Semiconductor power device pin bending mechanism

Abstract

The utility model relates to the technical field of pin bending, and discloses a semiconductor power device pin bending mechanism which comprises a base, a supporting frame is fixedly connected to the left side of the top end of the base, a supporting block is arranged at the top end of the base, and a containing groove is formed in the right side of the top end in the supporting block. The right side of the top end in the supporting frame is fixedly connected with a fixing rod. According to the semiconductor power device pin bending mechanism, a fluted disc, a supporting plate, a gear and a second hinge rod are arranged, a driving motor is started, the driving motor drives a first hinge rod and the gear to rotate through a rotating shaft, and the gear rotates to move along the inner side wall of the fluted disc; and when the gear moves on the inner side wall of the fluted disc, the gear can drive the connecting plate to ascend and descend through the second hinge rod, so that the bending block on the right side of the bottom end of the connecting plate can descend, one side of the pin is pressed downwards to bend the pin, and the problems that the bending block cannot be conveniently driven to ascend and descend, and the bending efficiency is easily affected are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of pin bending, in particular to a pin bending mechanism for semiconductor power devices. Background Art

[0002] Semiconductor power devices are mainly used for power conversion and circuit control of power equipment. They are the core devices for power processing and the bridge between weak current control and strong current operation. Pins refer to the wires led out from the internal circuit of an integrated circuit (chip) to the external circuit. The pins form the interface of this chip. When processing the pins, a pin bending mechanism is required.

[0003] Common pin bending mechanisms for semiconductor power devices still have some problems. For example, when bending the pins, it is necessary to squeeze the pins. When squeezing the pins, it is not convenient to drive the bending block to rise and fall, which easily affects the bending efficiency.

[0004] Therefore, we propose a pin bending mechanism for semiconductor power devices to improve the above problems. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a pin bending mechanism for semiconductor power devices to solve the problem of inconvenient lifting of the bending block and easy influence on the bending efficiency proposed in the above background art.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A pin bending mechanism for semiconductor power devices, including a base. The left side of the top of the base is fixedly connected with a support frame. A support block is arranged on the top of the base. A placement groove is opened on the right side of the inner top of the support block. The right side of the inner top of the support frame is fixedly connected with a fixed rod. A driving structure is arranged at the front end of the fixed rod.

[0007] The driving structure includes a toothed disc, a driving motor and a rotating shaft. A toothed disc is arranged at the front end of the fixed rod. A fixed block is fixedly connected to the rear end of the toothed disc. A support plate is fixedly connected to the rear end of the fixed rod. A driving motor is installed on the top of the support plate. The output end of the driving motor is fixedly connected with a rotating shaft. A first articulated rod is installed at the front end of the rotating shaft. A gear is installed at the bottom of the front end of the first articulated rod. A limiting frame is fixedly connected to the bottom end of the fixed rod. A connecting rod is arranged inside the limiting frame. The gear and the bottom of the front end of the connecting rod are provided with articulated blocks. A second articulated rod is movably articulated between the articulated blocks. The bottom end of the connecting rod is fixedly connected with a connecting plate.

[0008] Preferably, the inside of the toothed disc is processed with tooth blocks, and the outside of the gear is processed with tooth blocks having the same size as the inside of the toothed disc.

[0009] Preferably, the toothed disc is installed on the top of the front end of the fixed rod through a fixing block, and the connecting rod slides up and down inside the limiting frame.

[0010] Preferably, a connecting plate is fixedly connected to the bottom end of the connecting rod, a supporting rod is fixedly connected to the right side of the bottom end of the connecting plate, and a bending block is fixedly connected to the bottom end of the supporting rod.

[0011] Preferably, a pressing plate is arranged on the left side of the bottom end of the connecting plate, and springs are fixedly connected to both sides between the connecting plate and the pressing plate.

[0012] Preferably, a damper is arranged inside the spring, and a rubber pad is fixedly connected to the bottom end of the pressing plate.

[0013] Preferably, limiting chutes are opened on both sides inside the limiting frame, and limiting blocks are fixedly connected to both sides of the connecting rod.

[0014] Preferably, the limiting blocks are arranged inside the limiting chutes, and the limiting blocks slide up and down inside the limiting chutes.

[0015] Compared with the prior art, the beneficial effects of the present utility model are as follows: The pin bending mechanism of the semiconductor power device not only realizes the convenient lifting of the bending block, realizes the convenient limiting of the device, but also realizes the improvement of the stability of the connecting plate;

[0016] (1) By providing a toothed disc, a driving motor, a rotating shaft, a support plate, a gear and a second hinge rod, starting the driving motor, the driving motor drives the first hinge rod and the gear to rotate through the rotating shaft. When the gear rotates, it will move along the inner side wall of the toothed disc. When the gear moves on the inner side wall of the toothed disc, the gear will drive the connecting plate to lift and lower through the second hinge rod, so that the bending block on the right side of the bottom end of the connecting plate can descend, and one side of the pin can be pressed down to bend the pin;

[0017] (2) By providing a pressing plate, a spring, a damper and a rubber pad, when the connecting plate descends, the pressing plate will limit and fix the device on one side of the pin, preventing the device from shifting and lifting when pressing on the pin. The spring at the top end of the limiting frame can buffer the pressing plate, and the damper inside the spring can limit the spring to improve the stability of the lifting of the spring and the pressing plate. The rubber pad at the bottom end of the pressing plate can protect the device;

[0018] (3) By providing a connecting rod, a limiting frame, a limiting block and a limiting chute, when the connecting rod lifts and lowers, the limiting blocks on both sides of the connecting rod will lift and lower inside the limiting chute, so as to limit the connecting rod, and improve the stability of driving the connecting plate to lift and lower by the connecting rod, preventing the connecting rod from tilting accidentally when lifting and lowering. Description of the Drawings

[0019] Figure 1This is the front view sectional structure schematic diagram of the present utility model;

[0020] Figure 2 This is the enlarged front view sectional structure schematic diagram of the pressing plate of the present utility model;

[0021] Figure 3 This is the top view structure schematic diagram of the support block of the present utility model;

[0022] Figure 4 This is the Figure 1 enlarged sectional structure schematic diagram at position A in the present utility model.

[0023] In the figure: 1, base; 2, support block; 3, support frame; 4, pressing plate; 5, connecting plate; 6, connecting rod; 7, limiting frame; 8, gear disk; 9, fixed rod; 10, fixed block; 11, driving motor; 12, rotating shaft; 13, support plate; 14, first hinge rod; 15, gear; 16, second hinge rod; 17, hinge block; 18, limiting block; 19, support rod; 20, bending block; 21, spring; 22, damper; 23, rubber pad; 24, placement groove; 25, limiting chute. Specific embodiments

[0024] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0025] Embodiment 1: Please refer to Figures 1-4 , a semiconductor power device pin bending mechanism, including a base 1, a support frame 3 fixedly connected to the left side of the top of the base 1, a support block 2 arranged on the top of the base 1, a placement groove 24 opened on the right side of the inner top of the support block 2, a fixed rod 9 fixedly connected to the right side of the inner top of the support frame 3, and a driving structure arranged at the front end of the fixed rod 9;

[0026] The driving structure includes a toothed disc 8, a driving motor 11 and a rotating shaft 12. The front end of the fixed rod 9 is provided with a toothed disc 8. A fixed block 10 is fixedly connected to the rear end of the toothed disc 8. The rear end of the fixed rod 9 is fixedly connected to a support plate 13. A driving motor 11 is installed at the top of the support plate 13. The output end of the driving motor 11 is fixedly connected to a rotating shaft 12. A first articulated rod 14 is installed at the front end of the rotating shaft 12. A gear 15 is installed at the bottom of the front end of the first articulated rod 14. A limiting frame 7 is fixedly connected to the bottom end of the fixed rod 9. A connecting rod 6 is arranged inside the limiting frame 7. An articulated block 17 is arranged between the gear 15 and the bottom of the front end of the connecting rod 6. A second articulated rod 16 is movably articulated between the articulated blocks 17. The bottom end of the connecting rod 6 is fixedly connected to a connecting plate 5;

[0027] Toothed blocks are machined inside the toothed disc 8. Teeth blocks of the same size as the inside of the toothed disc 8 are machined on the outside of the gear 15. The toothed disc 8 is installed at the top of the front end of the fixed rod 9 through the fixed block 10. The connecting rod 6 slides up and down inside the limiting frame 7;

[0028] Specifically, as Figure 1 and Figure 4 shown, when the driving motor 11 is started, the driving motor 11 drives the first articulated rod 14 and the gear 15 to rotate through the rotating shaft 12. When the gear 15 rotates, it will move along the inner side wall of the toothed disc 8. When the gear 15 moves on the inner side wall of the toothed disc 8, the gear 15 will drive the connecting plate 5 to lift and lower through the second articulated rod 16, so that the bending block 20 on the right side of the bottom end of the connecting plate 5 can be lowered, and one side of the pin can be pressed down to bend the pin.

[0029] Embodiment 2: The bottom end of the connecting rod 6 is fixedly connected to a connecting plate 5. A support rod 19 is fixedly connected to the right side of the bottom end of the connecting plate 5. The bottom end of the support rod 19 is fixedly connected to a bending block 20. A pressing plate 4 is arranged on the left side of the bottom end of the connecting plate 5. Springs 21 are fixedly connected to both sides between the connecting plate 5 and the pressing plate 4. A damper 22 is arranged inside the spring 21. A rubber pad 23 is fixedly connected to the bottom end of the pressing plate 4;

[0030] Specifically, as Figure 1 and Figure 2 shown, when the connecting plate 5 descends, the pressing plate 4 will limit and fix the device on one side of the pin, preventing the device from shifting during the lifting and lowering when the pin is pressed. The spring 21 at the top end of the limiting frame 7 can buffer the pressing plate 4. The damper 22 inside the spring 21 can limit the spring 21, improving the stability of the lifting and lowering of the spring 21 and the pressing plate 4. The rubber pad 23 at the bottom end of the pressing plate 4 can protect the device.

[0031] Embodiment 3: Limiting chutes 25 are opened on both sides inside the limiting frame 7. Limiting blocks 18 are fixedly connected to both sides of the connecting rod 6. The limiting blocks 18 are arranged inside the limiting chutes 25. The limiting blocks 18 slide up and down inside the limiting chutes 25;

[0032] Specifically, as Figure 1 and Figure 4 shown, when the connecting rod 6 moves up and down, the limiting blocks 18 on both sides of the connecting rod 6 will move up and down inside the limiting chute 25, so as to limit the connecting rod 6, and improve the stability of driving the connecting plate 5 to move up and down by the connecting rod 6, preventing the connecting rod 6 from tilting accidentally when moving up and down.

[0033] Working principle: When the utility model is in use, the driving motor 11 is started. The driving motor 11 drives the first hinge rod 14 and the gear 15 to rotate through the rotating shaft 12. The rotation of the gear 15 will move along the inner side wall of the toothed disc 8. When the gear 15 moves along the inner side wall of the toothed disc 8, the gear 15 will drive the connecting plate 5 to move up and down through the second hinge rod 16, so that the bending block 20 on the right side of the bottom end of the connecting plate 5 can descend, press one side of the pin to bend the pin. When the connecting rod 6 moves up and down, the limiting blocks 18 on both sides of the connecting rod 6 will move up and down inside the limiting chute 25, so as to limit the connecting rod 6, and improve the stability of driving the connecting plate 5 to move up and down by the connecting rod 6, preventing the connecting rod 6 from tilting accidentally when moving up and down. When the connecting plate 5 descends, the pressing plate 4 will limit and fix the device on one side of the pin, preventing the device from shifting during the pin pressing. The spring 21 at the top of the limiting frame 7 can buffer the pressing plate 4, and the damper 22 inside the spring 21 can limit the spring 21, improving the stability of the spring 21 and the pressing plate 4 moving up and down. The rubber pad 23 at the bottom end of the pressing plate 4 can protect the device.

[0034] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present utility model. Any reference signs in the claims should not be regarded as limiting the claimed rights.

Claims

1. A semiconductor power device pin bending mechanism, comprising a base (1), characterized in that: The left side of the top of the base (1) is fixedly connected to a support frame (3), the top of the base (1) is provided with a support block (2), the right side of the top of the inner top of the support block (2) is provided with a placement groove (24), the right side of the top of the inner top of the support frame (3) is fixedly connected to a fixing rod (9), and the front end of the fixing rod (9) is provided with a driving structure; The driving structure comprises a toothed disc (8), a driving motor (11) and a rotating shaft (12); the front end of the fixing rod (9) is provided with a toothed disc (8); the rear end of the toothed disc (8) is fixedly connected to a fixing block (10); the rear end of the fixing rod (9) is fixedly connected to a supporting plate (13); the top end of the supporting plate (13) is equipped with a driving motor (11); the output end of the driving motor (11) is fixedly connected to the rotating shaft (12); the front end of the rotating shaft (12) is equipped with a A first hinged rod (14), a gear (15) is installed at the bottom of the front end of the first hinged rod (14), the bottom end of the fixed rod (9) is fixedly connected to the limiting frame (7), a connecting rod (6) is arranged inside the limiting frame (7), an articulated block (17) is arranged at the bottom of the front end of the gear (15) and the connecting rod (6), a second hinged rod (16) is movably hinged between the articulated blocks (17), and the bottom end of the connecting rod (6) is fixedly connected to a connecting plate (5).

2. A semiconductor power device pin bending mechanism according to claim 1, characterized in that: The interior of the toothed disc (8) is processed with a tooth block, and the exterior of the gear (15) is processed with a tooth block of the same size as the interior of the toothed disc (8).

3. The semiconductor power device pin bending mechanism according to claim 1, characterized in that: The toothed disc (8) is mounted on the top of the front end of the fixing rod (9) via a fixing block (10), and the connecting rod (6) slides up and down inside the limiting frame (7).

4. The semiconductor power device pin bending mechanism according to claim 1, characterized in that: The bottom end of the connecting rod (6) is fixedly connected to a connecting plate (5), the right side of the bottom end of the connecting plate (5) is fixedly connected to a supporting rod (19), and the bottom end of the supporting rod (19) is fixedly connected to a bending block (20).

5. The semiconductor power device pin bending mechanism according to claim 1, characterized in that: A pressing plate (4) is provided on the left side of the bottom end of the connecting plate (5), and springs (21) are fixedly connected on both sides between the connecting plate (5) and the pressing plate (4).

6. A semiconductor power device pin bending mechanism according to claim 5, characterized in that: A damper (22) is arranged inside the spring (21), and a rubber pad (23) is fixedly connected to the bottom end of the pressure plate (4).

7. A semiconductor power device pin bending mechanism according to claim 1, characterized in that: The limiting frame (7) has limiting sliding grooves (25) on both sides thereof, and the connecting rod (6) has limiting blocks (18) fixedly connected on both sides thereof.

8. A semiconductor power device pin bending mechanism according to claim 7, characterized in that: The limit block (18) is arranged inside the limit slide groove (25), and the limit block (18) slides up and down inside the limit slide groove (25).

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