Rapid temperature control device of laser imaging system based on PID control and TEC integration

Abstract

A laser imaging system rapid temperature control device based on PID control and TEC integration comprises a TEC refrigeration module located on a DMD chip module, the TEC refrigeration module is connected with a water cooling machine through a water pipe, and the TEC refrigeration module is further connected with a control box through a TEC power line and a signal line; the TEC refrigeration module comprises a cold conduction block, and the cold conduction block is located above the DMD chip module; the DMD chip module comprises a PCB (Printed Circuit Board) and a DMD chip positioned on the PCB; the upper portion of the cold conduction block is connected with the cold face of the semiconductor chilling plate, the hot face of the semiconductor chilling plate is connected with the water cooling head, the upper portion of the water cooling head is connected with a water inlet and a water outlet, and the water inlet and the water outlet are respectively connected with a water pipe. The temperature control device has the beneficial effects that the temperature control device comprises the refrigeration sheet, has the characteristics of compact volume, low power, low cost and high temperature control precision, and ensures the working temperature of the DMD chip, thereby improving the quality standard and reliability of products produced by the exposure machine.

Description

Technical Field

[0001] The utility model relates to a rapid temperature control device of a laser direct imaging system based on PID control and TEC integration. Background Art

[0002] The LDI exposure machine is an exposure device that uses laser direct imaging (LDI) technology. The DMD chip is part of the optical projection system of the laser direct imaging system (LDI), which is used to control the shape and position of the laser beam to achieve precise projection of photoresist or photosensitive materials. During the exposure process, the power of the DMD chip will change dynamically, generally in the range of 0-90W. The temperature of the DMD chip is too high or too low, which will affect the projection. Only by ensuring the working temperature of the DMD chip (20℃-26℃) can high-speed, high-resolution and flexible pattern projection be achieved, and the quality stability and reliability of the products produced by the exposure machine be improved. The cooling of the DMD chip in the existing exposure machine generally uses air cooling or water cooling for heat dissipation. However, the traditional air cooling and water cooling methods cannot control the chip temperature within the ideal range. The chip is prone to dynamic temperature being too high and static temperature being too low, causing damage to the DMD chip or life attenuation. Therefore, a fast temperature control device for a laser direct imaging system based on PID control and TEC integration was developed to meet the temperature control requirements of the DMD chip during operation. Utility Model Content

[0003] The technical problem to be solved by the utility model is: how to meet the temperature control requirements of the DMD chip during operation, and provide a rapid temperature control device for a laser direct imaging system based on PID control and TEC integration.

[0004] The technical solution of the utility model is specifically as follows:

[0005] A laser direct imaging system rapid temperature control device based on PID control and TEC integration, comprising a TEC refrigeration module located on a DMD chip module, wherein the TEC refrigeration module is connected to a water chiller via a water pipe, and the TEC refrigeration module is also connected to a control box via a TEC power line and a signal line;

[0006] The TEC refrigeration module includes a cooling block, which is located above the DMD chip module; the DMD chip module includes a PCB circuit board and a DMD chip located on the PCB circuit board; the cooling block is connected to the cold surface of the semiconductor refrigeration plate above, and the hot surface of the semiconductor refrigeration plate is connected to the water cooling head, and the water cooling head is respectively connected to a water inlet and a water outlet above, and the water inlet and the water outlet are respectively connected to a water pipe.

[0007] The heat conducting material is evenly applied between the cooling block and the cold end of the semiconductor refrigeration sheet, and between the water cooling head and the hot end of the semiconductor refrigeration sheet.

[0008] A shell is added to the TEC refrigeration module; the water cooling head, semiconductor refrigeration sheet and cooling block are all located in the shell.

[0009] A heat-insulating layer is arranged outside the cooling block.

[0010] The control box includes a box body, a control panel and a module power supply and temperature transmission interface are arranged on the upper surface of the box body, and a power interface and a communication interface are arranged on the bottom of the box body.

[0011] The beneficial effects of the utility model are: optimizing the maximum heating rate, average heating rate, maximum cooling rate, average cooling rate and temperature duration accuracy, ensuring the temperature control accuracy and speed of the DMD chip, and making the temperature control accuracy of the DMD chip reach ±2°C. The product refrigeration module contains a refrigeration chip, which has the characteristics of compact size, low power, low cost and high temperature control accuracy. The utility model ensures the working temperature of the DMD chip, thereby improving the quality standard and reliability of the exposure machine production products. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0013] Figure 2 This is a structural diagram of the control box device in the utility model;

[0014] Figure 3 It is a structural schematic diagram of the refrigeration module in the utility model. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0016] like Figure 1 As shown, a rapid temperature control device for a laser direct imaging system based on PID control and TEC integration includes a TEC refrigeration module 1 located on a DMD chip module 2, wherein the TEC refrigeration module 1 is connected to a water cooler 6 via a water pipe 7, and the TEC refrigeration module 1 is also connected to a control box 5 via a TEC power line 3 and a signal line 4.

[0017] like Figure 3As shown, the TEC refrigeration module 1 includes a cooling block 16, which is located above the DMD chip module 2; the DMD chip module 2 includes a PCB circuit board 22 and a DMD chip 21 located on the PCB circuit board 22. The cooling block 16 is connected to the cold surface of the semiconductor cooling plate 15, and the hot surface of the semiconductor cooling plate 15 is connected to the water cooling head 14. The water cooling head 14 is respectively connected to the water inlet 11 and the water outlet 12, and the water inlet 11 and the water outlet 12 are respectively connected to a water pipe 7. In this way, the hot surface of the TEC refrigeration module 1 is fixedly connected to the water cooling head 14, and a heat-conducting material is applied to the contact surface of the two; the cold surface of the TEC refrigeration module 1 is fixedly connected to the upper surface of the cooling block 16, and a heat-conducting material is applied to the contact surface of the two; the temperature sensor is arranged on the lower surface edge of the cooling block 16. The temperature sensor mainly realizes the temperature acquisition function during the operation of the TEC refrigeration module 1.

[0018] In the TEC refrigeration module 1, the two sides of the semiconductor refrigeration sheet 15 respectively include a metal cooling block 16 and a water cooling head 14 to form a temperature control module. The water cooling head 14 mainly dissipates heat and cools the hot surface of the semiconductor refrigeration sheet 15. The water cooling head 14 is externally connected to a chiller 6 and uses constant temperature water to dissipate heat. A flexible thermal interface material is provided between the metal cooling block 16 and the DMD chip 21. The thermal conductive material is evenly applied between the cooling block 16 and the cold end of the semiconductor refrigeration sheet 15, and between the water cooling head 14 and the hot end of the semiconductor refrigeration sheet 15, so that sufficient heat conduction can be achieved. By controlling the output power of the TEC refrigeration module 1, the temperature rise and fall function of the DMD chip 21 is achieved.

[0019] In order to prevent the water cooling head 14 from leaking and causing damage to components, a shell 13 is added to the TEC refrigeration module 1. The shell 13 is mainly a non-metallic shell, with a groove design and threaded interfaces. The water cooling head 14, semiconductor cooling sheet 15 and cooling block 16 are all located in the shell 13.

[0020] Furthermore, the cooling block 16 is T-shaped, the upper horizontal plate of the T-shaped block is arranged in the housing 13 , and the lower cooling block is connected to the DMD chip module 2 .

[0021] Furthermore, a mounting plate 17 is provided below the housing 13 , and the mounting plate 17 is used to mount the TEC refrigeration module 1 connected thereto.

[0022] Furthermore, an insulation layer is provided outside the cold end cooling block 16. The main purpose of the insulation layer is to isolate the exposed metal part of the cooling block from the outside air to prevent condensation at the cold end from causing damage to the device. At the same time, it has a certain insulation effect, which can prevent heat exchange between the exposed metal part and the outside air, and further increase the speed of cooling or heating.

[0023] like Figure 2As shown, the control box 5 includes a box body, a control panel 51 and a module power supply and temperature transmission interface 54 are arranged on the upper surface of the box body, and a power interface 53 and a communication interface 52 are arranged at the bottom of the box body. The communication interface 52 here can adopt a 485 communication interface or other forms of communication interfaces. All interfaces are designed for quick plug-in and have flange terminals, which are convenient, fast, safe and reliable.

[0024] The control box 5 is connected to the TEC refrigeration module 1 through the TEC power line 3 and is connected to the temperature sensor on the TEC refrigeration module 1 through the signal line.

[0025] It should be noted that a circuit control system is provided inside the control box 5, which mainly realizes the start and stop, alarm, equipment operation, and equipment data display and collection functions of the laser direct imaging system rapid temperature control device. A separate temperature control module is provided on the control box 5 to realize the separate control and display of the temperature of each temperature control module; the temperature of each module can be uploaded to the PC through the 485 communication interface, and the temperature setting of a single module can also be completed through the PC. The circuit control system integrates 485 communication and can be controlled by the host computer. Under the control of the control box 5, the TEC refrigeration module 1 provides stable heat dissipation to maintain the chip temperature within the set temperature range of ±2°C. A device usually contains multiple DMD modules, so an independent temperature control system is designed in parallel and integrated in the control box.

[0026] Before starting the laser imaging system, first set the control temperature of the DMD chip (such as 22°C) through the display module or PC, and the temperature setting is completed; start the laser imaging system, and the temperature sensor starts to collect the temperature data of the DMD chip 21 and transmits it to the control box 5; the control box 5 receives the temperature information and displays the temperature information of the chip.

[0027] It should be noted that the control algorithm in the control box 5 does not belong to the protection content of the present utility model.

[0028] A fast temperature control device for laser direct imaging system designed based on semiconductor refrigeration chip, the refrigeration and temperature control of the device is realized by semiconductor refrigeration chip. The advantages of this utility model are: optimizing the maximum heating rate, average heating rate, maximum cooling rate, average cooling rate and temperature duration accuracy, ensuring the temperature control accuracy and speed of the DMD chip, so that the temperature control accuracy of the DMD chip reaches ±2°C. The refrigeration module of this product contains a refrigeration chip, which has the characteristics of compact size, low power, low cost and high temperature control accuracy. The utility model ensures the working temperature of the DMD chip, thereby improving the quality standard and reliability of the exposure machine production products.

[0029] The above is only a preferred embodiment of the present invention. It should be pointed out that those skilled in the art can make several changes and improvements without departing from the overall concept of the present invention, and these should also be regarded as the protection scope of the present invention.

Claims

1. Rapid temperature control device for laser imaging system based on PID control and TEC integration, characterized by: It comprises a TEC refrigeration module (1) located on a DMD chip module (2), wherein the TEC refrigeration module (1) is connected to a water cooling machine (6) via a water pipe (7), and the TEC refrigeration module (1) is also connected to a control box (5) via a TEC power line (3) and a signal line (4); The TEC refrigeration module (1) comprises a cooling block (16), which is located above the DMD chip module (2); the DMD chip module (2) comprises a PCB circuit board (22) and a DMD chip (21) located on the PCB circuit board (22); the cooling block (16) is connected to the cold surface of a semiconductor cooling sheet (15) above, the hot surface of the semiconductor cooling sheet (15) is connected to a water cooling head (14), the water cooling head (14) is respectively connected to a water inlet (11) and a water outlet (12) above, and the water inlet (11) and the water outlet (12) are respectively connected to a water pipe (7).

2. According to claim 1, the laser imaging system rapid temperature control device based on PID control and TEC integration is characterized in that: Heat-conducting material is evenly applied between the cooling block (16) and the cold end of the semiconductor cooling sheet (15), and between the water cooling head (14) and the hot end of the semiconductor cooling sheet (15).

3. The rapid temperature control device for laser imaging system based on PID control and TEC integration according to claim 1, characterized in that: A shell (13) is added to the TEC refrigeration module (1); the water cooling head (14), the semiconductor refrigeration sheet (15) and the cooling block (16) are all located in the shell (13).

4. The rapid temperature control device for laser imaging system based on PID control and TEC integration according to claim 1, characterized in that: A heat-insulating layer is arranged outside the cooling block (16).

5. The rapid temperature control device for laser imaging system based on PID control and TEC integration according to claim 1, characterized in that: The control box (5) comprises a box body, a control screen (51) and a module power supply and temperature transmission interface (54) are arranged on the upper surface of the box body, and a power supply interface (53) and a communication interface (52) are arranged on the bottom of the box body.

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