Cooling liquid leakage processing device and semiconductor equipment

Abstract

The utility model discloses a cooling liquid leakage processing device and semiconductor equipment, which are applied to the semiconductor equipment, and the cooling liquid leakage processing device comprises a cooling liquid circulation assembly which is used for providing cooling liquid and is in circulation connection with at least one to-be-cooled part on the semiconductor equipment through a pipeline; the liquid pumping assembly is connected with a pipeline on the cooling liquid circulating assembly through a pipeline; and the liquid storage assembly is connected with the pipeline on the liquid extraction assembly through a pipeline. When the pipeline on the cooling liquid circulation assembly leaks liquid, the liquid extraction assembly is controlled to rapidly extract the cooling liquid in the pipeline of the cooling liquid circulation assembly and convey the cooling liquid to the liquid storage assembly for temporary storage; and after the leaked liquid treatment is completed, the liquid extraction assembly is controlled to extract the cooling liquid in the liquid storage assembly and convey the cooling liquid to a pipeline on the cooling liquid circulation assembly. The device has the advantages that all cooling liquid can be rapidly pumped away within a short time, and zero discharge of leaked liquid is achieved in the leaked liquid treatment process.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment processes, and particularly relates to a coolant leakage treatment device and a semiconductor equipment. Background Art

[0002] At present, the cooling systems of semiconductor equipment generally adopt two methods. One is gas (such as CDA, N 2 etc.) cooling, and the other is liquid (such as PCW, 75°C ethylene glycol, etc.) cooling. When liquid cooling is adopted, once there is liquid leakage, it not only affects the normal operation of the machine tool, but also affects the overall cleanliness of the clean room where the semiconductor equipment is located. If the liquid is toxic, it will also harm the physical health of the technical operators of the equipment.

[0003] The existing technologies generally have two measures for liquid leakage. One is to set up a liquid receiving tray at the high-risk points of liquid leakage and install a liquid leakage sensor at the same time. Once the liquid leakage sensor signal is triggered by liquid leakage, the machine tool will alarm and the operator will handle it in time. The other is to first wrap the leak point with a hose and tighten the joint with a hose clamp to prevent liquid from spraying out when dealing with liquid leakage. During the liquid leakage treatment process, only the leak point is wiped with a clean cloth. When replacing parts, one end of the quick connector is opened and placed at the mouth of the waste liquid bucket, and CDA or N2 is blown into the pipeline at the other end. After all the liquid is blown out, the parts are replaced. However, during the process of removing the quick connector, it is inevitable that some liquid will leak out. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a coolant leakage treatment device and a semiconductor equipment, aiming to solve the problem that the existing cooling system of semiconductor equipment cannot achieve zero-discharge and rapid treatment when liquid leakage occurs.

[0005] To solve the above technical problems, the purpose of the utility model is achieved through the following technical solutions: A coolant leakage treatment device is provided, which is applied to semiconductor equipment and includes: a coolant circulation component, a liquid pumping component, and a liquid storage component;

[0006] The coolant circulation component is used to provide coolant and is connected in a circulating manner through a pipeline with at least one component to be cooled on the semiconductor equipment;

[0007] The liquid pumping component is connected through a pipeline with the pipeline on the coolant circulation component;

[0008] The liquid storage component is connected through a pipeline with the pipeline on the liquid pumping component;

[0009] Wherein, the liquid extraction assembly is used to extract the coolant in the pipeline of the coolant circulation assembly and transport it to the liquid storage assembly for temporary storage when a leakage occurs in the pipeline of the coolant circulation assembly; and is used to extract the coolant in the liquid storage assembly and transport it to the pipeline of the coolant circulation assembly after the leakage treatment is completed.

[0010] Further, the coolant circulation assembly includes: a cooler, a liquid outlet pipe, and a liquid return pipe;

[0011] The cooler is used to provide coolant;

[0012] One end of the liquid outlet pipe is connected to the liquid outlet end of the cooler, and the other end of the liquid return pipe is connected in series / parallel to all components to be cooled;

[0013] All components to be cooled are connected in series / parallel to one end of the liquid return pipe, and the other end of the liquid return pipe is connected to the liquid return end of the cooler.

[0014] Further, the coolant circulation assembly further includes: a first pneumatic valve, a second pneumatic valve, and a first flowmeter;

[0015] The first pneumatic valve is arranged on the liquid outlet pipe;

[0016] The second pneumatic valve is arranged on the liquid return pipe;

[0017] The first flowmeter is arranged on the liquid return pipe;

[0018] Wherein, the liquid extraction assembly is connected to the liquid return pipe of the coolant circulation assembly through a pipeline.

[0019] Further, the liquid extraction assembly includes: a self-priming pump, a liquid extraction pipe, and a liquid discharge pipe;

[0020] One end of the liquid extraction pipe is connected to the pipeline of the coolant circulation assembly, and the other end of the liquid extraction pipe is connected to the liquid inlet end of the self-priming pump;

[0021] One end of the liquid discharge pipe is connected to the liquid outlet end of the self-priming pump, and the other end of the liquid discharge pipe is connected to the liquid storage assembly.

[0022] Further, the liquid extraction assembly further includes: a third pneumatic valve, a fourth pneumatic valve, and a second flowmeter;

[0023] The third pneumatic valve is arranged on the liquid extraction pipe;

[0024] The fourth pneumatic valve is arranged on the liquid discharge pipe;

[0025] The second flowmeter is arranged on the liquid extraction pipe;

[0026] Among them, the liquid extraction assembly is connected to the liquid return pipe on the coolant circulation assembly through a pipeline.

[0027] Further, the liquid storage assembly includes: a liquid storage tank, a first return pipe, a fifth pneumatic valve, a second return pipe, and a sixth pneumatic valve;

[0028] One end of the first return pipe is connected to the liquid storage tank, and the other end of the first return pipe is connected to the pipeline position on the liquid extraction pipe between the third pneumatic valve and the self-priming pump;

[0029] The fifth pneumatic valve is arranged on the first return pipe;

[0030] One end of the second return pipe is connected to the liquid outlet end of the self-priming pump, and the other end of the second return pipe is connected to the pipeline of the coolant circulation assembly;

[0031] The sixth pneumatic valve is arranged on the second return pipe.

[0032] Further, a liquid level sensor for detecting the liquid level height is arranged in the liquid storage tank.

[0033] Further, the coolant circulation assembly further includes: a first manual valve and a second manual valve;

[0034] The first manual valve is arranged on the liquid outlet pipe;

[0035] The second manual valve is arranged on the liquid return pipe.

[0036] Further, the coolant leakage treatment device further includes: a plurality of leakage sensors, and the plurality of leakage sensors are respectively arranged at each joint position between all or part of the pipelines in the coolant circulation assembly.

[0037] An embodiment of the present invention further provides a semiconductor device, and at least one component to be cooled on the semiconductor device is connected to the coolant circulation assembly of the coolant leakage treatment device as described above.

[0038] The beneficial effects of the embodiment of the present invention are: when it is detected that a pipeline on the coolant circulation assembly leaks, the liquid extraction assembly is controlled to quickly extract the coolant in the pipeline of the coolant circulation assembly and transport it to the liquid storage assembly for temporary storage; when the leakage treatment is completed, the liquid extraction assembly is controlled to extract the coolant in the liquid storage assembly and transport it to the pipeline on the coolant circulation assembly. It has the advantage of quickly pumping away all the coolant within a short time to achieve zero leakage discharge during the leakage treatment process. Description of the Drawings

[0039] To more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can also be obtained based on these drawings.

[0040] Figure 1 It is a schematic structural diagram of the coolant leakage treatment device provided by the embodiment of the present utility model.

[0041] Figure 2 It is a schematic structural diagram of the coolant leakage treatment device provided by the embodiment of the present utility model.

[0042] Figure 3 It is a schematic flowchart of the coolant leakage treatment method provided by the embodiment of the present utility model.

[0043] Explanation of the markings in the figure:

[0044] 10. Cooler; 11. Liquid outlet pipe; 12. Return pipe; 13. First pneumatic valve; 14. Second pneumatic valve; 15. First flowmeter; 16. First manual valve; 17. Second manual valve;

[0045] 20. Self-priming pump; 21. Liquid suction pipe; 22. Drain pipe; 23. Third pneumatic valve; 24. Fourth pneumatic valve; 25. Second flowmeter;

[0046] 30. Liquid storage tank; 31. First return pipe; 32. Fifth pneumatic valve; 33. Second return pipe; 34. Sixth pneumatic valve;

[0047] 40. Heating plate; 41. Reaction cavity; 42. Cavity end cover. Detailed implementation manners

[0048] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present utility model.

[0049] It should be understood that when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, wholes, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or their combinations.

[0050] It should also be understood that the terms used in the description of the present utility model herein are merely for the purpose of describing specific embodiments and are not intended to limit the present utility model. As used in the description of the present utility model and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include the plural forms.

[0051] It should be further understood that the term "and / or" used in the description of the present utility model and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0052] Please refer to Figure 1 and Figure 2 , Figure 1 and Figure 2 are all schematic structural diagrams of the coolant leakage treatment device provided by the embodiments of the present utility model.

[0053] The embodiments of the present utility model provide a coolant leakage treatment device, which is applied to semiconductor equipment and includes: a coolant circulation component, a liquid pumping component and a liquid storage component; the coolant circulation component is used to provide coolant and is connected in a circulating manner through a pipeline with at least one component to be cooled on the semiconductor equipment; the liquid pumping component is connected to the pipeline on the coolant circulation component through a pipeline; the liquid storage component is connected to the pipeline on the liquid pumping component through a pipeline; wherein, the liquid pumping component is used to extract the coolant in the pipeline of the coolant circulation component and transport it to the liquid storage component for temporary storage when a leakage occurs in the pipeline of the coolant circulation component; and is used to extract the coolant in the liquid storage component and transport it to the pipeline on the coolant circulation component after the leakage treatment is completed.

[0054] In this embodiment, the coolant circulation component is used to cool the components to be cooled on the semiconductor equipment (i.e., the components that become hot during the operation of the semiconductor equipment). The specific quantity and position of the components to be cooled on the semiconductor equipment can be set according to the type of semiconductor equipment and the cooling requirements. For example, in a general thin film deposition equipment, positions such as the heating plate 40, reaction chamber 41 and chamber end cover 42 that are hot in the equipment can all be connected to the pipeline of the coolant circulation component. Thus, by circulating and transporting the coolant through the coolant circulation component, the cyclic cooling of these several components can be achieved.

[0055] In this embodiment, when the pipeline of the coolant circulation component is connected to the component to be cooled on the semiconductor device, it is generally connected to the cooling channel in the component to be cooled through a joint, and there may be a risk of liquid leakage at the joint position after long-term use. Therefore, this embodiment is provided with a plurality of liquid leakage sensors, and the plurality of liquid leakage sensors are respectively arranged at each joint position in the coolant circulation component, for real-time detection of whether liquid leakage occurs at each joint position, and triggering a liquid leakage alarm immediately when liquid leakage occurs.

[0056] In this embodiment, after the liquid leakage alarm is triggered, the liquid extraction component is controlled to quickly extract the coolant in the pipeline of the coolant circulation component and transport it to the liquid storage component for temporary storage; at this time, when cleaning the leakage point position or replacing the joint parts after cleaning, there is no need to worry about more liquid leakage problems, and the efficiency of dealing with the leakage point and replacing parts is also higher, having the advantage of achieving zero liquid leakage during the liquid leakage treatment process. And after the liquid leakage treatment is completed, the liquid extraction component is controlled to extract the coolant in the liquid storage component and transport it to the pipeline on the coolant circulation component, and the normal cooling work can be restored.

[0057] Please continue to refer to Figure 1 and Figure 2 , and the coolant circulation component of the present application will be specifically introduced below.

[0058] In one embodiment, the coolant circulation component includes: a cooler 10, an outlet pipe 11, and a return pipe 12; the cooler 10 is used to provide coolant; one end of the outlet pipe 11 is connected to the outlet end of the cooler 10, and the other end of the return pipe 12 is connected in series / parallel to all components to be cooled; all components to be cooled are connected in series / parallel to one end of the return pipe 12, and the other end of the return pipe 12 is connected to the return end of the cooler 10.

[0059] In this embodiment, during the circulating cooling process of the coolant circulation component, the cooler 10 is used to provide coolant at a preset temperature (such as PCW, ethylene glycol at 75°C, etc.), and the cooler 10 can transport the coolant to all components to be cooled through the outlet pipe 11, such as transporting to the heating plates 40 (heating plate A and heating plate B), reaction chamber 41, and chamber end cover 42 shown in Figure 1 . Here, it is exemplified that the outlet pipe 11 is connected in series to the heating plate 40, reaction chamber 41, and chamber end cover 42 in sequence. Obviously, a parallel connection method can also be adopted, and the other end of the outlet pipe 11 is branched into three branches and respectively connected in parallel to the heating plate 40, reaction chamber 41, and chamber end cover 42; then, the coolant in the outlet pipe 11 undergoes heat exchange and temperature rise after passing through the heating plate 40, reaction chamber 41, and chamber end cover 42, and the heated coolant flows back to the cooler 10 through the return pipe 12, and the cooler 10 cools the heated coolant, and so on, and the circulating cooling treatment of the components to be cooled on the semiconductor device can be realized.

[0060] In one embodiment, the coolant circulation assembly further includes: a first pneumatic valve 13, a second pneumatic valve 14, and a first flowmeter 15; the first pneumatic valve 13 is disposed on the liquid outlet pipe 11; the second pneumatic valve 14 is disposed on the liquid return pipe 12; the first flowmeter 15 is disposed on the liquid return pipe 12; wherein, the liquid pumping assembly is connected to the liquid return pipe 12 of the coolant circulation assembly through a pipeline.

[0061] In this embodiment, during the normal circulation cooling operation of the coolant circulation assembly, the first pneumatic valve 13 and the second pneumatic valve 14 remain in an open state; the first flowmeter 15 is used to detect the coolant flow rate during the current circulation cooling operation, and can control the pipeline opening to adjust different flow velocities. A temperature sensor can also be built into the first flowmeter 15 to detect the coolant temperature, and the real-time flow rate and real-time temperature of the coolant are displayed in a digital display form. When there is a liquid leakage in the pipeline of the coolant circulation assembly, the first pneumatic valve 13 and the second pneumatic valve 14 can be automatically controlled to switch to the closed state, so that the liquid pumping assembly can pump away the coolant in the pipeline.

[0062] In this embodiment, through the flow rate detection of the first flowmeter 15, in the event of abnormal situations such as liquid leakage, it can also be identified through the flow rate detection of the first flowmeter 15 and an alarm is issued, forming a dual alarm with the liquid leakage sensor to improve the accuracy rate of the liquid leakage alarm.

[0063] In one embodiment, the coolant circulation assembly further includes: a first manual valve 16 and a second manual valve 17; the first manual valve 16 is disposed on the liquid outlet pipe 11; the second manual valve 17 is disposed on the liquid return pipe 12.

[0064] In this embodiment, during the normal circulation cooling operation of the coolant circulation assembly, the first manual valve 16 and the second manual valve 17 also remain in an open state; the first manual valve 16 and the second manual valve 17 can be used as standby valves to manually control the on-off of the pipeline when the first pneumatic valve 13 and the second pneumatic valve 14 fail.

[0065] Please continue to refer to Figure 1 and Figure 2 , and the liquid pumping assembly of the present application will be specifically introduced below.

[0066] In one embodiment, the liquid pumping assembly includes: a self-priming pump 20, a liquid pumping pipe 21, and a liquid discharge pipe 22; one end of the liquid pumping pipe 21 is connected to the pipeline of the coolant circulation assembly, and the other end of the liquid pumping pipe 21 is connected to the liquid inlet end of the self-priming pump 20; one end of the liquid discharge pipe 22 is connected to the liquid outlet end of the self-priming pump 20, and the other end of the liquid discharge pipe 22 is connected to the liquid storage assembly.

[0067] In this embodiment, when leakage occurs in the pipeline of the coolant circulation component, the coolant needs to be quickly extracted by the liquid extraction component and temporarily stored in the liquid storage component, so as to provide a good maintenance environment without liquid leakage for the repair of the leaking position. Specifically, one end of the liquid extraction pipe 21 is connected to the return pipe 12 in the coolant circulation component, and the first pneumatic valve 13 and the second pneumatic valve 14 are first controlled to be closed, and then the self-priming pump 20 provides suction force, and all the coolant in the pipeline of the coolant circulation component (i.e., the liquid outlet pipe 11, the return pipe 12, i.e., the internal cooling channel of the component to be cooled) is extracted through the liquid extraction pipe 21, and transported to the liquid storage component through the discharge pipe 22 for temporary storage.

[0068] In one embodiment, the liquid extraction component also includes: a third pneumatic valve 23, a fourth pneumatic valve 24 and a second flow meter 25; the third pneumatic valve 23 is arranged on the liquid extraction pipe 21; the fourth pneumatic valve 24 is arranged on the discharge pipe 22; the second flow meter 25 is arranged on the liquid extraction pipe 21; wherein the liquid extraction component is connected to the return pipe 12 on the coolant circulation component through a pipeline.

[0069] In this embodiment, the third pneumatic valve 23 and the fourth pneumatic valve 24 are in a normally closed state during the normal circulation cooling operation of the coolant circulation component, ensuring that the normal circulation cooling operation of the coolant circulation component is not affected. The third pneumatic valve 23 and the fourth pneumatic valve 24 are switched to an open state only when liquid leakage occurs, providing a connected liquid extraction channel for the liquid extraction component.

[0070] In this embodiment, the flow rate of the coolant during the extraction can be detected by the flow detection of the second flow meter 25. When the coolant flow rate reaches zero, it indicates that the coolant in the pipeline of the coolant circulation component has been completely extracted. The second flow meter 25 can also control the pipeline opening to adjust different flow rates. The second flow meter 25 can also be built with a temperature sensor to monitor the coolant temperature and display the real-time flow rate and real-time temperature of the coolant in a digital display form.

[0071] Please continue reading Figure 1 and Figure 2 , the liquid storage component of the present application is described in detail below.

[0072] In one embodiment, the liquid storage assembly includes: a liquid storage tank 30, a first return pipe 31, a fifth pneumatic valve 32, a second return pipe 33 and a sixth pneumatic valve 34; one end of the first return pipe 31 is connected to the liquid storage tank 30, and the other end of the first return pipe 31 is connected to the pipeline position on the liquid extraction pipe 21 between the third pneumatic valve 23 and the self-priming pump 20; the fifth pneumatic valve 32 is arranged on the first return pipe 31; one end of the second return pipe 33 is connected to the liquid outlet end of the self-priming pump 20, and the other end of the second return pipe 33 is connected to the pipeline of the coolant circulation assembly; the sixth pneumatic valve 34 is arranged on the second return pipe 33.

[0073] In this embodiment, the liquid storage tank 30 is used to temporarily store the coolant pumped by the liquid pumping assembly. A liquid level sensor for detecting the liquid level height can be arranged in the liquid storage tank 30 to facilitate the detection of the temporary storage capacity of the coolant. Multiple liquid storage tanks 30 can also be arranged to provide a larger temporary storage capacity.

[0074] In this embodiment, during the normal circulating cooling operation of the coolant circulation assembly and the process of the liquid pumping assembly pumping the coolant in the coolant circulation assembly, the fifth pneumatic valve 32 and the sixth pneumatic valve 34 are both kept in the normally closed state to ensure that the circulating cooling operation and the pumping operation are not affected. After the leak liquid treatment is completed, the fifth pneumatic valve 32 and the sixth pneumatic valve 34 are switched to the open state. At this time, the self-priming pump 20 can pump out the coolant in the liquid storage tank 30 through the first return pipe 31 and transport it back to the pipeline of the coolant circulation assembly through the second return pipe 33, so as to resume the normal cooling operation.

[0075] Based on the above-introduced coolant leak liquid treatment device, the complete working process of the present utility model is specifically introduced:

[0076] When a liquid leakage occurs at the joint between the pipeline of the coolant circulation assembly and the component to be cooled of the semiconductor device, the leak liquid sensor and / or the first flowmeter 15 are triggered to send an alarm signal. At this time, the first pneumatic valve 13 and the second pneumatic valve 14 are controlled to close, the third pneumatic valve 23 and the fourth pneumatic valve 24 are opened, and the self-priming pump 20 starts to operate, pumping all the coolant in the pipeline of the coolant circulation assembly through the liquid pumping pipe 21 and transporting it to the liquid storage tank 30 for temporary storage through the drain pipe 22. When the flow rate indication shown by the second flowmeter 25 is zero, the self-priming pump 20 stops working, and the third pneumatic valve 23 and the fourth pneumatic valve 24 are controlled to close, and then the leak point treatment and component replacement and other leak liquid repair work can be carried out.

[0077] After the leak liquid repair work is completed, the fifth pneumatic valve 32 and the sixth pneumatic valve 34 are controlled to open, and the self-priming pump 20 starts to operate, sucking out all the coolant temporarily stored in the liquid storage tank 30 through the first return pipe 31 and then flowing back to the pipeline of the coolant circulation assembly through the second return pipe 33. During the flowing-back process, when the liquid level sensor triggers a low liquid level signal, it indicates that the coolant temporarily stored in the liquid storage tank 30 has been completely sucked out. The fifth pneumatic valve 32 and the sixth pneumatic valve 34 are controlled to close, and the self-priming pump 20 stops working. At the same time, the first pneumatic valve 13 and the second pneumatic valve 14 are opened, so as to resume the normal cooling operation.

[0078] It should be noted that except for the case of leak liquid treatment, when the semiconductor device encounters an emergency or needs to be quickly cooled down, the same method as the leak liquid treatment can also be used to pump out all the coolant in the pipeline of the coolant circulation assembly.

[0079] An embodiment of the present utility model further provides a semiconductor device, and at least one component to be cooled on the semiconductor device is connected to the coolant circulation assembly of the coolant leakage treatment device as described above.

[0080] Please refer to Figure 3 , Figure 3 , which is a schematic flowchart of the coolant leakage treatment method provided by the embodiment of the present utility model.

[0081] An embodiment of the present utility model further provides a coolant leakage treatment method, which is applied to the coolant leakage treatment device as above, and includes steps S301 to S303:

[0082] S301. Control the coolant circulation assembly to circulate and transport the coolant at a preset temperature, so that the coolant circulates through at least one component to be cooled on the semiconductor device;

[0083] S302. When it is detected that the pipeline in the coolant circulation assembly leaks, control the liquid pumping assembly to extract the coolant in the pipeline of the coolant circulation assembly and transport it to the liquid storage assembly for temporary storage;

[0084] S303. After the leakage treatment is completed, control the liquid pumping assembly to extract the coolant in the liquid storage assembly and transport it to the pipeline on the coolant circulation assembly.

[0085] In this embodiment, after a leakage alarm occurs, control the liquid pumping assembly to quickly extract the coolant in the pipeline of the coolant circulation assembly and transport it to the liquid storage assembly for temporary storage; at this time, when cleaning the leakage point position or replacing the joint parts after cleaning, there is no need to worry about more liquid leakage problems, and the efficiency of dealing with the leakage point and replacing parts is also higher, having the advantage of achieving zero leakage during the leakage treatment process. And after the leakage treatment is completed, then control the liquid pumping assembly to extract the coolant in the liquid storage assembly and transport it to the pipeline on the coolant circulation assembly, and the normal cooling work can be restored.

[0086] Those skilled in the art can clearly understand that for the convenience and conciseness of description, the specific working process of the method described above can refer to the corresponding process in the foregoing device embodiment, and will not be elaborated here.

[0087] The above is only the specific implementation manner of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present utility model, and these modifications or replacements should all be covered within the protection scope of the present utility model. Therefore, the protection scope of the present utility model should be subject to the protection scope of the claims.

Claims

1. A cooling liquid leakage treatment device, applied to semiconductor equipment, characterized in that: include: A coolant circulation component, used for providing coolant and connected to at least one component to be cooled on the semiconductor device through a pipeline circulation; A liquid pumping assembly connected to a pipeline on the coolant circulation assembly through a pipeline; A liquid storage component connected to the pipeline on the liquid extraction component through a pipeline; Among them, the liquid extraction component is used to extract the coolant in the pipeline of the coolant circulation component and transport it to the liquid storage component for temporary storage when the pipeline on the coolant circulation component leaks; and is used to extract the coolant in the liquid storage component and transport it to the pipeline on the coolant circulation component after the leakage is dealt with.

2. The coolant leakage treatment device according to claim 1, characterized in that: The coolant circulation assembly comprises: A cooler for providing a coolant; A liquid outlet pipe, one end of which is connected to the liquid outlet of the cooler, and the other end of which is connected in series / in parallel to all components to be cooled; A liquid return pipe, all components to be cooled are connected in series / in parallel to one end of the liquid return pipe, and the other end of the liquid return pipe is connected to the liquid return end of the cooler.

3. The coolant leakage treatment device according to claim 2, characterized in that: The coolant circulation assembly also includes: A first pneumatic valve, disposed on the liquid outlet pipe; A second pneumatic valve is arranged on the liquid return pipe; A first flow meter is arranged on the liquid return pipe; Wherein, the liquid pumping component is connected to the liquid return pipe on the coolant circulation component through a pipeline.

4. The coolant leakage treatment device according to claim 1, characterized in that: The liquid extraction component comprises: Self-priming pumps; A liquid suction pipe, one end of which is connected to the pipeline on the coolant circulation component, and the other end of which is connected to the liquid inlet end of the self-priming pump; A liquid discharge pipe has one end connected to the liquid outlet of the self-priming pump and the other end connected to the liquid storage assembly.

5. The coolant leakage treatment device according to claim 4, characterized in that: The liquid extraction component also includes: A third pneumatic valve is provided on the liquid extraction pipe; a fourth pneumatic valve, disposed on the liquid discharge pipe; A second flow meter is arranged on the liquid extraction pipe; Wherein, the liquid pumping component is connected to the liquid return pipe on the coolant circulation component through a pipeline.

6. The coolant leakage treatment device according to claim 5, characterized in that: The liquid storage component comprises: Fluid storage tank; A first reflux pipe, one end of which is connected to the liquid storage tank, and the other end of which is connected to a pipeline position on the liquid extraction pipe between the third pneumatic valve and the self-priming pump; a fifth pneumatic valve, disposed on the first reflux pipe; A second reflux pipe, one end of which is connected to the liquid outlet of the self-priming pump, and the other end of which is connected to the pipeline of the coolant circulation component; The sixth pneumatic valve is arranged on the second return pipe.

7. The coolant leakage treatment device according to claim 6, characterized in that: A liquid level sensor for detecting the liquid level is arranged in the liquid storage tank.

8. The coolant leakage treatment device according to claim 2, characterized in that: The coolant circulation assembly also includes: A first manual valve is arranged on the liquid outlet pipe; The second manual valve is arranged on the liquid return pipe.

9. The coolant leakage treatment device according to claim 1, characterized in that: Also includes: A plurality of liquid leakage sensors are respectively arranged at various joint positions between all or part of the pipelines in the coolant circulation component.

10. A semiconductor device, characterized in that: At least one component to be cooled on the semiconductor device is connected to a coolant circulation component of the coolant leakage treatment device according to any one of claims 1 to 9.

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