Heat dissipation device and printing equipment

Abstract

The utility model discloses a heat dissipation device and printing equipment. The heat dissipation device comprises a flow dividing piece, the flow dividing piece comprises a medium inlet channel and a medium outlet channel, the medium inlet channel comprises a first medium inlet and a plurality of first medium outlets, and the medium outlet channel comprises a second medium outlet and a plurality of second medium inlets; the cold plate comprises a plurality of cooling channels, inlets and outlets of the cooling channels are arranged in the first direction, and the flow directions of media in at least two cooling channels are opposite. A part of the medium entering the cold plate flows from the left side to the right side through the cooling channel, and the other part of the medium flows from the right side to the left side through the cooling channel, so that the temperature of the medium distributed in the length direction of the heat dissipation device is more uniform, and the heat dissipation effect of a plurality of electronic elements distributed in the length direction of the heat dissipation device is more balanced. In addition, the flow directions of the media in the at least two cooling channels are opposite, and the heat dissipation efficiency is improved through convection heat exchange of the media.

Description

Technical Field

[0001] The present application relates to the field of printing technology, and in particular to a heat dissipation device and a printing device. Background Art

[0002] At present, air cooling is generally used to dissipate heat from electronic components. For example, the electronic components are brought into contact with a heat sink, and a fan is used to force air convection. The heat from the electronic components is transferred to the heat sink and then dissipated into the surrounding air. However, the air cooling method has low heat dissipation efficiency, high noise, and the installation of the fan is restricted by space. In addition, there are also methods in the prior art that use cold plates to cool down electronic components, that is, the cold plate has a cooling channel inside, and the coolant takes away the heat from the electronic components as it flows through the cooling channel. However, when using cold plates to dissipate heat, the heat dissipation effect of the electronic components is often uneven. Utility Model Content

[0003] The purpose of the present application is to provide a heat dissipation device and a printing device to improve the uniformity of the heat dissipation effect of electronic components and improve the heat dissipation efficiency.

[0004] In order to achieve the above objectives, this application provides the following technical solutions:

[0005] A heat dissipation device, comprising:

[0006] A flow divider, wherein the flow divider comprises an inlet medium channel and an outlet medium channel, wherein the inlet medium channel comprises a first medium inlet and a plurality of first medium outlets, wherein the outlet medium channel comprises a second medium outlet and a plurality of second medium inlets, wherein the number of the first medium outlets is the same as the number of the second medium inlets; at least one of the first medium outlets is located on one side of the first medium inlet along the first direction, and at least one of the first medium outlets is located on the other side of the first medium inlet along the first direction; at least one of the second medium inlets is located on one side of the second medium outlet along the first direction, and at least one of the second medium inlets is located on the other side of the second medium outlet along the first direction;

[0007] A cold plate, wherein the cold plate comprises a plurality of cooling channels, wherein the inlets and outlets of the cooling channels are arranged along a first direction, and the inlets of the plurality of cooling channels are respectively connected to a plurality of first medium outlets, and the outlets of the plurality of cooling channels are respectively connected to a plurality of second medium inlets, and the medium flows in at least two of the cooling channels in opposite directions.

[0008] In one implementation, the number of the first medium outlets is two and they are respectively arranged on both sides of the first medium inlet along the first direction; the number of the second medium inlets is two and they are respectively arranged on both sides of the second medium outlet along the first direction; the number of the cooling channels is two and the medium flows in the two cooling channels in opposite directions; and / or,

[0009] In the first direction, the distance between the first medium outlet and the first medium inlet is greater than or equal to one-third of the length of the heat dissipation device in the first direction; and / or,

[0010] In the first direction, the distance between the second medium inlet and the second medium outlet is greater than or equal to one-third of the length of the heat dissipation device in the first direction;

[0011] and / or, the heat dissipation device further includes a first joint connected to the first medium inlet and / or a second joint connected to the second medium outlet.

[0012] In one implementation, the medium inlet channel includes a transverse section extending in the first direction and a longitudinal section extending in the second direction;

[0013] The medium outlet channel includes a transverse section extending in the first direction and a longitudinal section extending in the second direction.

[0014] In one implementation, the flow splitter includes a stacked flow splitting upper cover, a flow splitting plate, and an upper sealing cover;

[0015] The bottom surface of the flow splitting upper cover has a first groove, the top surface of the flow splitting plate has a second groove, and the flow splitting upper cover and the flow splitting plate are stacked so that the first groove and the second groove face each other and jointly form the transverse section of the medium inlet channel;

[0016] The bottom surface of the flow splitting plate has a third groove, the top surface of the upper sealing cover has a fourth groove, and the flow splitting plate and the upper sealing cover are stacked so that the third groove and the fourth groove face each other and jointly form the transverse section of the medium outlet channel.

[0017] In one implementation, the cold plate includes a plate body and a lower sealing cover. Both the lower sealing cover and the upper sealing cover include a plurality of transverse channels, and the cold plate includes a plurality of longitudinal channels. The plurality of transverse channels and the plurality of longitudinal channels jointly form a plurality of independent cooling channels.

[0018] In one implementation, the flow splitting upper cover, the flow splitting plate, and the upper sealing cover are fixed by screws; and / or, the cold plate and the lower sealing cover are fixed by screws; and / or, a sealing gasket is provided between the flow splitting upper cover and the flow splitting plate; and / or, a sealing gasket is provided between the flow splitting plate and the upper sealing cover; and / or, a sealing gasket is provided between the cold plate and the lower sealing cover.

[0019] In one implementation, both the first medium inlet and the second medium outlet are located on the top surface of the flow splitting upper cover; a plurality of the first medium outlets and a plurality of the second medium inlets are all located on the bottom surface of the upper sealing cover;

[0020] The first medium inlet and the multiple first medium outlets are all communicated with the transverse section of the medium inlet channel through the longitudinal section of the medium inlet channel; the second medium outlet and the multiple second medium inlets are all communicated with the transverse section of the medium outlet channel through the longitudinal section of the medium outlet channel.

[0021] In one implementation, the transverse section of the medium inlet channel further includes an annular section, and the longitudinal section between the second medium outlet and the transverse section of the medium outlet channel passes through the middle position of the annular section.

[0022] In one implementation, the side wall of the cold plate can be fixed to the electronic component;

[0023] A heat-conducting material is arranged between the side wall of the cold plate and the electronic component.

[0024] When applying the heat dissipation device provided by the present application, the electronic component can be fixed on the two side walls of the cold plate along the thickness direction. A part of the medium enters the cooling channel through the first medium outlet on the left side and flows out through the second medium inlet on the right side, and another part of the medium enters the cooling channel through the first medium outlet on the right side and flows out through the second medium inlet on the left side, realizing that a part of the medium entering the cold plate flows from the left side to the right side through the cooling channel, and at the same time another part of the medium flows from the right side to the left side through the cooling channel. In this way, the temperature of the medium distributed along the length direction of the heat dissipation device is more uniform, so that the heat dissipation effects of the multiple electronic components distributed along the length direction of the heat dissipation device are more balanced. In addition, the medium flow directions in at least two cooling channels are opposite, and through the convective heat transfer of the medium, the heat dissipation efficiency is improved. Each cooling channel is designed with a single inlet and a single outlet, which simplifies the structure, makes the structure more compact, and is more conducive to lightweight design.

[0025] A printing device includes a plurality of electronic components and the heat dissipation device as described in any one of the above, and the plurality of electronic components are respectively fixedly connected to the two side walls of the heat dissipation device.

[0026] Compared with the prior art, the beneficial effects of the printing device provided by the embodiments of the present application are the same as those of the above heat dissipation device, and will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The drawings described herein are used to provide a further understanding of the present application, and constitute a part of the present application. The schematic embodiments of the present application and their descriptions are used to explain the present application, and do not constitute an improper limitation to the present application. In the drawings:

[0028] Figure 1 is an overall schematic diagram of the heat dissipation device provided by the embodiment of the present application;

[0029] Figure 2 is an exploded view of the heat dissipation device provided by the embodiment of the present application;

[0030] Figure 3 It is a diagram of the flow direction of the medium inside the heat dissipation device provided by the embodiment of the present application;

[0031] Figure 4 It is a schematic diagram of the flow direction inside the medium channel of the heat dissipation device provided by the embodiment of the present application;

[0032] Figure 5 It is an exploded view of the medium channel of the heat dissipation device provided by the embodiment of the present application;

[0033] Figure 6 It is a schematic diagram of the top surface of the shunt upper cover provided by the embodiment of the present application;

[0034] Figure 7 It is a schematic diagram of the bottom surface of the shunt upper cover provided by the embodiment of the present application;

[0035] Figure 8 It is a schematic diagram of the top surface of the shunt plate provided by the embodiment of the present application;

[0036] Figure 9 It is a schematic diagram of the bottom surface of the shunt plate provided by the embodiment of the present application;

[0037] Figure 10 It is a schematic diagram of the top surface of the upper sealing cover provided by the embodiment of the present application;

[0038] Figure 11 It is a schematic diagram of the bottom surface of the upper sealing cover provided by the embodiment of the present application;

[0039] Figure 12 It is a schematic diagram of the top surface of the cold plate provided by the embodiment of the present application;

[0040] Figure 13 It is a schematic diagram of the bottom surface of the cold plate provided by the embodiment of the present application;

[0041] Figure 14 It is a sectional view of the heat dissipation device provided by the embodiment of the present application;

[0042] Figure 15 It is a schematic diagram of the top surface of the lower sealing cover provided by the embodiment of the present application;

[0043] Figure 16 It is a schematic diagram of the bottom surface of the lower sealing cover provided by the embodiment of the present application.

[0044] Reference numerals:

[0045] 1 - upper shunt cover, 1a - first groove, 2 - gasket, 3 - shunt plate, 3a - second groove, 3b - third groove, 4 - upper sealing cover, 4a - fourth groove, 5 - plate body, 5a - longitudinal channel, 6 - lower sealing cover, 7 - electronic component, 8 - first joint, 9 - second joint, 10 - medium inlet channel, 11 - medium outlet channel, 12 - cooling channel;

[0046] a - first medium inlet, b - second medium outlet, c - first medium outlet, d - second medium inlet, e - first connection section, f - second connection section, g - transverse channel. Detailed implementation manners

[0047] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application clearer and more understandable, the following further details this application in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not used to limit this application.

[0048] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0049] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of this application, "a plurality" means two or more unless otherwise specifically defined. "Several" means one or more unless otherwise specifically defined.

[0050] In the description of this application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to this application.

[0051] In the description of the present application, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0052] Please refer to Figure 1 - Figure 2 As shown, the heat dissipation device provided by the embodiment of the present application includes a flow splitting member and a cold plate. As Figure 4 - Figure 5 shown, the flow splitting member includes an inlet medium channel 10 and an outlet medium channel 11. The cooling medium enters the cold plate through the inlet medium channel 10, and the cooling medium in the cold plate is discharged from the heat dissipation device through the outlet medium channel 11. The cold plate includes a plurality of cooling channels 12, and the plurality of cooling channels 12 are independent of each other, that is, the plurality of cooling channels 12 are not connected to each other inside the cold plate. The number of the first medium outlets c is the same as the number of the second medium inlets d.

[0053] The inlet medium channel 10 includes a first medium inlet a and a plurality of first medium outlets c, and the outlet medium channel 11 includes a second medium outlet b and a plurality of second medium inlets d. The inlets of the plurality of cooling channels 12 are respectively connected to the plurality of first medium outlets c, and the outlets of the plurality of cooling channels 12 are respectively connected to the plurality of second medium inlets d. Specifically, after the cooling medium enters the first medium inlet a, it flows through the inlet medium channel 10. The medium in the inlet medium channel 10 is discharged from the plurality of first medium outlets c and then enters the plurality of cooling channels 12. The medium in the plurality of cooling channels 12 is discharged and then enters the plurality of second medium inlets d respectively. The medium entering from the plurality of second medium inlets d flows in the outlet medium channel 11 and finally is discharged from the second medium outlet b of the heat dissipation device.

[0054] As Figure 4 - Figure 5 shown, the first direction can be set along the length direction of the heat dissipation device. At least one first medium outlet c is located on one side of the first medium inlet a along the first direction, and at least one first medium outlet c is located on the other side of the first medium inlet a along the first direction. That is, the plurality of first medium outlets c are respectively located on both sides of the first medium inlet a along the first direction. Or, in other words, the first medium inlet a is provided with first medium outlets c on both sides along the first direction. Or, in other words, a part of the first medium outlets c is arranged close to one side of the heat dissipation device along the first direction, and another part of the first medium outlets c is arranged close to the other side of the heat dissipation device along the first direction. From Figure 4Looking from the middle, a part of the first medium outlet c is arranged near the left side of the heat dissipation device, and another part of the first medium outlet c is arranged near the right side of the heat dissipation device. At least one second medium inlet d is located on one side of the second medium outlet b along the first direction, and at least one second medium inlet d is located on the other side of the second medium outlet b along the first direction. That is, multiple second medium inlets d are respectively located on both sides of the second medium outlet b along the first direction, or in other words, second medium inlets d are arranged on both sides of the second medium outlet b along the first direction; or in other words, a part of the second medium inlets d is arranged near one side of the heat dissipation device along the first direction, and another part of the second medium inlets d is arranged near the other side of the heat dissipation device along the first direction. From Figure 4 Looking from the middle, a part of the second medium inlets d is arranged near the left side of the heat dissipation device, and another part of the second medium inlets d is arranged near the right side of the heat dissipation device. With such an arrangement, a part of the medium enters the cooling channel 12 through the first medium outlet c on the left side and flows out through the second medium inlet d on the right side, and another part of the medium enters the cooling channel 12 through the first medium outlet c on the right side and flows out through the second medium inlet d on the left side. The flow directions of the two parts of the medium are opposite, so that the medium flow directions in at least two cooling channels 12 are opposite, that is, the medium in at least one cooling channel 12 flows from left to right, and the medium in at least one cooling channel 12 flows from right to left.

[0055] When applying the heat dissipation device provided by the present application, the electronic component 7 can be fixed on the two side walls of the cold plate along the thickness direction. A part of the medium enters the cooling channel 12 through the first medium outlet c on the left side and flows out through the second medium inlet d on the right side, and another part of the medium enters the cooling channel 12 through the first medium outlet c on the right side and flows out through the second medium inlet d on the left side, realizing that a part of the medium entering the cold plate flows from left to right through the cooling channel 12, and at the same time another part of the medium flows from right to left through the cooling channel 12. In this way, the temperature of the medium distributed along the length direction of the heat dissipation device is more uniform, so that the heat dissipation effects of multiple electronic components 7 distributed along the length direction of the heat dissipation device are more balanced. In addition, the medium flow directions in at least two cooling channels 12 are opposite, and through the convective heat transfer of the medium, the heat dissipation efficiency is improved. Each cooling channel 12 is designed with single inlet and single outlet, which simplifies the structure, makes the structure more compact, and is more conducive to lightweight design.

[0056] Such as Figure 4As shown, the number of the first medium outlets c is two, and the two first medium outlets c are respectively arranged on both sides of the first medium inlet a along the first direction; the number of the second medium inlets d is two, and the two second medium inlets d are respectively arranged on both sides of the second medium outlet b along the first direction; the number of the cooling channels 12 is two and the media flow directions in the two cooling channels 12 are opposite. The two first medium outlets c are respectively communicated with the inlets of the two cooling channels 12, and the outlets of the two cooling channels 12 are respectively communicated with the two second medium inlets d, so as to realize the mutual independence and opposite flow directions of the two cooling channels 12. The two first medium outlets c are respectively arranged close to both sides of the heat dissipation device along the first direction, and the two second medium inlets d are respectively arranged close to both sides of the heat dissipation device along the first direction, so that the medium flow path is longer and the heat dissipation effect is better. By adopting this technical solution, the two cooling channels 12 can be respectively close to both side walls of the cold plate along the thickness direction to form a double-layer cooling structure, so that the cooling channels 12 are closer to the electronic components 7 and the heat dissipation effect is improved. Among them, the side wall thickness of the cold plate can be 1.5 mm - 3 mm, for example, the side wall thickness of the cold plate is 1.5 mm, 2 mm, 2.5 mm, 3 mm, etc.

[0057] Optionally, a plurality of cooling channels 12 are arranged in sequence along the thickness direction of the cold plate, so that the heat dissipation effect of the heat dissipation device along the length direction is more uniform.

[0058] In addition, the medium can be water and / or ethylene glycol, or the medium can also be a gas.

[0059] As Figure 5 shown, along the first direction, the distance between the first medium outlet c and the first medium inlet a is greater than or equal to one-third of the length of the heat dissipation device along the first direction. With such a setting, the medium in the inlet medium channel 10 needs to flow a certain distance along the first direction and then enter the cooling channel 12, which can make the medium flow more smoothly and the flow division more uniform.

[0060] In addition, along the first direction, the distance between the second medium inlet d and the second medium outlet b is greater than or equal to one-third of the length of the heat dissipation device along the first direction. With such a setting, the medium in the outlet medium channel 11 needs to flow a certain distance along the first direction and then converge, which can make the medium flow more smoothly.

[0061] Exemplarily, the distance between the first medium outlet c and the first medium inlet a is one-third, one-half, three-fifths, etc. of the length of the heat dissipation device along the first direction. The distance between the second medium inlet d and the second medium outlet b is one-third, one-half, three-fifths, etc. of the length of the heat dissipation device along the first direction.

[0062] As Figure 1As shown, for the convenience of connection, the heat dissipation device further includes a first joint 8 connected to the first medium inlet a and / or a second joint 9 connected to the second medium outlet b. In this way, the refrigeration device can supply or recover the medium to the heat dissipation device through the first joint 8 and the second joint 9. The first joint 8 and the second joint 9 can both be fixed to the shunt member by threaded connection.

[0063] As Figure 5 and Figure 4 shown, the medium inlet channel 10 includes a transverse section extending in the first direction and a longitudinal section extending in the second direction. The medium outlet channel 11 includes a transverse section extending in the first direction and a longitudinal section extending in the second direction. Among them, the second direction can be perpendicular to the first direction, or the angle between the second direction and the first direction is an acute angle. The second direction can be set along the height direction of the heat dissipation device. With such a setting, the transverse section is used to make the medium inlet channel 10 and the medium outlet channel 11 have a longer extension distance in the first direction, and the longitudinal section can make the medium inlet channel 10 and the medium outlet channel 11 communicate with the cooling channel 12, simplifying the design of the medium flow direction, and at the same time making the medium distribution in the heat dissipation device more uniform along the length direction.

[0064] As Figure 1 and Figure 14 shown, in the above technical solution, the shunt member may include a stacked shunt upper cover 1, a shunt plate 3, and an upper sealing cover 4. Among them, the shunt upper cover 1, the shunt plate 3, and the upper sealing cover 4 are stacked along the second direction. As Figures 6 - 8 shown, the bottom surface of the shunt upper cover 1 has a first groove 1a, and the top surface of the shunt plate 3 has a second groove 3a. The shunt upper cover 1 and the shunt plate 3 are stacked so that the first groove 1a and the second groove 3a are opposite to each other and jointly form the transverse section of the medium inlet channel 10. That is, after the shunt upper cover 1 and the shunt plate 3 are stacked, the first groove 1a and the second groove 3a are buckled and joined together to form the transverse section of the medium inlet channel 10. As Figure 9 and Figure 10 shown, the bottom surface of the shunt plate 3 has a third groove 3b, and the top surface of the upper sealing cover 4 has a fourth groove 4a. The shunt plate 3 and the upper sealing cover 4 are stacked so that the third groove 3b and the fourth groove 4a are opposite to each other and jointly form the transverse section of the medium outlet channel 11. That is, after the shunt plate 3 and the upper sealing cover 4 are stacked, the third groove 3b and the fourth groove 4a are buckled and joined together to form the transverse section of the medium outlet channel 11. With this technical solution, the transverse section of the medium inlet channel 10 can be formed by machining on the bottom surface of the shunt upper cover 1 and the top surface of the shunt plate 3, and the transverse section of the medium outlet channel 11 can be formed by machining on the bottom surface of the shunt plate 3 and the top surface of the upper sealing cover 4. The depth of the groove is relatively shallow. Compared with machining deep holes, the machining difficulty is reduced, the manufacturing process is simplified, and the processing cost is reduced.

[0065] Further, the cold plate includes a plate body 5 and a lower sealing cover 6. Both the lower sealing cover 6 and the upper sealing cover 4 include a plurality of transverse channels g. The cold plate includes a plurality of longitudinal channels 5a. The plurality of transverse channels g and the plurality of longitudinal channels 5a together form a plurality of independent cooling channels 12. Specifically, the plurality of transverse channels g of the upper sealing cover 4 can be distributed at intervals in two rows, and each row of transverse channels g forms a part of the top of a cooling channel 12 extending in the first direction. The plurality of transverse channels g of the lower sealing cover 6 can be distributed at intervals in two rows, and each row of transverse channels g forms a part of the bottom of a cooling channel 12 extending in the first direction. The transverse channels g on the bottom surface of the upper sealing cover 4 or the top surface of the lower sealing cover 6 can also be in a groove structure. The top end of the longitudinal channel 5a of the plate body 5 communicates with the transverse channel g of the upper sealing cover 4, and the bottom end of the longitudinal channel 5a of the plate body 5 communicates with the transverse channel g of the lower sealing cover 6, so as to realize the communication between the longitudinal channel 5a and the transverse channels g of the upper sealing cover 4 and the lower sealing cover 6. With such a setting, each cooling channel 12 includes the transverse channel g of the upper sealing cover 4, the longitudinal channel 5a of the plate body 5, and the transverse channel g of the lower sealing cover 6. As Figure 12 shown, only the longitudinal channel 5a is machined on the plate body 5, as Figure 11 and Figure 15 shown, only the transverse channel g is machined on the upper sealing cover 4 and the lower sealing cover 6. Compared with machining channels in multiple directions on the same component, the machining difficulty is reduced and the machining process is simplified.

[0066] It can be understood that each cooling channel 12 can be integrally in a continuous U shape, a continuous S shape, etc. Of course, the cooling channel 12 can also be completely opened on the plate body 5, which is not limited herein. The longitudinal channel 5a of the plate body 5 can be obtained by drilling with a drill press or directly extruded, and the process is simple and the processing cost is low. The grooves of the flow dividing upper cover 1, the flow dividing plate 3, and the upper sealing cover 4 can be machined by a milling machine. The grooves are machined by a circular milling cutter, and the corners of the grooves are all rounded, which is beneficial to reducing the internal fluid flow resistance and the erosion of the medium on the pipe wall.

[0067] As can be seen from the above, the heat dissipation device provided by the present application includes a plurality of components such as a flow dividing upper cover 1, a flow dividing plate 3, an upper sealing cover 4, a plate body 5, and a lower sealing cover 6. The plurality of components can be separately processed and manufactured, and the plurality of components are stacked to form a channel for the medium to flow, reducing the machining difficulty. At the same time, it is also convenient for later replacement and maintenance of the components, reducing the maintenance cost.

[0068] For the convenience of connection, the flow dividing upper cover 1, the flow dividing plate 3, and the upper sealing cover 4 can be fixed by screws. The cold plate and the lower sealing cover 6 can also be fixed by screws. The cold plate and the upper sealing cover 4 can also be fixed by screws. As Figures 6 - 16As shown, the upper shunt cover 1, the shunt plate 3, the upper sealing cover 4, and the lower sealing cover 6 are all provided with screw holes. Of course, the upper shunt cover 1, the shunt plate 3, and the upper sealing cover 4 can also be fixed by means of snap connection, bonding, or welding. The cold plate and the lower sealing cover 6 or the cold plate and the upper sealing cover 4 can also be fixed by means of snap connection, bonding, or welding, which is not limited again.

[0069] The upper shunt cover 1, the shunt plate 3, the upper sealing cover 4, and the cold plate can all be made of aluminum alloy. Of course, the upper shunt cover 1, the shunt plate 3, the upper sealing cover 4, and the cold plate can also be made of other metal materials, such as copper, stainless steel, etc.

[0070] In order to prevent liquid leakage, a gasket 2 is provided between the upper shunt cover 1 and the shunt plate 3; and / or, a gasket 2 is provided between the shunt plate 3 and the upper sealing cover 4; and / or, a gasket 2 is provided between the cold plate and the lower sealing cover 6. It should be noted that the gasket 2 does not affect the formation of the medium inlet channel 10, the medium outlet channel 11, and the cooling channel 12, and is only used to prevent the medium in the medium inlet channel 10, the medium outlet channel 11, and the cooling channel 12 from leaking. The gasket 2 can be a rubber gasket, a silicone gasket, etc.

[0071] As Figure 6 shown, the first medium inlet a and the second medium outlet b are both located on the top surface of the upper shunt cover 1. As Figure 11As shown, multiple first medium outlets c and multiple second medium inlets d are both located on the bottom surface of the upper sealing cover 4. Moreover, the first medium inlet a and multiple first medium outlets c are both connected to the transverse section of the medium inlet channel 10 through the longitudinal sections of the medium inlet channel 10; that is, the medium first passes through the longitudinal section of the medium inlet channel 10 from the first medium inlet a and then enters the transverse section of the medium inlet channel 10. The second medium outlet b and multiple second medium inlets d are both connected to the transverse section of the medium outlet channel 11 through the longitudinal sections of the medium outlet channel 11. That is, after the medium enters the medium outlet channel 11, it flows out from the transverse section of the medium outlet channel 11 and then flows through the longitudinal section of the medium outlet channel 11 and finally flows to the top of the heat dissipation device. There are three longitudinal sections of the medium inlet channel 10, two of which are respectively connected to both ends of the transverse section of the medium inlet channel 10, and the above two longitudinal sections of the medium inlet channel 10 extend from the upper sealing cover 4 to the shunt upper cover 1. The other longitudinal section of the medium inlet channel 10 is the first connection section e. One end of the first connection section e is connected to a position between both ends of the transverse section of the medium inlet channel 10, and the other end of the first connection section e is the first medium inlet a. There are three longitudinal sections of the medium outlet channel 11, two of which are respectively connected to both ends of the transverse section of the medium outlet channel 11, and the longitudinal sections of the medium outlet channel 11 penetrate through the thickness direction of the upper sealing cover 4. The other longitudinal section of the medium outlet channel 11 is the second connection section f. One end of the second connection section f is connected to a position between both ends of the transverse section of the medium outlet channel 11, and the other end of the second connection section f is the second medium outlet b. With such a setting, the first medium inlet a and the second medium outlet b can both be located at the top of the heat dissipation device, making the structure more compact and facilitating the connection between the first medium inlet a and the second medium outlet b and the integrated components.

[0072] Of course, the first medium inlet a and the second medium outlet b can also be both located on the opposite side surfaces of the shunt upper cover 1 along the first direction, which is not limited herein.

[0073] As Figure 4 shown, the transverse section of the medium inlet channel 10 further includes an annular section, and the longitudinal section between the second medium outlet b and the transverse section of the medium outlet channel 11 passes through the middle position of the annular section. Specifically, the longitudinal section between the second medium outlet b and the transverse section of the medium outlet channel 11 is the second connection section f. A part of the transverse section of the medium inlet channel 10 is set as an annular section for the second connection section f of the medium outlet channel 11 to pass through the middle position of the annular section. With such a setting, the medium inlet channel 10 and the medium outlet channel 11 do not affect each other and are independent of each other, which is conducive to making the positions of the first medium inlet a and the second medium outlet b closer, facilitating the assembly of the heat dissipation device and the refrigeration equipment, and the refrigeration equipment can be a liquid cooler.

[0074] Of course, the transverse section of the medium inlet channel 10 and the second connection section f of the medium outlet channel 11 can also be arranged offset along the length or thickness direction of the cold plate, which is not limited herein.

[0075] In some embodiments, the side wall of the cold plate can be fixed to the electronic component 7 so that the heat of the electronic component 7 is absorbed by the cold plate. Specifically, the electronic component 7 and the side wall of the cold plate can be fixed by means such as screw connection or snap connection. The number of the electronic components 7 can be multiple, and the multiple electronic components 7 can be sequentially arranged on the side wall of the cold plate along the length direction of the cold plate. Since there are a plurality of cooling channels 12 arranged in the thickness direction in the cold plate, a plurality of electronic components 7 can be arranged on both opposite side walls of the cold plate in the thickness direction, so that the heat dissipation effect of the plurality of electronic components 7 is more uniform.

[0076] In order to improve the heat dissipation efficiency, a heat-conducting material can be arranged between the side wall of the cold plate and the electronic component 7, and the heat-conducting material can be heat-conducting silicone grease, heat-conducting silica gel, etc.

[0077] In addition, the embodiment of the present application also provides a printing device, which includes a plurality of electronic components 7 and the heat dissipation device provided in any of the above embodiments. Compared with the prior art, the beneficial effects of the printing device provided by the embodiment of the present application are the same as those of the above heat dissipation device, and will not be elaborated here.

[0078] Among them, the electronic component 7 can be the main control board of the print head. Since there are a plurality of cooling channels 12 arranged in the thickness direction in the cold plate, a plurality of electronic components 7 can be arranged on both opposite side walls of the cold plate in the thickness direction, so that the heat dissipation effect of the plurality of electronic components 7 is more uniform.

[0079] The above printing device can be a roll printer, a 3D printer, a flat printer, etc.

[0080] In the description of the above embodiments, the specific features, structures, materials or characteristics can be combined in a suitable manner in any one or more embodiments or examples.

[0081] The above is only the specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present application, and all should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claimed rights.

Claims

1. A heat dissipation device, characterized in that: include: A flow divider, wherein the flow divider comprises an inlet medium channel and an outlet medium channel, wherein the inlet medium channel comprises a first medium inlet and a plurality of first medium outlets, wherein the outlet medium channel comprises a second medium outlet and a plurality of second medium inlets, wherein the number of the first medium outlets is the same as the number of the second medium inlets; at least one of the first medium outlets is located on one side of the first medium inlet along the first direction, and at least one of the first medium outlets is located on the other side of the first medium inlet along the first direction; at least one of the second medium inlets is located on one side of the second medium outlet along the first direction, and at least one of the second medium inlets is located on the other side of the second medium outlet along the first direction; A cold plate, wherein the cold plate comprises a plurality of cooling channels, wherein the inlets and outlets of the cooling channels are arranged along a first direction, and the inlets of the plurality of cooling channels are respectively connected to a plurality of first medium outlets, and the outlets of the plurality of cooling channels are respectively connected to a plurality of second medium inlets, and the medium flows in at least two of the cooling channels in opposite directions.

2. The heat dissipation device according to claim 1, characterized in that: The number of the first medium outlets is two and they are respectively arranged on both sides of the first medium inlet along the first direction; the number of the second medium inlets is two and they are respectively arranged on both sides of the second medium outlet along the first direction; the number of the cooling channels is two and the medium flows in the two cooling channels in opposite directions; and / or, Along the first direction, the distance between the first medium outlet and the first medium inlet is greater than or equal to one third of the length of the heat dissipation device along the first direction; and / or, Along the first direction, the distance between the second medium inlet and the second medium outlet is greater than or equal to one third of the length of the heat dissipation device along the first direction; And / or, the heat dissipation device further includes a first joint connected to the first medium inlet and / or a second joint connected to the second medium outlet.

3. The heat dissipation device according to claim 1, characterized in that: The medium inlet channel includes a transverse section extending along a first direction and a longitudinal section extending along a second direction; The medium outlet channel includes a transverse section extending along a first direction and a longitudinal section extending along a second direction.

4. The heat dissipation device according to claim 3, characterized in that: The flow splitter comprises a flow splitter upper cover, a flow splitter plate and an upper sealing cover which are stacked; The bottom surface of the flow splitter upper cover has a first groove, the top surface of the flow splitter plate has a second groove, and the flow splitter upper cover and the flow splitter plate are stacked so that the first groove and the second groove are opposite to each other and together form a transverse section of the medium inlet channel; The bottom surface of the splitter plate has a third groove, the top surface of the upper sealing cover has a fourth groove, and the splitter plate and the upper sealing cover are stacked so that the third groove and the fourth groove are opposite to each other and together form a transverse section of the outlet medium channel.

5. The heat dissipation device according to claim 4, characterized in that: The cold plate includes a plate body and a lower sealing cover. The lower sealing cover and the upper sealing cover each include a plurality of transverse channels. The cold plate includes a plurality of longitudinal channels. The plurality of transverse channels and the plurality of longitudinal channels together form a plurality of cooling channels that are independent of each other.

6. The heat dissipation device according to claim 5, characterized in that: The diverter upper cover, diverter plate and upper sealing cover are fixed by screws; and / or, the cold plate and the lower sealing cover are fixed by screws; and / or, a sealing gasket is arranged between the diverter upper cover and the diverter plate; and / or, a sealing gasket is arranged between the diverter plate and the upper sealing cover; and / or, a sealing gasket is arranged between the cold plate and the lower sealing cover.

7. The heat dissipation device according to claim 4, characterized in that: The first medium inlet and the second medium outlet are both located on the top surface of the splitter upper cover; a plurality of the first medium outlets and a plurality of the second medium inlets are both located on the bottom surface of the upper sealing cover; The first medium inlet and the plurality of first medium outlets are connected to the transverse section of the inlet medium channel through the longitudinal section of the inlet medium channel; the second medium outlet and the plurality of second medium inlets are connected to the transverse section of the outlet medium channel through the longitudinal section of the outlet medium channel.

8. The heat dissipation device according to claim 7, characterized in that: The transverse section of the inlet medium channel further includes an annular section, and the longitudinal section between the second medium outlet and the transverse section of the outlet medium channel passes through a middle position of the annular section.

9. The heat dissipation device according to claim 1, characterized in that: The side wall of the cold plate can be fixed to the electronic component; A heat conducting material is arranged between the side wall of the cold plate and the electronic components.

10. A printing device, characterized in that: It comprises a plurality of electronic components and a heat dissipation device as described in any one of claims 1 to 9, wherein the plurality of electronic components are fixedly connected to two side walls of the heat dissipation device respectively.

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