Spraying type heat pipe structure and heat management system

Abstract

The utility model relates to a spraying type heat pipe structure and a heat management system.The spraying type heat pipe structure comprises an evaporation section, a condensation section, a liquid pump and a spraying pipe set, the evaporation section communicates with the condensation section, the liquid pump and the spraying pipe set are both arranged in the evaporation section, a power element and a liquid working medium are arranged in the evaporation section, and the liquid pump communicates with the spraying pipe set; and the liquid pump can spray the liquid working medium to the surface of the corresponding power element through the spraying pipe group, so that the liquid working medium can absorb heat, be gasified and enter the condensation section. According to the spraying type heat pipe structure and the heat management system provided by the invention, the problem that an existing cooling mode is difficult to meet the increasing heat dissipation requirement of a power element is solved.

Description

Technical Field

[0001] The present application relates to the field of heat pipe technology, and in particular to a spray type heat pipe structure and a thermal management system. Background Art

[0002] There are many heat dissipation technology routes for power components such as IGBT, batteries, and chips, such as contact heat transfer between power components and heat pipes, contact heat transfer between power components and liquid cooling plates, heat dissipation by immersing power components in a single-phase cooling medium under normal pressure, phase change heat dissipation by immersing power components in a cooling medium under normal pressure, and phase change heat dissipation by immersing power components in a cooling medium under vacuum.

[0003] However, as the heat flux density of power components continues to increase, the above cooling mode is increasingly unable to meet the increasing heat dissipation requirements of power components. Utility Model Content

[0004] Based on this, it is necessary to provide a spray type heat pipe structure and a thermal management system to solve the problem that the existing cooling mode is difficult to meet the increasing heat dissipation requirements of power components.

[0005] The spray-type heat pipe structure provided in the present application includes an evaporation section, a condensation section, a liquid pump and a spray pipe group. The evaporation section is connected to the condensation section. The liquid pump and the spray pipe group are both arranged in the evaporation section. The evaporation section is provided with power elements and liquid working fluids. The liquid pump is connected to the spray pipe group, and the liquid pump can spray the liquid working fluid onto the surface of the corresponding power element through the spray pipe group so that the liquid working fluid can absorb heat and vaporize and enter the condensation section.

[0006] In one embodiment, the evaporation section is provided with an evaporation chamber and a liquid storage chamber, the liquid storage chamber is connected to the bottom of the evaporation chamber, the power element and the spray pipe group are arranged in the evaporation chamber, and the liquid working medium is arranged in the liquid storage chamber.

[0007] In one embodiment, the liquid pump is immersed in the liquid medium in the liquid storage chamber, or the liquid pump is arranged in the evaporation chamber.

[0008] In one of the embodiments, the spray pipe group includes a collecting pipe, a distributing pipe and a nozzle. The liquid pump is connected to a plurality of distributing pipes through the collecting pipe. The plurality of distributing pipes are spaced apart along the arrangement direction of the power elements, and each distributing pipe has a plurality of nozzles spaced apart along its own length direction, so that the liquid working medium can be sprayed onto the surface of the corresponding power element through each nozzle.

[0009] In one embodiment, the liquid dispensing tubes and the power elements are arranged alternately.

[0010] In one embodiment, a plurality of power elements are arranged around the outer circumference of the spray pipe group, or a plurality of power elements are arranged on one side of the spray pipe group.

[0011] In one of the embodiments, the spray type heat pipe structure further includes a mounting bracket, and the power element can be mounted in the evaporation section through the mounting bracket.

[0012] In one of the embodiments, the mounting bracket includes a frame and buckles, a plurality of groups of buckles are distributed along the length direction of the frame and fixedly connected to the frame, and each group of buckles is correspondingly mounted with a power element.

[0013] In one embodiment, the snap-fit ​​member includes a first snap-fit ​​and a second snap-fit, and the first snap-fit ​​and the second snap-fit ​​are respectively connected to two ends of the frame along the width direction of the frame. The first snap-fit ​​is provided with a first snap-fit ​​groove with an opening facing away from the frame, and the second snap-fit ​​is provided with a second snap-fit ​​groove with an opening facing away from the frame. The two ends of the power element can be respectively snapped into the first snap-fit ​​groove and the second snap-fit ​​groove.

[0014] The present application also provides a thermal management system, which includes the spray type heat pipe structure described in any one of the above embodiments.

[0015] Compared with the prior art, the spray-type heat pipe structure and thermal management system provided by the present application are configured in such a way that, since the liquid pump can continuously spray the liquid working medium onto the surface of the power element through the spray pipe group, the power element can be continuously cooled. Moreover, when the heat dissipation of the power element is small, part of the liquid working medium is vaporized, and the remaining liquid working medium flows back to the bottom of the evaporation section. When the heat dissipation of the power element is large, the liquid working medium sprayed onto the surface of the power element is directly vaporized to take away the heat from the surface of the power element. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 A schematic structural diagram of a spray type heat pipe structure according to an embodiment of the present application;

[0018] Figure 2 A schematic structural diagram of a spray-type heat pipe structure according to another embodiment of the present application;

[0019] Figure 3 A schematic diagram of a partial structure of a spray-type heat pipe structure according to another embodiment of the present application;

[0020] Figure 4 for Figure 3 a top view of the structure shown;

[0021] Figure 5 A schematic structural diagram of a spray-type heat pipe structure according to another embodiment of the present application;

[0022] Figure 6 A schematic diagram of spraying between a spray pipe group and a power element according to an embodiment of the present application;

[0023] Figure 7 A schematic diagram of the assembly structure of a mounting bracket and a power element according to an embodiment of the present application;

[0024] Figure 8 A schematic structural diagram of a mounting bracket according to an embodiment of the present application.

[0025] Figure numerals: 100, evaporation section; 110, evaporation chamber; 120, liquid storage chamber; 200, condensation section; 300, liquid pump; 400, spray pipe group; 410, collecting pipe; 420, liquid distribution pipe; 430, nozzle; 500, power element; 600, mounting bracket; 610, frame; 620, snap-fit ​​piece; 621, first snap-fit; 622, first slot; 623, second snap-fit; 624, second slot. DETAILED DESCRIPTION

[0026] There are many heat dissipation technology routes for power components such as IGBT, batteries, and chips, such as contact heat transfer between power components and heat pipes, contact heat transfer between power components and liquid cooling plates, heat dissipation by immersing power components in a single-phase cooling medium under normal pressure, phase change heat dissipation by immersing power components in a cooling medium under normal pressure, and phase change heat dissipation by immersing power components in a cooling medium under vacuum.

[0027] However, as the heat flux density of power components continues to increase, the above cooling mode is increasingly unable to meet the increasing heat dissipation requirements of power components.

[0028] In view of this, it is necessary to provide a spray type heat pipe structure and a thermal management system to solve the problem that the existing cooling mode is difficult to meet the increasing heat dissipation requirements of power components.

[0029] See also Figure 1-Figure 8 The spray heat pipe structure includes an evaporation section 100, a condensation section 200, a liquid pump 300 and a spray pipe group 400. The evaporation section 100 is connected to the condensation section 200. The liquid pump 300 and the spray pipe group 400 are both arranged in the evaporation section 100. The evaporation section 100 is provided with a power element 500 (including but not limited to an IGBT module, a battery, a motor and a chip, etc.) and a liquid working medium. The liquid pump 300 is connected to the spray pipe group 400, and the liquid pump 300 can spray the liquid working medium onto the surface of the corresponding power element 500 through the spray pipe group 400, so that the liquid working medium can absorb heat and vaporize and enter the condensation section 200. After that, the gaseous working medium releases heat and liquefies in the condensation section 200 and flows back to the evaporation section 100.

[0030] It should be noted that the evaporation section 100 and the condensation section 200 are vacuum structures, that is, the evaporation section 100 and the condensation section 200 only contain working fluid and do not contain other impurity gases or liquids.

[0031] Further, it should be noted that the liquid pump 300 can be an electric pump with a plug-in cable or an electric pump with a battery. The former can work continuously without charging, while the latter has better sealing performance. In addition, the electric pump with a battery can also be wirelessly charged.

[0032] In this arrangement, since the liquid pump 300 can continuously spray the liquid working medium onto the surface of the power element 500 through the spray pipe group 400, the power element 500 can be continuously cooled. In addition, when the heat dissipation of the power element 500 is small, part of the liquid working medium is vaporized, and the remaining liquid working medium flows back to the bottom of the evaporation section 100. When the heat dissipation of the power element 500 is large, the liquid working medium sprayed onto the surface of the power element 500 is directly vaporized to take away the heat on the surface of the power element 500.

[0033] In one embodiment, the evaporation section 100 is directly connected to the condensation section 200, but is not limited thereto. In other embodiments, the evaporation section 100 may also be indirectly connected to the condensation section 200 through a pipeline.

[0034] In one embodiment, if Figure 1-Figure 5 As shown, the evaporation section 100 is provided with an evaporation chamber 110 and a liquid storage chamber 120 . The liquid storage chamber 120 is connected to the bottom of the evaporation chamber 110 . The power element 500 and the spray pipe group 400 are arranged in the evaporation chamber 110 . The liquid working medium is arranged in the liquid storage chamber 120 .

[0035] In this way, the liquid working medium does not directly contact the power element 500 , and the liquid working medium does not immerse the spray pipe group 400 , which is conducive to the spray pipe group 400 spraying the liquid working medium.

[0036] Further, in one embodiment, if Figure 1 , Figure 3 and Figure 5 As shown, the liquid pump 300 is immersed in the liquid medium in the liquid storage chamber 120 .

[0037] This is beneficial to the heat dissipation of the liquid pump 300 itself.

[0038] In another embodiment, if Figure 2 As shown, the liquid pump 300 is disposed in the evaporation chamber 110 .

[0039] In this way, the sealing requirements of the liquid pump 300 itself are reduced, which is beneficial to reducing the processing cost of the spray type heat pipe structure.

[0040] In one embodiment, the liquid level of the liquid working medium is located in the evaporation chamber 110 , and the power element 500 is immersed in the liquid working medium to further enhance the heat dissipation effect of the power element 500 .

[0041] In one embodiment, if Figure 1-Figure 5 As shown, the spray pipe group 400 includes a collecting pipe 410, a distributing pipe 420 and a nozzle 430. The liquid pump 300 is connected to a plurality of distributing pipes 420 through the collecting pipe 410. The plurality of distributing pipes 420 are distributed at intervals along the arrangement direction of the power elements 500, and each distributing pipe 420 has a plurality of nozzles 430 distributed at intervals along its own length direction, so that the liquid working medium can be sprayed on the surface of the corresponding power element 500 through each nozzle 430.

[0042] Such an arrangement increases the spraying range of the spray pipe group 400 and improves the heat dissipation uniformity of each power element 500 distributed in the evaporation section 100 .

[0043] Further, in one embodiment, if Figure 1 and Figure 2 As shown, the liquid dispensing tubes 420 and the power elements 500 are arranged alternately.

[0044] Such an arrangement is helpful to ensure that each power element 500 can be effectively sprayed.

[0045] In another embodiment, if Figure 3 and Figure 4 As shown, a plurality of power elements 500 are disposed around the outer circumference of the spray pipe group 400 .

[0046] In this way, the space occupied by the spray pipe group 400 can be reduced, and the space utilization rate of the evaporation section 100 can be improved.

[0047] In yet another embodiment, Figure 5 As shown, a plurality of power elements 500 are disposed on one side of the spray pipe group 400 . Specifically, the spray pipe group 400 may be disposed on the top, bottom or side.

[0048] For example, when the spray pipe group 400 is arranged at the top, the liquid working medium flowing back from the condensation section 200 can drip onto the heat dissipation surfaces of these power components 500 .

[0049] In this way, the difficulty of assembling the power element 500 and the spray pipe group 400 in the evaporation section 100 can be effectively reduced.

[0050] In one embodiment, the liquid working medium sprayed out by the nozzle 430 is fan-shaped and radial.

[0051] In this way, the spraying range of the liquid working medium can be increased.

[0052] In another embodiment, the liquid working medium sprayed out by the nozzle 430 may also be in the form of mist.

[0053] This is beneficial to improving the uniformity of the liquid spraying of the nozzle 430 .

[0054] In one embodiment, if Figure 7 and Figure 8 As shown, the spray type heat pipe structure further includes a mounting bracket 600 , and the power element 500 can be mounted in the evaporation section 100 through the mounting bracket 600 .

[0055] This helps to improve the assembly stability of the power device 500 .

[0056] Further, in one embodiment, if Figure 7 and Figure 8 As shown, the mounting bracket 600 includes a frame 610 and buckles 620 , a plurality of groups of buckles 620 are distributed along the length direction of the frame 610 and fixedly connected to the frame 610 , and each group of buckles 620 is correspondingly mounted with a power element 500 .

[0057] Specifically, the frame 610 is a quadrilateral structure, that is, the frame 610 includes two horizontal beams and two longitudinal beams, but is not limited thereto. In other embodiments, the frame 610 may also be an elliptical structure or structures of other shapes, which are not listed here one by one.

[0058] With such a configuration, the number of power elements 500 that can be mounted on the mounting bracket 600 can be increased.

[0059] Furthermore, in one embodiment, the fastener 620 is welded to the frame 610 , or the fastener 620 may be bonded to the frame 610 , or the fastener 620 may be screwed to the frame 610 via a fastener.

[0060] Furthermore, in one embodiment, if Figure 8 As shown, the snap fastener 620 includes a first snap fastener 621 and a second snap fastener 623, and the first snap fastener 621 and the second snap fastener 623 are respectively connected to the two ends of the frame 610 along the width direction of the frame 610, and the first snap fastener 621 is provided with a first snap slot 622 with an opening facing away from the frame 610, and the second snap fastener 623 is provided with a second snap slot 624 with an opening facing away from the frame 610, and the two ends of the power element 500 can be respectively snapped into the first snap slot 622 and the second snap slot 624.

[0061] Such a configuration improves the clamping stability of the power element 500 on the one hand, and reduces the difficulty of processing the clamping member 620 on the other hand.

[0062] Specifically, the first clip 621 and the second clip 623 are approximately U-shaped, or other shapes, to adapt to the shape of the power component 500 .

[0063] In one embodiment, the first clip 621 and the second clip 623 are elastic members, that is, the first clip 621 and the second clip 623 clamp the power element 500 through their own elastic deformation.

[0064] In other embodiments, rubber sheets may be further provided on the inner wall of the first slot 622 and the inner wall of the second slot 624 to increase the friction between the buckle 620 and the power element 500 , so that the power element 500 is installed more firmly.

[0065] The present application also provides a thermal management system, which includes the spray type heat pipe structure described in any one of the above embodiments.

[0066] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0067] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of patent protection of the present application shall be subject to the attached claims.

[0068] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0069] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0070] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0071] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0072] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0073] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

Claims

1. A spray type heat pipe structure, characterized in that: The invention comprises an evaporation section (100), a condensation section (200), a liquid pump (300) and a spray pipe group (400), wherein the evaporation section (100) is connected to the condensation section (200), the liquid pump (300) and the spray pipe group (400) are both arranged in the evaporation section (100), and a power element (500) and a liquid working medium are arranged in the evaporation section (100), the liquid pump (300) is connected to the spray pipe group (400), and the liquid pump (300) can spray the liquid working medium onto the surface of the corresponding power element (500) through the spray pipe group (400), so that the liquid working medium can absorb heat, vaporize and enter the condensation section (200).

2. The spray type heat pipe structure according to claim 1, characterized in that: The evaporation section (100) is provided with an evaporation chamber (110) and a liquid storage chamber (120); the liquid storage chamber (120) is connected to the bottom of the evaporation chamber (110); a power element (500) and the spray pipe group (400) are arranged in the evaporation chamber (110); and a liquid working medium is arranged in the liquid storage chamber (120).

3. The spray type heat pipe structure according to claim 2, characterized in that: The liquid pump (300) is immersed in the liquid working medium of the liquid storage chamber (120), or the liquid pump (300) is arranged in the evaporation chamber (110).

4. The spray type heat pipe structure according to claim 1, characterized in that: The spray pipe group (400) comprises a manifold (410), a liquid distributing pipe (420) and a nozzle (430); the liquid pump (300) is connected to a plurality of the liquid distributing pipes (420) respectively through the manifold (410); the plurality of liquid distributing pipes (420) are spaced apart along the arrangement direction of the power elements (500); and each of the liquid distributing pipes (420) is spaced apart along its length direction with a plurality of the nozzles (430), so that the liquid working medium can be sprayed onto the surface of the corresponding power element (500) through each of the nozzles (430).

5. The spray type heat pipe structure according to claim 4, characterized in that: The liquid dispensing tubes (420) and the power elements (500) are arranged alternately.

6. The spray type heat pipe structure according to claim 1, characterized in that: A plurality of power elements (500) are arranged around the outer circumference of the spray pipe group (400); Alternatively, a plurality of power elements (500) are arranged on one side of the spray pipe group (400).

7. The spray type heat pipe structure according to claim 1, characterized in that: It also includes a mounting bracket (600), through which the power element (500) can be mounted in the evaporation section (100).

8. The spray type heat pipe structure according to claim 7, characterized in that: The mounting bracket (600) comprises a frame (610) and a snap-fit ​​member (620), wherein a plurality of groups of the snap-fit ​​members (620) are distributed along the length direction of the frame (610) and are fixedly connected to the frame (610), and each group of the snap-fit ​​members (620) is correspondingly mounted with a power element (500).

9. The spray type heat pipe structure according to claim 8, characterized in that: The buckle (620) comprises a first buckle (621) and a second buckle (623); the first buckle (621) and the second buckle (623) are respectively connected to two ends of the frame (610) along the width direction of the frame (610); the first buckle (621) is provided with a first buckle slot (622) with an opening facing away from the frame (610); the second buckle (623) is provided with a second buckle slot (624) with an opening facing away from the frame (610); and the two ends of the power element (500) can be respectively buckled in the first buckle slot (622) and the second buckle slot (624).

10. A thermal management system, characterized in that: It comprises a spray type heat pipe structure as described in any one of claims 1 to claim 9.

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