Wafer turnover device
By setting a chute on the clamping block of the wafer flip device, a V-shaped structure abuts the wafer edge, the damage problem caused by the direct contact between the clamping end and the wafer surface in the prior art is solved, and a safer and more reliable wafer flip process is achieved.
Patent Information
- Application Number
- CN202421783201.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-26
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-07-26
AI Technical Summary
In the prior art, the gripping end of the device that clamps the wafer directly abuts the upper and lower surfaces of the wafer, which easily damages the wafer surface.
A wafer flip device is designed, by providing oblique chutes at the end of the clamping block to form a V-shaped structure, and abutting the edges of the wafer by using the oblique chutes to avoid direct contact with the wafer surface.
It effectively avoids scratches and other damages on the wafer surface, and improves safety and reliability during wafer flipping.
Smart Images
Figure CN222914779U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of flipping devices, in particular to a wafer flipping device. Background Art
[0002] Conventional wafers can be placed on a frame, which is used to carry the wafers and facilitate the transfer of the wafers. The wafers must be turned over according to the front and back processes. When the wafers need to be turned over, a mechanical arm is usually used to clamp the frame and the wafer and turn it 180 degrees. Since the frame and the wafer have a certain weight, turning them with a mechanical arm is prone to accidents such as falling, which in turn causes damage to the frame and the wafer.
[0003] Furthermore, in the prior art, the clamping end of the device for clamping the wafer for flipping often directly contacts the upper and lower surfaces of the wafer, making the wafer surface susceptible to scratches or other damages. Utility Model Content
[0004] The utility model aims to provide a wafer flipping device to solve the problem in the prior art that the clamping end of the device for clamping the wafer for flipping directly abuts against the upper and lower surfaces of the wafer, which easily damages the surface of the wafer.
[0005] The technical solution of the utility model is: a wafer flipping device, comprising a base, on which clamping arms are arranged, the clamping arms are arranged in pairs, and a clamping surface for clamping the wafer is formed between the pair of clamping arms;
[0006] The clamping arm includes a clamping block arranged at the end, and the adjacent clamping blocks on a pair of clamping arms perform opening and closing movements driven by the clamping arm to achieve the clamping function;
[0007] Any of the clamping arms has three or more clamping blocks, and an oblique groove is provided at one end of the clamping block close to the clamping surface. The oblique grooves between adjacent clamping blocks form a V-shaped structure, the oblique grooves abut against the wafer, and the opening of the V-shaped structure formed by any pair of oblique grooves is set toward the center point of the clamping arm.
[0008] Preferably, there is at least one clamping block on both sides of any vertical section passing through the center point of the clamping arm.
[0009] Preferably, in a pair of clamping blocks for cooperative clamping, one of the clamping blocks is provided with a boss, and the other clamping block is provided with a groove corresponding to the boss, and when adjacent clamping blocks abut against two ends of the wafer, the boss is embedded in the groove.
[0010] Preferably, the clamping arm is configured as a three-pointed star structure.
[0011] Preferably, the clamping arm is configured as an X-shaped structure.
[0012] Preferably, the base is arranged in the horizontal direction, and a mounting frame is arranged on it, a flip clamping assembly is installed at a vertical end of the mounting frame, a pair of clamping arms are connected to the flip clamping assembly, and rotate around a horizontal axis and perform opening and closing movements under the drive of the flip clamping assembly.
[0013] Preferably, the flipping and clamping assembly comprises a flipping mechanism and a clamping drive mechanism, the flipping mechanism comprises a rotating shaft driven by a flipping motor, the axis of the rotating shaft is horizontal and fixed to the clamping drive mechanism;
[0014] The clamping drive mechanism comprises a clamping cylinder, which is perpendicular to the axis of the rotating shaft and rotates with the rotating shaft. The two execution ends of the clamping cylinder perform opening and closing movements in a direction perpendicular to the clamping surface and are connected to the clamping arm.
[0015] Preferably, the flip clamping assembly further comprises a shell, and the inside and outside of the shell are respectively fixed to the clamping cylinder and the rotating shaft;
[0016] A connecting rod is also provided, one end of which is fixed to the execution end of the clamping cylinder, and the other end of which passes through the shell and is fixed at the midpoint of the clamping arm.
[0017] Preferably, the shell is provided with an avoidance groove for the connecting rod to pass through and provide space for its movement.
[0018] Compared with the prior art, the advantages of the utility model are: the utility model provides an oblique groove at one end of the clamping block, so that a V-shaped structure is formed at the oblique grooves of the adjacent clamping blocks in a pair of clamping arms, and the V-shaped structure abuts against the edge of the wafer, thereby avoiding contact with the upper and lower surfaces of the wafer, thereby avoiding damage to the surface of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The utility model is further described below in conjunction with the accompanying drawings and embodiments:
[0020] Figure 1 This is a structural diagram of a wafer flipping device described in the utility model;
[0021] Figure 2 This is a structural diagram of a wafer flipping device described in the utility model;
[0022] Figure 3 This is a top view of a wafer flipping device described in the utility model;
[0023] Figure 4 This is a structural diagram of the clamping block of the utility model;
[0024] Figure 5 This is a structural diagram of the clamping block of the utility model;
[0025] Wherein: 1. base, 2. mounting frame, 3. flip clamping assembly, 31. flip mechanism, 311. flip motor, 312. rotating shaft, 32. clamping drive mechanism, 321. clamping cylinder, 322. connecting rod, 33. shell, 34. avoidance groove, 4. clamping arm, 5. clamping block, 51. inclined groove, 52. boss, 53. groove, 6. wafer. DETAILED DESCRIPTION
[0026] The following is a further detailed description of the present invention in conjunction with specific embodiments:
[0027] like Figure 1 - Figure 3 As shown, a wafer flipping device includes a base 1, which is arranged in the horizontal direction to provide support for the device. A mounting frame 2 is fixed on the base 1 in the vertical direction, and a flip clamping assembly 3 is installed on a vertical side wall of the mounting frame 2. A pair of clamping arms 4 are arranged at one end of the flip clamping assembly 3 away from the mounting frame 2. A clamping surface of a wafer 6 is formed between the pair of clamping arms 4, and the wafer 6 is clamped by opening and closing movements, and rotates around a horizontal axis with the flip clamping assembly 3.
[0028] Specifically, the clamping arm 4 includes a clamping block 5 disposed at the end, and the adjacent clamping blocks 5 between a pair of clamping arms 4 perform opening and closing movements driven by the clamping arm 4 to clamp the wafer 6 .
[0029] like Figure 4 - Figure 5 As shown, in order to avoid scratches or other damage to the surface of the wafer 6 during clamping, an oblique groove 51 is provided at one end of the clamping block 5 close to the clamping surface, and the oblique grooves 51 between adjacent clamping blocks 5 form a V-shaped structure, and the opening of the V-shaped structure formed by any pair of oblique grooves 51 is arranged toward the center point of the clamping arm 4. When a pair of clamping blocks 5 clamp the wafer 6, the oblique grooves 51 abut against the upper and lower edges of the wafer 6, thereby avoiding contact between the clamping blocks 5 and the upper and lower surfaces of the wafer 6.
[0030] In order to prevent the upper and lower clamping arms 4 from sliding relative to each other when clamping the wafer 6, one of the two clamping blocks 5 that cooperate with each other is provided with a boss 52, and the other corresponding to the boss 52 is provided with a groove 53. When the two clamping blocks 5 clamp the workpiece, the boss 52 is embedded in the groove 53 to avoid relative displacement of the upper and lower clamping arms 4 in the radial direction.
[0031] In this embodiment, if Figure 3As shown, the clamping arm 4 for clamping the wafer 6 is set to an X-shaped structure, and four clamping blocks 5 are installed at the end of any clamping arm 4. In other embodiments, the clamping arm 4 can also be set to a three-pointed star structure or a star structure with more branches. It is only necessary to ensure that there is at least one clamping block 5 on both sides of any vertical section passing through the center point of the clamping arm 4, so as to ensure that the wafer 6 is not easy to slide off from one side.
[0032] like Figure 1 and Figure 2 As shown, the flip clamping assembly 3 includes a housing 33, a flip mechanism 31 and a clamping drive mechanism 32, wherein the flip mechanism 31 includes a rotating shaft 312 driven by a flip motor 311, the axis of the rotating shaft 312 is horizontal and passes through the mounting frame 2 and is fixed to the housing 33. The clamping drive mechanism 32 is fixed inside the housing 33, and includes a clamping cylinder 321, the clamping cylinder 321 is connected to the rotating shaft 312 at a perpendicular axis, and has two actuator ends on the left and right sides, the two actuator ends perform opening and closing movements perpendicular to the clamping surface, and are moved by the following steps: Figure 3 The connecting rod 322 shown is connected to the two clamping arms 4 respectively, thereby driving the pair of clamping arms 4 to open and close. One end of the connecting rod 322 away from the clamping cylinder 321 is connected to the midpoint of the clamping arm 4, as shown in FIG. Figure 1 As shown, a side of the housing 33 close to the clamping arm 4 is provided with an avoidance groove 34 for the connecting rod 322 to pass through and to provide space for the connecting rod 322 to move with the clamping cylinder 321 .
[0033] The above embodiments are only for illustrating the technical concept and features of the utility model, and their purpose is to enable people familiar with this technology to understand the content of the utility model and implement it accordingly, and they cannot be used to limit the protection scope of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and the utility model can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is limited by the attached claims rather than the above description, so it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the utility model.
Claims
1. A wafer flipping device, characterized in that: It comprises a base (1), on which a clamping arm (4) is arranged, the clamping arm (4) being arranged in pairs, and a clamping surface for clamping a wafer (6) is formed between the pair of clamping arms (4); The clamping arm (4) comprises a clamping block (5) arranged at an end portion, and adjacent clamping blocks (5) on a pair of clamping arms (4) perform opening and closing movements driven by the clamping arm (4) to achieve a clamping function; Any of the clamping arms (4) has three or more clamping blocks (5), and an end of the clamping block (5) close to the clamping surface is provided with an oblique groove (51), and the oblique grooves (51) between adjacent clamping blocks (5) form a V-shaped structure, the oblique grooves (51) abut against the wafer (6), and the opening of the V-shaped structure formed by any pair of oblique grooves (51) is arranged toward the center point of the clamping arm (4).
2. The wafer flipping device according to claim 1, characterized in that: There is at least one clamping block (5) on both sides of any vertical cross section passing through the center point of the clamping arm (4).
3. The wafer flipping device according to claim 2, characterized in that: In a pair of clamping blocks (5) for cooperating clamping, one of the clamping blocks (5) is provided with a boss (52), and the other clamping block (5) is provided with a groove (53) corresponding to the boss (52); when the adjacent clamping blocks (5) abut against two ends of a wafer (6), the boss (52) is embedded in the groove (53).
4. The wafer flipping device according to claim 3, characterized in that: The clamping arm (4) is configured as a three-pronged star structure.
5. The wafer flipping device according to claim 3, characterized in that: The clamping arm (4) is configured as an X-shaped structure.
6. A wafer flipping device according to claim 4 or 5, characterized in that: The base (1) is arranged in the horizontal direction, and a mounting frame (2) is arranged on it. A flip clamping assembly (3) is mounted on a vertical end of the mounting frame (2). A pair of clamping arms (4) are connected to the flip clamping assembly (3) and rotate around a horizontal axis and perform an opening and closing movement under the drive of the flip clamping assembly (3).
7. The wafer flipping device according to claim 6, characterized in that: The flipping and clamping assembly (3) comprises a flipping mechanism (31) and a clamping drive mechanism (32); the flipping mechanism (31) comprises a rotating shaft (312) driven by a flipping motor (311); the axis of the rotating shaft (312) is horizontal and fixed to the clamping drive mechanism (32); The clamping drive mechanism (32) comprises a clamping cylinder (321), the clamping cylinder (321) being perpendicular to the axis of the rotating shaft (312) and rotating along the rotating shaft (312), and the two actuating ends of the clamping cylinder (321) performing opening and closing movements in a direction perpendicular to the clamping surface and being connected to the clamping arm (4).
8. The wafer flipping device according to claim 7, characterized in that: The flip clamping assembly (3) further comprises a shell (33), the inside and outside of the shell (33) being fixed to the clamping cylinder (321) and the rotating shaft (312) respectively; A connecting rod (322) is also provided, one end of the connecting rod (322) being fixed to the actuating end of the clamping cylinder (321), and the other end of the connecting rod (322) passing through the housing (33) and being fixed to the midpoint of the clamping arm (4).
9. The wafer flipping device according to claim 8, characterized in that: The housing (33) is provided with an avoidance groove (34) for the connecting rod (322) to pass through and to provide space for its movement.