Display unit and spliced display screen

Abstract

The utility model relates to a display unit and a spliced display screen. The display unit comprises a substrate, a plurality of LED chips, a packaging layer and a reinforcing layer, a driving circuit is arranged on the substrate, the LED chips are arranged on the substrate in an array mode, and the LED chips are electrically connected with the driving circuit. The packaging layer is arranged on the substrate and covers the multiple LED chips, and the reinforcing layer is arranged on the side, away from the substrate, of the packaging layer. The risk that the display unit is collided and cracked in the transportation and daily use process can be reduced, and the display effect of the display unit can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display unit and a spliced ​​display screen. Background Art

[0002] The display unit includes a substrate, which is usually made of glass, resulting in a high risk of traditional display units being knocked and cracked during transportation and daily use. Summary of the invention

[0003] Based on this, it is necessary to provide a display unit and a spliced ​​display screen to address the problem that traditional display units have a high risk of being knocked and cracked during transportation and daily use.

[0004] According to a first aspect of the present application, a display unit is provided, comprising:

[0005] A substrate, on which a driving circuit is provided;

[0006] A plurality of LED chips are arranged in an array on the substrate, and the LED chips are electrically connected to the driving circuit;

[0007] a packaging layer, disposed on the substrate and covering the plurality of LED chips; and

[0008] The reinforcing layer is arranged on a side of the packaging layer away from the substrate.

[0009] In the technical solution of the present application, a driving circuit can be used to drive at least part of the LED chips to emit light to display the corresponding pattern. A packaging layer can also be used to package multiple LED chips. A reinforcing layer can also be used to physically protect the substrate to improve the strength of the display unit and reduce the probability of the substrate cracking due to impact. This can reduce the risk of the display unit being bumped and cracked during transportation and daily use, and is also beneficial to improving the display effect of the display unit.

[0010] In one of the embodiments, the reinforcing layer includes a hard light-transmitting layer and a first light-transmitting adhesive layer, the hard light-transmitting layer is arranged on the side of the encapsulation layer away from the substrate, and the first light-transmitting adhesive layer is arranged between the hard light-transmitting layer and the encapsulation layer. The hard light-transmitting layer can be used to improve the strength of the display unit, and can also be used to physically protect the substrate, which can further reduce the probability of the display unit causing the substrate to crack due to impact, thereby greatly reducing the risk of the display unit being bumped and cracked during transportation and daily use, and is also beneficial to improving the display effect of the display unit. In addition, by bonding the hard light-transmitting layer to the side of the encapsulation layer away from the substrate through the first light-transmitting adhesive layer, the installation reliability of the hard light-transmitting layer can be improved, which facilitates better use of the hard light-transmitting layer to physically protect the substrate.

[0011] In one embodiment, the hard light-transmitting layer includes a transparent acrylic plate or a tempered glass plate. The transparent acrylic plate or the tempered glass plate can improve the strength and impact resistance of the display unit, thereby reducing the probability of the display unit substrate being cracked due to impact, thereby greatly reducing the risk of the display unit being knocked and cracked during transportation and daily use, and is also conducive to improving the display effect of the display unit.

[0012] In one embodiment, the first light-transmitting adhesive layer at least includes an optical adhesive layer, so that the optical adhesive layer can be used to well bond the hard light-transmitting layer to the side of the packaging layer away from the substrate.

[0013] In one embodiment, the first light-transmitting adhesive layer includes a silicone layer and an optical adhesive layer; the silicone layer is disposed on the side of the packaging layer away from the substrate, and the optical adhesive layer is disposed between the hard light-transmitting layer and the silicone layer. One side of the optical adhesive layer is bonded to the hard light-transmitting layer, and the other side is bonded to one side of the silicone layer, and the other side of the silicone layer is bonded to the packaging layer. In this way, the bonding firmness of the first light-transmitting adhesive layer can be improved, and the optical adhesive layer can be better utilized to bond the hard light-transmitting layer to the side of the packaging layer away from the substrate.

[0014] In one embodiment, a frosted layer is provided on the side of the hard light-transmitting layer away from the first light-transmitting adhesive layer. The side of the hard light-transmitting layer away from the first light-transmitting adhesive layer can be frosted to form the frosted layer, thereby reducing the glossiness of the side of the hard light-transmitting layer away from the first light-transmitting adhesive layer, reducing the situation where the viewing experience is affected by the mirror reflection formed on the surface of the hard light-transmitting layer, and thereby improving the display effect of the display unit.

[0015] In one embodiment, the encapsulation layer includes an encapsulation film layer and a second light-transmitting adhesive layer, wherein the encapsulation film layer is disposed between the reinforcing layer and the substrate, and the second light-transmitting adhesive layer is disposed between the encapsulation film layer and the substrate and covers the plurality of LED chips. The second light-transmitting adhesive layer can be bonded between the encapsulation film layer and the substrate, and the second light-transmitting adhesive layer can be used to well encapsulate the plurality of LED chips, thereby improving the encapsulation reliability of the LED chips.

[0016] In one embodiment, the material of the packaging film layer includes polyethylene terephthalate or polyimide. The material of the packaging film layer is selected as polyethylene terephthalate (PET) or polyimide (PI), so that the light transmittance of the packaging film layer is higher, which is conducive to better utilizing the packaging film layer for packaging of LED chips and can also reduce the impact on the light output rate of the LED chips.

[0017] In one embodiment, the material of the second light-transmitting adhesive layer includes optical glue, so that the light transmittance of the second light-transmitting adhesive layer is higher, and the second light-transmitting adhesive layer can be well bonded between the packaging film layer and the substrate, thereby improving the packaging reliability of the packaging layer.

[0018] According to a first aspect of the present application, a spliced ​​display screen is provided, comprising a display unit as described in any one of the above embodiments; a plurality of the display units are arranged in an array, and two adjacent display units are spliced ​​with each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic structural diagram of a display unit in an embodiment of the present application is shown.

[0020] Figure 2 A circuit block diagram of a control chip, a driving circuit and a self-luminous chip in an embodiment of the present application is shown.

[0021] Figure 3 A schematic structural diagram of a display unit in another embodiment of the present application is shown.

[0022] Reference numerals:

[0023] 10. Display unit;

[0024] 110. substrate; 111. driving circuit;

[0025] 120. LED chip;

[0026] 130, encapsulation layer; 131, encapsulation film layer; 132, second light-transmitting adhesive layer;

[0027] 140, reinforcing layer; 141, hard light-transmitting layer; 142, first light-transmitting adhesive layer; 1421, optical adhesive layer; 1422, silicone layer;

[0028] 150. Control chip. DETAILED DESCRIPTION

[0029] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0030] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0031] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0032] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0033] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0034] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0035] Traditional display units usually include a substrate, an LED chip arranged on the substrate, and an encapsulation layer for encapsulating the LED chip. The encapsulation layer is usually an epoxy glue layer, a silicone layer or a film layer, and the substrate is usually made of glass, resulting in a higher risk of traditional display units being knocked and cracked during transportation and daily use.

[0036] In order to solve the technical problem, the present application designs a display unit, which includes a reinforcement layer, which can well protect the substrate and reduce the risk of the display unit being bumped and cracked during transportation and daily use.

[0037] Figure 1 A schematic structural diagram of a display unit in an embodiment of the present application is shown.

[0038] See also Figure 1 A display unit 10 provided in an embodiment of the present application includes a substrate 110 , a plurality of LED chips 120 , a packaging layer 130 and a reinforcement layer 140 .

[0039] A driving circuit 111 is disposed on the substrate 110 . A plurality of LED chips 120 are arranged in an array on the substrate 110 . The LED chips 120 are electrically connected to the driving circuit 111 .

[0040] Specifically, the substrate 110 may be a glass-based circuit board, and a plurality of LED chips 120 are arrayed on a side of the substrate 110 where the driving circuit 111 is disposed, and are electrically connected to the driving circuit 111 on the substrate 110 , respectively.

[0041] The driving circuit 111 may drive a part or all of the LED chips 120 to emit light to display different patterns.

[0042] The packaging layer 130 is disposed on the substrate 110 and covers the plurality of LED chips 120 .

[0043] The encapsulation layer 130 refers to a portion of the display unit 10 that can encapsulate the LED chip 120 , and can protect the LED chip 120 while allowing the light emitted by the LED chip 120 to pass through the encapsulation layer 130 .

[0044] The reinforcement layer 140 is disposed on a side of the packaging layer 130 facing away from the substrate 110 .

[0045] The reinforcing layer 140 is a portion disposed on a side of the encapsulation layer 130 away from the substrate 110 and capable of increasing the strength of the display unit 10 so as to protect the substrate 110 .

[0046] The display unit 10 of the present application can utilize the driving circuit 111 to drive at least part of the LED chips 120 to emit light to display a corresponding pattern, and can also utilize the packaging layer 130 to package multiple LED chips 120. It can also utilize the reinforcement layer 140 to physically protect the substrate 110, thereby improving the strength of the display unit 10 and reducing the probability of the substrate 110 being cracked due to impact. This can reduce the risk of the display unit 10 being bumped and cracked during transportation and daily use, and is also beneficial to improving the display effect of the display unit 10.

[0047] In some embodiments, the reinforcing layer 140 includes a hard light-transmitting layer 141 and a first light-transmitting adhesive layer 142 . The hard light-transmitting layer 141 is disposed on a side of the encapsulation layer 130 away from the substrate 110 , and the first light-transmitting adhesive layer 142 is disposed between the hard light-transmitting layer 141 and the encapsulation layer 130 .

[0048] The material of the hard light-transmitting layer 141 may include a light-transmitting hard material, so that the hard light-transmitting layer 141 can be used to improve the strength of the display unit 10, and can also be used to physically protect the substrate 110, and can further reduce the probability of the display unit 10 causing the substrate 110 to crack due to impact, thereby effectively reducing the risk of the display unit 10 being knocked and cracked during transportation and daily use, and is also conducive to improving the display effect of the display unit 10. In addition, the hard light-transmitting layer 141 is bonded to the side of the encapsulation layer 130 away from the substrate 110 through the first light-transmitting adhesive layer 142, which can improve the installation reliability of the hard light-transmitting layer 141 and facilitate better use of the hard light-transmitting layer 141 to physically protect the substrate 110.

[0049] In some embodiments, the hard light-transmitting layer 141 includes a transparent acrylic plate or a tempered glass plate.

[0050] The strength and impact resistance of the display unit 10 can be improved by using a transparent acrylic plate or a tempered glass plate, thereby reducing the probability of the display unit 10 causing cracks in the substrate 110 due to impact. This can greatly reduce the risk of the display unit 10 being bumped and cracked during transportation and daily use, and is also beneficial to improving the display effect of the display unit 10.

[0051] In some embodiments, a frosted layer is disposed on a side of the hard light-transmitting layer 141 facing away from the first light-transmitting adhesive layer 142 .

[0052] The side of the hard light-transmitting layer 141 away from the first light-transmitting adhesive layer 142 can be frosted to form the above-mentioned frosted layer, thereby reducing the glossiness of the side of the hard light-transmitting layer 141 away from the first light-transmitting adhesive layer 142, reducing the situation where the viewing experience is affected by the mirror reflection formed on the surface of the hard light-transmitting layer 141, and thereby improving the display effect of the display unit 10.

[0053] In some embodiments, the first light-transmissive adhesive layer 142 at least includes an optical adhesive layer 1421 .

[0054] The material of the optical adhesive layer 1421 can be selected from OCA or SCA, etc., which can make the light emitted by the LED chip 120 be uniform.

[0055] The first light-transmitting adhesive layer 142 may only include the optical adhesive layer 1421 , or may further include the optical adhesive layer 1421 and adhesive layers made of other materials.

[0056] In this way, the optical adhesive layer 1421 can be used to well bond the hard light-transmitting layer 141 to the side of the packaging layer 130 facing away from the substrate 110 .

[0057] In some embodiments, the first light-transmitting adhesive layer 142 includes an optical adhesive layer 1421 and a silicone layer 1422 . The silicone layer 1422 is disposed on a side of the packaging layer 130 facing away from the substrate 110 . The optical adhesive layer 1421 is disposed between the hard light-transmitting layer 141 and the silicone layer 1422 .

[0058] One side of the optical adhesive layer 1421 is bonded to the hard light-transmitting layer 141, and the other side is bonded to one side of the silicone layer 1422, and the other side of the silicone layer 1422 is bonded to the packaging layer 130. In this way, the bonding firmness of the first light-transmitting adhesive layer 142 can be improved, and the optical adhesive layer 1421 can be better utilized to better bond the hard light-transmitting layer 141 to the side of the packaging layer 130 away from the substrate 110.

[0059] In some embodiments, the packaging layer 130 includes a packaging film layer 131 and a second light-transmitting adhesive layer 132. The packaging film layer 131 is disposed between the reinforcement layer 140 and the substrate 110. The second light-transmitting adhesive layer 132 is disposed between the packaging film layer 131 and the substrate 110 and covers multiple LED chips 120.

[0060] The second light-transmitting adhesive layer 132 can be bonded between the packaging film layer 131 and the substrate 110 , and the second light-transmitting adhesive layer 132 can also be used to well package a plurality of LED chips 120 , thereby improving the packaging reliability of the LED chips 120 .

[0061] In some embodiments, the material of the packaging film layer 131 includes polyethylene terephthalate (PET) or polyimide (PI).

[0062] The material of the packaging film layer 131 is selected as polyethylene terephthalate (PET) or polyimide (PI), so that the light transmittance of the packaging film layer 131 is higher, which is conducive to better utilizing the packaging film layer 131 to package the LED chip 120 and can also reduce the impact on the light output rate of the LED chip 120.

[0063] Corresponding colorants may be added during the film drawing process of the packaging film layer 131 to adjust the ink color and transmittance of the packaging film layer 131 .

[0064] In this embodiment, the surface of the packaging film layer 131 facing the silicone layer 1422 and the surface of the silicone layer 1422 facing the packaging film layer 131 can both be smooth planes, so that water molecules will form a continuous layer between the packaging film layer 131 and the silicone layer 1422 due to surface tension, thereby facilitating the automatic removal of bubbles.

[0065] In some embodiments, the material of the second light-transmissive adhesive layer 132 includes optical glue.

[0066] The optical adhesive may be OCA or SCA, etc., which can make the light emitted by the LED chip 120 even.

[0067] In this way, the light transmittance of the second light-transmitting adhesive layer 132 can be made higher, and the second light-transmitting adhesive layer 132 can be well bonded between the packaging film layer 131 and the substrate 110 , thereby improving the packaging reliability of the packaging layer 130 .

[0068] In some embodiments, the display unit 10 further includes a control chip 150 . The control chip 150 is disposed on a side of the substrate 110 away from the LED chip 120 . The control chip 150 is electrically connected to the corresponding LED chip 120 through the driving circuit 111 .

[0069] A via connection structure (not shown) may be provided on the substrate 110 , and the driving circuit 111 is electrically connected to the control chip 150 via the via connection structure on the substrate 110 . Specifically, the material of the via connection structure includes copper.

[0070] The control chip 150 may correspond to the LED chip 120 one by one, or one control chip 150 may correspond to a plurality of LED chips 120 , so that the control chip 150 is electrically connected to the corresponding LED chip 120 through the driving circuit 111 . Figure 2 A schematic diagram of electrical connection between a control chip 150 and a plurality of LED chips 120 is provided.

[0071] The control chip 150 can be used to control at least part of the LED chips 120 to emit light to display corresponding patterns. In addition, the control chip 150 is disposed on the back side of the substrate 110 to facilitate the control chip 150 to be connected to other electrical devices.

[0072] An embodiment of the present application further provides a spliced ​​display screen, comprising the display unit 10 of any of the above embodiments, wherein the plurality of display units 10 are arranged in an array, and two adjacent display units 10 are spliced ​​with each other.

[0073] In this way, a plurality of display units 10 can be spliced ​​into a spliced ​​display screen to achieve a large-screen display.

[0074] Optionally, the spliced ​​display screen further includes a controller (not shown in the figure), which is electrically connected to the control chips 150 of the multiple display units 10 respectively, so that the controller can coordinately control the multiple display units 10 to better achieve large-screen display.

[0075] Optionally, the spliced ​​display screen also includes multiple bottom shells corresponding to the multiple display units 10, and a box body. The display unit 10 can be installed on the corresponding bottom shells to form a module, and then the module is installed on the box body, and adjacent bottom shells in adjacent modules are connected so that two adjacent display units 10 can be spliced ​​with each other. In this way, the multiple display units 10 can be well spliced ​​to form a spliced ​​display screen.

[0076] In some embodiments, the display unit 10 includes a substrate 110, a plurality of LED chips 120, a packaging layer 130, and a reinforcement layer 140. The reinforcement layer 140 includes a hard light-transmitting layer 141 and a first light-transmitting adhesive layer 142, the hard light-transmitting layer 141 is disposed on a side of the packaging layer 130 away from the substrate 110, and the first light-transmitting adhesive layer 142 is disposed between the hard light-transmitting layer 141 and the packaging layer 130.

[0077] In this way, the hard light-transmitting layer 141 can be used to improve the strength of the display unit 10, and can also be used to physically protect the substrate 110, which can further reduce the probability of the display unit 10 being cracked due to impact, thereby greatly reducing the risk of the display unit 10 being knocked and cracked during transportation and daily use, and is also conducive to improving the display effect of the display unit 10. In addition, the hard light-transmitting layer 141 is bonded to the side of the encapsulation layer 130 away from the substrate 110 through the first light-transmitting adhesive layer 142, which can improve the installation reliability of the hard light-transmitting layer 141, facilitate better use of the hard light-transmitting layer 141 to physically protect the substrate 110, and reduce the risk of the display unit 10 being knocked and cracked during transportation and daily use.

[0078] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0079] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A display unit, characterized in that: include: A substrate, on which a driving circuit is provided; A plurality of LED chips are arranged in an array on the substrate, and the LED chips are electrically connected to the driving circuit; A packaging layer, disposed on the substrate and covering the plurality of LED chips; as well as A reinforcing layer, disposed on a side of the packaging layer away from the substrate; The reinforcement layer comprises: a hard light-transmitting layer, disposed on a side of the packaging layer away from the substrate; and A first light-transmitting adhesive layer, disposed between the hard light-transmitting layer and the encapsulation layer; The first light-transmitting adhesive layer at least includes an optical adhesive layer.

2. The display unit according to claim 1, characterized in that The hard light-transmitting layer includes a transparent acrylic plate or a tempered glass plate.

3. The display unit according to claim 1, characterized in that The first light-transmitting adhesive layer includes a silicone layer and an optical adhesive layer; The silicone layer is arranged on a side of the packaging layer away from the substrate, and the optical adhesive layer is arranged between the hard light-transmitting layer and the silicone layer.

4. The display unit according to claim 1, characterized in that A frosted layer is provided on the side of the hard light-transmitting layer away from the first light-transmitting adhesive layer.

5. The display unit according to any one of claims 1 to 4, characterized in that: The encapsulation layer comprises: A packaging film layer, disposed between the reinforcement layer and the substrate; and The second light-transmissive adhesive layer is disposed between the packaging film layer and the substrate and covers the plurality of LED chips.

6. The display unit according to claim 5, characterized in that The material of the packaging film layer includes polyethylene terephthalate or polyimide.

7. The display unit according to claim 5, characterized in that The material of the second light-transmitting adhesive layer includes optical glue.

8. A spliced ​​display screen, characterized in that: comprising a plurality of display units according to any one of claims 1 to 7; The plurality of display units are arranged in an array, and two adjacent display units are spliced ​​with each other.

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