Wafer biscuit dicing device

Abstract

The utility model discloses a wafer biscuit dicing device which comprises a supporting plate erected on a platform, a machine frame arranged above the tail end of the supporting plate in a covering mode, a longitudinal cutting mechanism arranged at the tail end of the supporting plate and a transverse cutting mechanism arranged on the machine frame and right opposite to the longitudinal cutting mechanism. The longitudinal cutting mechanism comprises a brace bracket, a plurality of vertical cutting lines and a cake pressing plate, the brace bracket is arranged at the tail end of the supporting plate, the upper end of the brace bracket is fixed on the rack, the vertical cutting lines are vertically and radially arranged between the brace bracket, the cake pressing plate is arranged between the brace bracket and the supporting plate and is positioned above the supporting plate, and the vertical cutting lines penetrate through the cake pressing plate. According to the wafer biscuit cutting device, wafer biscuits are cut into strips through the steel wires which are vertically arranged, then the wafer biscuits are transversely cut into dices through the rotating blades, the productivity is high, the current production requirement can be effectively met, the wafer biscuit pressing plate is matched to fix the positions of the wafer biscuits, and the problem that cutting is uneven due to displacement of the wafer biscuits is effectively solved.

Description

Technical Field

[0001] The utility model relates to the technical field of food processing, in particular to a wafer biscuit dicing device. Background Art

[0002] Wafer biscuits are a kind of dessert snack, which are mainly made of wheat flour and starch, added with auxiliary materials such as emulsifiers and leavening agents, and are made into porous slices or shapes through dough mixing, pouring, and baking. Two or more layers of biscuits with sandwich materials such as sugar and oil are added between the slices or in the shapes.

[0003] When producing wafer biscuits, a cutting device is needed to cut large pieces of wafer biscuits into strips or blocks. In traditional cutting devices, the cutting knife is generally fixedly installed at the bottom of the power structure. Therefore, when cutting biscuits, only a single direction of horizontal or vertical cutting can be performed, with low efficiency, which cannot meet the existing production requirements. And because wafer biscuits are extremely easy to break, problems such as warping and displacement will occur during the cutting process, resulting in uneven cutting. Content of the Utility Model

[0004] Aiming at the above deficiencies, the purpose of the utility model is to provide a wafer biscuit dicing device, which cuts the wafer biscuits into strips by vertically arranged steel wires and then transversely cuts them into dices by a rotating blade. It has high production capacity, can effectively meet the contemporary production requirements, and cooperates with a cake pressing plate to fix the position of the wafer biscuits, effectively reducing the problem of uneven cutting caused by the displacement of the wafer biscuits.

[0005] The technical solution adopted by the utility model to achieve the above purpose is as follows:

[0006] A wafer biscuit dicing device includes a support plate erected on a platform, a frame cover arranged above the tail end of the support plate, a longitudinal cutting mechanism arranged at the tail end of the support plate, and a transverse cutting mechanism arranged on the frame and facing the longitudinal cutting mechanism; the longitudinal cutting mechanism includes a pull bar bracket arranged at the tail end of the support plate and fixed at the upper end on the frame, several vertical cutting lines vertically and radially arranged between the pull bar brackets, and a cake pressing plate arranged between the pull bar bracket and the support plate and above the support plate, and the vertical cutting lines penetrate through the cake pressing plate.

[0007] As a further improvement of the present utility model, the draw bar bracket includes a support column respectively arranged on both sides of the tail end of the pallet and extending upward through the frame, a lower support plate fixedly arranged between two groups of support columns and facing the tail end of the pallet, and an upper support plate fixedly arranged between two groups of support columns and located on the lower support plate. A plurality of cutting line fixing holes for the vertical cutting line to penetrate and be fixed are correspondingly formed on the lower support plate and the upper support plate. The tail end of the cake pressing plate is arranged between the upper support plate and the lower support plate.

[0008] As a further improvement of the present utility model, a plurality of tangent fixing grooves are formed at the tail end of the cake pressing plate, which are matched with the cutting line fixing holes and for the vertical cutting line to penetrate through.

[0009] As a further improvement of the present utility model, a guiding plate is formed at the front end of the cake pressing plate, which extends obliquely forward from the rear lower direction to the front upper direction.

[0010] As a further improvement of the present utility model, the transverse cutting mechanism includes a motor seat arranged on the inner wall of the upper end of the frame, a rotating motor fixed on the motor seat, a cutter head body with one end connected to the output shaft of the rotating motor and the other end penetrating through the motor seat, a cutter head pressing plate arranged on the cutter head body, and at least one rotating blade arranged between the cutter head body and the cutter head pressing plate.

[0011] As a further improvement of the present utility model, there are three groups of the rotating blades.

[0012] As a further improvement of the present utility model, a collecting groove is further arranged below the tail end of the pallet, and the whole collecting groove extends obliquely downward from the tail end of the pallet.

[0013] As a further improvement of the present utility model, both sides of the lower end of the collecting groove gradually contract towards the middle.

[0014] As a further improvement of the present utility model, a protective plate extending upward is arranged on both sides of the collecting groove.

[0015] The beneficial effects of the present utility model are as follows:

[0016] By setting this device to include a pallet erected on a platform, a frame covering the upper end of the tail of the pallet, a longitudinal cutting mechanism arranged at the tail end of the pallet, and a transverse cutting mechanism arranged on the frame and facing the longitudinal cutting mechanism; the longitudinal cutting mechanism includes a pull bar bracket arranged at the tail end of the pallet and fixed to the frame at the upper end, several vertical cutting lines arranged vertically and radially between the pull bar brackets, and a cake pressing plate arranged between the pull bar bracket and the pallet and above the pallet, and the vertical cutting lines penetrate through the cake pressing plate. When wafers need to be cut, just put the wafers into the tray and push them forward evenly by an external conveying mechanism or manually. The wafers first enter between the cake pressing plate and the pallet, so as to achieve the purpose of being limited by the cake pressing plate and the tray respectively up and down, preventing the problem of the wafers warping and shifting during the cutting process. When the wafers enter the pull bar bracket, they are cut into longitudinal strips by the vertically and radially arranged vertical cutting lines, and then the cut wafers continue to move forward and enter under the transverse cutting mechanism, and are transversely cut into dices by the transverse cutting mechanism, completing the cutting purpose of the wafers. This device has a simple structure, convenient operation, high automation degree, can cut wafers longitudinally and transversely respectively, has a high production capacity, can effectively meet the contemporary production requirements, and cooperates with the cake pressing plate to fix the position of the wafers, effectively reducing the problem of uneven cutting caused by the shifting of the wafers.

[0017] The above is an overview of the technical solution of the utility model. The following will further illustrate the present utility model in conjunction with the drawings and specific embodiments. Brief Description of the Drawings

[0018] Figure 1 is the overall schematic diagram of the present utility model;

[0019] Figure 2 is the structural schematic diagram after removing the frame;

[0020] Figure 3 is the back structural schematic diagram after removing the frame;

[0021] Figure 4 is the partial structural schematic diagram of the transverse cutting mechanism and the longitudinal cutting mechanism;

[0022] Figure 5 is the structural schematic diagram of the pull bar bracket;

[0023] Figure 6 is the structural schematic diagram of the cake pressing plate;

[0024] In the figure: 1, pallet; 2, frame; 3, longitudinal cutting mechanism; 31, draw bar bracket; 311, support column; 312, lower support plate; 313, upper support plate; 314, cutting line fixing hole; 32, vertical cutting line; 33, cake pressing plate; 331, tangent fixing groove; 332, guide plate; 4, transverse cutting mechanism; 41, motor base; 42, rotating motor; 43, cutter head body; 44, cutter head pressing plate; 45, rotating blade; 5, collection tank; 51, protective plate. Detailed implementation manners

[0025] To further elaborate on the technical means and effects adopted by the present utility model to achieve the predetermined purpose, the following provides a detailed description of the specific implementation manners of the present utility model in conjunction with the accompanying drawings and preferred embodiments.

[0026] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings. These are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model.

[0027] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, "a plurality" means two or more, unless otherwise specifically defined.

[0028] In the present utility model, unless otherwise clearly defined and limited, the terms "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0029] Please refer to Figures 1 to 6, an embodiment of the present utility model provides a wafer biscuit dicing device, which includes a pallet 1 erected on a platform, a frame 2 covering the upper end of the tail of the pallet 1, a longitudinal cutting mechanism 3 arranged at the tail end of the pallet 1, and a transverse cutting mechanism 4 arranged on the frame 2 and facing the longitudinal cutting mechanism 3; the longitudinal cutting mechanism 3 includes a pull bar bracket 31 arranged at the tail end of the pallet 1 and fixed to the frame 2 at the upper end, several vertical cutting lines 32 arranged vertically and radially between the pull bar brackets 31, and a pressing plate 33 arranged between the pull bar bracket 31 and the pallet 1 and above the pallet 1, and the vertical cutting lines 32 penetrate through the pressing plate 33.

[0030] When the wafer biscuits need to be cut, only need to put the wafer biscuits into the tray, and push them forward evenly through an external conveying mechanism or manually. The wafer biscuits first enter between the pressing plate 33 and the pallet 1, so as to achieve the purpose of being limited by the pressing plate 33 and the tray respectively up and down, preventing the problem that the wafer biscuits tilt and shift during the cutting process. When the wafer biscuits enter the pull bar bracket 31, they are cut into longitudinal strips by the vertically and radially arranged vertical cutting lines 32, and then the cut wafer biscuits continue to move forward and enter below the transverse cutting mechanism 4, and are transversely cut into dices by the transverse cutting mechanism 4, completing the cutting purpose of the wafer biscuits. The device has a simple structure, convenient operation, high automation degree, can cut the wafer biscuits longitudinally and transversely respectively, has a high production capacity, can effectively meet the current production requirements, and cooperates with the pressing plate 33 to fix the position of the wafer biscuits, effectively reducing the problem of uneven cutting caused by the displacement of the wafer biscuits.

[0031] Regarding the structural setting of the vertical cutting line 32, preferably, the vertical cutting line 32 is a steel wire, which has high strength, good wear resistance, high tensile strength, is not easy to break, and has a low cost. While reducing the production cost of the device, it effectively ensures the normal cutting of the wafer biscuits by the longitudinal cutting mechanism 3. The diameter of the steel wire can be set according to factors such as the actual thickness and required width of the wafer biscuits, so it is not specifically limited in this embodiment.

[0032] Regarding the specific structural setting of the pull bar bracket 31, as Figures 1 to 5 shown, the pull bar bracket 31 includes a support column 311 respectively arranged on both sides of the tail end of the pallet 1 and extending upward through the frame 2, a lower support plate 312 fixedly arranged between the two groups of support columns 311 and facing the tail end of the pallet 1, and an upper support plate 313 fixedly arranged between the two groups of support columns and located on the lower support plate 312. Several cutting line fixing holes 314 for the vertical cutting line 32 to penetrate and be fixed are correspondingly opened on the lower support plate 312 and the upper support plate 313, and the tail end of the pressing plate 33 is arranged between the upper support plate 313 and the lower support plate 312.

[0033] By extending the support column 311 upward to penetrate the frame 2, the strip support 31 is fixed at the position located at the rear end of the support plate 1. By arranging a lower support plate 312 and an upper support plate 313 between the two groups of support columns 311, the lower support plate 312 and the upper support plate 313 are provided with a plurality of cutting line fixing holes 314 for the vertical cutting line 32 to penetrate and fix, and the two ends of the vertical cutting line 32 are respectively wound in the cutting line fixing holes 314, so that the vertical cutting line 32 is fixedly arranged between the lower support plate 312 and the upper support plate 313 and is in a taut state, so that the passing wafer biscuits are cut into longitudinal strips. By setting the tail end of the cake pressing plate 33 between the upper support plate 313 and the lower support plate 312, the wafer biscuits are also squeezed and limited by the cake pressing plate 33 when being cut by the vertical cutting line 32 between the upper support plate 313 and the lower support plate 312, thereby effectively reducing the problem of uneven cutting caused by the displacement of the wafer biscuits.

[0034] The specific method of the vertical cutting line 32 passing through the cake pressing plate 33 is as follows: Figures 1 to 4 as well as Figure 6 As shown, the tail end of the cake pressing plate 33 is formed with a plurality of cutting line fixing grooves 331 that match the cutting line fixing holes 314 and are passed through by the vertical cutting line 32. The middle part of the vertical cutting line 32 passes through the cutting line fixing groove 331, and is thus restricted by the line fixing groove, thereby preventing the vertical cutting line 32 from shifting left and right during the wafer biscuit cutting process, resulting in uneven longitudinal cutting.

[0035] In order to make the wafer biscuits easier to enter between the cake pressing plate 33 and the supporting plate 1, as shown in FIG. Figures 1 to 4 as well as Figure 6 As shown, a guide plate 332 extending obliquely from the rear lower part to the front upper part is formed at the front end of the cake pressing plate 33. When the wafer biscuits are pushed by an external conveying mechanism or manually, the wafer biscuits first contact the guide plate 332. Under the inclined guiding action of the guide plate 332, the wafer biscuits are more likely to enter between the cake pressing plate 33 and the supporting plate 1, so that they are pressed by the cake pressing plate 33, limiting the position of their upper and lower ends, preventing the wafer biscuits from tilting and shifting during the cutting process, thereby improving the efficiency and accuracy of the device in cutting the wafer biscuits, and effectively improving the production capacity of the device.

[0036] As for the fixing method of the cake pressing plate 33, both sides of the cake pressing plate 33 can be fixed on the supporting plate 1 by screws, so as to achieve the fixing of the cake pressing plate 33, and the height of the cake pressing plate 33 can be adjusted by screws.

[0037] The specific method of cutting the wafer biscuits by the transverse cutting mechanism 4 is as follows:Figures 1 to 4 As shown in the figure, the transverse cutting mechanism 4 includes a motor base 41 disposed on the inner wall of the upper end of the frame 2, a rotary motor 42 fixed on the motor base 41, a cutter head body 43 with one end connected to the output shaft of the rotary motor 42 and the other end passing through the motor base, a cutter head pressing plate 44 disposed on the cutter head body 43, and at least one rotary blade 45 disposed between the cutter head body 43 and the cutter head pressing plate 44.

[0038] When the wafer biscuits longitudinally cut into strips continue to advance to the position of the rotary blade 45, the rotary motor 42 drives the cutter head body 43, the cutter head pressing plate 44 and the rotary blade 45 disposed on its output shaft to rotate, so that the rotary blade 45 rotates around the cutter head body 43 as the axis, and transversely cuts the advancing wafer biscuits, cutting the wafer biscuits into dices. By disposing the rotary blade 45 between the cutter head body 43 and the cutter head pressing plate 44, the rotary blade 45 is more firmly installed, preventing the problem of uneven cutting caused by the displacement of the rotary blade 45, thereby improving the cutting efficiency of the device and effectively improving the production capacity of the device.

[0039] To further improve the cutting efficiency of the transverse cutting mechanism 4, as Figures 2 to 4 shown, there are 3 groups of the rotary blades 45, which are arranged and distributed between the cutter head body 43 and the cutter head pressing plate 44, and cut the wafer biscuits in sequence, thereby further improving the cutting efficiency of the transverse cutting mechanism 4 and effectively improving the production capacity of the device.

[0040] The distance between the vertical cutting lines 32 and the cutting speed of the rotary blade 45 can be adjusted according to the width and length of the wafer biscuits to be actually cut. For example, if the wafer biscuits are to be cut into 3mm square dices, the distance between the vertical cutting lines 32 is set to 3mm, and the rotary blade 45 makes a transverse cut every 3mm on the 3mm strip-shaped wafer biscuits. Its specific dimensions can be determined according to the actual situation, so no specific limitation is made in this embodiment.

[0041] Preferably, as Figures 1 to 3 shown, to facilitate the collection of the wafer biscuits that have been cut into dices, the device further includes a collection tank 5 disposed below the tail end of the pallet 1. The collection tank 5 extends obliquely downward from the tail end of the pallet 1 as a whole. By setting the collection tank 5 to have a structure that extends obliquely downward from the tail end of the pallet 1, the wafer biscuits that have been cut into dices slide down along the inclined structure of the collection tank 5 under the action of gravity, and are thus collected by the machinery below the collection tank 5, or directly conveyed to other processing machinery, which is conducive to the cooperation with other machinery, improves the production efficiency, effectively improves the production capacity of the device, and forms a more efficient production line.

[0042] Preferably, as Figure 3 shown, in order to make the wafer biscuits easier to collect, the two sides at the lower end of the collection groove 5 gradually contract towards the middle, so that the wafer biscuits that have been cut into cubes are gradually concentrated during the sliding process in the collection groove 5, which is more conducive to being collected by the machine below the collection groove 5, or directly conveyed to other processing machines, facilitating the cooperation with other machines, improving the production efficiency, effectively increasing the production capacity of the present device, and forming a more efficient production line.

[0043] Preferably, as Figures 1 to 3 shown, in order to prevent the wafer biscuits from sliding out of the collection groove 5, a protective plate 51 extending upwards is provided on both sides of the collection groove 5, thereby effectively preventing the wafer biscuits from sliding out of the collection groove 5.

[0044] It should be noted here that the wafer biscuit dicing device disclosed in the present invention is an improvement on the specific structure, and the specific control method is not the innovation point of the present invention. For the rotating motor, blade, wire and other components involved in the present invention, they can be common standard parts or components known to those skilled in the art, and their structures, principles and control methods are all known to those skilled in the art through technical manuals or obtained through conventional experimental methods.

[0045] The above are only the preferred embodiments of the present invention, and do not limit the technical scope of the present invention in any way. Therefore, other structures obtained by adopting the same or similar technical features as those of the above embodiments of the present invention are all within the protection scope of the present invention.

Claims

1. A wafer biscuit dicing device, characterized in that: It includes a pallet mounted on a platform, a frame covering the rear end of the pallet, a longitudinal cutting mechanism arranged on the rear end of the pallet, and a transverse cutting mechanism arranged on the frame and opposite to the longitudinal cutting mechanism; the longitudinal cutting mechanism includes a pull rod bracket arranged at the rear end of the pallet and the upper end of which is fixed to the frame, a plurality of vertical cutting lines vertically and radially arranged between the pull rod brackets, and a cake pressing plate arranged between the pull rod bracket and the pallet and located above the pallet, and the vertical cutting lines pass through the cake pressing plate.

2. The wafer biscuit dicing device according to claim 1, characterized in that: The pull rod bracket includes a support column respectively arranged on both sides of the rear end of the support plate and extending upward to pass through the frame, a lower support plate fixedly arranged between the two groups of support columns and facing the rear end of the support plate, and an upper support plate fixedly arranged between the two groups of support columns and located on the lower support plate. The lower support plate and the upper support plate are correspondingly provided with a plurality of cutting line fixing holes for the vertical cutting line to pass through and fix. The rear end of the cake pressing plate is arranged between the upper support plate and the lower support plate.

3. The wafer biscuit dicing device according to claim 2, characterized in that: The tail end of the cake pressing plate is formed with a plurality of cutting line fixing grooves which match the cutting line fixing holes and are used for the vertical cutting lines to pass through.

4. The wafer biscuit dicing device according to claim 1, characterized in that: The front end of the cake pressing plate is formed with a guide plate extending obliquely from the rear lower part to the front upper part.

5. The wafer biscuit dicing device according to claim 1, characterized in that: The transverse cutting mechanism includes a motor base arranged on the inner wall of the upper end of the frame, a rotating motor fixed on the motor base, a cutter body with one end connected to the output shaft of the rotating motor and the other end passing through the motor base, a cutter pressure plate arranged on the cutter body, and at least one rotating blade arranged between the cutter body and the cutter pressure plate.

6. The wafer biscuit dicing device according to claim 5, characterized in that: The rotating blades are in three groups.

7. The wafer biscuit dicing device according to claim 1, characterized in that: It also includes a collecting trough disposed below the rear end of the support plate, and the collecting trough as a whole extends downwardly from the rear end of the support plate.

8. The wafer biscuit dicing device according to claim 7, characterized in that: Both sides of the lower end of the collecting tank gradually shrink toward the middle.

9. The wafer biscuit dicing device according to claim 7, characterized in that: Both sides of the collecting tank are provided with a protective plate extending upward.

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