickly reaches the required hardness and adhesion after processing.

[0018] 2. In the utility model, the force of the extrusion rod driven by the displacement of the threaded sleeve cooperates with the components such as the drive motor, torsion spring and cylindrical rod in the solder mask exposure device, so that the clamping plate is driven to rotate by the rotation of the fixed rod, and the clamping plate drives the metal substrate body to rotate, so as to achieve the effect of automatic flipping after the top of the metal substrate body is painted. The automatic flipping ensures that the solder mask can be evenly coated on each side of the metal substrate. By accurately controlling the timing and speed of flipping, the consistency of painting and the stability of quality can be guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0020] Figure 1 This is a schematic diagram of the three-dimensional appearance structure of the utility model;

[0021] Figure 2 It is a three-dimensional side view structural schematic diagram of the installation plate of the utility model;

[0022] Figure 3 It is a three-dimensional side view structural diagram of the roller brush of the utility model;

[0023] Figure 4 It is a three-dimensional enlarged structural schematic diagram of the clamping plate of the utility model;

[0024] Figure 5 It is a three-dimensional side view structural schematic diagram of the extrusion rod of the utility model.

[0025] In the figure: 101, protective plate; 102, metal substrate body; 2, solder mask exposure device; 201, fixed plate; 202, motor; 203, rotating rod; 204, reciprocating screw; 205, limiting rod; 206, threaded block; 207, roller brush; 208, gear; 209, gear plate; 210, rotating rod; 211, threaded rod; 212, threaded sleeve; 213, limiting column; 214, electric heating plate; 215, extrusion rod; 216, mounting plate; 217, fixed rod; 218, clamping plate; 219, driving motor; 220, rotating gear; 221, gear B; 222, cylindrical rod; 223, torsion spring; 224, spring telescopic rod. DETAILED DESCRIPTION

[0026] The following will be combined with the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] Example 1

[0028] like Figure 1-Figure 2 As shown, this embodiment proposes a solder resist exposure device for a Mini LED metal substrate, including a protective plate 101, a metal substrate body 102 is arranged on the top of the protective plate 101; a solder resist exposure device 2 is arranged on the top of the protective plate 101, and the solder resist exposure device 2 includes a fixed plate 201, the side of the fixed plate 201 is fixedly connected to the side of the protective plate 101, the side of the fixed plate 201 is fixedly connected to a motor 202, the output shaft of the motor 202 is fixedly connected to a rotating rod 203, one end of the rotating rod 203 is fixedly connected to a reciprocating screw 204, the circumferential surface of the reciprocating screw 204 is threadedly connected to a threaded block 206, the side of the threaded block 206 is rotatably connected to a cylindrical rod 222, and the circumferential surface of the cylindrical rod 222 is fixedly connected to a roller brush 207. The circumferential surface of the rotating rod 203 is fixedly connected with a gear 208, the side of the fixed plate 201 is rotatably connected with a rotating rod 210, the circumferential surface of the rotating rod 210 is fixedly connected with a gear plate 209, the end of the rotating rod 210 away from the fixed plate 201 is fixedly connected with a threaded rod 211, the circumferential surface of the threaded rod 211 is threadedly connected with a threaded sleeve 212, and the bottom of the threaded sleeve 212 is fixedly connected with an electric heating plate 214, so that the solder mask is evenly applied to the surface of the metal substrate. This uniform application can ensure that the solder mask has a consistent thickness and coverage on the entire substrate surface, improve product quality and stability, and rapid curing can shorten the production cycle, improve production efficiency, and ensure that the solder mask quickly reaches the required hardness and adhesion after processing.

[0029] In this embodiment, the motor 202 drives the rotating rod 203 to rotate, and then the rotating rod 203 rotates to drive the reciprocating screw 204 to rotate, and the reciprocating screw 204 rotates to drive the threaded block 206 to move horizontally, and then the limiting rod 205 on the side of the threaded block 206 limits the threaded block 206, and the displacement of the threaded block 206 drives the cylindrical rod 222 to move, and then the displacement of the cylindrical rod 222 drives the roller brush 207 to move, so as to achieve the effect of uniformly applying the solder mask on the surface of the metal substrate body 102, and the rotating rod 203 rotates to drive the roller brush 207 to move horizontally. The gear 208 is driven to rotate, and the gear 208 drives the gear plate 209 to rotate, and the gear plate 209 drives the rotating rod 210 to rotate, and the rotating rod 210 drives the threaded rod 211 to rotate, and the threaded sleeve 212 is driven to move horizontally by the rotation of the threaded rod 211, and the threaded sleeve 212 is limited by the limiting column 213 on the side of the threaded sleeve 212, and the electric heating plate 214 is driven to move by the displacement of the threaded sleeve 212, thereby achieving the effect of baking the metal substrate body 102 and accelerating the curing speed of the solder mask.

[0030] Example 2

[0031] like Figure 3-Figure 5As shown, based on the same concept as the above-mentioned embodiment 1, this embodiment also proposes a solder mask exposure device for MiniLED metal substrate, the side of the threaded block 206 is penetrated by a limiting rod 205, and one end of the limiting rod 205 is fixedly connected to the side of the fixed plate 201. The bottom of the fixed plate 201 is fixedly connected to a mounting plate 216, the side of the mounting plate 216 is rotatably connected to a fixing rod 217, the end of the fixing rod 217 away from the mounting plate 216 is fixedly connected to a clamping plate 218, the circumferential surface of the fixing rod 217 is fixedly connected to a gear B221, the side of the mounting plate 216 is fixedly connected to a driving motor 219, the output shaft of the driving motor 219 is fixedly connected to a spring telescopic rod 224, and the telescopic end of the spring telescopic rod 224 is fixedly connected to a rotating gear 220. The side of the threaded sleeve 212 is fixedly connected to an extrusion rod 215, the rotating gear 220 is located on the motion trajectory of the extrusion rod 215, and the shape of the extrusion rod 215 is set to be L-shaped. The side of the threaded block 206 is fixedly connected with a torsion spring 223, and one end of the torsion spring 223 away from the threaded block 206 is fixedly connected to the circumferential surface of the cylindrical rod 222. The initial state of the torsion spring 223 is a relaxed state, the gear B221 is located on the motion trajectory of the rotating gear 220, and the side of the gear 208 is meshed with the side of the gear plate 209. The number of mounting plates 216 is set to two, and they are symmetrical to each other along the vertical center axis of the protective plate 101, and the electric heating plate 214 is located at the bottom of the metal substrate body 102. The number of fixed rods 217 is set to two, and they are symmetrical to each other along the vertical center axis of the protective plate 101. The number of clamping plates 218 is set to two, and they are symmetrical to each other along the vertical center axis of the protective plate 101. The side of the threaded sleeve 212 passes through the limiting column 213, and one end of the limiting column 213 is fixedly connected to the side of the fixed plate 201. The device can automatically complete the flipping operation of the metal substrate without manual intervention. This can save a lot of human resources and time, improve the overall efficiency of the production line, and the automated flipping ensures that each side of the metal substrate can be evenly coated with solder mask. By precisely controlling the timing and speed of the flipping, the consistency and quality stability of the coating can be guaranteed.

[0032] In this embodiment, the displacement of the threaded sleeve 212 drives the extrusion rod 215 to be displaced, and then the extrusion rod 215 is displaced to squeeze the rotating gear 220, and the spring telescopic rod 224 on the side of the rotating gear 220 is squeezed. At this time, the gear B221 is meshed with the rotating gear 220, and the driving motor 219 drives the spring telescopic rod 224 to rotate, and then the rotating gear 220 is driven to rotate by the rotation of the spring telescopic rod 224, and the gear B221 is driven to rotate by the rotation of the rotating gear 220, and then the fixed rod 217 is driven to rotate by the rotation of the gear B221, and the clamping plate 218 is driven to rotate by the rotation of the fixed rod 217, and the clamping plate 218 will drive the metal substrate body 102 to rotate, and the rotation of the metal substrate body 102 will squeeze the roller brush 207, so that it drives the cylindrical rod 222 to rotate, and when the metal substrate body 102 is turned over, the roller brush 207 is reset by the elastic force of the torsion spring 223, so that the metal substrate body 102 is automatically turned over after the top of the brushing is completed.

[0033] The above description is only an embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention shall be included within the scope of the claims of the present invention.

Claims

1. A solder resist exposure device for a MiniLED metal substrate, characterized in that: It comprises a protection plate (101), wherein a metal substrate body (102) is arranged on the top of the protection plate (101); A solder resist exposure device (2) is arranged on the top of the protective plate (101), and the solder resist exposure device (2) comprises a fixed plate (201), the side of the fixed plate (201) is fixedly connected to the side of the protective plate (101), the side of the fixed plate (201) is fixedly connected to a motor (202), the output shaft of the motor (202) is fixedly connected to a rotating rod (203), one end of the rotating rod (203) is fixedly connected to a reciprocating screw (204), the circumferential surface of the reciprocating screw (204) is threadedly connected to a threaded block (206), the side of the threaded block (206) is rotatably connected to a cylindrical rod (222), and the circumferential surface of the cylindrical rod (222) is fixedly connected to a roller brush (207).

2. A solder resist exposure device for a MiniLED metal substrate according to claim 1, characterized in that: The circumferential surface of the rotating rod (203) is fixedly connected to a gear (208); the side surface of the fixed plate (201) is rotatably connected to a rotating rod (210); the circumferential surface of the rotating rod (210) is fixedly connected to a gear plate (209); one end of the rotating rod (210) away from the fixed plate (201) is fixedly connected to a threaded rod (211); the circumferential surface of the threaded rod (211) is threadedly connected to a threaded sleeve (212); and the bottom of the threaded sleeve (212) is fixedly connected to an electric heating plate (214).

3. A solder resist exposure device for a MiniLED metal substrate according to claim 2, characterized in that: A limiting rod (205) passes through the side surface of the threaded block (206), and one end of the limiting rod (205) is fixedly connected to the side surface of the fixing plate (201).

4. A solder resist exposure device for a MiniLED metal substrate according to claim 3, characterized in that: The bottom of the fixed plate (201) is fixedly connected to a mounting plate (216), the side of the mounting plate (216) is rotatably connected to a fixing rod (217), one end of the fixing rod (217) away from the mounting plate (216) is fixedly connected to a clamping plate (218), the circumferential surface of the fixing rod (217) is fixedly connected to a gear B (221), the side of the mounting plate (216) is fixedly connected to a driving motor (219), the output shaft of the driving motor (219) is fixedly connected to a spring telescopic rod (224), and the telescopic end of the spring telescopic rod (224) is fixedly connected to a rotating gear (220).

5. A solder resist exposure device for a Mini LED metal substrate according to claim 4, characterized in that: The side surface of the threaded sleeve (212) is fixedly connected with an extrusion rod (215); the rotating gear (220) is located on the movement track of the extrusion rod (215); and the shape of the extrusion rod (215) is set to be L-shaped.

6. A solder resist exposure device for a MiniLED metal substrate according to claim 5, characterized in that: A torsion spring (223) is fixedly connected to the side surface of the threaded block (206), and one end of the torsion spring (223) away from the threaded block (206) is fixedly connected to the circumferential surface of the cylindrical rod (222).

7. A solder resist exposure device for a MiniLED metal substrate according to claim 6, characterized in that: The initial state of the torsion spring (223) is a relaxed state, the gear B (221) is located on the motion track of the rotating gear (220), and the side surface of the gear (208) is meshed with the side surface of the gear plate (209).

8. The solder resist exposure device for MiniLED metal substrate according to claim 7, characterized in that: The number of the mounting plates (216) is set to two, and they are symmetrical to each other along the vertical center axis of the protection plate (101), and the electric heating plate (214) is located at the bottom of the metal substrate body (102).

9. A solder resist exposure device for a MiniLED metal substrate according to claim 8, characterized in that: The number of the fixing rods (217) is set to two, and they are symmetrical to each other along the vertical center axis of the protective plate (101); the number of the clamping plates (218) is set to two, and they are symmetrical to each other along the vertical center axis of the protective plate (101).

10. A solder resist exposure device for a Mini LED metal substrate according to claim 9, characterized in that: The side surface of the threaded sleeve (212) passes through a limiting column (213), and one end of the limiting column (213) is fixedly connected to the side surface of the fixing plate (201).

Images