Semiconductor splitter production clamping device

Abstract

The utility model relates to the technical field of semiconductor splitter production, in particular to a semiconductor splitter production clamping device which comprises a base, a placing bin is fixedly installed at the upper end of the base, a first limiting plate is fixedly installed at the left end of the inner side of the placing bin, and a sliding groove is formed in the position, above the first limiting plate, of the inner side of the placing bin. A first lead screw and a sliding block are arranged on the inner side of the sliding groove, the left end of the sliding block extends to the outer side of the sliding groove to be fixedly provided with a second limiting plate, a limiting hole is formed in the left side of the containing bin, a sliding rod is arranged on the inner side of the limiting hole, and a handle is fixedly installed on the side of the left end of the sliding rod. A second lead screw and a limiting block are arranged on the inner side of the movable groove. According to the utility model, the screw rod I is driven to rotate by rotating the knob I, so that the sliding block drives the limiting plate II to be matched with the limiting plate I, the front and back directions of the semiconductor dividers are limited, and the stacking uniformity of the semiconductor dividers and the stability of subsequent clamping are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor discrete device production, in particular to a clamping device for semiconductor discrete device production. Background Art

[0002] Semiconductor discrete devices generally refer to semiconductor crystal diodes, semiconductor triodes and semiconductor special devices, which are widely used in consumer electronics, computers and peripherals, network communication, automotive electronics, LED displays and other fields. In the production and processing of semiconductor discrete devices, a clamping device is required to fix the semiconductor discrete devices to assist the production and processing;

[0003] For example, the patent No. CN220233157U discloses a clamping device for semiconductor discrete device production, which relates to the technical field of semiconductor part production equipment, including a housing, and a clamping groove opened on the inner wall of the housing. It also includes a measuring unit arranged inside the clamping groove and an adjusting unit arranged inside the housing; the measuring unit includes two clamping plates symmetrically arranged inside the clamping groove, a limiting plate vertically arranged on the back of the clamping plate, a measuring component arranged at the top of the clamping plate and the limiting plate, and an auxiliary component arranged inside the clamping plate; the adjusting unit includes placing grooves symmetrically opened on both sides inside the housing, a plurality of extension grooves communicated with one side of the placing groove, and a moving component arranged inside the extension groove; when the clamping device for semiconductor discrete device production in this patent is in use, it lacks an auxiliary stacking structure, resulting in the semiconductor discrete devices being prone to offset and tilt during the stacking process, affecting the clamping stability and measurement accuracy.

[0004] Therefore, aiming at the problem that the clamping device for semiconductor discrete device production lacks an auxiliary stacking structure, affecting the clamping stability and measurement accuracy, a clamping device for semiconductor discrete device production can be designed. By adding a limiting structure in the front and back directions of the semiconductor discrete device, the stacking of the semiconductor discrete devices is made more neat and stable, improving the clamping stability and measurement accuracy. Summary of the Utility Model

[0005] In order to overcome the problem that the clamping device for semiconductor discrete device production lacks an auxiliary stacking structure, affecting the clamping stability and measurement accuracy.

[0006] The technical solution of the present utility model is as follows: A clamping device for semiconductor discrete device production, comprising a base, on the upper end of the base is fixedly installed a placement bin, on the left end inside the placement bin is fixedly installed a first limiting plate, above the first limiting plate inside the placement bin is provided a chute, inside the chute are provided a first lead screw and a slider, the left end of the slider extends to the outside of the chute and is fixedly installed with a second limiting plate, on the left side of the placement bin is provided a limiting hole, inside the limiting hole is provided a sliding rod, on the side of the left end of the sliding rod is fixedly installed a handle, on the surface of the sliding rod is provided a movable groove, inside the movable groove are provided a second lead screw and a limiting block, the right end of the sliding rod extends to the inside of the placement bin and is rotatably connected with a push plate, and on the right side of the push plate is provided a clamping plate.

[0007] Preferably, the front and rear ends of the first lead screw are rotatably connected with the inner wall of the chute, the front end of the first lead screw extends to the front side of the placement bin and is fixedly installed with a first knob, the left end of the slider is threadedly connected with the surface of the first lead screw and is slidably connected with the inside of the chute, which is convenient for controlling the forward and backward movement of the slider.

[0008] As a preference, the first limiting plate is designed in an L-shaped structure, the right side of the second limiting plate is slidably connected with the surface of the first limiting plate, the lower end of the second limiting plate is slidably connected with the inside of the placement bin, and on the front side of the second limiting plate is fixedly installed a first scale, which is convenient for controlling the cooperation of the second limiting plate and the first limiting plate to limit the semiconductor discrete device in the front and back directions, and at the same time is convenient for measuring the stacking height.

[0009] As a preference, the sliding rod is slidably connected with the inside of the limiting hole, the movable groove is arranged through the surface of the sliding rod, the left and right ends of the second lead screw are rotatably connected with the inner wall of the movable groove, the left end of the second lead screw extends to the left side of the sliding rod and is fixedly installed with a second knob, which is convenient for controlling the rotation of the second lead screw.

[0010] As a preference, the limiting block is slidably connected with the inside of the movable groove and is threadedly connected with the surface of the second lead screw, grooves are opened at the upper and lower ends of the limiting hole, both ends of the limiting block extend to the outside of the movable groove and are mutually adapted with the inside of the grooves, which is convenient for adjusting the position of the limiting block according to the size of the semiconductor discrete device to limit the push plate.

[0011] As a preference, the right side of the push plate and the clamping plate are elastically connected by a spring telescopic rod, the lower end of the clamping plate is slidably connected with the inside of the placement bin, and on the upper end of the clamping plate is fixedly installed a second scale, which is convenient for clamping the semiconductor discrete device and measuring the length in the front and back directions.

[0012] As a preference, on the rear end inside the placement bin is fixedly installed a third scale, on the upper end of the rear side of the clamping plate is fixedly installed a pointer, and the pointer is mutually adapted with the front side of the third scale, which is convenient for measuring the length of the semiconductor discrete device in the left and right directions.

[0013] The beneficial effects of the present utility model:

[0014] 1. The semiconductor discrete device production clamping device drives the first lead screw to rotate by rotating the first knob, so that the slider drives the second limiting plate to cooperate with the first limiting plate to limit the front and back directions of the semiconductor discrete device, improving the stacking neatness of the semiconductor discrete device and the stability of subsequent clamping.

[0015] 2. The semiconductor discrete device production clamping device drives the clamping plate to fit against the left side of the semiconductor discrete device by pushing the handle, so that the limiting block passes through the limiting hole and the groove and enters the inner side of the placement bin. Rotate the handle to misalign the limiting block with the groove. Drive the second lead screw to rotate by rotating the second knob to adjust the position of the limiting block, so that the limiting block abuts against the left inner wall of the placement bin, thereby driving the push plate to squeeze the spring telescopic rod to achieve stable clamping and limiting of the semiconductor discrete device. Subsequently, the limiting block can be aligned with the groove by rotating the handle, which is convenient for driving the clamping plate to quickly disengage from the semiconductor discrete device, facilitating the removal of the semiconductor discrete device. At the same time, the position of the limiting block is predetermined, which is convenient for clamping the semiconductor discrete device of the same size next time. Description of the Drawings

[0016] Figure 1 Shown is the three-dimensional structure schematic diagram of the semiconductor discrete device production clamping device of the present invention Figure 1 ;

[0017] Figure 2 Shown is the three-dimensional structure schematic diagram of the semiconductor discrete device production clamping device of the present invention Figure 2 ;

[0018] Figure 3 Shown is the three-dimensional structure schematic diagram of the semiconductor discrete device production clamping device of the present invention Figure 3 ;

[0019] Figure 4 Shown is the sectional three-dimensional structure schematic diagram of the semiconductor discrete device production clamping device of the present invention.

[0020] Description of the reference numerals: 1. Base; 2. Placement bin; 21. Scale three; 3. First limiting plate; 4. Slide groove; 5. First lead screw; 51. First knob; 6. Slider; 7. Second limiting plate; 71. Scale one; 8. Limiting hole; 81. Groove; 9. Slide bar; 10. Handle; 11. Activity groove; 12. Second lead screw; 121. Second knob; 13. Limiting block; 14. Push plate; 141. Spring telescopic rod; 15. Clamping plate; 151. Scale two; 152. Pointer. Detailed Embodiment

[0021] The present invention will be further described below with reference to the drawings and embodiments.

[0022] Please refer to ( Figures 1-4) An embodiment provided by the present utility model is: a clamping device for semiconductor discrete device production, including a base 1, characterized in that: a placement bin 2 is fixedly installed at the upper end of the base 1, a first limiting plate 3 is fixedly installed at the left end inside the placement bin 2, a chute 4 is opened above the first limiting plate 3 inside the placement bin 2, a first lead screw 5 and a slider 6 are arranged inside the chute 4, the left end of the slider 6 extends to the outside of the chute 4 and is fixedly installed with a second limiting plate 7, a limiting hole 8 is opened on the left side of the placement bin 2, a sliding rod 9 is arranged inside the limiting hole 8, a handle 10 is fixedly installed on the side of the left end of the sliding rod 9, an activity groove 11 is opened on the surface of the sliding rod 9, a second lead screw 12 and a limiting block 13 are arranged inside the activity groove 11, the right end of the sliding rod 9 extends to the inside of the placement bin 2 and is rotatably connected with a push plate 14, and a clamping plate 15 is arranged on the right side of the push plate 14.

[0023] Please refer to ( Figures 2-3 ) In this embodiment, the front and rear ends of the first lead screw 5 are rotatably connected to the inner wall of the chute 4, the front end of the first lead screw 5 extends to the front side of the placement bin 2 and is fixedly installed with a first knob 51, the left end of the slider 6 is threadedly connected to the surface of the first lead screw 5 and is slidably connected to the inside of the chute 4, the first limiting plate 3 is designed in an L-shaped structure, the right side of the second limiting plate 7 is slidably connected to the surface of the first limiting plate 3, the lower end of the second limiting plate 7 is slidably connected to the inside of the placement bin 2, and a first scale 71 is fixedly installed on the front side of the second limiting plate 7. The semiconductor discrete devices are stacked inside the placement bin 2 so that their right sides are in contact with the first limiting plate 3. By rotating the first knob 51 to drive the first lead screw 5 to rotate, the slider 6 drives the second limiting plate 7 to cooperate with the first limiting plate 3 to limit the semiconductor discrete devices in the front and rear directions.

[0024] Please refer to ( Figures 1-4) In this embodiment, the sliding rod 9 is slidably connected to the inner side of the limiting hole 8. The movable groove 11 is provided through the surface of the sliding rod 9. The left and right ends of the second lead screw 12 are rotatably connected to the inner wall of the movable groove 11. The left end of the second lead screw 12 extends to the left side of the sliding rod 9 and is fixedly installed with a second knob 121. The limiting block 13 is slidably connected to the inner side of the movable groove 11 and is threadedly connected to the surface of the second lead screw 12. Grooves 81 are opened at the upper and lower ends of the limiting hole 8. The two ends of the limiting block 13 extend to the outside of the movable groove 11 and are adapted to the inner sides of the grooves 81. The right side of the push plate 14 and the clamping plate 15 are elastically connected by a spring telescopic rod 141. The lower end of the clamping plate 15 is slidably connected to the inner side of the placement bin 2. A second scale 151 is fixedly installed at the upper end of the clamping plate 15. A third scale 21 is fixedly installed at the rear end of the inner side of the placement bin 2. A pointer 152 is fixedly installed at the upper end of the rear side of the clamping plate 15. The pointer 152 is adapted to the front side of the third scale 21. By pushing the handle 10, the clamping plate 15 is brought into contact with the left side of the semiconductor discrete device, so that the limiting block 13 passes through the limiting hole 8 and the groove 81 and enters the inner side of the placement bin 2. After the handle 10 is rotated to the front side, the limiting block 13 is misaligned with the groove 81. By rotating the second knob 121 to drive the second lead screw 12 to rotate and adjust the position of the limiting block 13, the limiting block 13 abuts against the left inner wall of the placement bin 2, thereby driving the push plate 14 to squeeze the spring telescopic rod 141 to achieve stable clamping and limiting of the semiconductor discrete device. At this time, the stacking height of the semiconductor discrete device can be measured by the first scale 71, the front and rear length of the semiconductor discrete device can be measured by the second scale 151, and the left and right width of the semiconductor discrete device can be measured by the cooperation of the pointer 152 and the third scale 21.

[0025] When working, stack the semiconductor discrete devices inside the placement bin 2 so that their right sides are in contact with the limiting plate 3. Rotate the knob 51 to drive the lead screw 5 to rotate, so that the slider 6 drives the limiting plate 2 7 to cooperate with the limiting plate 3 to limit the front and back directions of the semiconductor discrete devices, improving the stacking neatness of the semiconductor discrete devices and the stability of subsequent clamping. Then, push the handle 10 to drive the clamping plate 15 to fit against the left side of the semiconductor discrete device, so that the limiting block 13 passes through the limiting hole 8 and the groove 81 and enters the inside of the placement bin 2. After rotating the handle 10 to the front side, the limiting block 13 is misaligned with the groove 81. Rotate the knob 2 121 to drive the lead screw 2 12 to rotate and adjust the position of the limiting block 13 so that the limiting block 13 abuts against the left inner wall of the placement bin 2, thereby driving the push plate 14 to squeeze the spring telescopic rod 141 to achieve stable clamping and limiting of the semiconductor discrete device. At this time, the stacking height of the semiconductor discrete device can be measured through the scale 1 71, the front and back length of the semiconductor discrete device can be measured through the scale 2 151, and the left and right width of the semiconductor discrete device can be measured through the cooperation of the pointer 152 and the scale 3 21, which is convenient and fast. Subsequently, the handle 10 can be rotated to align the limiting block 13 with the groove 81, which is convenient for driving the clamping plate 15 to quickly disengage from the semiconductor discrete device, facilitating the removal of the semiconductor discrete device. At the same time, the position of the limiting block 13 is predetermined, which is convenient for clamping the semiconductor discrete devices of the same size next time.

[0026] Through the above steps, the slider 6 drives the limiting plate 2 7 to cooperate with the limiting plate 3 to limit the front and back directions of the semiconductor discrete devices, improving the stacking neatness of the semiconductor discrete devices and the stability of subsequent clamping, so as to solve the problem that the clamping device for semiconductor discrete device production lacks an auxiliary stacking structure, which affects the clamping stability and measurement accuracy.

Claims

1. A semiconductor discrete device production clamping device, comprising a base (1), characterized in that: A placement bin (2) is fixedly installed on the upper end of the base (1), a limiting plate (3) is fixedly installed on the left end of the inner side of the placement bin (2), a slide groove (4) is provided on the inner side of the placement bin (2) above the limiting plate (3), a screw rod (5) and a slider (6) are provided on the inner side of the slide groove (4), the left end of the slider (6) extends to the outer side of the slide groove (4) and a limiting plate (7) is fixedly installed thereon, and a limiting hole (7) is provided on the left side of the placement bin (2). 8), a sliding rod (9) is arranged on the inner side of the limiting hole (8), a handle (10) is fixedly installed on the side of the left end of the sliding rod (9), a movable groove (11) is opened on the surface of the sliding rod (9), a screw rod (12) and a limiting block (13) are arranged on the inner side of the movable groove (11), the right end of the sliding rod (9) extends to the inner side of the placement bin (2) and is rotatably connected to a push plate (14), and a clamping plate (15) is arranged on the right side of the push plate (14).

2. A semiconductor discrete device production clamping device according to claim 1, characterized in that: The front and rear ends of the screw rod (5) are rotatably connected to the inner wall of the slide groove (4); the front end of the screw rod (5) extends to the front side of the placement bin (2) and is fixedly mounted with a knob (51); the left end of the slider (6) is threadedly connected to the surface of the screw rod (5) and is slidably connected to the inner side of the slide groove (4).

3. A semiconductor discrete device production clamping device according to claim 1, characterized in that: The limiting plate 1 (3) is designed in an L-shaped structure, the right side of the limiting plate 2 (7) is slidably connected to the surface of the limiting plate 1 (3), the lower end of the limiting plate 2 (7) is slidably connected to the inner side of the placement bin (2), and the front side of the limiting plate 2 (7) is fixedly mounted with a scale 1 (71).

4. A semiconductor discrete device production clamping device according to claim 1, characterized in that: The sliding rod (9) is slidably connected to the inner side of the limiting hole (8), the movable groove (11) is arranged to penetrate the surface of the sliding rod (9), the left and right ends of the second screw rod (12) are rotatably connected to the inner wall of the movable groove (11), and the left end of the second screw rod (12) extends to the left side of the sliding rod (9) and is fixedly installed with a second knob (121).

5. The semiconductor discrete device production clamping device according to claim 1, characterized in that: The limit block (13) is slidably connected to the inner side of the movable groove (11) and is threadedly connected to the surface of the second screw rod (12). The upper and lower ends of the limit hole (8) are provided with grooves (81). The two ends of the limit block (13) extend to the outer side of the movable groove (11) and are mutually adapted to the inner side of the groove (81).

6. The semiconductor discrete device production clamping device according to claim 1, characterized in that: The right side of the push plate (14) and the clamping plate (15) are elastically connected via a spring telescopic rod (141), the lower end of the clamping plate (15) is slidably connected to the inner side of the placement bin (2), and a second scale (151) is fixedly mounted on the upper end of the clamping plate (15).

7. A semiconductor discrete device production clamping device according to claim 1, characterized in that: A scale ruler 3 (21) is fixedly mounted on the rear end of the inner side of the placement bin (2), and a pointer (152) is fixedly mounted on the upper end of the rear side of the clamping plate (15), and the pointer (152) and the front side of the scale ruler 3 (21) are adapted to each other.

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