X86 module single board circuit board card

Abstract

The utility model discloses an X86 module single board circuit board card, which relates to the technical field of circuit boards, and comprises a circuit board main body, four fixing holes and four mounting holes, the four fixing holes are distributed at four corners in the circuit board main body, and the four mounting holes are distributed in the circuit board main body in a rectangular array; the X86 module single board circuit board card comprises a circuit board main body, the top of the circuit board main body is provided with a heat dissipation structure for carrying out heat dissipation on electronic components at the top of the circuit board main body, the heat dissipation structure comprises a protective cover fixedly connected to the top of the circuit board main body, and the top of the protective cover is fixedly connected with a ventilation pipe. The cooling fins are arranged on the circuit board body, so that high-speed flowing air flows among the cooling fins, the cooling fins are cooled, the power supply module, a hard disk mounted at the top of the hard disk seat and electronic elements located on the inner side of the protective cover at the top of the circuit board body are cooled, and the operation stability of the circuit board card is maintained.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to an X86 module single-board circuit board card. Background Art

[0002] A modular single-board circuit board based on the x86 architecture, usually refers to a compact computer motherboard with an integrated x86 processor that integrates the processor, memory, I / O interface and other necessary electronic components.

[0003] For example, a computer motherboard with publication number CN207704331U includes a motherboard and a cold conduction plate, which is arranged above the motherboard. The cold conduction plate is provided with an XMC graphics card mounting portion, and the XMC graphics card mounting portion is provided with through holes for accommodating an interface of the XMC graphics card and a display module respectively; the motherboard is provided with an XMC graphics card connector for connecting to the interface; the XMC graphics card is fixedly connected to the XMC graphics card mounting portion, and is fixedly connected to the motherboard through the XMC graphics card mounting portion. The utility model connects the XMC graphics card to the motherboard through the cold conduction plate, which greatly improves the stability of the motherboard operation and the heat dissipation performance of the XMC graphics card.

[0004] A computer motherboard in the above technical solution improves the heat dissipation efficiency by optimizing the connection method of the motherboard, thereby improving the stability of the motherboard operation. In actual application scenarios, computer motherboards usually need to operate in a high-temperature environment. Although the current heat dissipation technology for processors is relatively mature, on motherboards running in high-temperature environments, electronic components other than graphics cards and processors mainly rely on passive heat dissipation mechanisms for heat dissipation. However, the effect of this heat dissipation method is limited and may affect the stability of the motherboard operation. Utility Model Content

[0005] The purpose of the utility model is to provide an X86 module single-board circuit board card to solve the problem that the electronic components other than the graphics card and the processor in the above-mentioned background technology mainly rely on passive heat dissipation mechanism for heat dissipation, however, the effect of this heat dissipation method is limited and may cause the stability of the mainboard operation to be affected.

[0006] To achieve the above object, the utility model provides the following technical solutions: an X86 module single-board circuit board card, comprising a circuit board body, fixing holes, and mounting holes, wherein four fixing holes are provided and distributed at the four corners inside the circuit board body, and four mounting holes are provided and distributed in a rectangular array inside the circuit board body;

[0007] A heat dissipation structure for dissipating heat from the electronic components on the top of the circuit board main body is provided on the top of the circuit board main body. The heat dissipation structure includes a protective cover fixedly connected to the top of the circuit board main body, and a ventilation pipe is fixedly connected to the top of the protective cover. A plurality of heat dissipation fins are fixedly connected inside the ventilation pipe and are evenly distributed. A plurality of heat conduction fins are fixedly connected to the inner top of the protective cover and are evenly distributed. A heat conduction seat is fixedly connected to the bottoms of the plurality of evenly distributed heat conduction fins. There are three protective covers, and a connecting pipe is fixedly connected between two protective covers. The two ends of the connecting pipe communicate with the inside of the ventilation pipe. At the same time, an air duct is formed among the three ventilation pipes and the two connecting pipes.

[0008] Preferably, an air inlet pipe is fixedly connected to the end of the air duct, and an air suction pipe is fixedly connected to the end of the air inlet pipe away from the ventilation pipe. The width of the air inlet pipe near the ventilation pipe is greater than the width of the end near the air suction pipe, and the width of the air suction pipe near the air inlet pipe is greater than the width of the end away from the air inlet pipe. A turbine is rotatably connected inside the air suction pipe.

[0009] Preferably, a processor is fixedly connected to the top of the circuit board main body, and the processor is located between four mounting holes. The circuit board main body is fixedly connected with two groups of power supply modules, and the two groups of power supply modules are distributed outside the processor.

[0010] Preferably, a main board power supply seat and a processing power supply seat are respectively fixedly connected to the bottom of the circuit board main body, and extension wiring seats are fixedly connected to the positions on the top of the circuit board main body that are aligned with the main board power supply seat and the processing power supply seat.

[0011] Preferably, an O / I panel is fixedly connected to the side of the circuit board main body away from the main board power supply seat, and a heat conduction sticker is attached to the top of the power supply module. A hard disk seat is fixedly connected to the top of the circuit board main body, and the hard disk seat is located outside the processor.

[0012] Preferably, the top of the power supply module is attached to the bottom of the protective cover through a heat conduction sticker, and the top of the hard disk seat is attached to the heat conduction seat. Both the power supply module and the hard disk seat are located inside the protective cover.

[0013] Preferably, two PCIE slots are fixedly connected to the top of the circuit board main body, and a USB slot and a SATA slot are fixedly connected to the side of the top of the circuit board main body away from the O / I panel.

[0014] Compared with the prior art, the beneficial effects of the present utility model are:

[0015] The X86 module single-board circuit board card is provided with a heat dissipation structure, which enters the interior of the ventilation pipe after passing through the air intake pipe, so that the high-speed air flows between a plurality of heat dissipation fins, thereby cooling the heat dissipation fins, and then cooling the power supply module and the hard disk installed on the top of the hard disk seat and the electronic components located inside the protective cover on the top of the circuit board body, thereby maintaining the stability of the operation of the circuit board card;

[0016] Furthermore, the intake pipe and the air intake pipe together form a pipe that is wide at both ends and narrow in the middle. When the turbine inside the air intake pipe is working, the air passing through the intake pipe and the air intake pipe will undergo compression and speed increase and expansion and speed decrease operations, so that the turbulence and flow separation of the air are reduced before entering the ventilation pipe, so that the air flows evenly between each cooling fin, while reducing the noise generated by the air flow;

[0017] Furthermore, compared to traditional computer motherboards, the processing power supply socket that supplies power to the processor and the mainboard power supply socket that supplies power to the circuit board body are both located on the back of the circuit board body, and the mainboard power supply socket and the processing power supply socket both connect their internal wires to the circuit board body through extended terminal sockets, thereby increasing the space on the front side of the circuit board body. At the same time, since the mainboard power supply socket and the processing power supply socket are both located on the back of the circuit board body, the wiring difficulty for the installer is reduced, and the wire entanglement is prevented while being both beautiful. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the bottom structure of the utility model;

[0020] Figure 3 This is a schematic diagram of the explosion structure of the utility model;

[0021] Figure 4 This is a schematic diagram of the main structure of the circuit board of the utility model;

[0022] Figure 5 This is a schematic diagram of the explosion structure of the protective cover of the utility model;

[0023] Figure 6 This is a schematic diagram of the explosion structure of the intake pipe of the utility model.

[0024] In the figure: 1. Circuit board body; 2. Fixing hole; 3. Mounting hole; 4. Processor; 5. Power supply module; 6. Mainboard power supply socket; 7. Processor power supply socket; 8. Extension terminal socket; 9. O / I panel; 10. Thermal paste; 11. Hard disk socket; 12. PCIE slot; 13. USB slot; 14. SATA slot; 15. Protective cover; 16. Ventilation duct; 17. Heat sink fins; 18. Thermal fins; 19. Thermal socket; 20. Connecting pipe; 21. Intake pipe; 22. Intake pipe. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] Embodiment 1:

[0027] See also Figure 1 - Figure 6 , the utility model provides the following technical solutions:

[0028] An X86 module single-board circuit board card, comprising a circuit board body 1, fixing holes 2, and mounting holes 3, wherein four fixing holes 2 are provided and distributed at four corners inside the circuit board body 1, and four mounting holes 3 are provided and distributed in a rectangular array inside the circuit board body 1;

[0029] A heat dissipation structure for dissipating the electronic components on its top is provided on the top of the circuit board body 1, and the heat dissipation structure includes a protective cover 15 fixedly connected to the top of the circuit board body 1, and a ventilation pipe 16 is fixedly connected to the top of the protective cover 15, and a plurality of equidistantly distributed heat dissipation fins 17 are fixedly connected inside the ventilation pipe 16, a plurality of equidistantly distributed heat-conducting fins 18 are fixedly connected to the top of the inner side of the protective cover 15, and a heat-conducting seat 19 is fixedly connected to the bottom of the plurality of equidistantly distributed heat-conducting fins 18, three protective covers 15 are provided, and a connecting pipe 20 is fixedly connected between two protective covers 15, and both ends of the connecting pipe 20 are communicated with the inside of the ventilation pipe 16, and an air duct is formed between the three ventilation pipes 16 and the two connecting pipes 20.

[0030] An air intake pipe 21 is fixedly connected to the end of the air duct, and an air intake pipe 22 is fixedly connected to the end of the air intake pipe 21 away from the ventilation pipe 16, the width of the end of the air intake pipe 21 close to the ventilation pipe 16 is greater than the width of the end of the air intake pipe 22 close to the air intake pipe 21 is greater than the width of the end of the air intake pipe 22 away from the air intake pipe 21, and a turbine is rotatably connected inside the air intake pipe 22.

[0031] A processor 4 is fixedly connected to the top of the circuit board body 1 , and the processor 4 is located between the four mounting holes 3 . Two groups of power supply modules 5 are fixedly connected to the circuit board body 1 , and the two groups of power supply modules 5 are distributed outside the processor 4 .

[0032] The bottom of the circuit board body 1 is fixedly connected with a mainboard power supply socket 6 and a processing power supply socket 7, and the top of the circuit board body 1 is fixedly connected with an extension wiring socket 8 at a position aligned with the mainboard power supply socket 6 and the processing power supply socket 7.

[0033] An O / I panel 9 is fixedly connected to the side of the circuit board body 1 away from the mainboard power supply socket 6, and a thermal conductive paste 10 is attached to the top of the power supply module 5. A hard disk socket 11 is fixedly connected to the top of the circuit board body 1, and the hard disk socket 11 is located outside the processor 4.

[0034] The top of the power supply module 5 is bonded to the bottom of the protective cover 15 via the thermal paste 10 , and the top of the hard disk seat 11 is bonded to the thermal seat 19 . Both the power supply module 5 and the hard disk seat 11 are located inside the protective cover 15 .

[0035] Two PCIE slots 12 are fixedly connected to the top of the circuit board body 1 , and a USB slot 13 and a SATA slot 14 are fixedly connected to the side of the top of the circuit board body 1 away from the O / I panel 9 .

[0036] Embodiment 2:

[0037] Based on the first embodiment, the specific working principle is as follows:

[0038] In this X86 module single-board circuit board card, when the circuit board body 1 is in operation, the temperature generated by the processor 4 when working will cause heat accumulation inside the chassis where the circuit board card is installed. At the same time, the heat generated by the power supply module 5 will be directly introduced into the top of the protective cover 15 through the thermal paste 10, so that the heat is absorbed by the heat dissipation fins 17, and the hard disk installed on the top of the hard disk seat 11 and the heat is introduced into the inside of the thermal seat 19, and then the heat is introduced into the top of the protective cover 15 through the thermal fins 18, so that the heat is absorbed by the heat dissipation fins 17. At this time, the turbine inside the air intake pipe 22 is started to rotate, so that the turbine draws air from the inside of the air intake pipe 22, and enters the inside of the ventilation pipe 16 after passing through the air intake pipe 21, so that the high-speed flowing air flows between the multiple heat dissipation fins 17, thereby cooling the heat dissipation fins 17, and then cooling the hard disk installed on the top of the power supply module 5 and the hard disk seat 11 and the electronic components located on the inner side of the protective cover 15 on the top of the circuit board body 1, so as to maintain the stability of the operation of the circuit board card;

[0039] The air inlet pipe 21 and the air intake pipe 22 together form a pipe that is wide at both ends and narrow in the middle. When the turbine inside the air intake pipe 22 is working, the air passing through the air inlet pipe 21 and the air intake pipe 22 will undergo compression to increase speed and expansion to decrease speed, so that the turbulence and flow separation of the air are reduced before entering the ventilation pipe 16, so that the air flows evenly between each heat sink fin 17, while reducing the noise generated by the air flow.

[0040] Compared with the traditional computer motherboard, the processing power supply socket 7 for powering the processor 4 and the mainboard power supply socket 6 for powering the circuit board body 1 are both located on the back of the circuit board body 1, and the mainboard power supply socket 6 and the processing power supply socket 7 are connected to the circuit board body 1 through the extended terminal socket 8 to increase the space on the front side of the circuit board body 1. At the same time, since the mainboard power supply socket 6 and the processing power supply socket 7 are both located on the back of the circuit board body 1, the wiring difficulty of the installer is reduced, and the wire entanglement is prevented while being beautiful.

[0041] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. An X86 module single-board circuit board card, comprising a circuit board body (1), a fixing hole (2), and a mounting hole (3), wherein the fixing holes (2) are provided with four holes distributed at four corners inside the circuit board body (1), and the mounting holes (3) are provided with four holes distributed in a rectangular array inside the circuit board body (1); Features: The top of the circuit board body (1) is provided with a heat dissipation structure for dissipating heat from the electronic components on the top thereof, the heat dissipation structure comprising a protective cover (15) fixedly connected to the top of the circuit board body (1), a ventilation pipe (16) fixedly connected to the top of the protective cover (15), and a plurality of equidistantly distributed heat dissipation fins (17) fixedly connected inside the ventilation pipe (16), a plurality of equidistantly distributed heat conduction fins (18) fixedly connected to the top of the inner side of the protective cover (15), and a heat conduction seat (19) fixedly connected to the bottom of the plurality of equidistantly distributed heat conduction fins (18), three protective covers (15) are provided, and a connecting pipe (20) is fixedly connected between two protective covers (15), and both ends of the connecting pipe (20) are communicated with the inside of the ventilation pipe (16), and an air duct is formed between the three ventilation pipes (16) and the two connecting pipes (20).

2. The X86 module single-board circuit board card according to claim 1, characterized in that: An air intake pipe (21) is fixedly connected to the end of the air duct, and an end of the air intake pipe (21) away from the ventilation pipe (16) is fixedly connected to an air intake pipe (22), the width of the end of the air intake pipe (21) close to the ventilation pipe (16) is greater than the width of the end of the air intake pipe (22) close to the air intake pipe (21) is greater than the width of the end of the air intake pipe (22) away from the air intake pipe (21), and a turbine is rotatably connected inside the air intake pipe (22).

3. The X86 module single-board circuit board card according to claim 2, characterized in that: A processor (4) is fixedly connected to the top of the circuit board body (1), and the processor (4) is located between the four mounting holes (3); two groups of power supply modules (5) are fixedly connected to the circuit board body (1), and the two groups of power supply modules (5) are distributed outside the processor (4).

4. The X86 module single-board circuit board card according to claim 3, characterized in that: The bottom of the circuit board body (1) is respectively fixedly connected to a mainboard power supply seat (6) and a processing power supply seat (7), and the top of the circuit board body (1) is fixedly connected to an extension wiring seat (8) at a position aligned with the mainboard power supply seat (6) and the processing power supply seat (7).

5. The X86 module single-board circuit board card according to claim 4, characterized in that: An O / I panel (9) is fixedly connected to a side of the circuit board body (1) away from the mainboard power supply seat (6), and a heat conductive paste (10) is attached to the top of the power supply module (5). A hard disk seat (11) is fixedly connected to the top of the circuit board body (1), and the hard disk seat (11) is located outside the processor (4).

6. The X86 module single-board circuit board card according to claim 5, characterized in that: The top of the power supply module (5) is bonded to the bottom of the protective cover (15) via a thermal paste (10), and the top of the hard disk seat (11) is bonded to the thermal seat (19), and the power supply module (5) and the hard disk seat (11) are both located inside the protective cover (15).

7. The X86 module single-board circuit board card according to claim 6, characterized in that: Two PCIE slots (12) are fixedly connected to the top of the circuit board body (1), and a USB slot (13) and a SATA slot (14) are fixedly connected to the side of the top of the circuit board body (1) away from the O / I panel (9).

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