Radiator
By using stainless steel support and copper or copper alloy thermal conductors, and fixing with brazing or diffusion welding, the existing IGBT radiator has solved the problems of high cost and poor sealing, and the balance of efficient heat dissipation and low cost is achieved.
Patent Information
- Application Number
- CN202421766227.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-24
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-07-24
AI Technical Summary
While improving the heat dissipation performance, existing IGBT radiators have increased manufacturing costs, and the welding of oxygen-free copper materials is prone to pores, affecting sealing and welding rate.
The supporting body made of stainless steel and the thermal conductor made of copper or copper alloy are fixed by brazing or diffusion welding to ensure thermal conductivity and structural strength, while reducing the generation of pores and improving sealing and welding rate.
It effectively reduces the manufacturing cost of IGBT radiator, while taking into account the heat dissipation performance and structural strength, improves the sealing and welding rate, and improves the appearance quality.
Smart Images

Figure CN222914795U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of heat dissipation devices, and particularly to a radiator. Background Art
[0002] In the prior art, some radiators (taking IGBT radiators as an example) are made of aluminum materials. Due to the limitation of their own thermal conductivity, the power output of IGBT power modules is restricted in some application scenarios. To meet higher power requirements, usually the number of IGBT power modules is increased or the heat dissipation area of the aluminum IGBT radiator is increased, which will lead to an increase in manufacturing costs. In some technologies, the aluminum alloy material is replaced with oxygen-free copper material. Since the thermal conductivity of copper is nearly twice that of aluminum, the copper IGBT radiator can effectively solve the above problems of IGBT power modules, but at the same time it leads to an increase in the cost of the IGBT radiator itself. Moreover, pores are extremely likely to be generated during oxygen-free copper brazing, affecting the sealing performance and welding rate requirements of the IGBT radiator; in addition, surface quality problems such as scratches and bumps on the surface of the copper radiator also increase the manufacturing cost.
[0003] How to balance the heat dissipation performance and manufacturing cost of IGBT radiators is a technical problem to be solved. Utility Model Content
[0004] This application provides a radiator that can further reduce costs on the premise of meeting the power output requirements of power modules.
[0005] A radiator of this application includes:
[0006] A support body, at least a part of which is made of stainless steel;
[0007] A heat conducting member, the material of which is copper or copper alloy. The heat conducting member is fixed to the support body. The heat conducting member has an opposite heat absorption side and a heat dissipation side, and at least a part of the heat absorption side is exposed to the support body for coupling with a heating element.
[0008] The following also provides several optional ways, but they are not additional limitations to the above overall solution, but only further supplements or optimizations. On the premise of no technical or logical contradictions, each optional way can be combined with the above overall solution alone, or multiple optional ways can be combined with each other.
[0009] In one embodiment, the support body is provided with an installation opening;
[0010] The heat conducting member includes:
[0011] A substrate, which is fixedly embedded in the installation opening;
[0012] The heat exchange part is fixed to the heat dissipation side of the substrate, and the heat exchange part has a fluid gap.
[0013] In one embodiment, the support includes two half shells that are snap-fitted together. The interior of the support is a fluid chamber for accommodating a cooling medium, and at least one of the two half shells is made of stainless steel.
[0014] At least a part of the heat conducting member is located in the fluid chamber, and this part has a fluid gap for the cooling medium to pass through.
[0015] In one embodiment, the heat conducting member and one of the half shells are of an integral structure.
[0016] In one embodiment, in the two half shells, one of the half shells is provided with an installation opening, and the heat conducting member includes:
[0017] A substrate that is fixed and closes the installation opening.
[0018] A heat exchange part that is connected to the inner side of the substrate. The heat exchange part extends and is fixed in the fluid chamber to the other half shell, and the heat exchange part has the fluid gap.
[0019] In one embodiment, both of the two half shells are provided with installation openings, and the heat conducting member includes:
[0020] Two substrates, each substrate is fixed and closes the corresponding installation opening.
[0021] A heat exchange part that is located in the fluid chamber, and two opposite sides of the heat exchange part are respectively fixed to the corresponding substrates.
[0022] In one embodiment, the installation openings of the two half shells are opposite in position, and the two substrates and the heat exchange part are fixed together by brazing or diffusion welding.
[0023] In one embodiment, the edge of the substrate is placed and fixed on the outer wall of the corresponding half shell, and at least a part of the substrate is embedded in the corresponding installation opening.
[0024] In one embodiment, the edge of the substrate is circumferentially provided with positioning steps. The positioning steps have a first step surface and a second step surface that intersect with each other. The first step surface cooperates with the outer wall of the corresponding half shell, and the second step surface cooperates with the inner edge of the corresponding installation opening.
[0025] In one embodiment, the heat conducting member is made of red copper, and the two half shells are made of stainless steel.
[0026] Between the two half shells, and between the heat conducting member and the corresponding half shell are respectively fixed by brazing or diffusion welding.
[0027] Through the improvement of the structure and materials of the radiator in this application, its heat dissipation performance and manufacturing cost can be taken into account. In addition, the structural strength and sealing performance are also ensured. In some additional improvement methods, the sealing performance, welding rate, and qualification rate of the appearance quality of the radiator can also be improved. Brief Description of the Drawings
[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application or in the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0029] Figure 1 It is a schematic structural diagram of the radiator in an embodiment of the present application;
[0030] Figure 2 It is Figure 1 a schematic diagram of the combined part of the heat conduction part and each half shell in
[0031] Figure 3 It is a schematic structural diagram of the radiator in another embodiment of the present application;
[0032] Figure 4 It is a schematic structural diagram of the radiator in another embodiment of the present application;
[0033] Figure 5 It is a schematic structural diagram of the radiator in another embodiment of the present application.
[0034] The reference numerals of each component are as follows:
[0035] 1000, support body;
[0036] 100, the first half shell; 110, the first mounting opening; 120, the first adaptation structure;
[0037] 200, the second half shell; 210, the convex part; 211, the cooling medium flow port; 220, the second mounting opening; 230, the second adaptation structure;
[0038] 300, heat conduction part; 310, the first substrate; 311, the first stepped surface; 312, the second stepped surface; 320, the heat exchange part; 330, the second substrate;
[0039] 400, fluid cavity. Detailed Description of the Embodiments
[0040] To make the above objects, features, and advantages of the present application more apparent and understandable, the following provides a detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings. Many specific details are set forth in the following description to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.
[0041] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it can be directly on the other component or there can also be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of the present application are only for illustrative purposes and do not represent the only implementation manner.
[0042] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.
[0043] In the present application, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature can be that the first feature is in direct contact with the second feature, or the first feature is in indirect contact with the second feature through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the first feature is at a higher horizontal height (or in a certain use state, or from a certain perspective of the drawing) than the second feature. The first feature being "below", "beneath" and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the first feature is at a lower horizontal height (or in a certain use state, or from a certain perspective of the drawing) than the second feature.
[0044] Unless otherwise defined, all technical and scientific terms used in the specification of the present application have the same meaning as commonly understood by those skilled in the technical field to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used in the specification of the present application includes any and all combinations of one or more of the related listed items.
[0045] To overcome the deficiencies existing in the prior art, refer to Figures 1 to 5, An embodiment of the present application provides a heat sink, which can be used for IGBT power modules, electronic components, etc. The heat sink of this embodiment includes a support body 1000 and a heat conducting member 300, wherein at least a part of the support body 1000 is made of stainless steel.
[0046] The heat conducting member 300 is fixed to the support body 1000. To ensure the heat conduction performance, the material of the heat conducting member 300 is copper or copper alloy. The heat conducting member 300 has opposite sides, namely a heat absorption side and a heat dissipation side, wherein at least a part of the heat absorption side is exposed to the support body 1000 for coupling with a heating element, for example, it can be attached to the IGBT power module for heat dissipation.
[0047] Compared with the heat sink made of all-copper material in the prior art, in this embodiment, at least a part of the support body 1000 being made of stainless steel can further reduce the material cost. Moreover, the stainless steel material can also provide better structural strength, reduce surface quality problems such as bumps and scratches. The contact part between the heat conducting member 300 and the support body 1000 can adopt brazing or diffusion welding, which can reduce the generation of pores and improve the sealing performance and welding rate.
[0048] In Figures 1 to 4 the embodiment, a water cooling method is adopted. The support body 1000 correspondingly includes two half-shells that are buckled with each other, such as the first half-shell 100 and the second half-shell 200 in the figure. After the two half-shells are enclosed, the inside thereof is a fluid cavity 400 for accommodating a cooling medium. The material of one or both of the first half-shell 100 and the second half-shell 200 is stainless steel.
[0049] The heat sink of this embodiment can operate based on the water cooling method. The support body 1000 has a length direction as a whole, and the heat conducting member 300 is located in the middle of the length direction of the support body 1000. To connect with external pipelines, the first half-shell 100 and / or the second half-shell 200 are provided with cooling medium circulation ports 211 communicating with the fluid cavity 400, and the cooling medium can enter and exit the fluid cavity 400 through the cooling medium circulation ports 211 at both ends.
[0050] There is no strict limit on the opening method of the cooling medium circulation port 211. For example, the pipeline can be directly connected to the support body 1000, or there is a locally convex part 210, and the cooling medium circulation port 211 is arranged on the convex part 210.
[0051] To facilitate the connection of peripheral components, a plurality of first adaptation structures 120 are arranged on the edge of the first half-shell 100, and a plurality of second adaptation structures 230 are arranged on the edge of the second half-shell 200. Each adaptation structure can be in the form of connection holes or the like to facilitate quick disassembly and assembly.
[0052] To further enhance heat exchange, at least a part of the heat conducting member 300 is located in the fluid chamber 400, and this part has a fluid gap for the cooling medium to pass through, which can increase the contact area with the cooling medium and ensure the cooling effect.
[0053] As for the heat conducting member 300 itself, it can adopt methods such as pinfin, fins or a combination of multiple methods. In this embodiment, the first half shell 100 is provided with a first installation opening 110, and the heat conducting member 300 is embedded in the first installation opening 110. Specifically, the heat conducting member 300 of this embodiment includes a first substrate 310 and a heat exchange portion 320. The first substrate 310 and the heat exchange portion 320 can be fixed separately or integrally (such as pinfin). Among them, the first substrate 310 is fixed at the first installation opening 110 and closes the first installation opening 110. Relative to the fluid chamber 400, the first substrate 310 has opposite inner and outer sides. Among them, the heat exchange portion 320 is connected to the inner side of the first substrate 310, and the heat exchange portion 320 extends and is fixed in the fluid chamber 400 to the second half shell 200, and the fluid gap is distributed in the heat exchange portion 320.
[0054] Since different metal materials are involved in this embodiment, in order to facilitate connection and take into account the connection strength, resistance spot welding can be used to fix stainless steel components. For example, both the first half shell 100 and the second half shell 200 are made of stainless steel, and their outer edges are overlapped with each other and fixed by resistance spot welding. Resistance spot welding can effectively reduce the fitting gap caused by the dimensional deviation of the components themselves and ensure the sealing requirements around.
[0055] Between the edge of the first installation opening 110 of the first substrate 310 and the first half shell 100, and between the inner wall of the heat exchange portion 320 and the second half shell 200, it belongs to dissimilar metal welding (copper and stainless steel), and brazing or diffusion welding can be used. Specifically, nickel-based brazing materials or CuSn brazing materials, CuMn brazing materials, etc. can be selected. For diffusion welding, brazing materials can be added or not.
[0056] As a preferred method, the material of the heat conducting member 300 can specifically be selected as red copper, and the materials of the first substrate 310 and the first half shell 100 are specifically selected as austenitic stainless steel; austenitic stainless steel can not only reduce costs, but also has a linear expansion coefficient close to that of oxygen-free copper. When brazed or diffusion welded, their deformations when heated are relatively consistent, which can avoid generating large welding stresses and provide guarantee for the product and its sealing performance. Of course, in other embodiments, the material of the heat conducting member 300 can also be copper alloy. The materials of the first substrate 310 or the first half shell 100 can also be ferritic stainless steel, martensitic stainless steel, etc.
[0057] Combined Figure 2, in order to ensure the connection strength and welding accuracy, in a preferred embodiment, the edge of the first substrate 310 is placed and fixed on the outer wall of the first half shell 100, and at least a part of the first substrate 310 is also embedded in the first mounting opening 110 for positioning.
[0058] Since brazing or diffusion welding has high requirements for the fitting clearance of components, in this embodiment, the first half shell 100 and the second half shell 200 can be fixed by pre-resistance spot welding to form a support body 1000, which is more convenient for the design of the product fixture. When performing brazing or diffusion welding operations, the fixture can be used to clamp the first substrate 310 and the second half shell 200 towards each other, so that the edge of the first substrate 310 can fit well with the outer wall of the first half shell 100, and at the same time, good contact between the heat exchange part 320 and the inner wall of the second half shell 200 can be ensured. Then, the pre-coated filler metal is heated for brazing or diffusion welding.
[0059] As can be seen in the figure, the edge of the first substrate 310 is provided with positioning steps, and the positioning steps have a first step surface 311 and a second step surface 312 that intersect with each other. The first step surface 311 cooperates with the outer wall of the first half shell 100, and the second step surface 312 cooperates with the inner edge of the first mounting opening 110.
[0060] In order to avoid the corrosion of the cooling medium to the heat conducting part 300, the heat conducting part 300 can be pre-plated with pure nickel, and then brazing or diffusion welding is carried out with the support body 1000, which can avoid nickel plating in the inner cavity after brazing or diffusion welding and further reduce the manufacturing cost.
[0061] See Figure 3 , in another embodiment of the present application, the first half shell 100 is provided with a first mounting opening 110. The main difference from the previous embodiment is that the second half shell 200 is provided with a second mounting opening 220, and the heat conducting part 300 is correspondingly arranged, specifically including two substrates and a heat exchange part 320. The two substrates are respectively a first substrate 310 fixed in the first mounting opening 110 and a second substrate 330 fixed in the second mounting opening 220. The heat exchange part 320 can adopt fins and is located in the fluid cavity 400. The two opposite sides of the heat exchange part 320 are respectively fixed to the corresponding substrates.
[0062] The first mounting opening 110 and the second mounting opening 220 are opposite in position. As in the previous embodiment, the edges of each substrate are provided with positioning steps. When performing brazing or diffusion welding operations, the fixture can be used to clamp the first substrate 310 and the second substrate 330 towards each other, so that the substrates can fit well with the outer walls of the half shells, and at the same time, good contact between both sides of the heat exchange part 320 and the corresponding substrates can be ensured. Then, the pre-coated filler metal is heated for brazing or diffusion welding.
[0063] The materials of the two substrates and the heat exchange part 320 are all oxygen-free copper. Therefore, the three can be fixed to each other by the method of brazing with the same metal. The brazing filler metal can adopt the existing technology suitable for metal copper, such as copper-phosphorus-tin-nickel brazing filler metal or silver-copper-phosphorus brazing filler metal, etc.
[0064] The shapes and areas of the substrates can be set according to the IGBT power module accordingly. One substrate is in thermal contact with the IGBT power module to achieve thermal coupling, while the other substrate can be only for open heat dissipation or can also be in thermal contact with other heat-generating components.
[0065] See Figure 4 , in another embodiment of the present application, the main difference from the previous embodiment is that the heat conducting member 300 and the first half shell 100 are of an integral structure, for example, the pinfin method is adopted as a whole. The materials of the heat conducting member 300 and the first half shell 100 are copper, and the material of the second half shell 200 is stainless steel. The two are fixed by brazing or diffusion welding.
[0066] Except for the heat conducting member itself retaining the copper material, the rest of the radiator in the present application can all adopt stainless steel. The brazing or diffusion welding connection of dissimilar metals is convenient for controlling the assembly gap, effectively ensuring the reliability of the brazing or diffusion welding part of copper and stainless steel. When used in cooperation with the IGBT power module, it can meet the power output requirements and reduce the manufacturing cost.
[0067] See Figure 5 , in another embodiment of the present application, the support body 1000 of the radiator is of a frame structure and is provided with an installation opening. The heat conducting member 300 can adopt the pinfin method as a whole, and also includes a substrate fixedly embedded in the installation opening. On the heat dissipation side of the substrate is a heat exchange part with a fluid gap. The radiator in this embodiment is an open type. When installing, the IGBT power module and the support body 1000 can be hermetically connected around with a sealing ring.
[0068] The technical solution in the present application can also be used for other radiators, such as a water-cooled plate. The water-cooled plate includes two heat exchange plates and fins. One of the heat exchange plates is used as the heat conducting member, and its material is copper. The other heat exchange plate is regarded as the support body, and its material is stainless steel. The fins and one of the heat exchange plates can be integrally formed, or the fins can also be formed separately. The fins are located between the two heat exchange plates and are welded and fixed to the heat exchange plates on both sides respectively. The material of the fins can be copper or stainless steel. Of course, in other embodiments, the water-cooled plate can also be provided without fins.
[0069] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as falling within the scope described in this specification. When the technical features in different embodiments are embodied in the same drawing, the drawing can be regarded as also disclosing the combination examples of the various embodiments involved.
[0070] The above-described embodiments merely represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application shall be subject to the appended claims.
Claims
1. A radiator, characterized in that: include: A support body, at least a portion of which is made of stainless steel; The heat conductive member is made of copper or copper alloy, is fixed to the support body, has a heat absorbing side and a heat dissipating side opposite to each other, and at least a portion of the heat absorbing side is exposed to the support body for coupling with a heating element.
2. The heat sink according to claim 1, characterized in that: The support body is provided with a mounting opening; The heat conducting member comprises: A base plate, the base plate is fixedly embedded in the installation opening; The heat exchange part is fixed on the heat dissipation side of the substrate, and the heat exchange part has a fluid gap.
3. The heat sink according to claim 1, characterized in that: The support body comprises two half shells that are interlocked with each other, the support body contains a fluid cavity for accommodating a cooling medium, and at least one of the two half shells is made of stainless steel; At least a portion of the heat conducting element is located in the fluid cavity, and the portion has a fluid gap for cooling medium to pass through.
4. The heat sink according to claim 3, characterized in that: The heat conducting member and one of the half shells are an integral structure.
5. The heat sink according to claim 3, characterized in that: One of the two half shells is provided with a mounting opening, and the heat conducting member comprises: A base plate, the base plate being fixed and sealed to the mounting opening; The heat exchange part is connected to the inner side of the base plate, the heat exchange part extends in the fluid cavity and is fixed to the other half shell, and the heat exchange part has the fluid gap.
6. The heat sink according to claim 3, characterized in that: The two half shells are both provided with mounting openings, and the heat conducting member comprises: Base plate, the base plate is two pieces, each base plate is fixed and sealed in a corresponding mounting opening; The heat exchange part is located in the fluid cavity, and two opposite sides of the heat exchange part are respectively fixed to the substrates on the corresponding sides.
7. The heat sink according to claim 6, characterized in that The mounting openings of the two half shells are located opposite to each other, and the two base plates and the heat exchange part are fixed by welding.
8. The heat sink according to any one of claims 5 to 7, characterized in that: The edge of the base plate is overlapped and fixed on the outer wall of the half shell, and at least a part of the base plate is embedded in the corresponding installation opening.
9. The radiator according to any one of claims 2 or 5 to 7, characterized in that: The edge of the base plate is surrounded by positioning steps, and the positioning steps have a first step surface and a second step surface that intersect each other, the first step surface matches the outer wall of the corresponding half shell, and the second step surface matches the inner edge of the corresponding installation opening.
10. The heat sink according to any one of claims 5 to 7, characterized in that: The heat conducting member is made of copper, and the two half shells are made of stainless steel; The two half shells, and the heat conducting member and the corresponding half shells are fixed by welding.