Wafer proton irradiation tray with stamping step

Abstract

The utility model discloses a wafer proton irradiation tray with stamping steps. The wafer proton irradiation tray comprises a tray and a plurality of groups of placing positions arranged on the tray, each group of placing positions comprises four groups of double-layer steps which are stamped on the tray and are distributed circularly; and each group of double-layer steps comprises a placing step for placing and supporting the wafer, so that a preset distance is formed between the wafer and the tray, the wafer is cushioned by a certain height through the placing step, and the influence of dust and other impurities on the surface of the tray on the wafer is reduced. And the positioning step is higher than the placement step, is positioned on one side of the placement step and is used for positioning the wafer. According to the utility model, the four groups of double-layer steps are designed to form the placement position, the wafer is cushioned to a certain height through the placement steps, the influence of dust and other impurities on the surface of the tray on the wafer is reduced, the positioning steps are used for positioning the position of the wafer, traditional copper screw positioning and fixing are replaced, the negative influence of free copper elements on the wafer is further avoided, and the service life of the wafer is prolonged. And impurities such as dust on the surface of the tray can pollute the wafer.

Description

Technical Field

[0001] The utility model relates to the field of semiconductors, in particular to a wafer proton irradiation tray with a stamping step. Background Art

[0002] A wafer tray is a device that places and transports wafers during proton irradiation.

[0003] The existing aluminum tray uses copper screws to position and fix the wafer. The free copper element in this way will have a negative impact on the wafer.

[0004] The wafer is in direct contact with the aluminum plate. Dust and other impurities on the surface of the aluminum plate will contaminate the wafer. In addition, since the wafer is in direct contact with the tray, the suction between the wafer and the aluminum plate makes the operation inconvenient.

[0005] The tray is very thin, and the copper screws are not firmly in contact with the tray surface and are easy to fall off;

[0006] Loading and unloading screws on large quantities of pallets is time-consuming and inefficient. Utility Model Content

[0007] Purpose of the utility model: to provide a wafer proton irradiation tray with a stamping step to solve the above-mentioned problems existing in the prior art.

[0008] Technical solution: A wafer proton irradiation tray with a stamping step, comprising:

[0009] A tray, and a plurality of sets of placement positions arranged on the tray;

[0010] Each set of placement positions includes four sets of double-layer steps punched in a circular pattern on the tray;

[0011] Each set of double steps includes:

[0012] The placement step is used to place and support the wafer so that there is a predetermined distance between the wafer and the tray. The wafer is raised to a certain height by the placement step to reduce the impact of dust and other impurities on the tray surface on the wafer.

[0013] The positioning step is higher than the placement step, located on one side of the placement step, and is used to locate the wafer position.

[0014] The utility model designs four groups of double-layer steps to form a placement position. The wafer is raised to a certain height by the placement steps to reduce the impact of dust and other impurities on the tray surface on the wafer. The positioning steps are used to locate the wafer position, replacing the traditional copper screw positioning and fixation, thereby avoiding the negative impact of free copper elements on the wafer and the pollution of the wafer by dust and other impurities on the tray surface.

[0015] In a further embodiment, the tray is made of aluminum alloy.

[0016] In a further embodiment, the tray is rectangular.

[0017] In a further embodiment, the placement locations are staggered on the tray.

[0018] In a further embodiment, the tray is provided with five groups of staggered placement positions, and the center distance between each group of placement positions is 161.5 mm.

[0019] Beneficial effects: The utility model discloses a wafer proton irradiation tray with a stamped step. The utility model designs four groups of double-layer steps to form a placement position. The wafer is raised to a certain height by the placement steps to reduce the influence of dust and other impurities on the tray surface on the wafer. The positioning step is used to locate the wafer position, replacing the traditional copper screw positioning and fixing, thereby avoiding the negative impact of free copper elements on the wafer, and the dust and other impurities on the tray surface may cause pollution to the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of the utility model.

[0021] Figure 2 It is a step schematic diagram of the utility model.

[0022] The accompanying drawings are marked as follows:

[0023] 1. Step; 11. Placement step; 12. Positioning step; 2. Wafer; 3. Tray. DETAILED DESCRIPTION

[0024] The present application relates to a wafer proton irradiation tray with a stamping step, which is explained in detail below through a specific implementation method.

[0025] A wafer proton irradiation tray with a stamped step, comprising:

[0026] A tray 3, and a plurality of groups of placement positions arranged on the tray 3;

[0027] Each set of placement positions includes four sets of double-layer steps 1 punched on the tray 3 and distributed in a circular shape;

[0028] Each set of double-layer steps 1 comprises:

[0029] The placement step 11 is used to place and support the wafer 2 so that the wafer 2 and the tray 3 have a predetermined distance. The wafer 2 is raised to a certain height by the placement step 11 to reduce the impact of impurities such as dust on the surface of the tray 3 on the wafer 2.

[0030] The positioning step 12 is higher than the placement step 11 and is located on one side of the placement step 11 , and is used to position the wafer 2 .

[0031] The utility model designs four groups of double-layer steps 1 to form a placement position, and the wafer 2 is raised to a certain height by the placement step 11 to reduce the influence of impurities such as dust on the surface of the tray 3 on the wafer 2. The positioning step 12 is used to position the wafer 2, replacing the traditional copper screw positioning and fixing, thereby avoiding the negative impact of free copper elements on the wafer 2, and the dust and other impurities on the surface of the tray 3 causing pollution to the wafer 2.

[0032] The tray is made of 3-dimensional aluminum alloy.

[0033] The tray 3 is rectangular.

[0034] The placement positions are staggeredly distributed on the tray 3 .

[0035] The tray 3 is provided with five groups of staggered placement positions, and the center distance between each group of placement positions is 161.5 mm.

[0036] Working principle description: When placing, the wafer 2 is placed on the placement step 11 of the four sets of double-layer steps 1. The wafer 2 is raised to a certain height by the placement step 11 to reduce the impact of dust and other impurities on the surface of the tray 3 on the wafer 2, and then the positioning step 12 is used to position the wafer 2.

[0037] The preferred embodiments of the present invention are described in detail above in conjunction with the accompanying drawings; however, the present invention is not limited to the specific details in the above embodiments. Within the technical concept of the present invention, various equivalent transformations can be made to the technical scheme of the present invention, and these equivalent transformations all belong to the protection scope of the present invention.

Claims

1. A wafer proton irradiation tray with a stamping step, comprising: A tray (3), and a plurality of groups of placement positions arranged on the tray (3); The invention is characterized in that each set of placement positions comprises four sets of double-layer steps (1) punched on the tray (3) and distributed in a circular shape; Each set of double-layer steps (1) comprises: A placement step (11) for placing and supporting the wafer (2) so that the wafer (2) and the tray (3) have a predetermined distance; The positioning step (12) is higher than the placement step (11), is located on one side of the placement step (11), and is used to position the wafer (2).

2. The wafer proton irradiation tray with a stamping step according to claim 1, characterized in that: The tray (3) is made of aluminum alloy.

3. The wafer proton irradiation tray with a stamping step according to claim 1, characterized in that: The tray (3) is rectangular.

4. The wafer proton irradiation tray with a stamping step according to claim 1, characterized in that: The placement positions are staggered and distributed on the tray (3).

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