High-voltage-resistant sensor

Abstract

The utility model discloses a high-pressure-resistant sensor, and the sensor comprises a housing which comprises a housing with an accommodation space, and a connector which is in sealed connection with the opening end of the housing; the base is positioned in the accommodating space of the shell; the insulating component comprises an insulating bottom plate and a shielding cover and is positioned in the accommodating space of the shell; the lower surface of the insulating bottom plate is fixed at the bottom of the accommodating space of the shell, and the upper surface of the insulating bottom plate is fixedly connected with the lower surface of the base; the shielding cover sleeves the periphery of the base; insulating glue is filled between the outer wall of the shielding cover and the inner wall of the shell; and the sensitive system is fixed on the base and located in the shielding cover, and the sensitive system is electrically connected with the connector. According to the invention, the insulating glue, the insulating bottom plate, the shielding cover and other insulating materials are arranged between the internal sensitive system and the external shell for isolation, so that the high voltage endurance capability and the good reliability are ensured.

Description

Technical Field

[0001] This application relates to the technical field of sensors, and particularly to a high-voltage-resistant sensor. Background Art

[0002] Since wind turbines are installed in relatively high areas, and the equipment itself is tall, with huge rotating blades towering into the clouds and being exposed to the natural environment for a long time, they are prone to being struck by lightning during thunderstorms. Although wind turbines are equipped with good lightning protection and grounding measures, a large voltage may still be generated when they are struck by lightning. The composite sensor housing installed inside it for sensitive fault information directly bears such strong interference voltages, resulting in a kilovolt-level potential difference between the sensor housing and the internal low-voltage circuit. If the insulation and voltage resistance ability of the composite sensor itself is insufficient, it is easy to cause the composite sensor and even the subsequent acquisition and processing circuit to be damaged by electric flashover breakdown and lose the detection function.

[0003] Currently, the commonly adopted solution is to use a non-isolated method, taking the composite sensor housing as the signal ground. This solution has no voltage resistance ability and may cause damage to the composite sensor under strong interference voltages. The isolated solution generally uses non-metallic parts on both sides of the piezoelectric wafer for isolation. The housing is no longer the signal ground, and the signal ground is output separately. However, this solution causes the size of the second-order system to increase, affecting the resonance of the sensor, and the voltage resistance is insufficient, making it difficult to reach more than 4 kV.

[0004] Therefore, in view of the above technical problems, how to provide a high-voltage-resistant sensor with high voltage resistance ability and good reliability is a technical problem that those skilled in the art need to solve. Utility Model Content

[0005] The purpose of this application is to provide a high-voltage-resistant sensor. By setting insulating materials such as insulating glue, insulating bottom plate, and heat shrinkable sleeve between the internal sensitive system and the external housing for isolation, the creepage distance is increased, the voltage resistance ability of the sensor is improved, and its good reliability is maintained.

[0006] To achieve the above purpose, this application provides a high-voltage-resistant sensor, including:

[0007] A housing, including a shell having an accommodation space and a connector sealingly connected to the open end of the shell;

[0008] A base, located in the accommodation space of the shell; an insulating bottom plate, located in the accommodation space of the shell, the lower surface of the insulating bottom plate is fixed to the bottom of the accommodation space of the shell, and the upper surface of the insulating bottom plate is fixedly connected to the lower surface of the base;

[0009] A shielding cover is located in the accommodating space of the shell, and the shielding cover is sleeved on the outer periphery of the base; an insulating glue is filled between the outer wall of the shielding cover and the inner wall of the shell;

[0010] The sensitive system is fixed on the base and located in the shielding cover, and the sensitive system is electrically connected to the connector.

[0011] Preferably, a first insulating sleeve is sleeved on the outer periphery of the shielding cover, two ends of the first insulating sleeve at least cover two ends of the shielding cover, and the insulating glue is filled between the outer wall of the first insulating sleeve and the inner wall of the shell.

[0012] Preferably, the insulating glue is filled to the bottom of the shell and is higher than the lower end surface of the first insulating sleeve.

[0013] Preferably, a first step is provided on the outer circle of the end surface of the base facing the shielding cover, and the end of the shielding cover abuts against the first step and is fixedly connected to the base.

[0014] Preferably, a first glue containing groove is provided on the outer periphery of the base, and the insulating glue fills the first glue containing groove.

[0015] Preferably, a second glue containing groove is provided on the inner wall of the shell, and the insulating glue fills the second glue containing groove.

[0016] Preferably, a column located inside the shielding cover is provided on the side of the base facing away from the insulating bottom plate, and the sensitive system is fixed on the column. The sensitive system includes the piezoelectric chip attached to the column, a lead plate arranged on the outside of the piezoelectric chip, and a mass block arranged on the outside of the lead plate; an insulating gap is left between the lower end surface of the sensitive system and the upper end surface of the base.

[0017] Preferably, a through hole is opened on the column at a position corresponding to the sensitive system, and a screw is arranged in the through hole. After the screw passes through the piezoelectric chip, the lead plate and the mass block, it is fixedly connected to the column. The outer periphery of the screw rod is sleeved with a second insulating sleeve corresponding to at least the position of the piezoelectric chip, the lead plate and the inner wall of the column through hole, and the screw is fixed to the column by a nut.

[0018] Preferably, a through hole is opened on the column at a position corresponding to the sensitive system, a screw is arranged in the through hole, and a thread is arranged on the inner wall of the through hole. After the screw passes through the piezoelectric chip, the lead plate and the mass block, it is fixedly connected with the thread of the column through hole; the outer periphery of the screw rod is provided with a third insulating sleeve corresponding to the mass block, the lead plate and the piezoelectric chip.

[0019] Preferably, two fitting surfaces are provided on the column, and the number of the current-carrying sheets, the piezoelectric wafers, and the mass blocks is the same as that of the fitting surfaces, and the two piezoelectric wafers are in contact with the fitting surfaces.

[0020] Preferably, the specific electrical connection between the sensing system and the connector is as follows:

[0021] A substrate is provided at the end of the shielding cover facing away from the base. The substrate is made of a conductive material and is embedded in the open end of the shielding cover and fixedly connected to the shielding cover;

[0022] A circuit board is fixedly connected to the end face of the substrate facing the base. The substrate, the circuit board, the shielding cover, the base, and the contact surface between the piezoelectric wafer and the base are electrically connected; One pin of the connector is connected to the substrate through a first wire; The current-carrying sheet is connected to an input pad on the side of the circuit board facing away from the substrate through a second wire. Through holes are provided on the substrate and the circuit board. The other pin of the connector is connected to an output pad on the side of the circuit board facing away from the substrate through a third wire, and the third wire passes through the through hole.

[0023] Preferably, the negative electrode of the piezoelectric wafer is in contact with the column, and the positive electrode of the piezoelectric wafer is in contact with the current-carrying sheet.

[0024] Preferably, a second step for mating with the substrate is provided on the inner side wall of the shielding cover.

[0025] Compared with the above background art, in the present application, the sensor is divided into an internal sensitive system, an external housing, and an insulating component. The insulating component is used to improve the insulation ability between the sensitive system and the housing, thereby improving the withstand voltage performance. Specifically, a base, an insulating bottom plate, and a shielding cover are arranged in the accommodation space of the housing. The lower surface of the insulating bottom plate is fixedly insulated at the bottom of the accommodation space of the housing, and the upper surface of the insulating bottom plate is fixedly connected to the lower surface of the base in an insulated manner, thereby realizing the insulated isolation between the base and the housing. At the same time, the shielding cover is sleeved on the outer periphery of the base, and insulating glue is filled between the outer wall of the shielding cover and the inner wall of the housing. On the one hand, the insulating glue can insulate and isolate the shielding cover and the housing. On the other hand, after the insulating glue is cured, it can improve the overall stability of the base, the shielding cover, and the housing, and ensure the connection stability of the sensor. The sensitive system is fixed on the base and is located inside the shielding cover, and the sensitive system is electrically connected to the connector. At the same time, the outside of the sensitive system is the shielding cover, which can remove interference and improve the reliability of the sensor; an insulating sleeve is provided on the outermost side, which can improve the withstand voltage performance of the sensor. The insulating component between the sensitive system and the housing includes an insulating bottom plate, insulating glue, and an insulating sleeve, which can ensure the withstand voltage level between the sensitive system and the housing and reach at least more than 4 kV. Therefore, in the present application, insulating materials such as insulating glue, insulating bottom plate, and insulating sleeve are arranged between the internal sensitive system and the external housing for isolation, ensuring high withstand voltage ability and good reliability. Moreover, to improve the performance of the sensor, the present application designs the structures of the circuit board and the substrate, and through a clever structural design, the charge is led out from the piezoelectric wafer to the circuit board and transmitted to the electrical connector after being processed by the circuit board. The overall structure is ingenious, has strong stability, and high withstand voltage ability. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to the provided drawings.

[0027] Figure 1 Schematic diagram of the internal structure of the high withstand voltage sensor provided by the embodiment of the present application;

[0028] Figure 2 Schematic three-dimensional structure diagram of the high withstand voltage sensor provided by the embodiment of the present application;

[0029] Figure 3 Schematic diagram of the housing structure provided by the embodiment of the present application;

[0030] Figure 4 Schematic diagram of the sensitive system structure provided by the embodiment of the present application;

[0031] Figure 5 Schematic diagram of the base structure provided by the embodiment of the present application;

[0032] Figure 6 Schematic diagram of the electrical conduction sheet structure provided by the embodiment of the present application;

[0033] Figure 7 Schematic diagram of the mass block structure provided by the embodiment of the present application.

[0034] In the figure: 1. Connector 2. First insulating sleeve 3. Substrate 4. Housing 5. Shielding cover 6. Insulating glue 7. First glue-containing groove 8. Second glue-containing groove 9. Insulating bottom plate 10. Base 11. Piezoelectric wafer 12. Electrical conduction sheet 13. Mass block 14. Screw 15. Nut 16. Circuit board 17. Second insulating sleeve 18. Column 19. Connecting part. Specific embodiments

[0035] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0036] It should be noted that in this embodiment, the orientation or positional relationship indicated by "up", "down", "front", "back", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application. In addition, "first", "second", "third", "fourth" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0037] In order to enable those skilled in the art of the present technology to better understand the solution of the present application, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0038] As Figure 1 shown, in this embodiment, a high-voltage-resistant composite sensor is provided. Since the voltage-resistant ability tests the insulation ability between the sensor housing and the internal low-voltage circuit, the sensor as a whole is divided into three parts, namely, an internal sensitive system, an external housing, and an insulation component for improving the insulation ability between the two. When the voltage resistance between the inside and outside of the sensor reaches 4 kV, the overall voltage-resistant ability of the sensor can reach 4 kV.

[0039] Specifically, the sensor includes a housing, a base 10, a sensitive system, an insulating base plate 9, and a shielding cover 5. The housing includes a receiving housing 4 and a connector 1 hermetically connected to the open end of the housing 4. The connector 1 itself has a certain voltage withstand performance. In order for the overall sensor to achieve a voltage withstand capacity of more than 4 kV, in addition to the insulation ability between the housing and the internal circuit, the connector 1 itself also needs to have a high voltage withstand capacity. Therefore, the connector 1 of this application also needs to reach a voltage withstand of more than 4 kV. Similarly, the internal wires have insulating outer sheaths, and they themselves can also reach a voltage withstand of more than 4 kV, so as to ensure that the overall sensor can reach a voltage withstand of more than 4 kV and achieve the high voltage withstand value required by the wind power system.

[0040] Please refer to Figure 1 , the base 10, the insulating base plate 9, and the shielding cover 5 are located in the receiving space of the housing 4. An insulating glue 6 is filled between the shielding cover 5 and the inside of the housing 4. The insulating glue 6 can be selected as epoxy insulating glue. The epoxy insulating glue has good insulation properties, and at the same time, after the epoxy insulating glue is cured, it has high stability, which can improve the integrity between the shielding cover 5 and the housing, thereby ensuring the stability of signal transmission.

[0041] The insulating component includes an insulating base plate 9 fixed to the bottom of the housing 4. Specifically, the lower surface of the insulating base plate 9 is fixed to the bottom of the receiving space of the housing 4, and the upper surface of the insulating base plate 9 is fixedly connected to the lower surface of the base 10. The insulating base plate 9 is preferably an insulating ceramic with a certain hardness. The hardness of the insulating ceramic can ensure the transmission of vibration and shock signals, and at the same time, the insulating performance of the insulating ceramic can ensure the voltage withstand performance.

[0042] Considering reducing the influence of external interference signals on the sensitive system, a shielding cover 5 is sleeved on the outer periphery of the base 10. It can be understood that one end of the shielding cover 5 needs to be sleeved on the base 10, and the other end needs to extend upward, so as to ensure that the live components of the sensitive system can be located in the shielding cover 5, avoiding the influence of external interference signals on the live components, and thus making the overall sensitive system have a high anti-interference ability.

[0043] It should be noted that the insulating base plate 9 is adhesively fixed to the bottom of the housing 4 with insulating glue. Similarly, the base 10 is also adhesively fixed to the insulating base plate 9 with insulating glue, so as to keep the base 10 insulated from the outer shell. The sensitive system is fixed on the base 10 and is located inside the shielding cover 5, and the sensitive system is electrically connected to the connector 1. Of course, the base 10 can also be adhesively fixed to the bottom of the accommodating space of the housing 4 with insulating glue. Considering that directly gluing the base 10 and the housing 4 may cause the sensitive system to be not perpendicular to the bottom surface of the accommodating space of the housing 4 due to the too thick glue layer, thus affecting the signal acquisition effect, an insulating base plate 9 is added as an intermediate transition piece. First, the insulating base plate 9 and the base 10 are fixed with a layer of insulating glue, and then the insulating base plate 9 and the bottom surface of the accommodating space of the housing 4 are fixed with a layer of insulating glue. Moreover, the glue layers between the insulating base plate 9 and the housing 4 and between the insulating base plate 9 and the base 10 are thin and uniform. After pasting and curing, insulating glue 6 is filled between the outer wall of the shielding cover 5 and the inner wall of the housing 4.

[0044] In summary of the above embodiments, in the present application, the sensor is divided into an internal sensitive system, an external housing, and an insulating component. By means of the insulating component, the insulation ability between the sensitive system and the housing is improved, thereby improving the withstand voltage performance. Specifically, a base 10, an insulating base plate 9, and a shielding cover 5 are arranged in the accommodating space of the housing 4. The lower surface of the insulating base plate 9 is insulatingly fixed to the bottom of the accommodating space of the housing 4, and the upper surface of the insulating base plate 9 is insulatingly fixedly connected to the lower surface of the base 10, so as to realize the insulating isolation between the base 10 and the housing 4. At the same time, the shielding cover 5 is sleeved on the outer periphery of the base 10, and the insulating glue 6 is filled between the outer wall of the shielding cover 5 and the inner wall of the housing 4. On the one hand, the insulating glue 6 can insulate and isolate the shielding cover 5 and the housing 4. On the other hand, after curing, the insulating glue 6 can improve the overall stability of the base 10, the shielding cover 5, and the housing 4, and ensure the connection stability of the sensor. The sensitive system is fixed on the base 10 and is located inside the shielding cover 5, and the sensitive system is electrically connected to the connector 1. At the same time, the outside of the sensitive system is the shielding cover 5, which can improve the use reliability of the sensor and shield signal interference. The insulating component between the sensitive system and the housing includes the insulating base plate 9 and the insulating glue 6, which can ensure the withstand voltage level between the sensitive system and the housing and reach at least above 4 kV. Therefore, in the present application, insulating materials such as the insulating glue 6 and the insulating base plate 9 are arranged between the internal sensitive system and the external housing for isolation, ensuring high withstand voltage ability and good reliability.

[0045] A first insulating sleeve 2 is sleeved on the outer periphery of the shielding cover 5. Please refer to Figure 1 , the first insulating sleeve 2 can be a heat-shrinkable sleeve. After the heat-shrinkable sleeve is heat-shrunk, its two ends at least cover the two ends of the shielding cover 5, so as to ensure that the internal components of the shielding cover 5 have anti-interference ability while further increasing the creepage distance of the shielding cover 5 and improving the withstand voltage ability of the sensitive system inside the shielding cover 5.

[0046] The insulating glue 6 is filled between the inner wall of the first insulating sleeve 2 and the housing 4, and one side of the insulating glue 6 is filled to the bottom of the housing 4, and the other side is at least higher than the lower end face of the first insulating sleeve 2. Ensure that the ends of the first insulating sleeve 2 and the shielding cover 5 have high sealing performance, ensure the withstand voltage level between the sensitive system and the housing, and reach at least more than 4 kV.

[0047] A first step is provided on the outer periphery of the end face of the base 10 facing the shielding cover 5. The end of the shielding cover 5 abuts against the first step surface and is fixedly connected to the base 10 by welding. Please refer to Figure 1 . Similarly, a second step matching with the substrate 3 can be provided on the inner side wall of the shielding cover 5 to limit and fix the substrate 3.

[0048] Please refer to Figure 1 and Figure 3 , a second glue-containing groove 8 is provided at the bottom of the inner wall of the housing 4; and a first glue-containing groove 7 is provided on the outer periphery of the bottom of the base 10. Please refer to Figure 1 and Figure 5 . The two glue-containing grooves are preferably annular glue-containing grooves, and the two can be provided separately or simultaneously. When the insulating glue 6 is filled between the inner wall of the housing 4 and the outer wall of the shielding cover 5, the insulating glue 6 will fill the two glue-containing grooves. After the insulating glue 6 is cured, the insulating glue 6 will form an integral body embedded in the glue-containing groove. Therefore, the glue-containing groove can effectively improve the integrity between the insulating glue 6 and the base 10 and the shielding cover 5. At the same time, the filled insulating glue 6 can also have a high withstand voltage capacity.

[0049] A column 18 located inside the shielding cover 5 is provided on the side of the base 10 facing away from the insulating base plate 9. Please refer to Figure 5 , the sensitive system is fixed on the column 18. The sensitive system includes a piezoelectric wafer 11 attached to the column 18, a current-carrying sheet 12 provided outside the piezoelectric wafer 11, and a mass block 13 provided outside the current-carrying sheet 12.

[0050] On this basis, through holes are provided on the column 18 corresponding to the sensitive system. Screws 14 are provided in the through holes. After the screws 14 pass through the piezoelectric wafer 11, the current-carrying sheet 12, and the mass block 13, they are fixedly connected to the column 18. And at least a second insulating sleeve 17 corresponding to the inner wall positions of the piezoelectric wafer 11, the current-carrying sheet 12, and the through hole of the column 18 is sleeved on the outer periphery of the screw rod of the screw 14. Or rather, the second insulating sleeve 17 can isolate the screw 14 from the piezoelectric wafer 11, the current-carrying sheet 12, and the hole wall of the column 18 to ensure insulation between the screw 14, the current-carrying sheet 12, and the base 10 and the piezoelectric wafer 11. Of course, the current-carrying sheet 12 and the piezoelectric wafer 11 are kept electrically connected. The second insulating sleeve 17 can also be a heat-shrinkable sleeve. Please refer to Figure 4, after heat shrinking, it can maintain the insulation ability between the screw 14, the piezoelectric current lead piece 12 and the base 10, the piezoelectric wafer 11, and improve the creepage distance.

[0051] Two solutions are provided for the fixing method of the screw 14. One is that the screw 14 is fixed on the column 18 through the nut 15. Please refer to Figure 1 and Figure 4 . The nut 15 is located at the tail of the screw 14, so as to be threadedly engaged with the screw 14, and the piezoelectric wafer 11, the current lead piece 12, and the mass block 13 are pressed and fixed on the column 18. The other is that there is a thread in the through hole, and the screw 14 is threadedly connected to the through hole, so as to cooperate with the head of the screw 14 to press and fix the piezoelectric wafer 11, the current lead piece 12, and the mass block 13 on the column 18; since the screw 14 and the base 10 are threadedly connected, an insulating sleeve cannot be placed at the connection, which will cause the screw 14 and the base 10 to be electrically connected, resulting in a short circuit between the positive and negative poles. Therefore, at this time, the insulating sleeve must be placed in sections on both sides of the screw 14, that is, the third insulating sleeve, to ensure the insulation between the screw 14 and the mass block 13, the current lead piece 12, and the piezoelectric wafer 11. The settings of the second insulating sleeve 17 and the third insulating sleeve are both to ensure that the positive and negative poles of the piezoelectric wafer 11 are not conducting, because positive charges are generated on one side of the piezoelectric crystal and negative charges are generated on the other side, so it is necessary to block all possibilities of the positive and negative poles of the piezoelectric wafer 11 from conducting through the insulating sleeve.

[0052] It should be noted that in this embodiment, there are two opposite assembly surfaces provided on the column 18. Please refer to Figure 1 . The number of the piezoelectric wafers 11, the current lead pieces 12, and the mass blocks 13 is the same as the number of the assembly surfaces, that is, one piezoelectric wafer 11 is attached to one assembly surface, that is, each assembly surface corresponds to one current lead piece 12, one piezoelectric wafer 11, and one mass block 13, and the piezoelectric wafer 11, the current lead piece 12, and the mass block 13 are assembled in sequence from near to far from the assembly surface. Each current lead piece 12 is connected to each other through the connecting portion 19. The current lead piece 12 and the connecting portion 19 are both made of conductive materials and are used to lead out the charges generated by the piezoelectric wafer 11. Please refer to Figure 6 . The piezoelectric wafer 11, the current lead piece 12, and the mass block 13 are fixed by the screw 14, and since the two assembly surfaces are arranged oppositely, one screw 14 and one nut 15 can be used to complete the fixing of two groups of the piezoelectric wafers 11, the current lead pieces 12, and the mass blocks 13.

[0053] It should be noted that for the above-mentioned pressing and fixing of the piezoelectric wafer 11, the current lead piece 12, and the mass block 13 by the screw 14 and the nut 15, it means fixing with a preset torque, not fixing tightly, otherwise no shear force can be formed.

[0054] Of course, for the above-mentioned assembly surfaces, it can also be one surface, three surfaces, four surfaces or a circumferential arrangement. One assembly surface can be directly fixed by screws 14. Please refer to the fixing method of two assembly surfaces. When there are three or four assembly surfaces, two screws 14 may be required, and two through holes are provided on the column 18 to meet the sequential installation and fixation of three or four groups of piezoelectric wafers 11, conductive sheets 12, and mass blocks 13. The circumferential arrangement means that after the piezoelectric wafers 11, conductive sheets 12, and mass blocks 13 are arranged in sequence, they are circumferentially distributed along the circumference of the column 18.

[0055] It should be noted that the piezoelectric wafers 11, conductive sheets 12, and mass blocks 13 need to maintain a certain distance from the upper surface of the base 10 to prevent direct contact and conduction with the base 10.

[0056] Please refer to Figure 7 , after the piezoelectric wafers 11, conductive sheets 12, and mass blocks 13 are set up, they are fixed on the screws 14 through nuts 15, pressed against the column 18, and a fixture is used to ensure that the piezoelectric wafers 11, conductive sheets 12, and mass blocks 13 are aligned and flat. This kind of sensitive system is a shear-type piezoelectric sensitive second-order system, and its working performance is stable and reliable.

[0057] A substrate 3 is provided at the end of the shielding cover 5 facing away from the base 10. The substrate 3 is made of a conductive material. The substrate 3 matches the shape of the open end of the shielding cover 5 and is embedded in the open end of the shielding cover 5. The outer circle of the substrate 3 is laser welded to the circumference of the shielding cover 5. Similarly, the shielding cover 5 is laser welded to the circumference of the base 10 so that the piezoelectric wafers 11, the base 10, the shielding cover 5, and the substrate 3 are electrically connected and jointly serve as an electrode of the piezoelectric wafers 11.

[0058] The end face of the substrate 3 facing the base 10 is soldered with a circuit board 16. Based on the above embodiments, it can be known that the substrate 3 as a whole serves as an electrode of the piezoelectric wafers 11, so the welding surface of the substrate 3 and the circuit board 16 also serves as an electrode of the piezoelectric wafers 11 as a whole.

[0059] It should be pointed out that for this sensor, it can still work without the substrate 3 and the circuit board 16, but the effect is not good. Therefore, the substrate 3 and the circuit board 16 are added in this embodiment. A conditioning circuit (not shown in the figure, please refer to the prior art) is provided on the circuit board 16, which can perform pre-processing on the collected signals, thereby improving the signal collection effect.

[0060] In addition, through holes are provided on the substrate 3 and the circuit board 16. A pin of the connector 1 is connected to the substrate 3 through a first wire. The conductive sheet 12 is connected to the side of the circuit board 16 facing away from the substrate 3 through a second wire. Through holes are provided on the substrate 3 and the circuit board 16. Another pin of the connector 1 is connected to the side of the circuit board 16 facing away from the substrate through a third wire passing through the through hole.

[0061] It should be noted that in this embodiment, the negative electrode of the piezoelectric wafer 11 is attached to the assembly surface of the column 18, and the base 10 is laser welded to the shielding cover 5, and the shielding cover 5 is laser welded to the substrate 3. Therefore, the negative electrode is electrically connected to the shielding cover 5 and the substrate 3, and the substrate 3 serves as the negative electrode of the piezoelectric wafer 11. The conductive sheet 12 is attached to the positive electrode of the piezoelectric wafer 11, so the conductive sheet 12 serves as the positive electrode of the piezoelectric wafer 11. On this basis, the positive electrode is led from the conductive sheet 12 to the circuit board 16 through the second wire, and then from the circuit board 16 to one pin of the connector 1 through the third wire. The negative electrode is led out from the substrate 3 through the first wire and led to the other pin of the connector 1. Of course, it is also possible to attach the negative electrode of the piezoelectric wafer 11 to the conductive sheet 12 and the positive electrode to the assembly surface of the column 18. In this case, only the circuit on the circuit board 16 needs to be redesigned to adapt to it.

[0062] The outer ring of the connector 1 is in interference fit with the circumference of the housing 4, and laser welding is performed at the connection to ensure the sealing protection level of the entire sensor. After connection, the sensor is as Figure 2 shown. The connector 1 itself is a two-core high-voltage-resistant connector 1, which can achieve a withstand voltage of more than 4 kV by itself, and cooperates with an insulation assembly (including an insulation base plate 9, an insulating adhesive 6, and an insulating sleeve) to make the insulation ability between the sensitive system and the housing 4 reach more than 4 kV. Therefore, the overall sensor can achieve a withstand voltage of more than 4 kV, realizing the high withstand voltage value required by the wind power system, and has a simple structure, is convenient for processing and assembly, and has good reliability.

[0063] It should be noted that in this specification, relational terms such as first and second are only used to distinguish one entity from several other entities, and do not necessarily require or imply any actual relationship or order between these entities.

[0064] Specific examples are used in this article to elaborate on the principles and implementation manners of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A high withstand voltage sensor, characterized in that: include: The housing comprises a shell having a receiving space and a connector sealedly connected to an open end of the shell; A base, located in the accommodation space of the shell; An insulating bottom plate is located in the accommodating space of the shell, the lower surface of the insulating bottom plate is fixed to the bottom of the accommodating space of the shell, and the upper surface of the insulating bottom plate is fixedly connected to the lower surface of the base; A shielding cover is located in the accommodating space of the shell, and the shielding cover is sleeved on the outer periphery of the base; an insulating glue is filled between the outer wall of the shielding cover and the inner wall of the shell; The sensitive system is fixed on the base and located in the shielding cover, and the sensitive system is electrically connected to the connector.

2. The high withstand voltage sensor according to claim 1, characterized in that: A first insulating sleeve is sleeved on the outer periphery of the shielding cover, two ends of the first insulating sleeve at least cover two ends of the shielding cover, and the insulating glue is filled between the outer wall of the first insulating sleeve and the inner wall of the shell.

3. The high withstand voltage sensor according to claim 2, characterized in that: The insulating glue is filled to the bottom of the shell and is higher than the lower end surface of the first insulating sleeve.

4. The high withstand voltage sensor according to claim 2, characterized in that: A first step is arranged on the outer circle of the end surface of the base facing the shielding cover, and the end of the shielding cover abuts against the first step and is fixedly connected to the base.

5. The high withstand voltage sensor according to claim 2, characterized in that: A first glue containing groove is arranged on the outer periphery of the base, and the insulating glue fills the first glue containing groove.

6. The high withstand voltage sensor according to claim 2, characterized in that: The inner wall of the shell is provided with a second glue containing groove, and the insulating glue fills the second glue containing groove.

7. The high withstand voltage sensor according to claim 2, characterized in that: A column located inside the shielding cover is arranged on the side of the base facing away from the insulating bottom plate, and the sensitive system is fixed on the column. The sensitive system includes a piezoelectric chip bonded to the column, a lead plate arranged on the outside of the piezoelectric chip, and a mass block arranged on the outside of the lead plate; an insulating gap is left between the lower end surface of the sensitive system and the upper end surface of the base.

8. The high withstand voltage sensor according to claim 7, characterized in that: A through hole is provided on the column at a position corresponding to the sensitive system, and a screw is arranged in the through hole. After passing through the piezoelectric chip, the lead plate and the mass block, the screw is fixedly connected to the column. The outer periphery of the screw rod is sleeved with a second insulating sleeve corresponding to at least the position of the piezoelectric chip, the lead plate and the inner wall of the column through hole, and the screw is fixed to the column by a nut.

9. The high withstand voltage sensor according to claim 7, characterized in that: A through hole is provided on the column at a position corresponding to the sensitive system, a screw is provided in the through hole, a thread is provided on the inner wall of the through hole, and the screw is fixedly connected with the thread of the column through hole after passing through the piezoelectric chip, the lead plate and the mass block; a third insulating sleeve corresponding to the mass block, the lead plate and the piezoelectric chip is sleeved on the outer periphery of the screw rod.

10. The high withstand voltage sensor according to claim 8, characterized in that: The column is provided with two assembly surfaces, the number of the lead-in sheets, the piezoelectric chips and the mass blocks is consistent with the number of the assembly surfaces, and the two piezoelectric chips are fitted with the assembly surfaces.

11. The high withstand voltage sensor according to any one of claims 7 to 10, characterized in that: The electrical connection between the sensitive system and the connector is specifically as follows: The end of the shielding cover away from the base is provided with a substrate, the substrate is made of a conductive material, the substrate is embedded in the opening end of the shielding cover, and is fixedly connected to the shielding cover; A circuit board is fixedly connected to the end surface of the substrate facing the base, and the substrate, the circuit board, the shielding cover, the base, and the mating surface of the piezoelectric chip and the base are electrically conductive; one pin of the connector is connected to the substrate through a first wire; the lead-in plate is connected to an input pad on a side of the circuit board facing away from the substrate through a second wire, and wire holes are provided on the substrate and the circuit board, and another pin of the connector is connected to an output pad on a side of the circuit board facing away from the substrate through a third wire, and the third wire passes through the wire hole.

12. The high withstand voltage sensor according to claim 11, characterized in that: The negative electrode of the piezoelectric chip is attached to the column, and the positive electrode of the piezoelectric chip is attached to the lead-in sheet.

13. The high withstand voltage sensor according to claim 11, characterized in that: The inner side wall of the shielding cover is provided with a second step matched with the substrate.

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