Heat dissipation type IGBT module and frequency converter

Abstract

The utility model discloses a heat radiation type IGBT module and a frequency converter, the heat radiation type IGBT module comprises an IGBT module body, the side edge of the IGBT module body is provided with pins, and the heat radiation surface of the IGBT module body is provided with an open accommodating cavity used for filling heat conduction glue. According to the IGBT module, the open container capable of being filled with the heat-conducting glue is arranged on the heat dissipation surface of the IGBT module body, the heat-conducting glue is directly contacted with the heat dissipation surface for heat dissipation, the structure arrangement is simple, other parts do not need to be installed, and the heat dissipation cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of refrigeration compressor production, and particularly relates to a heat-dissipating IGBT module and an inverter. Background Art

[0002] In a refrigeration compressor, the main function of an inverter is to adjust the operating speed of a motor to achieve precise control of the compressor. The IGBT module on the inverter plays a key role in power conversion and control. The IGBT module generates a certain amount of heat during operation. Therefore, good heat dissipation performance is very important for ensuring the stable operation and service life of the inverter.

[0003] In the prior art, the common heat dissipation method of the IGBT module is to install a heat dissipation fan to enhance the heat dissipation effect. The heat dissipation fan conducts air convection on the heat sink to accelerate the dissipation of heat, thereby reducing the operating temperature of the IGBT module; or a heat conduction gasket is used to conduct the heat generated by the IGBT module to the heat dissipation plate for heat dissipation. However, the heat dissipation methods of installing a heat dissipation fan or a heat conduction gasket have high costs and require extra parts. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a heat-dissipating IGBT module and an inverter for the problems existing in the prior art. The utility model has a simple structure, does not require the installation between other components, has good heat dissipation performance, and effectively reduces the heat dissipation cost at the same time.

[0005] To achieve the above purpose, the technical solution adopted by the utility model is: According to one aspect of the utility model, the utility model provides a heat-dissipating IGBT module, which includes an IGBT module body. Pins are arranged on the side of the IGBT module body, and an open receiving cavity for filling heat-conducting glue is arranged on the heat dissipation surface of the IGBT module body.

[0006] By arranging the open receiving cavity capable of filling heat-conducting glue on the heat dissipation surface of the IGBT module body, the heat generated by the IGBT module body is conducted by the heat-conducting glue for heat dissipation. The structure is simply arranged, does not require the installation between other components, has good heat dissipation performance, and reduces the heat dissipation cost at the same time.

[0007] Furthermore, the axial section of the open receiving cavity is trapezoidal, and the opening area at the upper end of the open receiving cavity is larger than the opening area at the bottom end. By increasing the opening area at the upper end of the open receiving cavity, it helps to increase the heat dissipation area of the heat-conducting glue and improves the heat dissipation effect of the IGBT module body.

[0008] Further, the included angle between the side wall of the open accommodating cavity 3 and the vertical direction is 10° to 30°. By controlling the inclination angle of the side wall of the open accommodating cavity, it is avoided that the thermal conductive adhesive in the open accommodating cavity is too heavy and damages the IGBT module body.

[0009] Further, a bevel is provided at the inner edge of the upper opening of the open accommodating cavity. By providing the bevel at the inner edge of the upper opening of the open accommodating cavity, the heat dissipation area of the thermal conductive adhesive is further increased, and the heat dissipation effect is improved.

[0010] Further, the end face of the bottom end of the open accommodating cavity is connected to the surface of the heat dissipation surface; or, the end face of the bottom end of the open accommodating cavity is lower than the heat dissipation surface, and the inner side surface of the open accommodating cavity is connected to the outer peripheral surface of the IGBT module body.

[0011] By the end face of the bottom end of the open accommodating cavity being lower than or connected to the heat dissipation surface, the contact area between the thermal conductive adhesive and the heat dissipation surface is ensured, and the heat dissipation effect of the IGBT module body is effectively improved.

[0012] According to another aspect of the present invention, the present invention provides an inverter, including a heat dissipation plate, a frequency conversion board, and the heat dissipation type IGBT module. A plurality of the heat dissipation type IGBT modules are arranged on the frequency conversion board. The open accommodating cavity is filled with a thermal conductive adhesive, and the heat dissipation plate is arranged on the side where the open accommodating cavity is filled with the thermal conductive adhesive.

[0013] Heat dissipation is performed by the thermal conductive adhesive provided on the heat dissipation type IGBT module in contact with the heat dissipation plate, improving the working performance of the frequency conversion board. At the same time, the heat dissipation plate covers the upper opening of the open accommodating cavity to prevent the thermal conductive adhesive accommodated inside the open accommodating cavity from overflowing.

[0014] Further, the heat dissipation type IGBT module is connected to the frequency conversion board through the pins, and a plurality of the heat dissipation type IGBT modules are arranged in an array on the frequency conversion board.

[0015] The pins are used to transmit electrical signals. The array arrangement of a plurality of the heat dissipation type IGBT modules helps the heat dissipation type IGBT modules dissipate heat, avoiding excessive heat generation at local areas and insufficient heat dissipation space when arranged irregularly, which is not conducive to the working performance of the inverter.

[0016] Compared with the prior art, the beneficial effects of the present utility model are as follows: 1. By providing an open accommodating cavity capable of filling thermal conductive adhesive on the heat dissipation surface of the IGBT module body, the heat generated by the IGBT module body is conducted by the thermal conductive adhesive for heat dissipation. The structure is simple, without the need for installation between other components, having good heat dissipation performance and reducing the heat dissipation cost at the same time. 2. By increasing the area of the upper opening of the open accommodating cavity, it helps to increase the heat dissipation area of the thermal conductive adhesive and improve the heat dissipation effect of the IGBT module body. 3. For a frequency converter using a heat dissipating IGBT module, heat dissipation is carried out through the thermal conductive adhesive provided on the heat dissipating IGBT module, improving the working performance of the frequency conversion board. The heat dissipation board abuts against the upper end of the open accommodating cavity, transferring the heat generated by the IGBT module body to the heat dissipation board through the thermal conductive adhesive for heat dissipation. At the same time, the heat dissipation board covers the upper opening of the open accommodating cavity to prevent the thermal conductive adhesive contained inside the open accommodating cavity from overflowing. Description of the Drawings

[0017] Figure 1 It is a schematic structural diagram of a heat dissipating IGBT module of the present utility model;

[0018] Figure 2 It is a first structural sectional view of a heat dissipating IGBT module of the present utility model;

[0019] Figure 3 It is a second structural sectional view of a heat dissipating IGBT module of the present utility model;

[0020] Figure 4 It is a structural sectional view of a frequency converter of the present utility model;

[0021] Figure 5 It is a plan layout diagram of a heat dissipating IGBT module of a frequency converter of the present utility model.

[0022] In the figure: 1. IGBT module body; 101. Heat dissipation surface; 2. Pin; 3. Open accommodating cavity; 4. Bevel; 5. Heat dissipation board; 6. Frequency conversion board; 7. Heat dissipating IGBT module. Detailed Embodiments

[0023] Next, the technical solutions of the present utility model will be clearly and completely described in conjunction with the drawings in the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative work conditions belong to the scope of protection of the present utility model.

[0024] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by terms such as "middle", "upper", "lower", "left", "right", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model.

[0025] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0026] The following combines Figures 1 to 5 , through specific embodiments and their application scenarios, to describe in detail a heat dissipation type IGBT module and an inverter provided by an embodiment of the present utility model.

[0027] Embodiment 1, as Figures 1 - 3 shown, the present utility model provides a heat dissipation type IGBT module 7, which includes an IGBT module body 1. Pins 2 are arranged on the side of the IGBT module body 1. A heat dissipation surface 101 is arranged on the IGBT module body 1, and an open receiving cavity 3 for filling thermal conductive glue is arranged on the heat dissipation surface 101. As Figure 1 shown, the open receiving cavity 3 is a basket-like structure with a trapezoidal peripheral side. The bottom end of the open receiving cavity 3 is connected to the IGBT module body 1. By setting the area of the upper opening of the open receiving cavity 3 to be larger than the area of the bottom opening, it helps to increase the heat dissipation area of the thermal conductive glue and improves the heat dissipation effect of the IGBT module body 1. In some embodiments, the open receiving cavity 3 can also be set as a frustum structure.

[0028] As Figure 2 shown, the included angle between the side wall of the open receiving cavity 3 and the vertical direction is 10° to 30°. Preferably, the included angle is 20°. If the included angle is too large, the weight of the thermal conductive glue in the open receiving cavity 3 is too heavy, which generates a greater pressure on the IGBT module body 1 and is easily damaged.

[0029] As Figure 1As shown, in some embodiments, the height of the open receiving cavity 3 is 3 mm to 7 mm, the side length of the outer edge at the upper end of the open receiving cavity 3 is 7 mm to 10 mm, the wall thickness of the open receiving cavity 3 is 0.5 mm to 0.9 mm, and the side length of the IGBT module body 1 is 6 mm. Preferably, the height of the open receiving cavity 3 is 5 mm, the side length of the outer edge at the upper end is 8 mm, and the wall thickness is 0.7 mm. The open receiving cavity 3 needs to have a certain volume to accommodate the thermal conductive adhesive. At the same time, the wall thickness needs to ensure that the open receiving cavity 3 has sufficient strength to avoid damage.

[0030] Further, as Figure 1 shown, a bevel 4 is provided on the inner edge of the upper opening of the open receiving cavity 3. By providing the bevel 4 on the inner edge of the upper opening of the open receiving cavity 3, the heat dissipation area of the thermal conductive adhesive is further increased, and the heat dissipation effect is improved. Among them, the bevel 4 is provided at a certain distance from the outer edge of the upper opening of the open receiving cavity 3. By moving the bevel 4 inward, the integrity of the outer edge of the opening is ensured, and the strength of the upper opening of the open receiving cavity 3 is ensured.

[0031] In some embodiments, as Figure 2 shown, the end face of the open receiving cavity 3 is lower than the heat dissipation surface 101, so as to ensure that the heat dissipation surface 101 is entirely located inside the open receiving cavity 3, ensure that the heat dissipation surface 101 is in full contact with the thermal conductive adhesive, and ensure the heat dissipation effect of the heat dissipation surface 101.

[0032] In other embodiments, as Figure 3 shown, the bottom end face of the open receiving cavity 3 is connected to the heat dissipation surface 101, the outer edge of the bottom end of the open receiving cavity 3 is butted against the edge of the IGBT module body 1, and the material of the open receiving cavity 3 can also conduct heat. After being connected to the IGBT module body 1, it can dissipate heat together with the thermal conductive adhesive.

[0033] Embodiment 2, as Figure 4 shown, the present invention also provides an inverter, including a heat dissipation plate 5, a frequency conversion board 6 and a heat dissipation type IGBT module 7. The heat dissipation plate 5 is covered on the upper end of the heat dissipation type IGBT module 7 and abuts against the upper end of the open receiving cavity 3 to prevent the thermal conductive adhesive from overflowing from the open receiving cavity 3. At the same time, the thermal conductive adhesive filled in the open receiving cavity 3 contacts the heat dissipation plate 5, and the heat generated by the IGBT module body 1 is dissipated through the heat dissipation plate 5, reducing the working temperature of the inverter and improving the working performance.

[0034] Further, the heat dissipation type IGBT module 7 is connected to the frequency conversion board 6 through the pin 2. The heat dissipation type IGBT module 7 is fixed through the pin 2 and connected to the frequency conversion board 6 for transmitting electrical signals, thereby controlling the operation of the inverter. In some embodiments, as Figure 5As shown, a number of heat-dissipating IGBT modules 7 are arranged in an array on the frequency conversion board 6, which helps the heat dissipation plate 5 to dissipate heat evenly, avoiding excessive local heat generation during irregular arrangement and affecting the heat dissipation effect of the heat dissipation plate 5, which is not conducive to the working performance of the frequency converter. The number of heat-dissipating IGBT modules 7 can be arranged vertically and horizontally or in a ring. Preferably, a number of heat-dissipating IGBT modules 7 are arranged in a 2X3 array.

[0035] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation type IGBT module (7), comprising an IGBT module body (1), wherein a pin (2) is provided on a side of the IGBT module body (1), characterized in that: The IGBT module body (1) is provided with a heat dissipation surface (101), and the heat dissipation surface (101) is provided with an open receiving cavity (3) for filling with heat-conducting glue.

2. A heat dissipation type IGBT module (7) according to claim 1, characterized in that: The axial cross-section of the open accommodating cavity (3) is trapezoidal, and the upper end opening area of ​​the open accommodating cavity (3) is larger than the bottom end opening area.

3. A heat dissipation type IGBT module (7) according to claim 2, characterized in that: The angle between the side wall of the open accommodating cavity (3) and the vertical direction is 10° to 30°.

4. The heat dissipation type IGBT module (7) according to claim 1, characterized in that: The height of the open accommodating cavity (3) is 3 mm to 7 mm, the side length of the upper outer edge of the open accommodating cavity (3) is 7 mm to 10 mm, and the wall thickness of the open accommodating cavity (3) is 0.5 mm to 0.9 mm.

5. The heat dissipation type IGBT module (7) according to claim 1, characterized in that: The inner edge of the upper opening of the open accommodating cavity (3) is provided with a groove (4).

6. The heat dissipation type IGBT module (7) according to claim 1, characterized in that: The end surface of the bottom end of the open accommodating cavity (3) is connected to the surface of the heat dissipation surface (101); Alternatively, the end surface of the bottom end of the open accommodating cavity (3) is lower than the heat dissipation surface (101), and the inner side surface of the open accommodating cavity (3) is connected to the outer peripheral surface of the IGBT module body (1).

7. A frequency converter, characterized in that: It comprises a heat sink (5), a frequency conversion board (6) and the heat dissipation type IGBT module (7) as claimed in any one of claims 1 to 5, wherein a plurality of the heat dissipation type IGBT modules (7) are arranged on the frequency conversion board (6), the open accommodating cavity (3) is filled with thermal conductive adhesive, and the heat sink (5) is arranged on one side of the open accommodating cavity (3) filled with the thermal conductive adhesive.

8. A frequency converter according to claim 7, characterized in that: The heat dissipation type IGBT module (7) is connected to the frequency conversion board (6) via the pins (2), and a plurality of the heat dissipation type IGBT modules (7) are arranged in an array on the frequency conversion board (6).

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