Wafer carrying platform

Abstract

The utility model relates to the technical field of semiconductor material processing equipment, in particular to a wafer carrying table. A wafer carrying table is used for carrying a wafer and comprises a first part serving as a bottom, a second part serving as a side wall and a third part serving as a top. A hollow closed space is defined by the first part, the second part and the third part; a cooling medium circulates in the closed space; and a turbulent flow part is arranged in the closed space and is used for changing the flowing path of the cooling medium. The objective of the utility model is to provide the wafer carrying platform, and the wafer carrying platform can uniformly cool the wafer when carrying the wafer to carry out processes such as bonding, film coating, etching and the like, thereby improving the yield.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor material processing equipment, and in particular to a wafer carrier. Background Art

[0002] In semiconductor equipment, the wafer needs to be placed on a wafer stage for bonding, etching, coating and other related processes, which will increase the temperature of the wafer. The increase in wafer temperature is undesirable and will cause thermal deformation of the wafer or damage to the semiconductor devices already manufactured on the wafer. For example: in the room temperature bonding process, an ion beam is used to irradiate the surface of the wafer to activate its surface before bonding. Ion beam irradiation causes the wafer temperature to increase, generating thermal stress in the wafer, and thus causing the wafer to deform; the deformed wafer will have an adverse effect on the subsequent bonding process.

[0003] To solve the above problems, a cooling device, such as a water cooling block, is installed on the wafer stage. The cooling device can take away the heat generated by the process, avoid the wafer from heating up unexpectedly, and maintain the temperature of the wafer at the desired value. However, the existing wafer stage has the problem of uneven temperature. The cooling effect of the cooling device in the entire wafer stage area is inconsistent. Some local cooling effects are better, while other local cooling effects are poor, resulting in uneven temperature distribution of the wafer, which may still cause deformation or device damage. Utility Model Content

[0004] The purpose of the utility model is to provide a wafer carrier for carrying wafers and controlling the temperature of the wafers, thereby improving the uniformity of the temperature distribution of the wafer carrier and the wafers.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A wafer carrier, used for carrying a wafer, comprising: a first part as a bottom, a second part as a side wall and a third part as a top;

[0007] The first part, the second part and the third part are enclosed to form a hollow closed space;

[0008] A cooling medium circulates in the closed space;

[0009] A spoiler is provided in the closed space, and the spoiler is used to change the flow path of the cooling medium.

[0010] Furthermore, the spoiler portion includes a spoiler column arranged in the closed space.

[0011] Furthermore, two ends of the spoiler column are respectively connected to the first part and the third part, and the spoiler column plays a certain supporting role, so that the surface of the third part has sufficient rigidity.

[0012] Furthermore, the cross-sectional shapes of the spoiler column include circular, square, rectangular, pentagonal, hexagonal, gear-shaped, and star-shaped.

[0013] Furthermore, the widest cross-sectional dimension of the spoiler column does not exceed 5 mm.

[0014] Furthermore, the number of the spoiler columns is several;

[0015] The total cross-sectional area of ​​the plurality of spoiler columns accounts for 20%-60% of the area of ​​the first portion.

[0016] Furthermore, the plurality of spoiler columns are asymmetrically distributed in the closed space as a whole.

[0017] Furthermore, the first part, the second part and the third part are made of metal;

[0018] The spoiler column is made of metal or resin.

[0019] Furthermore, it also includes a first through hole and a second through hole; the first through hole and the second through hole are the inlet and outlet of the cooling medium respectively; the first through hole and the second through hole are selectively arranged in the first part and / or the second part.

[0020] Furthermore, the number and positions of the spoiler columns in the closed space are determined by means of three-dimensional model digital simulation.

[0021] Furthermore, the three-dimensional model digital simulation includes establishing a digital model of a wafer carrier; establishing a parameter variable relationship in the digital model of the wafer carrier, the parameter variable relationship including the size of the enclosed space, the material of the cooling medium, the flow rate of the cooling medium, the number of spoiler columns, the position of the spoiler columns, the shape and size of the spoiler columns, the flow field distribution of the cooling medium, and the temperature field distribution of the wafer carrier; solving the parameter variable relationship to obtain a simulation model of the expected wafer carrier.

[0022] Furthermore, the wafer carrier is integrally formed by 3D printing, and the 3D printed model is a simulation model of the above-mentioned expected wafer carrier.

[0023] Beneficial effects of the utility model:

[0024] This application arranges spoiler columns in the internal space of the wafer stage to change the flow direction of the cooling medium inside the wafer stage, thereby improving the cooling uniformity of the third part as the wafer bearing surface, and making the temperature distribution in the third part uniform. This application processes the wafer stage by means of simulation model and 3D printing, so that the physical parameters of the wafer stage entity are consistent with those of the wafer stage simulation model, thereby obtaining a wafer stage entity with an ideal cooling effect. When the wafer stage carries the wafer for processes such as bonding, coating, etching, etc., it can evenly cool the wafer and improve the yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the wafer stage structure of the utility model;

[0026] Figure 2 This is a schematic diagram of the structure of a spoiler portion of the wafer carrier of the utility model;

[0027] Figure 3 This is a schematic diagram of another spoiler structure of the wafer carrier of the utility model.

[0028] In the figure: 1, first part; 2, second part; 3, third part; 4, first through hole; 5, second through hole; 6, spoiler. DETAILED DESCRIPTION

[0029] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0030] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0032] In the description of this embodiment, the terms "upper", "lower", "right", etc., are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0033] Example 1

[0034] See also Figure 1-3 , this embodiment provides a wafer stage for carrying wafers and cooling wafers during processes such as wafer bonding, coating, and etching. The shape of the wafer stage in this embodiment can be circular, square, or rectangular, and there is no restriction on the specific shape. Accordingly, the wafer mentioned in this embodiment does not specifically refer to a conventional circular wafer, but can also include materials of any shape cut from a conventional wafer.

[0035] In this embodiment, a wafer carrier is provided, including: a first part 1 as a bottom, a second part 2 as a side wall and a third part 3 as a top. The first part 1, the second part 2 and the third part 3 are enclosed to form a hollow closed space, and a cooling medium circulates in the closed space.

[0036] A first through hole 4 and a second through hole 5 are also provided. The first through hole 4 and the second through hole 5 are selectively provided on the first part 1 or the second part 2. In this embodiment, the first through hole 4 and the second through hole 5 are provided on both sides of the first part 1. The first through hole 4 serves as an inlet of the cooling medium, and the second through hole 5 serves as an outlet of the cooling medium. The first through hole 4 and the second through hole 5 are connected to an external circulation mechanism through a pipeline.

[0037] In this embodiment, the cooling medium is water.

[0038] Under normal circumstances, when the cooling medium is filled into the closed space and the circulation is started, the cooling medium flows fast near the line connecting the first through hole 4 and the second through hole 5, and flows slowly away from it. This phenomenon leads to poor cooling uniformity of the third part 3, which is not expected.

[0039] In this embodiment, a spoiler 6 is provided in the closed space to change the flow direction of the cooling medium, which is expected to improve the cooling uniformity of the third part 3 .

[0040] In this embodiment, the spoiler 6 includes some disrupting flow columns, and the disrupting flow columns are asymmetrically distributed in the closed space to change the flow direction of the cooling medium.

[0041] In this embodiment, the spoiler column is a cylinder with a diameter of 5 mm, and the two ends of the cylinder are respectively connected to the first part 1 and the third part 3. In this embodiment, the spoiler column can play a supporting role, provide supporting force to the third part 3, and enhance the strength of the third part 3.

[0042] In some feasible implementations, the spoiler 6 also includes some solid objects in other shapes, such as a mesh, a tree, a cone, etc.

[0043] In this embodiment, the first part 1, the second part 2, and the third part 3 are made of metal, such as stainless steel, titanium alloy, and aluminum alloy; the spoiler 6 is made of metal or resin.

[0044] The number and position of the spoiler columns in the enclosed space are determined by means of a three-dimensional model digital simulation. The three-dimensional model digital simulation includes establishing a digital model of a wafer stage; establishing a parameter variable relationship in the digital model of the wafer stage. The parameter variable relationship includes the size of the enclosed space, the material of the cooling medium, the flow rate of the cooling medium, the number of spoiler columns, the position of the spoiler columns, the shape and size of the spoiler columns, the flow field distribution of the cooling medium, and the temperature field distribution of the wafer stage; solving the parameter variable relationship to obtain a simulation model of the expected wafer stage.

[0045] In the expected wafer carrier simulation model, the setting of the spoiler column makes the temperature distribution on the surface of the third part 3 uniform, so that the wafer carried by it can be evenly cooled.

[0046] In this embodiment, the wafer stage is processed by 3D printing, and the 3D printed model is a simulation model of the above-mentioned expected wafer stage. The processing steps include inputting the simulation model into a 3D printing device, setting material parameters, and starting the 3D printing device to print the wafer stage layer by layer, and finally forming a physical wafer stage.

[0047] In this embodiment, the surface of the third part 3 is also cleaned and polished, so that the surface of the third part 3 in contact with the wafer reaches the required surface roughness.

[0048] In this embodiment, the wafer carrier is integrally formed, has good overall rigidity, is not easy to deform, does not leak cooling medium, and can improve heat transfer efficiency.

[0049] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A wafer carrier, used for carrying a wafer, characterized in that: include: A first portion as a bottom, a second portion as a side wall and a third portion as a top; The first part, the second part and the third part are enclosed to form a hollow closed space; A cooling medium circulates in the closed space; A spoiler is provided in the closed space, and the spoiler is used to change the flow path of the cooling medium.

2. The wafer stage according to claim 1, characterized in that: The spoiler portion includes a spoiler column arranged in a closed space.

3. The wafer stage according to claim 2, characterized in that: Two ends of the spoiler column are respectively connected to the first part and the third part.

4. The wafer stage according to claim 2, characterized in that: The cross-sectional shapes of the spoiler column include circular, square, rectangular, pentagonal, hexagonal, gear-shaped, and star-shaped.

5. The wafer stage according to claim 2, characterized in that: The widest dimension of the cross section of the spoiler column does not exceed 5 mm.

6. The wafer stage according to claim 2, characterized in that: The number of the spoiler columns is several; The total cross-sectional area of ​​the plurality of spoiler columns accounts for 20%-60% of the area of ​​the first portion.

7. The wafer stage according to claim 6, characterized in that: The plurality of spoiler columns are asymmetrically distributed in the closed space as a whole.

8. The wafer stage according to claim 1, characterized in that: Also includes a first through hole and a second through hole; The first through hole and the second through hole are respectively an inlet and an outlet of the cooling medium; The first through hole and the second through hole are selectively configured in the first portion and / or the second portion.

9. The wafer stage according to claim 2, characterized in that: The first part, the second part and the third part are made of metal; The spoiler column is made of metal or resin.

10. The wafer stage according to any one of claims 2 to 9, characterized in that: The number and position of the spoiler columns in the enclosed space are determined by means of three-dimensional model digital simulation; The wafer carrier is integrally formed by 3D printing.

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