Silicon wafer carrier

Abstract

The utility model relates to the technical field of battery production and manufacturing, in particular to a silicon wafer carrier. The silicon wafer carrier comprises a tooth tool, the tooth tool comprises a base and a plurality of clamping teeth, the clamping teeth are detachably connected to the base and arranged in the first direction, a gap is formed between every two adjacent clamping teeth and used for clamping a silicon wafer, and the clamping teeth and the silicon wafer are in line contact or point contact. According to the silicon wafer carrier provided by the invention, the clamping teeth are detachably connected to the base, and compared with an existing structure in which the base and the clamping teeth are integrally formed, when one or more clamping teeth are abraded and need to be cleaned or replaced, only the abraded clamping teeth can be disassembled for cleaning or replacing, and the whole silicon wafer carrier does not need to be disassembled; the maintenance efficiency is improved, the maintenance cost is reduced, and the service life of the silicon wafer carrier is prolonged; the clamping teeth and the silicon wafers on the two sides form line contact or point contact, the contact area between the silicon wafers and the clamping teeth can be reduced, and therefore friction and abrasion caused by contact between the silicon wafers and the clamping teeth are reduced.

Description

Technical Field

[0001] This application relates to the technical field of battery production and manufacturing, and particularly relates to a silicon wafer carrier. Background Art

[0002] In processes such as boron diffusion, oxidation, and annealing of silicon wafers, a silicon wafer carrier made of ceramic material is required. The silicon wafer carrier mainly uses teeth to clamp the silicon wafer to achieve the effect of carrying the silicon wafer.

[0003] In the prior art, the teeth are generally integrally formed. If one of the teeth is damaged, the entire tooth needs to be replaced, increasing the maintenance cost. Utility Model Content

[0004] This application discloses a silicon wafer carrier, which can reduce the contact area between the silicon wafer carrier and the silicon wafer, thereby reducing the frictional loss of the silicon wafer.

[0005] To achieve the above object, this application discloses a silicon wafer carrier, including teeth, and the teeth include:

[0006] A base; and

[0007] A plurality of teeth, and the plurality of teeth are detachably connected to the base and arranged along a first direction. A gap is formed between adjacent two of the teeth and is used for clamping the silicon wafer, and the teeth are in line contact or point contact with the silicon wafer.

[0008] Optionally, the base is provided with a plurality of mounting holes along the first direction, and the plurality of teeth are respectively detachably disposed in the plurality of mounting holes.

[0009] Optionally, the mounting hole is provided with internal threads, the tooth is provided with external threads, and the tooth is matched with the internal threads of the mounting hole through the external threads.

[0010] Optionally, the mounting hole is a clearance hole, and the tooth is inserted into the clearance hole; the base is further provided with a plurality of threaded holes along a direction perpendicular to the mounting hole, the plurality of threaded holes correspond to the plurality of clearance holes one by one, and the threaded holes communicate with the clearance holes. The tooth further includes a plurality of Jimi screws, and the plurality of Jimi screws are respectively disposed in the plurality of threaded holes and abut against the teeth.

[0011] Optionally, the teeth are in line contact with the silicon wafer, and the surface of the tooth for contacting the silicon wafer is a convex arc surface.

[0012] Optionally, the tooth includes a clamping portion and a guiding portion. The shape of the clamping portion is a cylinder, the clamping portion is used for clamping the silicon wafer, the guiding portion is disposed at an end of the clamping portion away from the base, and the guiding portions of adjacent two of the teeth are used for guiding the silicon wafer to be clamped into the gap.

[0013] Optionally, the guiding portion is a cone, the bottom of the cone is connected to one end of the clamping portion away from the base, and the side surface of the cone is used to guide the silicon wafer into the gap.

[0014] Optionally, the length of the base in the first direction ranges from 329.95 mm to 330.05 mm, and / or the height of the cylinder ranges from 19.95 mm to 20.05 mm, and / or the height of the cone ranges from 9.95 mm to 10.05 mm.

[0015] Optionally, the silicon wafer carrier includes two of the toothed tools, the teeth of the two toothed tools face each other, the silicon wafer carrier further includes a driving member, the driving member is connected to the two toothed tools, and the driving member can drive the two toothed tools to approach or move away from each other.

[0016] Optionally, the radius of the cylinder ranges from 2.5 mm to 2.7 mm.

[0017] Optionally, the silicon wafer carrier includes two of the toothed tools, the teeth of the two toothed tools face each other, the silicon wafer carrier further includes a driving member, the driving member is connected to the two toothed tools, and the driving member can drive the two toothed tools to approach or move away from each other.

[0018] Compared with the prior art, the beneficial effects of the present application are as follows:

[0019] The silicon wafer carrier provided by the present application is detachably connected to the base through the teeth. Compared with the prior art structure in which the base and the teeth are integrally formed, when one or several teeth are worn and need to be cleaned or replaced, only the worn teeth can be disassembled for cleaning or replacement, without disassembling the entire silicon wafer carrier, which improves the maintenance efficiency, reduces the maintenance cost, and at the same time increases the service life of the silicon wafer carrier; in addition, the teeth form a line contact or a point contact with the silicon wafers on both sides. Compared with the prior art in which the teeth and the silicon wafers form a surface contact, the contact area between the silicon wafers and the teeth can be reduced, thereby reducing the friction and wear generated by the silicon wafers due to contact with the teeth, helping to protect the surface quality of the silicon wafers and avoiding affecting the performance of the silicon wafers. Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0021] Figure 1It is a schematic structural diagram of a tooth tool provided by an embodiment of the present application;

[0022] Figure 2 It is a schematic structural diagram of a wafer carrier provided by an embodiment of the present application.

[0023] Main reference numerals description

[0024] 1 - Wafer carrier;

[0025] 11 - Tooth tool;

[0026] 111 - Base;

[0027] 112 - Locking teeth; 1121 - Clamping part; 1122 - Guiding part;

[0028] 113 - Base screw. Detailed implementation manners

[0029] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0030] In the present application, the terms "mounted", "arranged", "provided with", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there is internal communication between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0031] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements, or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements, or components. Unless otherwise specified, the meaning of "a plurality" is two or more.

[0032] Next, the technical solutions of the present application will be further described in conjunction with specific embodiments and the accompanying drawings.

[0033] Please refer to Figure 1 , an embodiment of the present application discloses a wafer carrier 1, including a tooth tool 11. The tooth tool 11 includes a base 111 and a plurality of locking teeth 112. The plurality of locking teeth 112 are detachably connected to the base 111 and are arranged along a first direction (such as Figure 1They are arranged in the X direction, and a gap is formed between two adjacent teeth 112 for clamping the silicon wafer, and the teeth 112 are in line contact or point contact with the silicon wafer.

[0034] Among them, the shape of the base 111 can be a cuboid or a cube, etc., which is not limited here.

[0035] In addition, the multiple teeth 112 are arranged in the first direction. It can be that the multiple teeth 112 only form a single row in the first direction, or it can be that the multiple teeth 112 form multiple rows in the first direction, which is not limited here. It should be noted that when the multiple teeth 112 form multiple rows in the first direction, the number of teeth 112 in each row is the same, and in the second direction perpendicular to the first direction, the multiple teeth 112 form multiple columns, and a gap for accommodating the silicon wafer is formed between two adjacent columns of teeth 112.

[0036] In this embodiment, the multiple teeth 112 are detachably connected to the base 111. In other words, each tooth 112 is independently installed on the base 111.

[0037] Compared with the existing structure in which the base 111 and the teeth 112 are integrally formed, the above structure can improve the maintenance efficiency of the teeth 112. Exemplarily, when one or several teeth 112 are worn and need to be cleaned, only the worn teeth 112 can be disassembled for cleaning, and then reinstalled after cleaning, without disassembling the entire silicon wafer carrier 1, which improves the maintenance efficiency, reduces the maintenance cost, and at the same time increases the service life of the silicon wafer carrier 1. Similarly, this structure also improves the replacement efficiency of the teeth 112. Exemplarily, when one or several teeth 112 are damaged, only the damaged teeth 112 can be disassembled and new teeth 112 can be installed, without replacing the entire silicon wafer carrier 1, which greatly reduces the replacement cost.

[0038] The above structure makes the silicon wafer carrier 1 have high flexibility. Specifically, according to the different thicknesses of the silicon wafers, teeth 112 of different sizes can be selected for replacement to adapt to silicon wafers of different thicknesses, while improving the applicable range of the silicon wafer carrier 1 and reducing the manufacturing cost of the silicon wafer carrier 1.

[0039] The above structure also helps to reduce errors in the production process. It can be understood that since the teeth 112 are independently installed and detachable, each tooth 112 can be accurately calibrated and adjusted individually to ensure more accurate and stable contact between the teeth 112 and the silicon wafer, which helps to reduce the situation of the silicon wafer shifting or shaking.

[0040] In this embodiment, the engaging teeth 112 form a line contact or a point contact with the silicon wafers on both sides. Compared with the existing engaging teeth 112 forming a surface contact with the silicon wafers, it can reduce the contact area between the silicon wafers and the engaging teeth 112, thereby reducing the friction and wear generated when the silicon wafers contact the engaging teeth 112, helping to protect the surface quality of the silicon wafers and avoiding affecting the performance of the silicon wafers.

[0041] In some embodiments, the base 111 is provided with a plurality of mounting holes (not shown in the figure) along the first direction, and the plurality of engaging teeth 112 are respectively detachably disposed in the plurality of mounting holes.

[0042] Among them, the mounting holes can be blind holes or through holes, etc., which are not limited herein.

[0043] Providing mounting holes for detachably mounting the engaging teeth 112 on the base 111 provides a modular and standardized mounting method for the engaging teeth 112 to be mounted on the base 111. Specifically, through the preset mounting holes, the engaging teeth 112 can be accurately mounted on the base 111, ensuring the accuracy of the position and angle of the engaging teeth 112, simplifying the mounting process, reducing the mounting time, improving the mounting efficiency, and reducing the mounting cost.

[0044] The plurality of mounting holes are arranged along the first direction, so that the distance between two adjacent engaging teeth 112 along the first direction can be adjusted as needed, increasing the flexibility of the silicon wafer carrier 1 and enabling it to adapt to silicon wafers of different thicknesses. It should be noted that this effect requires the aperture of the mounting hole to be larger than the radial dimension of the engaging teeth 112.

[0045] Disposing the engaging teeth 112 in the mounting holes can reduce the length of the engaging teeth 112 protruding from the base 111 along the axial direction of the mounting holes. When the silicon wafers contact the engaging teeth 112, the contact area between the silicon wafers and the engaging teeth 112 can be further reduced, thereby further reducing the friction and wear generated when the silicon wafers contact the engaging teeth 112, helping to protect the surface quality of the silicon wafers and avoiding affecting the performance of the silicon wafers.

[0046] In some other embodiments, the engaging teeth 112 can also be adhered to the base 111.

[0047] In some more specific embodiments, the mounting holes are provided with internal threads, and the engaging teeth 112 are provided with external threads. The engaging teeth 112 are engaged with the internal threads of the mounting holes through the external threads.

[0048] In this embodiment, the cooperation between the internal thread and the external thread enables the engaging teeth 112 and the mounting holes to be closely combined together, making the connection between the engaging teeth 112 and the mounting holes firm and reliable. This ensures that during the processing or transportation of the silicon wafer, the engaging teeth 112 will not loosen or fall off, enhancing the structural stability of the silicon wafer carrier 1, improving the reliability of silicon wafer clamping, and ensuring the safety and stability of the processing or transportation process.

[0049] The installation and disassembly of the engaging teeth 112 are made simple and efficient through the threaded connection method. Specifically, by rotating the engaging teeth 112, the engaging teeth 112 can be easily fixed in the mounting holes or detached from the mounting holes, improving the work efficiency of assembling and disassembling the engaging teeth 112 and reducing the operation difficulty of assembling and disassembling the engaging teeth 112.

[0050] The threaded connection also has a certain self-locking function. It can be understood that when the engaging teeth 112 are screwed into the internal thread of the mounting hole through the external thread, due to the inclined plane effect of the thread, a certain frictional force will be generated, making the engaging teeth 112 not easily loosen when subjected to external forces. Therefore, the self-locking function further enhances the connection stability between the engaging teeth 112 and the base 111, reducing the risk of the engaging teeth 112 loosening.

[0051] The threaded connection has a certain universality and interchangeability. Specifically, due to the adoption of a standardized threaded connection method, different specifications and models of engaging teeth 112 can be easily matched and connected with the corresponding mounting holes, which makes the replacement of the silicon wafer carrier 1 more flexible and convenient.

[0052] In some more specific embodiments, the mounting holes are through holes, and the engaging teeth 112 are inserted into the through holes; the base 111 is further provided with a plurality of threaded holes along the direction perpendicular to the mounting holes. The plurality of threaded holes correspond to the plurality of through holes one by one, and the threaded holes communicate with the through holes. The tooth tool 11 further includes a plurality of Jimi screws 113, and the plurality of Jimi screws 113 are respectively arranged in the plurality of threaded holes and abut against the engaging teeth 112.

[0053] The method of inserting the engaging teeth 112 into the through holes realizes fast and simple installation. The operator can accurately insert the engaging teeth 112 into the through holes without complex operations, greatly improving the installation efficiency, simplifying the installation steps, reducing the error rate during the installation process, and improving the work efficiency.

[0054] The combined use of the threaded holes and the Jimi screws 113 provides a stable fixing effect for the engaging teeth 112. Specifically, the Jimi screws 113 are screwed into the threaded holes and abut against the engaging teeth 112, thereby realizing the fastening of the engaging teeth 112 and ensuring the stability of the engaging teeth 112 mounted on the base 111, reducing the risk of the engaging teeth 112 loosening.

[0055] The adjustability of the Kimi screw 113 enables the position and angle of the engaging teeth 112 to be precisely adjusted. Specifically, by rotating the Kimi screw 113, the position of the engaging teeth 112 can be finely adjusted to adapt to wafers of different thicknesses, improving the flexibility and applicability of the wafer carrier 1.

[0056] The Kimi screw 113 also facilitates the disassembly and replacement of the engaging teeth 112. Specifically, when the engaging teeth 112 are worn or need to be replaced, rotate the Kimi screw 113 until it separates from the engaging teeth 112, and then the engaging teeth 112 can be easily removed from the light hole, reducing the maintenance cost and extending the service life of the wafer carrier 1.

[0057] In some embodiments, the engaging teeth 112 are in line contact with the wafer, and the surface of the engaging teeth 112 for contacting the wafer is a convex arc surface.

[0058] In this embodiment, the surface of the engaging teeth 112 for contacting the wafer is a convex arc surface, so that the engaging teeth 112 are in line contact with the wafer. Compared with the existing surface contact between the engaging teeth 112 and the wafer, the contact area between the wafer and the engaging teeth 112 can be reduced, thereby reducing the friction and wear generated when the wafer contacts the engaging teeth 112, helping to protect the surface quality of the wafer and avoiding affecting the performance of the wafer.

[0059] In some other embodiments, the surface of the engaging teeth 112 for contacting the wafer can be a spherical surface, so that the engaging teeth 112 are in point contact with the wafer.

[0060] In some embodiments, the engaging teeth 112 include a clamping portion 1121 and a guiding portion 1122. The shape of the clamping portion 1121 is a cylinder, and the clamping portion 1121 is used to clamp the wafer. The guiding portion 1122 is provided at one end of the clamping portion 1121 away from the base 111, and the guiding portions 1122 of two adjacent engaging teeth 112 are used to guide the wafer into the gap.

[0061] Among them, the shape of the clamping portion 1121 is a cylinder, which can form a convex arc surface for contacting the wafer, so that the engaging teeth 112 are in line contact with the wafer.

[0062] In this embodiment, the guiding portion 1122 is provided at one end of the clamping portion 1121 away from the base 111, enabling the wafer to be more smoothly inserted into the gap between two adjacent engaging teeth 112. Specifically, when the wafer is offset relative to the gap between two engaging teeth 112, the guiding portion 1122 can effectively guide the wafer along the correct path into the gap, reducing the deviation and misalignment during the placement of the wafer and improving the accuracy and efficiency of wafer placement.

[0063] It can be understood that without the guiding portion 1122, since the clamping portion 1121 is a cylinder, when the silicon wafer is offset relative to the gap between the two teeth 112, the silicon wafer may contact the surface of the clamping portion 1121 away from the base 111 and be damaged. To solve this problem, in this embodiment, the guiding portion 1122 can guide the silicon wafer to be inserted into the gap, which helps to reduce the collision between the silicon wafer and the clamping portion 1121 and avoid the damage of the silicon wafer caused by the collision.

[0064] In some other embodiments, the shape of the clamping portion 1121 can be two semi-cylinders respectively arranged on both sides of a cube.

[0065] In some more specific embodiments, the guiding portion 1122 is a cone, the bottom of the cone is connected to one end of the clamping portion 1121 away from the base 111, and the side surface of the cone is used to guide the silicon wafer to be inserted into the gap.

[0066] In this embodiment, the guiding portion 1122 is a cone, and the bottom surface of the cone fits the surface of the cylinder away from the base 111. The apex of the cone is located on the axis of the cylinder, and the apex points away from the cylinder.

[0067] The shape of the cone enables the guiding portion 1122 to have a good guiding function. Since the side surface of the cone gradually shrinks from the apex to the bottom surface, when the silicon wafer approaches the tooth 112, the side surface of the cone can naturally guide the silicon wafer to slide along its side surface into the gap between two adjacent teeth 112, ensuring that the silicon wafer can be accurately placed at the predetermined clamping position and improving the accuracy and efficiency of the placement.

[0068] The cone also reduces the friction and collision between the silicon wafer and the tooth 112. Compared with other shapes, the side surface of the cone is smoother, reducing the contact area between the silicon wafer and the guiding portion 1122, thereby reducing the risk of surface damage of the silicon wafer caused by friction and collision.

[0069] In some other more specific embodiments, the guiding portion 1122 can also be a sphere.

[0070] In some more specific embodiments, the length of the base 111 in the first direction ranges from 299.95 mm to 330.05 mm, and / or the height of the cylinder (such as Figure 1 in the Y direction) ranges from 19.95 mm to 20.05 mm, and / or the height of the cone (such as Figure 1 in the Y direction) ranges from 9.95 mm to 10.05 mm.

[0071] In this embodiment, the length of the base 111 in the first direction ranges from 329.95 mm to 330.05 mm. This length range allows the wafer carrier 1 to adapt to wafers of different thicknesses, improving the flexibility and versatility of the wafer carrier 1. Exemplarily, the length of the base 111 in the first direction can be 329.95 mm or 330 mm or 330.05 mm. Of course, the length of the base 111 in the first direction can also be other length values within the range of 329.95 mm - 330.05 mm excluding the above three length values, which is not limited herein.

[0072] In this embodiment, the height of the cylinder refers to the height by which the cylinder protrudes from the base 111. The range of the cylinder is from 19.95 mm to 20.05 mm. This height range enables the clamping teeth 112 to tightly hold the wafer, preventing the wafer from moving or falling off during the processing or transportation process. At the same time, it also avoids excessive friction on the wafer caused by an overly high cylinder height, reducing the risk of surface damage to the wafer. Exemplarily, the height of the cylinder can be 19.95 mm or 20 mm or 20.05 mm. Of course, the height of the cylinder can also be other height values within the range of 19.95 mm - 20.05 mm excluding the above three height values, which is not limited herein.

[0073] In this embodiment, the height range of the cone is from 9.95 mm to 10.05 mm. This height range enables the cone to effectively guide the wafer into the clamping position. At the same time, the height of the cone also avoids problems of ineffective guidance caused by being too high or too low, optimizing the wafer guiding process. Exemplarily, the height of the cone can be 9.95 mm or 10 mm or 10.05 mm. Of course, the height of the cone can also be other height values within the range of 9.95 mm - 10.05 mm excluding the above three height values, which is not limited herein.

[0074] In some other more specific embodiments, the length range of the base 111 in the first direction can be less than 299.95 mm or greater than 330.05 mm, and / or the height range of the cylinder can be less than 19.95 mm or greater than 20.05 mm, and / or the height range of the cone can be less than 9.95 mm or greater than 10.05 mm.

[0075] In some more specific embodiments, the radius range of the cylinder is from 2.5 mm to 2.7 mm.

[0076] In this embodiment, the radius range of the cylinder is from 2.5 mm to 2.7 mm. If the radius of the cylinder is too small, it may result in too large a gap and be unable to effectively fix the wafer. While if the radius of the cylinder is too large, it may result in a smaller gap, causing the cylinder to exert too large a force on the wafer, thereby damaging the wafer.

[0077] Exemplarily, the radius of the cylinder can be 2.5 mm, or 2.6 mm, or 2.7 mm. Of course, the radius of the cylinder can also be other values within the range of 2.5 mm to 2.7 mm excluding the above three radius values, which are not limited herein.

[0078] In some other more specific embodiments, the radius range of the cylinder can be less than 2.5 mm or greater than 2.7 mm.

[0079] Please refer to Figure 2 , in some embodiments, the wafer carrier 1 includes two toothed members 11, the engaging teeth 112 of the two toothed members 11 face each other, and the wafer carrier 1 further includes a driving member (not shown in the figure), the driving member is connected to the two toothed members 11, and the driving member can drive the two toothed members 11 to move closer to or away from each other.

[0080] In this embodiment, the driving member first drives the two toothed members 11 to move away from each other to form a larger loading space between the two toothed members 11. After a plurality of wafers are placed in the loading space, the driving member drives the two toothed members 11 to move closer to each other, so that the two side edges of the wafer are respectively caught in the gaps formed between two adjacent engaging teeth 112 of the two toothed members 11, thereby achieving the purpose of the wafer carrier 1 loading the wafers.

[0081] In some other embodiments, the wafer carrier 1 can also include one toothed member 11. A plurality of wafers are placed on other loading members, and the driving member drives the toothed member 11 to move towards the loading members so that the wafers are caught in the gaps of the toothed member 11.

[0082] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A silicon wafer carrier, characterized in that: The invention comprises a tooth tool, wherein the tooth tool comprises: a base; and A plurality of latch teeth are detachably connected to the base and arranged along a first direction, a gap is formed between two adjacent latch teeth and used for clamping a silicon wafer, and the latch teeth form line contact or point contact with the silicon wafer.

2. The silicon wafer carrier according to claim 1, characterized in that: The base is provided with a plurality of mounting holes along the first direction, and the plurality of latch teeth are detachably arranged in the plurality of mounting holes respectively.

3. The silicon wafer carrier according to claim 2, characterized in that: The mounting hole is provided with an internal thread, the latching tooth is provided with an external thread, and the latching tooth cooperates with the internal thread of the mounting hole through the external thread.

4. The silicon wafer carrier according to claim 2, characterized in that: The mounting hole is a light hole, and the latch is inserted into the light hole; the base is also provided with a plurality of threaded holes along a direction perpendicular to the mounting hole, the plurality of threaded holes correspond one-to-one to the plurality of light holes, and the threaded holes are connected to the light holes, and the tooth tool also includes a plurality of Kimi screws, which are respectively arranged in the plurality of threaded holes and abut against the latch.

5. The silicon wafer carrier according to claim 1, characterized in that: The latching teeth form a line contact with the silicon wafer, and the surface of the latching teeth used for contacting the silicon wafer is a convex arc surface.

6. The silicon wafer carrier according to claim 5, characterized in that: The clamping teeth include a clamping portion and a guiding portion. The clamping portion is in the shape of a cylinder and is used to clamp the silicon wafer. The guiding portion is arranged at one end of the clamping portion away from the base. The guiding portions of two adjacent clamping teeth are used to guide the silicon wafer to be clamped into the gap.

7. The silicon wafer carrier according to claim 6, characterized in that: The guide portion is a cone, the bottom of the cone is connected to one end of the clamping portion away from the base, and the side surface of the cone is used to guide the silicon wafer to be clamped into the gap.

8. The silicon wafer carrier according to claim 7, characterized in that: The length of the base in the first direction ranges from 329.95 mm to 330.05 mm, and / or the height of the cylinder ranges from 19.95 mm to 20.05 mm, and / or the height of the cone ranges from 9.95 mm to 10.05 mm.

9. The silicon wafer carrier according to claim 7, characterized in that: The radius of the cylinder is in the range of 2.5 mm to 2.7 mm.

10. The silicon wafer carrier according to any one of claims 1 to 9, characterized in that: The silicon wafer carrier includes two teeth, the teeth of the two teeth are opposite to each other, and the silicon wafer carrier also includes a driving member, which connects the two teeth and can drive the two teeth to move closer to or away from each other.

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