Environmental sensor and electronic equipment

Abstract

The utility model discloses an environment sensor and electronic equipment. The environment sensor comprises a circuit board, a chip assembly and a waterproof sealing piece, the circuit board is provided with a first surface, and a containing cavity is formed in the circuit board from the first surface to the interior of the circuit board; at least part of the structure of the chip assembly is arranged in the accommodating cavity; the waterproof sealing element is arranged in the accommodating cavity and covers at least part of the structure of the chip assembly; the waterproof seal is configured such that an external pressure signal is transmitted to at least part of the structure of the chip assembly via the waterproof seal. According to the environmental sensor provided by the embodiment of the invention, the circuit board is provided with the accommodating cavity, and at least part of the structure of the chip assembly is arranged in the accommodating cavity and is sealed by the waterproof sealing element; the environment sensor does not need to be provided with an independent shell, and when the environment sensor is assembled in complete electronic equipment, the circuit board is directly connected with the complete shell. Therefore, the environmental sensor has the advantages of fewer parts, simple structure and easy realization of the manufacturing process.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and more specifically, to an environmental sensor and an electronic device. Background Art

[0002] With the development of science and technology and the improvement of living standards, various electronic products have gradually entered thousands of households and become people's daily necessities. Some electronic products are equipped with environmental sensors, such as smart watches, bracelets and other wearable products to measure the ambient air pressure, and the data can be used to determine the altitude of the product's location.

[0003] At present, the environmental sensor in the prior art has a relatively complex structure, a high production cost, and is not convenient to assemble in a complete machine.

[0004] In view of this, it is necessary to propose a new technical solution to solve the above technical problems. Summary of the invention

[0005] One purpose of the present application is to provide a new technical solution for environmental sensors and electronic devices.

[0006] According to a first aspect of the present application, an environmental sensor is provided, the environmental sensor comprising:

[0007] A circuit board, the circuit board having a first surface, and the circuit board is provided with a receiving cavity formed from the first surface to the inside thereof;

[0008] A chip assembly, at least a portion of the structure of the chip assembly is disposed in the accommodating cavity;

[0009] A waterproof seal is disposed in the accommodating cavity and covers at least a portion of the structure of the chip assembly; the waterproof seal is configured such that an external pressure signal is transmitted to at least a portion of the structure of the chip assembly via the waterproof seal.

[0010] Optionally, the circuit board has a bottom wall arranged corresponding to the accommodating cavity, and at least a part of the structure of the chip assembly is fixed to the bottom wall.

[0011] Optionally, a distance between the first surface and the bottom wall is greater than or equal to two-thirds of the thickness of the circuit board, and less than or equal to four-fifths of the thickness of the circuit board.

[0012] Optionally, the chip assembly includes a MEMS chip, and the MEMS chip is fixed to the bottom wall.

[0013] Optionally, the chip assembly further includes an ASIC chip, and the ASIC chip is embedded in the circuit board.

[0014] Optionally, the waterproof sealing member is a waterproof sealant, and the waterproof sealant is filled in the accommodating cavity and wraps at least a partial structure of the chip assembly.

[0015] According to a second aspect of the present application, an electronic device is provided. The electronic device includes the environmental sensor as described in the first aspect, and further includes a whole machine housing, wherein the whole machine housing is connected to the circuit board.

[0016] Optionally, the whole machine housing is provided with a through hole portion, the whole machine housing is connected to the first surface, and the accommodating cavity is arranged corresponding to the through hole portion.

[0017] Optionally, a portion of the waterproof seal is disposed in the accommodating cavity, and another portion of the waterproof seal is disposed in the through hole portion.

[0018] Optionally, the entire housing is formed with a groove, and a portion of the circuit board is embedded in the groove.

[0019] The environmental sensor provided in the embodiment of the present application has a receiving cavity on the circuit board, and at least part of the structure of the chip assembly is arranged in the receiving cavity and sealed with a waterproof seal; it does not need to set up a separate housing, and when the environmental sensor is assembled in the whole electronic device, the circuit board can be directly connected to the whole housing. Therefore, the environmental sensor has a simple structure, an easy manufacturing process, a small number of parts, and is conducive to reducing production costs.

[0020] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.

[0022] Figure 1 is a schematic diagram of the overall structure of an environmental sensor according to an embodiment of the present application;

[0023] Figure 2a is a partial structural diagram of an electronic device according to an embodiment of the present application Figure 1 ;

[0024] Figure 2b is a second schematic diagram of a partial structure of an electronic device according to an embodiment of the present application;

[0025] Figure 2c is a third schematic diagram of a partial structure of an electronic device according to an embodiment of the present application;

[0026] Figure 2d It is a schematic structural diagram of a complete housing of an electronic device according to an embodiment of the present application.

[0027] Description of reference numerals:

[0028] 1. Environmental sensor; 11. Circuit board; 111. First surface; 110. Accommodating cavity; 112. Bottom wall; 12. Chip assembly; 121. MEMS chip; 122. ASIC chip; 13. Waterproof seal; 2. Whole machine housing; 20. Through hole portion; 200. Cavity; 21. Groove portion. DETAILED DESCRIPTION

[0029] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0030] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present application, its application, or uses.

[0031] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0032] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0033] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0034] Reference Figure 1 As shown, according to an embodiment of the present application, an environmental sensor 1 is provided. The environmental sensor 1 includes a circuit board 11, a chip assembly 12 and a waterproof seal 13. The circuit board 11 has a first surface 111. The circuit board 11 is provided with a receiving cavity 110 from the first surface 111 to the inside thereof; at least part of the structure of the chip assembly 12 is arranged in the receiving cavity 110; the waterproof seal 13 is arranged in the receiving cavity 110 and covers at least part of the structure of the chip assembly 12; the waterproof seal 13 is configured such that: an external pressure signal is transmitted to at least part of the structure of the chip assembly 12 via the waterproof seal 13.

[0035] The environmental sensor provided in the embodiment of the present application may be, for example, a pressure sensor, an acoustic wave sensor, a temperature and humidity sensor, or a gas sensor, or a combination of at least two of them.

[0036] Taking the pressure sensor as an example, in the environmental sensor 1 provided in the embodiment of the present application, the external pressure signal is transmitted to the chip component 12 via the waterproof seal 13, and the chip component 12 further converts, processes and outputs the pressure signal accordingly.

[0037] The environmental sensor 1 provided in the embodiment of the present application has a receiving cavity 110 on the circuit board 11, and at least part of the structure of the chip assembly 12 is arranged in the receiving cavity 110 and sealed with a waterproof seal 13; it does not need to set up a separate housing, and when the environmental sensor 1 is assembled in the whole electronic device, the circuit board 11 can be directly connected to the whole housing. Therefore, the environmental sensor has a simple structure, an easy manufacturing process, a small number of parts, and is conducive to reducing production costs.

[0038] Reference Figure 1 As shown, in one embodiment, the circuit board 11 has a bottom wall 112 arranged corresponding to the accommodating cavity 110 , and at least a part of the structure of the chip assembly 12 is fixed to the bottom wall 112 .

[0039] In this specific example, at least part of the structure of the chip assembly 12 is welded or bonded to the bottom wall 112, and is electrically connected to the circuit board 11; in this way, the chip assembly 12 can be stably mounted on the circuit board 11, and due to the support of the bottom wall 112, the chip assembly 12 can better withstand external pressure.

[0040] Reference Figure 1 As shown, in one embodiment, the distance between the first surface 111 and the bottom wall 112 is greater than or equal to two-thirds of the thickness of the circuit board 11 , and less than or equal to four-fifths of the thickness of the circuit board 11 .

[0041] In this specific example, the distance between the first surface 111 and the bottom wall 112, that is, the depth of the accommodating cavity 110, is greater than or equal to two-thirds of the thickness of the circuit board 11, and less than or equal to four-fifths of the thickness of the circuit board 11; this ensures that the chip component 12 has sufficient space for installation and fixation, and ensures the strength of the circuit board 11 without affecting other structures of the circuit board.

[0042] Reference Figure 1As shown, in one embodiment, the chip assembly 12 includes a MEMS chip 121, and the MEMS chip 121 is fixed to the bottom wall 112. Further, the chip assembly 12 also includes an ASIC chip 122, and the ASIC chip 122 is embedded in the circuit board 11.

[0043] In this specific example, the MEMS chip 121 is electrically connected to the ASIC chip 122 through a metal wire; wherein the MEMS chip 121 is disposed in the accommodating cavity 110 and fixed to the bottom wall 112, the MEMS chip 121 receives an external pressure signal and converts the pressure signal into an electrical signal, the MEMS chip 121 transmits the electrical signal to the ASIC chip 122, and the ASIC chip 122 further processes and outputs the electrical signal.

[0044] The ASIC chip 122 is buried in the circuit board 11, which can save space and is conducive to the miniaturization design of the environmental sensor.

[0045] Reference Figure 1 As shown, in one embodiment, the waterproof seal 13 is a waterproof sealant, and the waterproof sealant is filled in the accommodating cavity 110 and wraps at least a portion of the structure of the chip assembly 12 .

[0046] In this specific example, a waterproof sealant is used as the waterproof sealant 13. The waterproof sealant forms a closed environment in the accommodating cavity 110. The waterproof sealant not only has a good waterproof sealing effect, but also has a certain elasticity, thereby ensuring that the external pressure signal can be transmitted to the MEMS chip 121 through the waterproof sealant, while also effectively preventing the intrusion of external moisture.

[0047] According to another embodiment of the present application, referring to Figure 2a to Figure 2c As shown, an electronic device is provided. The electronic device includes the environmental sensor 1 as described above, and also includes a whole machine housing 2 . The whole machine housing 2 is connected to the circuit board 11 .

[0048] The electronic device provided in the embodiment of the present application includes the above-mentioned environmental sensor 1, and the environmental sensor 1 is not provided with a separate shell, and the circuit board 11 of the environmental sensor 1 is connected to the overall housing 2 of the electronic device; thus, the structure of the electronic device is relatively simple, the number of parts is relatively small, the manufacturing process is easy to implement, and the production cost is relatively low.

[0049] Reference Figure 2a to Figure 2c As shown, in one embodiment, the whole machine housing 2 is provided with a through hole portion 20 , the whole machine housing 2 is connected to the first surface 111 , and the accommodating cavity 110 is provided corresponding to the through hole portion 20 .

[0050] In this specific example, the external pressure signal is transmitted to the MEMS chip 121 via the through hole portion 20 provided in the housing 2 and the opening of the accommodating cavity 110, so that the MEMS chip 121 can sense the external pressure signal and transmit the sensed signal to the subsequent processing circuit. The accommodating cavity 110 is arranged correspondingly to the through hole portion 20, ensuring that the external pressure signal can be transmitted to the MEMS chip 121 in a timely manner.

[0051] In addition, the whole machine housing 2 is connected to the first surface 111 of the circuit board 11 by hot air welding, solder paste welding or adhesive bonding, eliminating the traditional sealing ring connection between the shell of the environmental sensor 1 and the whole machine housing. The structure is simpler, reducing the complexity of the product, thereby reducing production costs.

[0052] In addition, the width of the circuit board 11 is greater than the inner diameter of the through hole 20, so that the circuit board 11 and the whole housing 2 are welded and sealed. The inner diameter of the through hole 20 is greater than the width of the opening of the accommodating cavity 110, so that the whole housing 2 and the accommodating cavity 110 are staggered, that is, the structure of the whole housing 2 does not block the accommodating cavity 110, so as to ensure that the external pressure signal can be transmitted to the MEMS chip 121 in time.

[0053] Reference Figure 2b As shown, in one embodiment, a portion of the waterproof seal 13 is disposed in the accommodating cavity 110 , and another portion of the waterproof seal 13 is disposed in the through hole portion 20 .

[0054] In this specific example, the waterproof seal 13 is not only disposed in the accommodating cavity 110, but also disposed in the through hole portion 20, thereby forming a complete waterproof sealing structure. In this way, even if there is a small gap between the entire housing 2 and the circuit board 11, the waterproof seal 13 can effectively prevent foreign substances such as moisture from entering the interior of the electronic device.

[0055] In the embodiment where the waterproof sealing member 13 is waterproof sealant, the waterproof sealant is filled into the through hole portion 20 after the accommodating cavity 110 is completely filled.

[0056] Reference Figure 2c As shown, in one embodiment, the whole housing 2 is formed with a groove portion 21 , and a portion of the circuit board 11 is embedded in the groove portion 21 .

[0057] In this specific example, a portion of the circuit board 11 is embedded in the groove 21 formed by the entire housing 2. The entire housing 2 is not only connected to the first surface 111 of the circuit board 11, but also to the side surface of the circuit board 11. This can increase the connection stability between the circuit board 11 and the entire housing 2, and can reduce the overall size of the electronic device to a certain extent.

[0058] It should be noted that since the MEMS chip 121 is packaged in the environmental sensor 1 and the mechanical layer of the MEMS chip 121 is exposed, it has strict requirements on the environment of the production and assembly process. The existing traditional solutions generally use a hard shell for protection in the production and packaging of the environmental sensor.

[0059] In the environmental sensor and electronic device provided in the embodiments of the present application, the hard packaging housing of the environmental sensor itself is eliminated to simplify the structure and production process, and the circuit board 11 and the waterproof seal 13 are used as temporary protection structures of the environmental sensor during the production process of the environmental sensor. As long as high cleanliness requirements are met in the production of the environmental sensor, it can be used as a dustproof / waterproof protection structure during the transportation and assembly of the environmental sensor. After the environmental sensor is assembled in the electronic device, the housing 2 of the electronic device provides protection to form a final protection structure for the environmental sensor.

[0060] In a specific example, the whole machine housing 2 is provided with a sensor cavity, which has an inward opening end and an outward opening end; the environmental sensor is provided with a chip component on one side which is plugged into the sensor cavity through the inward opening end, and a waterproof seal is provided in the sensor cavity, and the circuit board at least partially blocks the inward opening end; relying on the above structure, the final protection of the environmental sensor 1 by the whole machine housing 2 is achieved.

[0061] Reference Figure 2d As shown, the whole machine housing 2 has a cavity 200 in which components such as a motherboard and a battery of the whole machine electronic device are installed; the side wall of the whole machine housing 2 is provided with the above-mentioned through hole portion 20 to facilitate the installation of the environmental sensor 1.

[0062] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0063] Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are only for illustration, not for limiting the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. An environmental sensor, characterized in that: The environmental sensor comprises: A circuit board (11), the circuit board (11) having a first surface (111), and the circuit board (11) is provided with a receiving cavity (110) extending from the first surface (111) to the inside thereof; A chip assembly (12), wherein at least a portion of the structure of the chip assembly (12) is disposed in the accommodating cavity (110); A waterproof seal (13), the waterproof seal (13) being arranged in the accommodating cavity (110) and covering at least a portion of the structure of the chip assembly (12); the waterproof seal (13) being configured such that an external pressure signal is transmitted to at least a portion of the structure of the chip assembly (12) via the waterproof seal (13).

2. The environmental sensor according to claim 1, characterized in that: The circuit board (11) has a bottom wall (112) arranged corresponding to the accommodating cavity (110), and at least a part of the structure of the chip assembly (12) is fixed to the bottom wall (112).

3. The environmental sensor according to claim 2, characterized in that: The distance between the first surface (111) and the bottom wall (112) is greater than or equal to two thirds of the thickness of the circuit board (11), and less than or equal to four fifths of the thickness of the circuit board (11).

4. The environmental sensor according to claim 2, characterized in that: The chip assembly (12) comprises a MEMS chip (121), and the MEMS chip (121) is fixed to the bottom wall (112).

5. The environmental sensor according to claim 4, characterized in that: The chip assembly (12) further comprises an ASIC chip (122), and the ASIC chip (122) is embedded in the circuit board (11).

6. The environmental sensor according to claim 1, characterized in that: The waterproof sealing member (13) is a waterproof sealant, which is filled in the accommodating cavity (110) and wraps at least a part of the structure of the chip component (12).

7. An electronic device, characterized in that: The electronic device comprises the environmental sensor (1) according to any one of claims 1 to 6, and further comprises a whole housing (2), wherein the whole housing (2) is connected to the circuit board (11).

8. The electronic device according to claim 7, characterized in that: The whole machine housing (2) is provided with a through hole portion (20), the whole machine housing (2) is connected to the first surface (111), and the accommodating cavity (110) is arranged corresponding to the through hole portion (20).

9. The electronic device according to claim 8, characterized in that: A portion of the waterproof seal (13) is disposed in the accommodating cavity (110), and another portion of the waterproof seal (13) is disposed in the through hole portion (20).

10. The electronic device according to claim 8, characterized in that: The whole machine housing (2) is formed with a groove portion (21), and a portion of the circuit board (11) is embedded in the groove portion (21).

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