Packaging structure for preventing electric leakage and LED display module thereof

Abstract

The utility model relates to an electric leakage prevention packaging structure and an LED display module thereof, the electric leakage prevention packaging structure comprises a support, a plurality of bonding pad groups, a block assembly and an electrode assembly, the plurality of bonding pad groups are arranged on the support at intervals along a first direction, each bonding pad group comprises two bonding pads arranged on the support at intervals along a second direction, and the first direction is perpendicular to the second direction; the block assembly is arranged between two adjacent bonding pads; the electrode assembly is provided with a mating member, and the mating member and the block assembly form a block structure used for blocking the mutual circulation of the binder on the two adjacent pads. According to the invention, the support is provided with the block assembly and the mating part to form the block structure, so that the mutual circulation of the adhesive on the bonding pad is blocked, the tin and glue connection risk is avoided, and the yield of the lamp beads is improved.

Description

Technical Field

[0001] The present application relates to the field of LED display modules, and in particular to a packaging structure for preventing leakage and an LED display module thereof. Background Art

[0002] With the development of LED, packaging technology has become more mature, the market has gradually expanded the use of LED screens, and they appear more and more frequently in people's field of vision. Therefore, the requirements and standards for its display effect are getting higher and higher, among which the standards for screen resolution, brightness, etc. are becoming more and more stringent. The existing TOP-type products have gradually shifted from the wire bonding mode to the flip-chip process to meet the needs of high brightness and high performance. Because the flip-chip process of TOP-type products adopts a similar operation method such as dipping tin / dispensing conductive glue, it is difficult to ensure the consistency of the control of its tin amount / conductive glue amount, and the proportion of poor tin / glue connection increases, leakage, short circuit and other defects will occur. Utility Model Content

[0003] The present application provides a packaging structure and an LED display module for preventing leakage, which can solve the problems of leakage, short circuit and other defects that may occur when the flip-chip process of TOP-type products in the related art adopts tin dipping / conductive glue dispensing operations.

[0004] In the first aspect, the embodiment of the present application provides a packaging structure for preventing leakage, which includes: a bracket, a plurality of pad groups, a blocking component and an electrode component. Along a first direction, a plurality of pad groups are arranged on the bracket at intervals, and each pad group includes two pads arranged on the bracket at intervals along a second direction, and the first direction is perpendicular to the second direction; the blocking component is arranged between two adjacent pads; a matching piece is arranged on the electrode assembly, and the matching piece and the blocking component form a blocking structure for blocking the mutual flow of adhesives on two adjacent pads. In the present application, a blocking structure is formed by arranging a blocking component and a matching piece on the bracket, which blocks the mutual flow of adhesives on the pads, avoids the risk of solder and glue connection, and improves the yield rate of lamp beads.

[0005] In combination with the first aspect, in one embodiment, the electrode assembly includes: an electrode body and an insulating portion, the electrode body is connected to the pad via an adhesive; and a matching piece is disposed on the insulating portion.

[0006] In combination with the first aspect, in one embodiment, the blocking component includes a groove formed on the bracket, the groove is arranged along the first direction and between two adjacent pads along the second direction;

[0007] The matching piece is a protruding block arranged at the bottom end of the electrode assembly, and the protruding block is clamped with the groove.

[0008] In combination with the first aspect, in one embodiment, a baffle is vertically provided at the bottom end of the inner wall of the groove;

[0009] An empty slot is formed at the bottom end of the protruding block, and the baffle is engaged with the empty slot.

[0010] In combination with the first aspect, in one embodiment, a sealing gasket is provided at the top end of the baffle and / or the top end of the inner wall of the hollow groove.

[0011] In combination with the first aspect, in one embodiment, the blocking assembly further includes blocking blocks disposed at the top end of the bracket and located on both sides of the groove along the second direction.

[0012] In combination with the first aspect, in one embodiment, the orthographic projection area of ​​the block relative to the top of the bracket is the same as the fitting surface area of ​​the block on the top of the bracket, and the projection surface of the block on the top of the bracket coincides with the fitting surface of the block on the bracket.

[0013] In combination with the first aspect, in one implementation, the cross section of the stopper is triangular, rectangular or trapezoidal.

[0014] In combination with the first aspect, in one implementation, the blocking component includes a protrusion disposed on the bracket, the protrusion is disposed along the second direction and between two adjacent pads along the first direction.

[0015] In a second aspect, an embodiment of the present application provides an LED display module, characterized in that it includes: a packaging structure for preventing leakage as described above.

[0016] The beneficial effects brought by the technical solution provided in the embodiments of the present application include:

[0017] The embodiment of the present application provides a packaging structure and an LED display module for preventing leakage. A blocking structure is formed by arranging a blocking component and a matching part on the bracket, which blocks the adhesive on the soldering pad from flowing together, avoids the risk of soldering and glue connection, and improves the yield rate of the lamp beads. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 A schematic diagram of a bracket provided in an embodiment of the present application;

[0020] Figure 2 A schematic diagram of an electrode assembly provided in an embodiment of the present application;

[0021] Figure 3A schematic diagram of the overall structure provided for an embodiment of the present application;

[0022] Figure 4 The overall structural diagram provided for the embodiment of the present application (Scheme 1);

[0023] Figure 5 The overall structural diagram provided for the embodiment of the present application (Scheme 2);

[0024] Figure 6 The overall structural diagram provided for the embodiment of the present application (Scheme 3);

[0025] Figure 7 for Figure 6 Schematic diagram of the local enlarged structure at point A in the middle.

[0026] In the figure: 1, bracket; 10, block; 2, pad; 3, bump; 4, groove; 40, baffle; 5, electrode assembly; 50, electrode body; 51, insulating part; 52, raised block; 53, empty slot. DETAILED DESCRIPTION

[0027] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0028] See also Figures 1 to 7 As shown, the embodiment of the present application provides a packaging structure and an LED display module for preventing leakage, which can solve the problems of leakage, short circuit and other defects that may occur when the TOP type product flip-chip process in the related art adopts tin dipping / conductive glue dispensing operations.

[0029] In the first aspect, an embodiment of the present application provides a packaging structure for preventing leakage, which includes: a bracket 1, a plurality of solder pads 2 groups, a blocking assembly and an electrode assembly 5, wherein along a first direction, a plurality of solder pads 2 groups are arranged on the bracket 1 at intervals, and each solder pad 2 group includes two solder pads 2 arranged on the bracket 1 at intervals along a second direction, and the first direction is perpendicular to the second direction; the blocking assembly is arranged between two adjacent solder pads 2; a matching piece is arranged on the electrode assembly 5, and the matching piece and the blocking assembly form a blocking structure for blocking the adhesive on two adjacent solder pads 2 from flowing between each other.

[0030] In the present application, a blocking structure is formed by arranging a blocking component and a matching piece on the bracket 1, thereby blocking the adhesive on the soldering pad 2 from flowing mutually, avoiding the risk of soldering and glue connection, and improving the yield rate of the lamp beads.

[0031] It should be noted that the first direction in this application refers to Figure 1 The Y direction shown is the length direction of the bracket 1, and the second direction is Figure 1 The X direction shown is also the width direction of the bracket 1 .

[0032] The pad 2 is used to connect with the electrode assembly 5, and the electrode assembly 5 is fixed on the pad 2 by an adhesive. In this embodiment, the electrode assembly 5 is provided to include an insulating portion 51 and an electrode body 50, and the electrode body 50 is connected to the pad 2 by an adhesive; a matching piece is provided on the insulating portion 51. Specifically, two electrode bodies 50 are provided, and the two electrode bodies 50 are respectively provided at both ends of the insulating portion 51, and the two electrode bodies 50 are respectively connected to two pads 2 in the same pad 2 group. Among them, the adhesive is tin or conductive glue. The adhesive is first applied to the pad 2, and then the electrode assembly 5 is placed. Therefore, the adhesive will flow around under the pressure of the electrode body 50 of the electrode assembly 5. If the adhesive on one pad 2 is combined with the adhesive on another pad 2, the electrode assembly 5 will have a risk of short circuit. Therefore, in this embodiment, the blocking assembly is provided to include a groove 4 opened on the bracket 1, and the groove 4 is arranged along the first direction and arranged between two adjacent pads 2 along the second direction. Here, two adjacent pads 2 along the second direction refer to two pads 2 with a gap in the second direction.

[0033] Generally, the groove 4 is set to have a depth of 20um-30um and a width of 40um-50um, and the groove 4 isolates the left and right areas of the bracket 1. The groove 4 can be formed by injection molding, that is, integrally formed with the bracket 1; in addition, the groove 4 can be opened on the top of the bracket 1 after the bracket 1 is manufactured as needed.

[0034] By providing the groove 4, the adhesive can flow into the groove 4 when it flows around under the pressure of the electrode assembly 5, thereby increasing the area where the adhesive flows. Generally, after the adhesive flows through the surface of the bracket 1, a small amount of adhesive will flow into the groove 4 due to the increase in the area where the adhesive flows. At this time, the risk of adhesive connection on different pads 2 is greatly reduced.

[0035] However, when only the groove 4 is provided, if too much adhesive flows into the groove 4, there is still a risk of adhesive creeping and causing a short circuit in the electrode assembly 5. Therefore, a matching piece is provided to form a blocking structure with the blocking assembly for blocking the adhesive on two adjacent pads 2 from flowing mutually.

[0036] In this embodiment, the matching piece is a protruding block 52 disposed at the bottom end of the electrode assembly 5 , and the protruding block 52 is engaged with the groove 4 .

[0037] In this embodiment, the protruding block 52 is arranged at the bottom of the insulating part 51, wherein the protruding block 52 and the insulating part 51 are made of the same material, and any popular substrate of the electrode assembly 5 on the market can be used, which can be gallium nitride (GaN), silicon carbide (SIC), aluminum nitride (AlN), etc. The protruding block 52 is made by etching process. After the electrode body 50 of the electrode assembly 5 is connected and fixed to the pad 2, the protruding block 52 at the bottom of the insulating part 51 is clamped in the groove 4. By setting the protruding block 52, not only can the flow connection of the adhesive in the left and right areas of the bracket 1 be avoided, but also the contact area between the electrode assembly 5 and the bracket 1 can be increased. By clamping the protruding block 52 with the groove 4, the bonding force between the bracket 1 and the electrode assembly 5 is increased.

[0038] In order to further reduce the risk of adhesive bonding on different pads 2, a baffle 40 is vertically arranged at the bottom end of the inner wall of the groove 4; in order to adapt the baffle 40, an empty groove 53 is opened at the bottom end of the protruding block 52, and the baffle 40 is clamped with the empty groove 53.

[0039] Specifically, after the electrode body 50 is connected and fixed to the pad 2, the protruding block 52 is clamped in the groove 4. Therefore, a corresponding empty groove 53 is provided at the bottom of the protruding block 52. That is, when the protruding block 52 is clamped in the groove 4, the baffle 40 can be clamped in the empty groove 53. The baffle 40 can further block the flow of the adhesive in the left and right areas of the bracket 1, thereby improving the yield rate of the lamp beads.

[0040] On this basis, a sealing gasket is provided at the top of the baffle plate 40 and / or the top of the inner wall of the empty groove 53. That is, a sealing gasket may be provided on the top of the baffle plate 40, and a sealing gasket may be provided on the top of the inner wall of the empty groove 53; moreover, a sealing gasket may be provided on both the top of the baffle plate 40 and the top of the inner wall of the empty groove 53. By providing a sealing gasket, the area where the wall surface of the baffle plate 40 and the wall surface of the empty groove 53 contact is sealed, so as to prevent the adhesive from connecting with the adhesive on other pads 2 through the gap where the baffle plate 40 and the wall surface of the empty groove 53 are attached.

[0041] On the basis of the above embodiment, in this embodiment, the blocking assembly further includes a blocking block 10 which is arranged at the top end of the bracket 1 and is located at both sides of the groove 4 along the second direction.

[0042] In this embodiment, the groove 4 is located between two blocks 10, and the length of the block 10 can be the same as the length of the groove 4, or greater than the length of the groove 4. Due to the setting of the block 10, when the adhesive in the left and right areas of the bracket 1 flows, most of the adhesive will be directly blocked by the block 10, preventing the adhesive in the left area of ​​the bracket 1 from flowing to the right area, and the adhesive in the right area of ​​the bracket 1 from flowing to the left area. If too much adhesive is applied to the pad 2, a small amount of adhesive will flow through the block 10 into the groove 4, but since the protrusion 52 is provided to cooperate with the groove 4, the adhesive flow in the left and right areas of the bracket 1 can be blocked.

[0043] Furthermore, in order to facilitate demoulding of the bracket 1 after production, the orthographic projection area of ​​the block 10 relative to the top of the bracket 1 is set to be the same as the fitting surface area of ​​the block 10 on the top of the bracket 1, and the projection surface of the block 10 on the top of the bracket 1 and the fitting surface of the block 10 on the bracket 1 coincide with each other.

[0044] That is to say, when the stopper 10 is projected on the top of the bracket 1, the shape and size of the orthographic projection of the stopper 10 is the same as the shape and size of the fitting surface of the stopper 10 on the bracket 1, and the projection surface of the stopper 10 on the top of the bracket 1 and the fitting surface of the stopper 10 on the bracket 1 completely overlap. Figure 7 As shown, the cross section of the stopper 10 is set to be triangular, and the cross section of the stopper 10 can also be rectangular or trapezoidal; the cross section here refers to the cross section of the stopper 10 in the vertical direction, and the vertical direction is perpendicular to the first direction and the second direction, that is, perpendicular to the horizontal plane. Generally, the shape of the contact surface of the stopper 10 on the bracket 1 is rectangular.

[0045] On the basis of the above embodiment, in this embodiment, the blocking component includes a protrusion 3 arranged on the bracket 1, and the protrusion 3 is arranged along the second direction and between two adjacent pads 2 along the first direction. Here, two adjacent pads 2 along the first direction refer to two pads 2 having a gap in the first direction.

[0046] Therefore, a bump 3 is set in the insulating area between the upper and lower pads 2 of the bracket 1 to block the upper and lower connection of the adhesive, and a groove 4 is set in the middle of the pads 2 on the left and right sides, so that the left and right areas can be isolated in conjunction with the electrode assembly 5, blocking the left and right connection of the adhesive, avoiding the risk of soldering and glue connection, and improving the yield rate of the lamp beads. At the same time, through the setting of the bump 3 and the groove 4, multiple card slot structures are formed at the top of the bracket 1, which is convenient for positioning the electrode assembly 5 when it is installed to the top of the bracket 1.

[0047] In a second aspect, an embodiment of the present application provides an LED display module, which includes: a packaging structure for preventing leakage provided by any of the above embodiments of the present application. The LED display module is connected to an external PCB board through a conductive structure.

[0048] In the present application, a blocking structure is formed by arranging a blocking component and a matching piece on the bracket 1, thereby blocking the adhesive on the soldering pad 2 from flowing mutually, avoiding the risk of soldering and glue connection, and improving the yield rate of the lamp beads.

[0049] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0050] It should be noted that, in this application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0051] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. A packaging structure for preventing leakage, characterized in that: It includes: Bracket (1); A plurality of pad groups, wherein the plurality of pad groups are arranged on a support (1) at intervals along a first direction, each pad group comprises two pads (2) arranged on the support (1) at intervals along a second direction, and the first direction is perpendicular to the second direction; A blocking component, the blocking component being arranged between two adjacent welding pads (2); An electrode assembly (5) is provided with a matching piece, and the matching piece and the blocking assembly form a blocking structure for blocking the mutual flow of adhesives on two adjacent welding pads (2).

2. The packaging structure for preventing leakage as claimed in claim 1, characterized in that: The electrode assembly (5) comprises: An electrode body (50), wherein the electrode body (50) is connected to the welding pad (2) via an adhesive; An insulating portion (51), wherein a matching piece is arranged on the insulating portion (51).

3. The packaging structure for preventing leakage of electricity according to claim 1, characterized in that: The blocking component comprises a groove (4) formed on the bracket (1), wherein the groove (4) is arranged along a first direction and between two adjacent pads (2) along a second direction; The matching piece is a protruding block (52) arranged at the bottom end of the electrode assembly (5), and the protruding block (52) is clamped with the groove (4).

4. The packaging structure for preventing leakage of electricity as claimed in claim 3, characterized in that: A baffle (40) is vertically arranged at the bottom end of the inner wall of the groove (4); A hollow groove (53) is formed at the bottom end of the protruding block (52), and the baffle (40) is engaged with the hollow groove (53).

5. The packaging structure for preventing leakage of electricity as claimed in claim 4, characterized in that: A sealing gasket is provided at the top end of the baffle (40) and / or the top end of the inner wall of the hollow groove (53).

6. The packaging structure for preventing leakage as claimed in claim 3, characterized in that: The blocking assembly also includes blocking blocks (10) arranged at the top end of the bracket (1) and located on both sides of the groove (4) along the second direction.

7. The packaging structure for preventing leakage of electricity according to claim 6, characterized in that: The orthographic projection area of ​​the stopper (10) relative to the top of the bracket (1) is the same as the area of ​​the contact surface of the stopper (10) on the top of the bracket (1), and the projection surface of the stopper (10) on the top of the bracket (1) and the contact surface of the stopper (10) on the bracket (1) coincide with each other.

8. The packaging structure for preventing leakage of electricity according to claim 7, characterized in that: The cross section of the stopper (10) is triangular, rectangular or trapezoidal.

9. The packaging structure for preventing leakage of electricity according to claim 1, characterized in that: The blocking component comprises a protrusion (3) arranged on the bracket (1); the protrusion (3) is arranged along the second direction and between two adjacent pads (2) along the first direction.

10. An LED display module, characterized in that: It includes: A packaging structure for preventing leakage as described in any one of claims 1 to 9.

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