Loading cavity capable of switching wafer heating and cooling functions
Patent Information
- Application Number
- CN202421832118.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-31
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-07-31
AI Technical Summary
The existing wafer loading cavity has a single structure and only has loading function. It has low efficiency and cannot meet the needs of efficient production.
A loading chamber with switchable heating and cooling functions is designed, including a cooling chamber and a preheating chamber, to achieve heating and cooling of the wafer by cooling and preheating lifting mechanisms.
By implementing heating and cooling functions in the loading chamber, the heating time of the wafer in the process chamber is shortened, production efficiency is improved, and the demand for additional cooling devices is reduced, and the overall cost is reduced.
Smart Images
Figure CN222914740U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer processing equipment. More specifically, the utility model relates to a loading chamber capable of switching functions of heating and cooling wafers. Background Art
[0002] Semiconductor wafer manufacturing equipment consists of a wafer loading chamber and a process chamber. All wafers will wait in the loading chamber together to be transferred into the process chamber by the equipment robot arm. After this step of the process is completed, they will be transferred back to the loading chamber by the robot arm.
[0003] The structure of the loading chamber in the prior art is single and only has a loading function, which is limited to the use of equipment for a single process purpose, with low efficiency. For customers with high efficiency requirements, there are significant disadvantages. Summary of the Utility Model
[0004] To solve the above problems of the prior art, the utility model innovatively provides a loading chamber capable of switching functions of heating and cooling wafers, which can meet different requirements and improve production efficiency.
[0005] To achieve the above technical objectives, the technical solution of the utility model is as follows:
[0006] A loading chamber capable of switching functions of heating and cooling wafers includes a cavity. A cooling chamber and a preheating chamber are arranged in the cavity. A cooling chamber support frame and a cooling mechanism are arranged in the cooling chamber. A cooling chamber wafer carrier for placing wafers is arranged on the cooling chamber support frame. The cooling chamber support frame is connected with a cooling lifting mechanism, and the cooling lifting mechanism drives the cooling chamber support frame to lift, thereby driving the cooling chamber wafer carrier to approach or move away from the cooling mechanism. A preheating chamber support frame and a preheating mechanism are arranged in the preheating chamber. A preheating chamber wafer carrier for placing wafers is arranged on the preheating chamber support frame. The preheating chamber support frame is connected with a preheating lifting mechanism, and the preheating lifting mechanism drives the preheating chamber support frame to lift, thereby driving the preheating chamber wafer carrier to approach or move away from the preheating mechanism.
[0007] Further, the cooling chamber wafer carrier includes a lower cooling chamber wafer carrier and an upper cooling chamber wafer carrier; the preheating chamber wafer carrier includes an upper preheating chamber wafer carrier and a lower preheating chamber wafer carrier.
[0008] Further, the cooling chamber and the preheating chamber are distributed vertically.
[0009] Further, the cooling chamber and the preheating chamber are distributed horizontally.
[0010] Further, the cooling mechanism is arranged at the bottom of the cooling chamber; the preheating mechanism is arranged at the bottom of the preheating chamber.
[0011] Furthermore, the cooling mechanism is a cold water tray or a cooling fan.
[0012] Furthermore, the preheating mechanism is a hot water tray or a hot air blower.
[0013] Furthermore, both the cooling lifting mechanism and the preheating lifting mechanism are air cylinders or electric cylinders.
[0014] The beneficial effects of the present utility model are as follows:
[0015] On the basis of having a loading function, the loading cavity provided by the present utility model has both heating and cooling functions, which can meet different requirements. During the entire process of atomic layer deposition, heating and cooling processes are often required. However, traditional equipment heating is generally carried out in the process chamber, which consumes time and reduces production efficiency. The cooling process is relatively slow. Some equipment even does not have a cooling device, or a separate cooling device is set up, which increases costs and the entire process flow. The present utility model perfectly solves these problems. First, regarding the preheating problem, before the wafer enters the process chamber, it is first heated to a certain temperature in the preheating chamber, so that the heating time in the process chamber is shortened, and the production efficiency is improved. Second, regarding the cooling problem, the wafer coming out of the process chamber has a certain temperature, and cooling requires a certain amount of time. This requires a cooling device. The present utility model completes preheating or cooling during the loading process, reasonably utilizes the waiting time during the coating process, and greatly improves the production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 is a schematic structural diagram of the present utility model.
[0017] Figure 2 is a schematic diagram of the usage state of the present utility model Figure 1 .
[0018] Figure 3 is a schematic diagram of the usage state of the present utility model Figure 2 .
[0019] Figure 4 is a schematic diagram of the usage state of the present utility model Figure 3 .
[0020] Figure 5 is a schematic diagram of the usage state of the present utility model Figure 4 .
[0021] In the figure,
[0022] 1. Cavity; 2. Cooling chamber; 3. Preheating chamber; 4. Cooling chamber support frame; 5. Cooling mechanism; 6. Cooling chamber wafer holder; 6a. Lower cooling chamber wafer holder; 6b. Upper cooling chamber wafer holder; 7. Cooling lifting mechanism; 8. Preheating chamber support frame; 9. Preheating mechanism; 10. Preheating chamber wafer holder; 10a. Upper preheating chamber wafer holder; 10b. Lower preheating chamber wafer holder; 11. Preheating lifting mechanism; 12. Wafer to be processed; 13. Finished wafer. Detailed implementation mode
[0023] The solution provided by the present utility model will be explained and described in detail below in conjunction with the accompanying drawings of the specification.
[0024] Refer to Figures 1 to 5 As shown, this embodiment provides a loading cavity with switchable heating and cooling functions for wafers, including a cavity 1. A cooling chamber 2 and a preheating chamber 3 are arranged in the cavity 1. The cooling chamber 2 and the preheating chamber 3 can be arranged vertically as shown. Figure 1 In some other embodiments, they can also be arranged horizontally. In this embodiment, the cooling chamber 2 is arranged above the preheating chamber 3, which can reduce a certain floor area.
[0025] A cooling chamber support frame 4 and a cooling mechanism 5 are arranged in the cooling chamber 2. The cooling mechanism 5 is one of a cold water tray or a cold air blower, that is, it can be realized in a water-cooling or air-cooling manner.
[0026] A cooling chamber wafer holder 6 for placing wafers is arranged on the cooling chamber support frame 4. The cooling chamber wafer holder 6 includes a lower cooling chamber wafer holder 6a and an upper cooling chamber wafer holder 6b. The lower cooling chamber wafer holder 6a and the upper cooling chamber wafer holder 6b are arranged vertically, and both are used to place wafers. Specifically, they can place the wafer to be processed 12 (the wafer to enter the process chamber for coating) or the finished wafer 13 (the wafer after coating in the process chamber).
[0027] The cooling chamber support frame 4 is connected with a cooling lifting mechanism 7. The cooling lifting mechanism 7 drives the cooling chamber support frame 4 to lift or lower, thereby driving the cooling chamber wafer holder 6 to approach or move away from the cooling mechanism 5. In the illustrated embodiment, the cooling mechanism 5 is arranged at the bottom of the cooling chamber 2. When the cooling lifting mechanism 7 drives the cooling chamber support frame 4 to descend, it can drive the entire cooling chamber wafer holder 6 to descend, so that the lower cooling chamber wafer holder 6a approaches the cooling mechanism 5, thereby cooling the wafer on the lower cooling chamber wafer holder 6a (generally cooling the finished wafer 13 taken out from the process chamber), thus increasing the cooling time of the wafer without the need to additionally set up a cooling device. After cooling, the cooling lifting mechanism 7 drives the cooling chamber support frame 4 to rise back to the initial height, and the cooled wafer can be taken out.
[0028] Similarly, a preheating chamber support frame 8 and a preheating mechanism 9 are provided in the preheating chamber 3. In this embodiment, the preheating mechanism 9 is one of a hot water tray or a hot air blower, that is, it can be realized by a hot water pipe preheating method or a hot air preheating method;
[0029] A preheating chamber wafer carrier 10 for placing wafers is provided on the preheating chamber support frame 8. The preheating chamber wafer carrier 10 includes a preheating chamber upper wafer carrier 10a and a preheating chamber lower wafer carrier 10b. The preheating chamber upper wafer carrier 10a and the preheating chamber lower wafer carrier 10b are also arranged vertically and are also used for placing wafers.
[0030] The preheating chamber support frame 8 is connected to a preheating lifting mechanism 11. The preheating lifting mechanism 11 drives the preheating chamber support frame 8 to move up and down, thereby driving the preheating chamber wafer carrier 10 to approach or move away from the preheating mechanism 9; in the illustrated embodiment, the preheating mechanism 9 is also provided at the bottom inside the preheating chamber 3. When the preheating lifting mechanism 11 drives the preheating chamber support frame 8 to descend, the preheating chamber wafer carrier 10 can be driven to descend, so that the preheating chamber lower wafer carrier 10b approaches the preheating mechanism 9, thereby preheating the wafers placed thereon (generally, preheating the wafers 12 to be processed that have not yet entered the process chamber for coating), thereby shortening the heating time in the process chamber and improving production efficiency; after preheating is completed, the preheating lifting mechanism 11 drives the preheating chamber support frame 8 to rise back to the initial height, and the preheated wafers can be taken out and sent into the process chamber.
[0031] In this embodiment, both the cooling lifting mechanism 7 and the preheating lifting mechanism 11 are cylinders or electric cylinders, and the up and down lifting function is realized by cylinders or electric cylinders.
[0032] The utility model has heating and cooling functions for selection and switching:
[0033] (1) When the wafer needs to be preheated during the process and does not need to be cooled and sent out (that is, when entering the process chamber, the wafers 12 to be processed need to be preheated, and the finished wafers 13 coming out of the process chamber after coating do not need to be cooled): Refer to Figure 2 As shown, it can be selected to enter from the position of the preheating chamber lower wafer carrier 10b. After placing the wafers 12 to be processed on the preheating chamber lower wafer carrier 10b, the preheating lifting mechanism 11 drives the preheating chamber lower wafer carrier 10b to descend and makes the wafers 12 to be processed approach the preheating mechanism 9. After preheating is completed, the preheating lifting mechanism 11 rises to lift the wafers 12 to be processed, and then the wafers 12 to be processed are taken away. At the same time as the wafers 12 to be processed are taken away, the finished wafers 13 after coating are placed at the position of the preheating chamber upper wafer carrier 10a and then taken out.
[0034] (2) When the wafer needs to be preheated when entering the process and cooled when sent out (that is, the wafer 12 to be processed needs to be preheated when entering the process chamber, and the finished wafer 13 coming out of the coating in the process chamber needs to be cooled): Refer to Figure 3 As shown, it can be selected to enter from the position of the lower wafer carrier 10b of the preheating chamber. After placing the wafer 12 to be processed on the lower wafer carrier 10b of the preheating chamber, the preheating lifting mechanism 11 descends to make the wafer 12 to be processed approach the preheating mechanism 9. After preheating is completed, the preheating lifting mechanism 11 ascends to lift the wafer 12 to be processed, and then the wafer 12 to be processed is taken away. At the same time as the above steps, after the coated finished wafer 13 is placed on the lower wafer carrier 6a of the cooling chamber, the cooling lifting mechanism 7 descends to make the finished wafer 13 approach the cooling mechanism 5. After cooling is completed, the cooling lifting mechanism 7 ascends to lift the finished wafer 13 to the original position, and then it is taken out.
[0035] (3) When the wafer does not need to be preheated when entering the process and does not need to be cooled when sent out: Refer to Figure 4 As shown, it can be selected to enter from the position of the upper wafer carrier 6b of the cooling chamber. Place the wafer 12 to be processed on the upper wafer carrier 6b of the cooling chamber, and at the same time take away the finished wafer 13 on the lower wafer carrier 6a of the cooling chamber, and then the wafer 12 to be processed is sent in; or select to enter from the position of the lower wafer carrier 10b of the preheating chamber, place the wafer 12 to be processed on the lower wafer carrier 10b of the preheating chamber, and at the same time take away the finished wafer 13 on the upper wafer carrier 10a of the preheating chamber, and then the wafer 12 to be processed is sent in. Other ways can also be used for loading and unloading. At this time, the cooling mechanism 5, the preheating mechanism 9, the cooling lifting mechanism 7, and the preheating lifting mechanism 11 do not need to be started, and the loading chamber only functions as a loading chamber.
[0036] (4) When the wafer does not need to be preheated when entering the process and needs to be cooled when sent out (that is, when the wafer 12 to be processed does not need to be preheated when entering the process chamber, and the finished wafer 13 coming out of the coating in the process chamber needs to be cooled): Refer to Figure 5 As shown, it can be selected to enter from the position of the upper wafer carrier 6b of the cooling chamber and sent out from the position of the lower wafer carrier 6a of the cooling chamber. This process is to place the finished wafer 13 on the lower wafer carrier 6a of the cooling chamber, the cooling lifting mechanism 7 descends to make the finished wafer 13 approach the cooling mechanism 5. After cooling, the finished wafer 13 is taken away, and at the same time the wafer 12 to be processed is placed on the upper wafer carrier 6b of the cooling chamber, and then the wafer 12 to be processed is sent in.
[0037] It should be noted that in this embodiment, when the wafer is preheated or cooled after being sent into the loading chamber, the loading chamber can be closed. After cooling or preheating is completed, the loading chamber can be opened, and then the wafer can be transferred by a robotic arm or the like.
[0038] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model.
[0039] In the present utility model, unless otherwise clearly specified and defined, the terms "installed", "connected", "connected to", "fixed", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0040] In the description of this specification, the descriptions referring to the terms "this embodiment", "one embodiment", "some embodiments", "examples", "specific examples", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any at least one embodiment or example. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.
[0041] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" can explicitly or implicitly include at least one of such features. In the description of the present utility model, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0042] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, and simple improvements made to the substantial content of the present utility model shall be included within the protection scope of the present utility model.
Claims
1. A loading chamber with switchable heating and cooling functions for wafers, characterized in that: The invention comprises a cavity (1), wherein the cavity (1) is provided with a cooling chamber (2) and a preheating chamber (3); the cooling chamber (2) is provided with a cooling chamber support frame (4) and a cooling mechanism (5); the cooling chamber support frame (4) is provided with a cooling chamber wafer holder (6) for placing a wafer; the cooling chamber support frame (4) is connected to a cooling lifting mechanism (7); the cooling lifting mechanism (7) drives the cooling chamber support frame (4) to rise and fall, thereby driving the cooling chamber wafer holder (6) to rise and fall. ) approaches or moves away from the cooling mechanism (5); a preheating chamber support frame (8) and a preheating mechanism (9) are arranged in the preheating chamber (3); a preheating chamber wafer holder (10) for placing wafers is arranged on the preheating chamber support frame (8); the preheating chamber support frame (8) is connected to a preheating lifting mechanism (11); the preheating lifting mechanism (11) drives the preheating chamber support frame (8) to rise and fall, thereby driving the preheating chamber wafer holder (10) to approach or move away from the preheating mechanism (9).
2. The loading chamber with switchable heating and cooling functions for wafers according to claim 1, characterized in that: The cooling chamber sheet support (6) comprises a cooling chamber lower sheet support (6a) and a cooling chamber upper sheet support (6b); the preheating chamber sheet support (10) comprises a preheating chamber upper sheet support (10a) and a preheating chamber lower sheet support (10b).
3. The loading chamber with switchable heating and cooling functions for wafers according to claim 1, characterized in that: The cooling chamber (2) and the preheating chamber (3) are distributed vertically.
4. The loading chamber with switchable heating and cooling functions for wafers according to claim 1, characterized in that: The cooling chamber (2) and the preheating chamber (3) are distributed on the left and right.
5. The loading chamber with switchable heating and cooling functions for wafers according to claim 1, characterized in that: The cooling mechanism (5) is arranged at the bottom of the cooling chamber (2); and the preheating mechanism (9) is arranged at the bottom of the preheating chamber (3).
6. The loading chamber with switchable heating and cooling functions for wafers according to claim 1, characterized in that: The cooling mechanism (5) is a cold water tray or a cold air blower.
7. The loading chamber with switchable heating and cooling functions for wafers according to claim 1, characterized in that: The preheating mechanism (9) is a hot water tray or a hot air blower.
8. The loading chamber with switchable heating and cooling functions for wafers according to claim 1, characterized in that: The cooling lifting mechanism (7) and the preheating lifting mechanism (11) are both air cylinders or electric cylinders.