Grounding partition plate assembly structure of ion etching cavity

Abstract

The utility model discloses a grounding partition plate assembly structure of an ion etching cavity, which relates to the technical field of ion etching and comprises a shell, two first partition plates and two second partition plates. The two first partition plates are symmetrically and horizontally arranged in the shell, and two first lap joint parts are arranged on each first partition plate; the two second partition plates are symmetrically and horizontally arranged in the shell, two second lap joint parts are arranged on each second partition plate, and the second lap joint parts are matched with the corresponding first lap joint parts; wherein the first partition plate and the second partition plate are combined to divide the shell into two cavities, and a fabrication hole is formed between the first partition plate and the second partition plate. According to the utility model, an electromagnetic field can be effectively prevented from leaking from a gap between the first partition plate and the second partition plate.

Description

Technical Field

[0001] The utility model relates to the technical field of ion etching, in particular to a grounding partition plate component structure of an ion etching chamber. Background Art

[0002] Ion etching is the most common form of dry etching. Its principle is that the gas exposed to the high-frequency electric field area is excited to form plasma. The plasma is composed of charged electrons and ions. In addition to being converted into ions, the gas also absorbs energy and forms active groups. The charged ions and active groups are accelerated by the electric field and hit the surface of the etched material, which will release enough force to tightly bond the material or etch the surface with the surface expulsion force. In the ion etching chamber, a process area is formed between the upper electrode assembly and the lower electrode assembly. There is an electromagnetic field in the upper chamber. If the electromagnetic field leaks into the lower chamber, it will cause abnormal discharge to damage the equipment in the lower chamber and increase energy consumption. At this time, the abnormal discharge will also affect the etching quality of the workpiece. It is necessary to prevent the electromagnetic field from leaking into the lower chamber. The partition is usually installed in four pieces because it needs to be installed in the chamber, but the electromagnetic field will pass through the gap between the partitions to cause abnormal discharge, causing equipment damage and reduced etching quality. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a grounding partition assembly structure of an ion etching chamber, which can effectively prevent the electromagnetic field from leaking from the gap between the first partition and the second partition.

[0004] According to the first aspect of the utility model, a grounded partition assembly structure of an ion etching chamber includes: a shell, two first partitions, and two second partitions, the shell is grounded; the two first partitions are symmetrically arranged horizontally in the shell, and two first overlapping parts are arranged on the first partition; the two second partitions are symmetrically arranged horizontally in the shell, and two second overlapping parts are arranged on the second partition, and the second overlapping parts match the corresponding first overlapping parts; wherein the first partition and the second partition are combined to separate the shell into two cavities, and a process hole is formed between the first partition and the second partition.

[0005] According to the grounding partition assembly structure of an ion etching chamber of the utility model embodiment, at least the following beneficial effects are achieved: the first partition and the second partition are connected by the first overlap portion and the second overlap portion, which is convenient for installation, and the first overlap portion and the second overlap portion reduce the electromagnetic field leakage between the first partition and the second partition, which is beneficial for improving the etching quality.

[0006] According to some embodiments of the present invention, the first overlapping portion is connected to the side surface of the first partition plate, the second overlapping portion is connected to the side surface of the second partition plate, and the top surface of the first overlapping portion abuts against the bottom surface of the second overlapping portion.

[0007] According to some embodiments of the present invention, the top surface of the first partition plate and the top surface of the second partition plate are equal in height.

[0008] According to some embodiments of the present invention, the sum of the thickness of the first overlapping portion and the thickness of the second overlapping portion matches the thickness of the first partition plate or the thickness of the second partition plate.

[0009] According to some embodiments of the present invention, both the first partition plate and the second partition plate are detachably connected to the side wall of the shell via a connecting piece.

[0010] According to some embodiments of the present invention, a first shielding wire is arranged between the shell side wall and the first partition plate, and a second shielding wire is arranged between the shell side wall and the second partition plate.

[0011] According to some embodiments of the present invention, the upper ends of the first partition plate and the second partition plate are both connected to a support platform, and the support platform is used to support and position the pressure plate.

[0012] According to some embodiments of the present invention, an insulating layer is disposed on the upper ends of the first partition plate and the second partition plate.

[0013] According to some embodiments of the present invention, a plurality of vertically arranged ventilation holes are provided on the first partition plate and the second partition plate.

[0014] According to some embodiments of the present invention, a shielding plate is provided at the upper end of the ventilation hole, and a plurality of vertically arranged shielding holes are opened on the shielding plate, and the diameter of the shielding holes is 0.5 mm to 3 mm.

[0015] According to an embodiment of the utility model, a grounding partition assembly structure of an ion etching chamber has at least the following beneficial effects:

[0016] (1) The first partition plate and the second partition plate are connected by the first overlapping portion and the second overlapping portion, which is convenient for installation;

[0017] (2) The first overlapping portion and the second overlapping portion reduce the electromagnetic field leakage between the first partition and the second partition, which is beneficial to improving the etching quality;

[0018] (3) The ventilation holes can promptly discharge the waste gas generated during the etching process, improve the contact resistance of the substrate, and improve the etching quality.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:

[0021] Figure 1 It is a cross-sectional schematic diagram of an installation structure of an embodiment of the utility model;

[0022] Figure 2 A schematic diagram of the installation of the first partition and the second partition according to an embodiment of the utility model

[0023] Figure 3 Schematic diagram of the explosion of the first partition and the second partition of an embodiment of the utility model

[0024] Figure 4 Bottom view of the first partition of an embodiment of the utility model

[0025] Figure 5 A cross-sectional schematic diagram of a ventilation hole in an embodiment of the utility model

[0026] Figure 6 A schematic cross-sectional view of a second shielding line according to an embodiment of the utility model

[0027] Figure 7 The figure is a cross-sectional schematic diagram of a connecting piece according to an embodiment of the utility model.

[0028] Figure Number:

[0029] Shell 100, upper cavity 110, lower cavity 120;

[0030] A first partition plate 200, a first overlapping portion 210, and a mounting hole 220;

[0031] A second partition plate 300 and a second overlapping portion 310;

[0032] Process hole 400, base 410;

[0033] Connector 500;

[0034] A first shielding line 600;

[0035] A second shielding line 700;

[0036] Support platform 800, pressing plate 810;

[0037] Ventilation hole 900 , shielding plate 910 , shielding hole 911 . DETAILED DESCRIPTION

[0038] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0039] In the description of the present invention, it should be understood that the descriptions involving orientation, such as the orientation or positional relationship indicated as up, down, etc., are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0040] In the description of the present utility model, "a plurality" means more than two. If there is a description of "first" or "second", it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0041] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0042] Reference Figures 1 to 7As shown, a grounding partition assembly structure of an ion etching chamber according to an embodiment of the utility model includes: a shell 100, two first partitions 200, and two second partitions 300. The shell 100 is usually a metal part, and the cross-section of the shell 100 is square. The shell 100 is grounded to meet the requirements of the process; the first partition 200 is preferably an aluminum alloy plate, and the two first partitions 200 are symmetrically arranged horizontally in the shell 100, and the first partition 200 and the shell 100 are electrically connected to achieve indirect grounding. Two first overlapping parts 210 are arranged on the first partition 200; two second partitions 300 are symmetrically arranged horizontally in the shell 100, and the second partition 300 and the shell 100 are electrically connected to achieve indirect grounding. Two first partitions 200 and two second partitions 300 are arranged in a square manner to form a rectangular frame, and two second overlap portions 310 are provided on the second partition 300, and the second overlap portions 310 match the corresponding first overlap portions 210; the two first overlap portions 210 on the upper end of a first partition 200 are matched with the second overlap portions 310 on the two second partitions 300 respectively, wherein the first partition 200 and the second partition 300 combine to separate the shell 100 into two cavities, and the two cavities include an upper cavity 110 and a lower cavity 120, and a process hole 400 is formed between the first partition 200 and the second partition 300. During installation, the two first partitions 200 are first installed on the two opposite side walls inside the shell 100, and then the second overlapping parts 310 of the two second partitions 300 are respectively installed on the first overlapping parts 210 to achieve pre-positioning, and then the second partitions 300 are installed to the shell 100. In addition to the role of pre-positioning, the first overlapping parts 210 and the second overlapping parts 310 can also have a shielding effect to prevent the electromagnetic field in one cavity from leaking to another cavity.

[0043] Reference Figure 2 and Figure 3As shown, it can be understood that the first overlap portion 210 is connected to the side of the first partition 200 close to the other first partition 200, the first overlap portion 210 is integrally formed with the first partition 200, the second overlap portion 310 is connected to the side of the second partition 300 close to the first partition 200, the second overlap portion 310 is integrally formed with the second partition 300, the top surface of the first overlap portion 210 abuts against the bottom surface of the second overlap portion 310, and the abutment between the top surface of the first overlap portion 210 and the bottom surface of the second overlap portion 310 is conducive to reducing the gap between the first overlap portion 210 and the second overlap portion 310, improving the assembly accuracy and the effect of shielding the electromagnetic field. The first overlap portion 210 supports the second overlap portion 310. It is foreseeable that in some other embodiments of the utility model, the first overlap portion 210 is set to be a groove opened at the upper end of the first partition 200, and the second overlap portion 310 is set to be a convex edge integrally formed on the side of the second partition 300, and the convex edge is embedded in the groove for limiting. Since the gap between the first overlap portion 210 and the second overlap portion 310 is smaller in size and the path passing through the gap from the top to the bottom is longer, the shielding effect is better than when the first overlap portion 210 and the second overlap portion 310 are not provided.

[0044] Reference Figure 2 and Figure 3 As shown, it can be understood that the top surface of the first partition 200 is equal to the top surface of the second partition 300. The first partition 200 and the second partition 300 form a flat plane, so that the electromagnetic field in the cavity above the first partition 200 and the second partition 300 is evenly distributed to meet the process requirements of ion etching.

[0045] Reference Figure 2 As shown, it can be understood that the sum of the thickness of the first overlap portion 210 in the vertical direction and the thickness of the second overlap portion 310 in the vertical direction is equal to the thickness of the first partition 200 or the thickness of the second partition 300. So that after the first overlap portion 210 contacts the second overlap portion 310, the upper and lower end surfaces of the first partition 200 can be kept flush with the upper and lower end surfaces of the second partition 300 respectively. It can be foreseen that in order to keep the top surface of the first partition 200 and the second partition 300 flat after being combined, the horizontal dimension of the first overlap portion 210 should not be less than 1 / 4 of the width of the first partition 200. The horizontal dimension of the second overlap portion 310 should not be less than 1 / 4 of the width of the second partition 300. Ensure that there is sufficient contact area between the first overlap portion 210 and the second overlap portion 310.

[0046] Reference Figure 1 , Figure 2 and Figure 7As shown, it can be understood that the first partition 200 and the second partition 300 are both detachably connected to the side wall of the shell 100 through the connecting member 500. The connecting member 500 is a bolt. It is foreseeable that in some other embodiments of the utility model, the connecting member 500 can also be a pin, an expansion bolt, a buckle and other structures. During the working process, the first partition 200 and the second partition 300 will inevitably wear and need to be replaced, or when the process requirements change, the first partition 200 and the second partition 300 of different specifications need to be replaced. Configuring the first partition 200 and the second partition 300 to be detachably connected is conducive to replacing the first partition 200 and the second partition 300. When the connecting member 500 is a bolt, it is necessary to open a plurality of spaced mounting holes 220 on the side of the first partition 200 close to the process hole 400, and also open a plurality of spaced mounting holes 220 on the side of the second partition 300 close to the process hole 400. The mounting hole 220 is a through hole extending in the horizontal direction. The connector 500 is mounted in the mounting hole 220. A threaded hole for threaded mounting is provided on the inner side of the housing 100. A stepped surface is provided in the mounting hole 220 for mounting the connector 500, so that the connector 500 is completely located in the mounting hole 220 to prevent the connector 500 from extending out of the mounting hole 220.

[0047] Reference Figure 6 and Figure 7 As shown, it can be understood that a first shielding wire 600 is arranged between the side wall of the shell 100 and the first partition 200, a first installation groove is arranged on the side wall of the first partition 200 for the first shielding wire 600 to be embedded, and a second shielding wire 700 is arranged between the side wall of the shell 100 and the second partition 300. A second installation groove is arranged on the side wall of the second partition 300 for the second shielding wire 700 to be embedded. The first shielding wire 600 and the second shielding wire 700 are both made of conductive metal materials, and the first shielding wire 600 and the second shielding wire 700 have a certain elasticity along their diameter direction. The first shielding wire 600 maintains good electrical contact between the side wall of the shell 100 and the first partition 200, and the second shielding wire 700 maintains good electrical contact between the side wall of the shell 100 and the second partition 300, so that the first partition 200 and the second partition 300 can be well grounded to meet the process requirements.

[0048] Reference Figure 2 , Figure 3 and Figure 6As shown, it can be understood that the upper ends of the first partition 200 and the second partition 300 are both integrally formed with a support platform 800, and the support platform 800 can also be connected to the first partition 200 and the second partition 300 by welding. The support platforms 800 at the upper ends of the first partition 200 and the second partition 300 are combined to form a rectangular frame that matches the pressing plate 810. The support platform 800 is used to support and position the pressing plate 810. The process hole 400 is for the base 410 to pass through, and the workpiece is placed on the base 410. The pressing plate 810 is against the upper edge of the workpiece to prevent the workpiece from moving during processing. The pressing plate 810 is placed on the support platform 800, and the support platform 800 supports and positions the pressing plate 810. The height of the support platform 800 is between 2 mm and 5 mm. The specific structure and installation method of the pressing plate 810 are prior art, so they are not described in detail. The top surface of the support platform is not provided with an insulating layer, so that the pressing plate 810 can maintain good contact with the support platform and the pressing plate 810 can be well grounded to meet the etching process requirements.

[0049] Reference Figure 1 As shown, it can be understood that an insulating layer is provided at the upper end of the first partition 200 and the second partition 300. The first partition 200 and the second partition 300 are made of aluminum alloy plates, and the insulating layer is formed by an anodizing process. Only the upper end surfaces of the first partition 200 and the second partition 300 are oxidized. The side of the first partition 200 in contact with the shell 100 is not provided with an insulating layer, and the side of the second partition 300 in contact with the shell 100 is not provided with an insulating layer, so as to ensure that the first partition 200 and the second partition 300 can be well grounded. The surfaces where the first overlap part 210 and the second overlap part 310 contact each other are not provided with an insulating layer, so that the first partition 200 and the second partition 300 maintain a good electrical connection and improve the grounding effect. When the first partition 200 and the second partition 300 are made of other metal materials, the insulating layer can be painted on the surface of the first partition 200 and the second partition 300 using ceramic insulating paint.

[0050] Reference Figure 2 and Figure 5 As shown, it can be understood that a plurality of vertically arranged ventilation holes 900 are provided on the first partition plate 200 and the second partition plate 300. The lower cavity 120 is connected with a vacuum pump to extract the gas in the two cavities. The purpose of setting the ventilation hole is to facilitate the gas in the upper cavity 110 to enter the lower cavity 120. During the etching process, organic waste gas and solid particles will be generated in the upper cavity 110. In order to prevent the generated organic waste gas and solid particles from affecting the etching process, the vacuum pump extracts the waste gas in the upper cavity 110 through the ventilation holes 900, which effectively improves the quality of workpiece etching.

[0051] Reference Figure 5As shown, it can be understood that a shielding plate 910 is provided at the upper end of the ventilation hole 900, and a plurality of vertically arranged shielding holes 911 are opened on the shielding plate 910. The shielding plate 910 is arranged at the upper end of the ventilation port, so that the top surface of the first partition plate 200 and the second partition plate 300 remains flat, and the uniformity of the electromagnetic field in the upper cavity 110 is improved. The diameter of the shielding hole 911 is 0.5mm to 3mm. The depth of the shielding hole 911 is 2mm to 5mm. The shielding hole 911 can allow airflow to pass through while also shielding the electromagnetic field. The simple hole-shaped metal structure presents the characteristics of a high-pass filter, allowing signals above the cut-off frequency to pass through, while signals below the cut-off frequency are blocked or attenuated, which is similar to the frequency characteristics of a high-pass filter. Using this characteristic, the shielding hole 911 is designed to make the frequency of the interference signal fall within the cut-off region of the electromagnetic waveguide, so that the shielding hole 911 plays the role of electromagnetic shielding. It is foreseeable that in some other embodiments of the present invention, a plurality of ventilation holes 900 with a diameter of 0.5 mm to 3 mm can be evenly opened directly on the first partition plate 200 and the second partition plate 300. However, this method will increase the resistance along the way when the gas passes through the ventilation holes 900, resulting in the air in the upper cavity 110 cannot be extracted in time, the ventilation effect is not good, and the processing difficulty of opening the ventilation holes 900 with a larger depth and a smaller diameter is greater, which will increase the cost of processing the first partition plate 200 and the second partition plate 300.

[0052] Working principle: During installation, first install the two first baffles 200 to the two opposite side walls inside the housing 100 through the connector 500, and then install the second overlap portions 310 of the two second baffles 300 to the first overlap portions 210 respectively to achieve pre-positioning, and then install the second baffles 300 to the housing 100 through the connector 500. The first overlap portion 210 and the second overlap portion 310 cooperate to extend the path of the electromagnetic wave through the gap between the first overlap portion 210 and the second overlap portion 310, effectively shielding the electromagnetic field, and the shielding hole 911 uses the high-pass filter effect of the hole-shaped metal structure. While blocking the electromagnetic field from passing through, it allows airflow to pass through to extract the exhaust gas in the cavity.

[0053] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A grounding partition assembly structure for an ion etching chamber, characterized in that: include: A housing (100), wherein the housing (100) is grounded; Two first partitions (200) are symmetrically arranged horizontally in the shell (100), and two first overlapping portions (210) are arranged on the first partition (200); Two second partitions (300) are symmetrically arranged horizontally in the shell (100), and two second overlapping parts (310) are arranged on the second partition (300), and the second overlapping parts (310) match the corresponding first overlapping parts (210); wherein the first partition (200) and the second partition (300) are combined to separate the shell (100) into two cavities, and a process hole (400) is formed between the first partition (200) and the second partition (300).

2. The grounding partition assembly structure of the ion etching chamber according to claim 1, characterized in that: The first overlapping portion (210) is connected to the side surface of the first partition (200), the second overlapping portion (310) is connected to the side surface of the second partition (300), and the top surface of the first overlapping portion (210) abuts against the bottom surface of the second overlapping portion (310).

3. The grounding partition assembly structure of the ion etching chamber according to claim 2, characterized in that: The top surface of the first partition plate (200) and the top surface of the second partition plate (300) are of equal height.

4. The grounding partition assembly structure of the ion etching chamber according to claim 3, characterized in that: The sum of the thickness of the first overlapping portion (210) and the thickness of the second overlapping portion (310) matches the thickness of the first separator (200) or the thickness of the second separator (300).

5. The grounding partition assembly structure of the ion etching chamber according to claim 1, characterized in that: The first partition plate (200) and the second partition plate (300) are both detachably connected to the side wall of the shell (100) via a connecting piece (500).

6. The grounding partition assembly structure of the ion etching chamber according to claim 1, characterized in that: A first shielding wire (600) is arranged between the side wall of the shell (100) and the first partition (200), and a second shielding wire (700) is arranged between the side wall of the shell (100) and the second partition (300).

7. The grounding partition assembly structure of the ion etching chamber according to claim 1, characterized in that: The upper ends of the first partition plate (200) and the second partition plate (300) are both connected to a support platform (800), and the support platform (800) is used to support and position the pressing plate (810).

8. The grounding partition assembly structure of the ion etching chamber according to claim 1, characterized in that: An insulating layer is disposed on the upper ends of the first separator (200) and the second separator (300).

9. The grounding partition assembly structure of the ion etching chamber according to claim 1, characterized in that: The first partition plate (200) and the second partition plate (300) are both provided with a plurality of vertically arranged ventilation holes (900).

10. The grounding partition assembly structure of the ion etching chamber according to claim 9, characterized in that: A shielding plate (910) is provided at the upper end of the ventilation hole (900), and a plurality of vertically arranged shielding holes (911) are opened on the shielding plate (910), and the diameter of the shielding holes (911) is 0.5 mm to 3 mm.

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