Vacuum adsorption jig and processing equipment

Abstract

The utility model relates to a vacuum adsorption jig and machining equipment, and the vacuum adsorption jig comprises an adsorption platform which is provided with a first butt joint face, and the first butt joint face is provided with a butt joint hole; one end of the pipeline assembly is inserted into the adsorption platform and communicated with the butt-joint hole, and the other end of the pipeline assembly is connected with the driving pump; the carrying piece is provided with an adsorption face and a second butt joint face which are oppositely arranged, the adsorption face is provided with an adsorption area used for containing a to-be-machined module, an adsorption hole corresponding to the driving unit is formed in the adsorption area, and the adsorption hole penetrates through the carrying piece in the thickness direction of the carrying piece; when the second butt joint face abuts against the first butt joint face, the adsorption hole communicates with the butt joint hole. According to the technical scheme, the technical problems that when a traditional vacuum adsorption jig adsorbs and fixes the to-be-machined module, particles can enter the to-be-machined module, the electrical property of the to-be-machined module is poor, and the quality of a finished product is affected are effectively solved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a vacuum adsorption fixture and processing equipment. Background Art

[0002] The camera module generally includes components such as lens, sensor, voice coil motor, main control board, hard lining and connector. During the hard lining packaging process, it is usually necessary to place the camera module on the carrier board, and then fix the camera module by vacuum adsorption of the entire lens area for subsequent dispensing and bonding operations. However, due to the gap between the voice coil motor and the lens, when the entire lens area is vacuum adsorbed and fixed, the risk of particles entering the camera module will increase, resulting in poor electrical properties of the camera module and low quality of the finished product obtained by processing. Utility Model Content

[0003] The present application provides a vacuum adsorption jig and processing equipment to solve the technical problem that when a traditional vacuum adsorption jig adsorbs and fixes a module to be processed, particles will enter the interior of the module to be processed, causing poor electrical properties of the module to be processed and affecting the quality of the finished product.

[0004] To this end, on the first aspect, an embodiment of the present application provides a vacuum adsorption jig for adsorbing a module to be processed, wherein the module to be processed includes a driving unit located at the periphery of the module to be processed, and the vacuum adsorption jig includes: an adsorption platform having a first docking surface, on which a docking hole is provided; a pipe assembly, one end of which is plugged into the adsorption platform and connected to the docking hole, and the other end is connected to a driving pump; and a carrier having an adsorption surface and a second docking surface arranged opposite to each other, the adsorption surface being provided with an adsorption area for placing the module to be processed, the adsorption area being provided with adsorption holes corresponding to the driving unit, and the adsorption holes penetrating the carrier along the thickness direction of the carrier; when the second docking surface abuts against the first docking surface, the adsorption hole is connected to the docking hole.

[0005] In a possible implementation, a plurality of adsorption holes are provided, and the plurality of adsorption holes are spaced and distributed around the periphery of the adsorption area. A plurality of docking holes are provided, and one docking hole is provided correspondingly to one adsorption hole.

[0006] In a possible implementation, a plurality of adsorption holes are provided, and the plurality of adsorption holes are spaced apart and distributed around the periphery of the adsorption area. A connecting groove is provided on the second docking surface, and the connecting groove is connected to the plurality of adsorption holes, and the docking hole is connected to the connecting groove.

[0007] In a possible implementation manner, the orthographic projections of the plurality of adsorption holes on the second docking surface are accommodated in the connecting groove.

[0008] In a possible implementation manner, a plurality of connecting grooves are provided, and one connecting groove is communicated with at least one adsorption hole. A plurality of docking holes are provided, and one docking hole is communicated with one connecting groove.

[0009] In a possible embodiment, a first detection hole is further provided on the adsorption platform, and the first detection hole penetrates the adsorption platform along the thickness direction of the adsorption platform; a second detection hole is further provided on the carrier, and the second detection hole penetrates the carrier along the thickness direction of the carrier, and the second detection hole is arranged in the middle position of the adsorption area and is connected with the first detection hole; the vacuum adsorption fixture also includes a detection part located below the first detection hole, and the detection part detects the appearance quality of the module to be processed through the first detection hole and the second detection hole.

[0010] In a possible embodiment, an air cavity connected to the docking hole is provided in the adsorption platform, and the pipeline assembly includes a connector and a main pipeline. One end of the connector is plugged into the adsorption platform and connected to the air cavity, and the other end is connected to the driving pump through the main pipeline.

[0011] In a possible embodiment, a plurality of gas flow channels are provided in the adsorption platform, one gas flow channel is connected to at least one docking hole, the pipeline assembly includes a main pipeline and a plurality of connectors, one connector is provided corresponding to one gas flow channel, one end of the connector is plugged into the adsorption platform and connected to the gas flow channel, and the other end is connected to the driving pump through the main pipeline.

[0012] In a possible implementation, the gas flow channel extends along the length direction of the adsorption platform, and the plurality of connectors are spaced and distributed in the width direction of the adsorption platform; and / or,

[0013] The gas flow channel extends along the width direction of the adsorption platform, and a plurality of connectors are distributed at intervals along the length direction of the adsorption platform.

[0014] In a second aspect, the present application also provides a processing equipment, including the vacuum adsorption jig as described above.

[0015] According to the vacuum adsorption fixture and processing equipment provided by the embodiment of the present application, the vacuum adsorption fixture includes: an adsorption platform, having a first docking surface, and a docking hole is provided on the first docking surface; a pipe assembly, one end of which is plugged into the adsorption platform and connected to the docking hole, and the other end is connected to the driving pump; and a carrier, having an adsorption surface and a second docking surface arranged oppositely, the adsorption surface is provided with an adsorption area for placing the module to be processed, and the adsorption area is provided with an adsorption hole corresponding to the driving unit, and the adsorption hole penetrates the carrier along the thickness direction of the carrier; when the second docking surface abuts against the first docking surface, the adsorption hole is connected to the docking hole. Compared with the adsorption mode of the traditional adsorption fixture to fix the module to be processed by adsorbing the lens unit located in the middle, the present application proposes an adsorption concept of realizing the overall fixation of the module to be processed by adsorbing the driving unit on the periphery, and it is proposed to set the adsorption hole of the carrier on the periphery of the adsorption area so that it corresponds to the driving unit of the module to be processed placed in the adsorption area, and by adsorbing and fastening the driving unit, the position fixation of the entire module to be processed is realized. In this way, the overall fixation of the module to be processed can be achieved through local adsorption of the module to be processed, preventing particles from entering the module to be processed from the gap between the drive unit and the lens unit during conventional adsorption, thereby improving the electrical yield of the module to be processed and thus improving the quality of the product; moreover, the structure of the entire vacuum adsorption fixture is simple, and the adsorption and fastening of the module to be processed are strong, which is conducive to subsequent dispensing and patch operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings herein are incorporated into the specification and constitute a part of the specification, showing embodiments that conform to the present application, and are used together with the specification to explain the principles of the present application. In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can also be obtained based on these drawings without paying creative labor. One or more embodiments are exemplarily illustrated by the pictures in the corresponding drawings. These exemplified descriptions do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements. Unless otherwise stated, the figures in the drawings do not constitute a proportional limitation.

[0017] Figure 1 An exploded view of the vacuum adsorption fixture provided in an embodiment of the present application;

[0018] Figure 2 An assembly diagram of a vacuum adsorption fixture provided in an embodiment of the present application;

[0019] Figure 3 A three-dimensional structural diagram of a carrier of a vacuum adsorption fixture provided in an embodiment of the present application;

[0020] Figure 4 for Figure 3 A partial enlarged view of point B in the middle;

[0021] Figure 5 A bottom view of a carrier of a vacuum adsorption fixture provided in an embodiment of the present application;

[0022] Figure 6 for Figure 5 A partial enlarged view of point C in the middle;

[0023] Figure 7 for Figure 1 Cross-section view at AA in the middle.

[0024] Description of reference numerals:

[0025] 100, adsorption platform; 101, first docking surface; 110, docking hole; 120, first detection hole; 130, gas flow channel;

[0026] 200, pipeline assembly; 210, connector;

[0027] 300, carrier; 301, adsorption surface; 302, second docking surface; 310, adsorption area; 320, adsorption hole; 330, connection groove; 340, second detection hole;

[0028] Z, thickness direction; Y, length direction; X, width direction. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0030] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not indicate the relationship between the various embodiments and / or settings discussed in itself. In addition, the various specific processes and examples of materials provided by the present application, but those of ordinary skill in the art can appreciate the applicability of other processes and / or the use of other materials.

[0031] For ease of description, spatial relative terms may be used herein to describe the relative positional relationship or movement of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", "front", "back", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure undergoes a position flip or a posture change or a motion state change, then these directional indications also change accordingly, for example: an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions) and the spatial relative descriptors used herein are interpreted accordingly.

[0032] See also Figures 1 to 7 The embodiment of the present application provides a vacuum adsorption fixture for adsorbing a module to be processed, the module to be processed includes a driving unit located at the periphery of the module to be processed, and the vacuum adsorption fixture includes: an adsorption platform 100, having a first docking surface 101, and a docking hole 110 is provided on the first docking surface 101; a pipeline assembly 200, one end of which is plugged into the adsorption platform 100 and communicated with the docking hole 110, and the other end is connected to the driving pump; and a carrier 300, having an adsorption surface 301 and a second docking surface 302 arranged oppositely, the adsorption surface 301 is provided with an adsorption area 310 for placing the module to be processed, and the adsorption area 310 is provided with an adsorption hole 320 corresponding to the driving unit, and the adsorption hole 320 penetrates the carrier 300 along the thickness direction Z of the carrier 300; when the second docking surface 302 abuts against the first docking surface 101, the adsorption hole 320 is communicated with the docking hole 110.

[0033] Compared with the adsorption mode of the conventional adsorption fixture that fixes the module to be processed by adsorbing the lens unit in the middle, the present application proposes an adsorption concept that realizes the overall fixation of the module to be processed by adsorbing the drive unit on the periphery. It is proposed to set the adsorption hole 320 of the carrier 300 on the periphery of the adsorption area 310 so that it corresponds to the drive unit of the module to be processed placed in the adsorption area 310, and to realize the position fixation of the entire module to be processed by adsorbing and fastening the drive unit. In this way, the overall fixation of the module to be processed can be realized by partial adsorption of the module to be processed, avoiding the entry of particles into the module to be processed from the gap between the drive unit and the lens unit during conventional adsorption, improving the electrical yield of the module to be processed, and thus improving the quality of the product; and the structure of the entire vacuum adsorption fixture is simple, and the adsorption and fastening of the module to be processed are strong, which is conducive to the subsequent dispensing and patch operations.

[0034] It should be understood that the module to be processed may be a camera module, and the driving unit of the module to be processed may be a voice coil motor. The driving unit is arranged around the periphery of its lens unit, so there is an assembly gap between the lens unit and the driving unit, and particles can easily enter the interior of the module to be processed through the assembly gap.

[0035] Specifically, the vacuum adsorption fixture is configured as a composite component including at least an adsorption platform 100, a pipeline assembly 200 and a carrier 300. The adsorption platform 100 may be a rectangular block structure with a certain thickness, and the first docking surface 101 on the top thereof may be a plane with a small surface roughness so as to dock and fit with the second docking surface 302 of the carrier 300. A gas flow channel 130 connected to the pipeline assembly 200 may be provided inside the adsorption platform 100, and a docking hole 110 provided on the first docking surface 101 extends inwardly and is connected to the gas flow channel 130. In this way, a negative pressure can be provided to the pipeline assembly 200 by driving a pump, and then an adsorption negative pressure is provided to the gas flow channel 130 and the docking hole 110. The adsorption platform 100 provided in this example has a high structural strength and a long service life. The pipeline assembly 200 is connected to the driving pump and the adsorption platform 100. When the driving pump is started, the gas in the adsorption platform 100 and the gas in the pipeline assembly 200 can be extracted, so that they are connected to form a negative pressure channel; when the docking hole 110 on the adsorption platform 100 is connected with the adsorption hole 320 on the carrier 300, the gas in the adsorption hole 320 can also be discharged together, making it a part of the negative pressure channel, and a negative pressure area is formed at the adsorption hole 320 of the adsorption surface 301 and a certain area around it. The negative pressure area can provide enhanced adsorption force to the driving unit of the module to be processed placed there, so that the driving unit is firmly adsorbed on the adsorption surface 301, thereby achieving adsorption and fixation of the module to be processed. The carrier 300 may be a rectangular plate-like structure having a shape similar to that of the adsorption platform 100, and the second docking surface 302 arranged at the bottom thereof may be a plane with a relatively small surface roughness, so that when the second docking surface 302 is attached to the first docking surface 101, the two may generate a certain smooth surface adsorption force to adsorb and fasten the carrier 300 to the adsorption platform 100; the adsorption area 310 arranged at the top thereof may be a polished surface with a certain roughness so as to increase the friction between it and the module to be processed and prevent the module to be processed from moving on the adsorption surface 301; the adsorption hole 320 arranged on the carrier 300 is connected with the docking hole 110 arranged on the adsorption platform 100, so that the vacuum negative pressure at the docking hole 110 can be transmitted to the adsorption surface 301 through the adsorption hole 320, so as to realize the adsorption and fastening of the driving unit placed in this area, thereby realizing the adsorption and fastening of the entire module to be processed.

[0036] In one example, a plurality of adsorption areas 310 are provided on the adsorption surface 301, and the plurality of adsorption areas 310 are distributed in a matrix. There are a plurality of adsorption holes 320 in each adsorption area 310, and the plurality of adsorption holes 320 are distributed symmetrically, so that the driving unit is subjected to a uniform adsorption force, thereby improving the adsorption stability and reliability of the module to be processed; there are a plurality of docking holes 110 corresponding to each adsorption area 310, and the plurality of docking holes 110 are distributed at intervals, and one docking hole 110 is arranged corresponding to at least one adsorption hole 320; there are a plurality of pipeline components 200, and one pipeline component 200 is arranged corresponding to at least one docking hole 110. In this way, the adsorption and fixation of a plurality of modules to be processed can be achieved simultaneously, thereby improving processing efficiency and reducing costs.

[0037] In a possible implementation, a plurality of adsorption holes 320 are provided, and the plurality of adsorption holes 320 are spaced apart and distributed around the periphery of the adsorption region 310 . A plurality of docking holes 110 are provided, and one docking hole 110 is correspondingly provided to one adsorption hole 320 .

[0038] In this embodiment, the layout of the adsorption holes 320 and the docking holes 110 is optimized. Specifically, a plurality of adsorption holes 320 are arranged in each adsorption area 310, so as to realize simultaneous adsorption of different positions of the same drive unit through the plurality of adsorption holes 320; and a plurality of docking holes 110 are arranged at the corresponding positions of the adsorption platform 100, and one docking hole 110 corresponds to one adsorption hole 320. In this way, the simultaneous adsorption of different positions of the drive unit can be realized, the force stability of the drive unit can be improved, the adsorption firmness of the drive unit can be improved, and thus the adsorption firmness and reliability of the module to be processed can be improved. For example but not limited to, there are four adsorption holes 320, and the four adsorption holes 320 are respectively distributed in a rectangular shape corresponding to the four corners of the drive unit. At this time, there are four docking holes 110, and the four docking holes 110 respectively correspond to the four adsorption holes 320. The vacuum adsorption fixture provided in this example has a large adsorption force and has the strongest adsorption fastness to the module to be processed.

[0039] In a possible implementation, a plurality of adsorption holes 320 are provided, and the plurality of adsorption holes 320 are spaced apart and distributed around the periphery of the adsorption area 310 . A connecting groove 330 is provided on the second docking surface 302 , and the connecting groove 330 is connected to the plurality of adsorption holes 320 , and the docking hole 110 is connected to the connecting groove 330 .

[0040] In this embodiment, the layout of the adsorption holes 320 and the docking holes 110 and the specific configuration of the carrier 300 are optimized. Specifically, a plurality of adsorption holes 320 are arranged in each adsorption area 310, so as to realize the adsorption of different positions of the same drive unit through the plurality of adsorption holes 320; at the same time, a connecting groove 330 is arranged on the second docking surface 302, and the connecting groove 330 can be a groove structure with an opening, and its opening faces the first docking surface 101 of the adsorption platform 100, so that when the second docking surface 302 abuts and adsorbs on the first docking surface 101, it is enclosed with the first docking surface 101 to form a closed gas passage; the connecting groove 330 can be an integrated groove structure connected by a ring, rectangle, triangle, prism, pentagon, etc., or a split groove structure such as a curve, straight line or point, and the operator can choose according to actual needs. In this way, by bringing together a plurality of adsorption holes 320 through a connecting groove 330 structure, the number of docking holes 110 below it can be reduced, and the processing difficulty of the adsorption platform 100 can be reduced. For example, a docking hole 110 can be set at the corresponding position of the adsorption platform 100, and the docking hole 110 is connected to the connecting groove 330. In this way, a docking hole 110 can provide negative pressure to a gas channel formed by the connecting groove 330 and the first docking surface 101, and then negative pressure can be provided to multiple adsorption holes 320 at the same time through a gas channel, thereby improving the uniformity of the negative pressure on each adsorption hole 320 and ensuring that each local force of the driving unit is uniform, thereby improving the connection stability and reliability of the module to be processed.

[0041] In a possible implementation, the orthographic projections of the plurality of adsorption holes 320 on the second docking surface 302 are contained in the connection groove 330. This arrangement can minimize the length of the adsorption holes 320, shorten the gas extraction stroke, reduce gas loss, and increase the adsorption force of the adsorption holes 320, thereby improving the adsorption effect on the drive unit.

[0042] In one example, an adsorption trough is provided at a position corresponding to the adsorption area 310 to limit the movement of the module to be processed on the adsorption surface 301, further improving the connection reliability between the module to be processed and the carrier 300. The size of the adsorption trough is slightly larger than the size of the module to be processed, so that the operator can easily place the module to be processed in the adsorption trough.

[0043] In a possible implementation manner, a plurality of connection grooves 330 are provided, and one connection groove 330 is communicated with at least one adsorption hole 320 ; a plurality of docking holes 110 are provided, and one docking hole 110 is communicated with one connection groove 330 .

[0044] In this embodiment, the layout of the connection grooves 330 and the docking holes 110 is optimized. Specifically, a plurality of connection grooves 330 are arranged on the second docking surface 302 of the adsorption area 310, so as to form a plurality of gas channels through the plurality of connection grooves 330 and the corresponding first docking surface 101, and respectively realize the negative pressure supply to the plurality of adsorption holes 320 adsorbing the same drive unit, so as to avoid the unnecessary grooves on the second docking surface 302 of the carrier 300, ensure the integrity of the carrier 300, and improve the overall strength of the carrier 300. For example, but not limited to, there are two connection grooves 330, and the shapes of the two connection grooves 330 can be the same to facilitate processing; the connection groove 330 can be a U-shaped half-groove structure, and the open ends of the two connection grooves 330 are opposite and spaced; one connection groove 330 corresponds to two adsorption holes 320, so that the negative pressure supply to the two adsorption holes 320 can be realized through one connection groove 330, the pressure supply stability is improved, the number of docking holes 110 is reduced, and the processing difficulty of the adsorption platform 100 is reduced.

[0045] In a possible embodiment, a first detection hole 120 is further provided on the adsorption platform 100, and the first detection hole 120 penetrates the adsorption platform 100 along the thickness direction Z of the adsorption platform 100; a second detection hole 340 is further provided on the carrier 300, and the second detection hole 340 penetrates the carrier 300 along the thickness direction Z of the carrier 300, and the second detection hole 340 is arranged in the middle position of the adsorption area 310 and is connected with the first detection hole 120; the vacuum adsorption fixture also includes a detection member (not shown in the figure) located below the first detection hole 120, and the detection member detects the appearance quality of the module to be processed through the first detection hole 120 and the second detection hole 340.

[0046] In this embodiment, the specific configuration of the vacuum adsorption jig is further optimized. Specifically, the vacuum adsorption jig is configured as a combination of at least a suction platform 100, a pipeline assembly 200, a carrier 300 and a detection component. The detection component can be an industrial camera, which is configured below the push detection hole of the suction platform 100; the detection component can realize the appearance detection of the lens unit of the jig to be processed located above the carrier 300 through the first detection hole 120 and the second detection hole 340, and the detection data is highly accurate and the appearance detection result is reliable. The vacuum adsorption jig provided in this example is rich in functions. It can not only realize the adsorption and fastening of the module to be processed, but also realize the appearance detection of the module to be processed, saving the subsequent process of manually judging the appearance, and reducing the production cost.

[0047] In one example, the aperture of the first detection hole 120 is slightly larger than the aperture of the second detection hole 340, and the aperture of the second detection hole 340 is slightly larger than the aperture of the lens unit of the processing module, so as to avoid interfering with the appearance inspection of the lens unit by the inspection part and improve the accuracy and reliability of the inspection results.

[0048] In a possible embodiment, an air cavity connected to the docking hole 110 is provided in the adsorption platform 100, and the pipeline assembly 200 includes a connector 210 and a main pipeline (not shown in the figure). One end of the connector 210 is plugged into the adsorption platform 100 and connected to the air cavity, and the other end is connected to the driving pump through the main pipeline.

[0049] In this embodiment, the specific configuration of the pipeline assembly 200 is optimized. Specifically, an integrated air cavity is set inside the adsorption platform 100, and the air cavity is connected to the main pipeline through the connector 210, and is connected to the driving pump through the main pipeline, so that the driving pump can provide a negative pressure environment to the air cavity. All docking holes 110 on the first docking surface 101 are connected to the air cavity, so that a negative pressure environment can be provided to multiple docking holes 110 at the same time through the air cavity, thereby realizing the negative pressure supply to multiple adsorption holes 320; and, due to the large volume of the air cavity, it can provide sufficient negative pressure to the docking hole 110 to ensure the adsorption effect on the side of the adsorption hole 320. The adsorption platform 100 provided in this example can realize the negative pressure supply to multiple docking holes 110 and multiple adsorption holes 320 through a connector 210 and a main pipeline, thereby realizing the adsorption and fixation of multiple modules to be processed. The overall structure of the adsorption platform 100 is simple and convenient for processing; and the number of connectors 210 required is small, and the cost is low.

[0050] In a possible embodiment, a plurality of docking holes 110 are provided, a plurality of gas flow channels 130 are provided in the adsorption platform 100, a gas flow channel 130 is connected to at least one docking hole 110, the pipeline assembly 200 includes a main pipeline and a plurality of connectors 210, a connector 210 is provided corresponding to a gas flow channel 130, one end of the connector 210 is plugged into the adsorption platform 100 and connected to the gas flow channel 130, and the other end is connected to the driving pump through the main pipeline.

[0051] In this embodiment, the specific configuration of the pipeline assembly 200 is further optimized. Specifically, a plurality of gas flow channels 130 are arranged inside the adsorption platform 100, and a gas flow channel 130 is connected to the main pipeline through a connector 210, and is connected to the driving pump through the main pipeline, so that a negative pressure environment can be provided to the gas flow channel 130 through the driving pump. The docking hole 110 arranged on the first docking surface 101 extends inward and is connected to the gas flow channel 130, so that the gas in the docking hole 110, the gas flow channel 130, the docking joint and the main pipeline can be drawn out by the driving pump to provide a negative pressure environment to the docking hole 110, and then provide negative pressure to the adsorption hole 320; since the number of docking holes 110 connected to each gas flow channel 130 is small, the gas loss in the gas flow channel 130 is small, the adsorption negative pressure provided to the adsorption hole 320 side is large, the adsorption force is strong, and the adsorption stability and reliability are high. The adsorption platform 100 provided in this example has high structural strength and long service life.

[0052] like Figure 7 As shown, in a possible embodiment, the gas flow channel 130 extends along the length direction Y of the adsorption platform 100, and a plurality of connectors 210 are spaced apart in the width direction X of the adsorption platform 100. In this example, a plurality of connectors 210 can be respectively arranged on the two short sides of the adsorption platform 100. At this time, the gas flow channel 130 in the adsorption platform 100 can be arranged in two columns and multiple rows, and each column is provided with a plurality of gas flow channels 130 spaced apart in the width direction X of the adsorption platform 100. The gas flow channel 130 extends from the end of the adsorption platform 100 to the center of the adsorption platform 100, and each end of the gas flow channel 130 is connected to a connector 210. In this way, a stable and continuous negative pressure can be provided to the corresponding gas flow channel 130 through a separate connector 210, ensuring that the docking hole 110 and the adsorption hole 320 connected to each gas flow channel 130 can be supplied with a stable and reliable negative pressure. The layout of the gas flow channel 130 provided in this example can reduce the difficulty of opening the internal hole of the adsorption platform 100, facilitate the processing of the adsorption platform 100, and improve production efficiency.

[0053] In a possible implementation, the gas flow channel 130 extends along the width direction X of the adsorption platform 100, and a plurality of connectors 210 are spaced apart in the length direction Y of the adsorption platform 100. In this example, a plurality of connectors 210 may be centrally arranged on one of the long sides of the adsorption platform 100. At this time, the gas flow channels 130 in the adsorption platform 100 may be arranged as a plurality of columns spaced apart along the length direction Y of the adsorption platform 100, and one column of gas flow channels 130 is connected to one connector 210. In this way, a stable and continuous negative pressure is provided to the corresponding gas flow channels 130 through a separate connector 210, ensuring that the docking holes 110 and the adsorption holes 320 connected to each gas flow channel 130 can be supplied with a stable and reliable negative pressure. The layout of the gas flow channels 130 provided in this example can reduce the use of connectors 210 and reduce equipment costs.

[0054] In addition, the embodiment of the present application also provides a processing device, including the vacuum adsorption fixture as described in any of the above items. The specific structure of the vacuum adsorption fixture refers to the above embodiment. Since the processing device adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here one by one.

[0055] It should be understood that the terms used herein are only for the purpose of describing specific example embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive, and therefore specify the existence of stated features, steps, operations, elements and / or parts, but do not exclude the existence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0056] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.

[0057] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. A vacuum adsorption fixture for adsorbing a module to be processed, wherein the module to be processed comprises a driving unit located at the periphery of the module to be processed, characterized in that: The vacuum adsorption fixture comprises: The adsorption platform (100) has a first docking surface (101), wherein the first docking surface (101) is provided with a docking hole (110); A pipeline assembly (200), one end of which is plugged into the adsorption platform (100) and communicates with the docking hole (110), and the other end of which is connected to the driving pump; and The carrier (300) comprises an adsorption surface (301) and a second docking surface (302) which are arranged opposite to each other. The adsorption surface (301) is provided with an adsorption area (310) for placing the module to be processed. The adsorption area (310) is provided with an adsorption hole (320) corresponding to the driving unit. The adsorption hole (320) penetrates the carrier (300) along the thickness direction (Z) of the carrier (300). When the second docking surface (302) abuts against the first docking surface (101), the adsorption hole (320) is connected with the docking hole (110).

2. The vacuum adsorption fixture according to claim 1, characterized in that: A plurality of the adsorption holes (320) are provided, and the plurality of the adsorption holes (320) are distributed at intervals around the periphery of the adsorption area (310); a plurality of the docking holes (110) are provided, and one docking hole (110) is arranged correspondingly to one adsorption hole (320).

3. The vacuum adsorption fixture according to claim 1, characterized in that: A plurality of the adsorption holes (320) are provided, and the plurality of the adsorption holes (320) are spaced apart and distributed around the periphery of the adsorption area (310); a connecting groove (330) is provided on the second docking surface (302); the connecting groove (330) is connected to the plurality of the adsorption holes (320); and the docking hole (110) is connected to the connecting groove (330).

4. The vacuum adsorption fixture according to claim 3, characterized in that: The orthographic projections of the plurality of adsorption holes (320) on the second docking surface (302) are accommodated in the connection groove (330).

5. The vacuum adsorption fixture according to claim 3, characterized in that: There are a plurality of connection grooves (330), one connection groove (330) being connected to at least one adsorption hole (320); there are a plurality of docking holes (110), one docking hole (110) being connected to one connection groove (330).

6. The vacuum adsorption fixture according to claim 1, characterized in that: The adsorption platform (100) is also provided with a first detection hole (120), and the first detection hole (120) penetrates the adsorption platform (100) along the thickness direction (Z) of the adsorption platform (100); the carrier (300) is also provided with a second detection hole (340), and the second detection hole (340) penetrates the carrier (300) along the thickness direction (Z) of the carrier (300), and the second detection hole (340) is arranged in the middle position of the adsorption area (310) and is connected with the first detection hole (120); the vacuum adsorption fixture also includes a detection component located below the first detection hole (120), and the detection component detects the appearance quality of the module to be processed through the first detection hole (120) and the second detection hole (340).

7. The vacuum adsorption fixture according to claim 1, characterized in that: An air cavity connected to the docking hole (110) is provided in the adsorption platform (100); the pipeline assembly (200) comprises a connector (210) and a main pipeline; one end of the connector (210) is plugged into the adsorption platform (100) and connected to the air cavity, and the other end is connected to the driving pump through the main pipeline.

8. The vacuum adsorption fixture according to claim 1, characterized in that: The adsorption platform (100) is provided with a plurality of gas flow channels (130), one of the gas flow channels (130) being connected to at least one of the docking holes (110); the pipeline assembly (200) comprises a main pipeline and a plurality of connectors (210), one of the connectors (210) being provided corresponding to one of the gas flow channels (130); one end of the connector (210) is plugged into the adsorption platform (100) and connected to the gas flow channel (130), and the other end is connected to a driving pump via the main pipeline.

9. The vacuum adsorption fixture according to claim 8, characterized in that: The gas flow channel (130) extends along the length direction (Y) of the adsorption platform (100), and the plurality of connectors (210) are distributed at intervals in the width direction (X) of the adsorption platform (100); and / or, The gas flow channel (130) extends along the width direction (X) of the adsorption platform (100), and the plurality of connectors (210) are distributed at intervals in the length direction (Y) of the adsorption platform (100).

10. A processing equipment, characterized in that: It comprises the vacuum adsorption jig as described in any one of claims 1 to 9.

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