IC package carrier structure

Abstract

The utility model discloses an integrated circuit (IC) packaging carrier plate structure, which comprises a substrate, two metal layers, a connecting layer and two welding layers, a through hole is formed in the substrate in the thickness direction, the two metal layers are located on the two sides of the substrate respectively, the two ends of the through hole are communicated with the two metal layers respectively, the through hole is filled with the connecting layer, the two ends of the connecting layer make contact with the two metal layers respectively, and the two welding layers are arranged on the two metal layers respectively. The utility model has the advantages that the firmness of the connection between the metal layer and the substrate is increased, and the service life of the electronic device is prolonged.

Description

Technical Field

[0001] The utility model belongs to the technical field of IC packaging substrates, and particularly relates to an IC packaging substrate structure. Background Art

[0002] A packaging substrate is to provide a metal layer for conducting electricity on a substrate. With the requirement for the size of electronic devices, the size of the packaging substrate is gradually reduced. In order to adapt to the smaller packaging substrate, the metal layer becomes thicker and thinner. However, increasing the thickness will increase the stress between the metal layer and the substrate, and thinning will result in a smaller contact area between the metal layer and the substrate. Therefore, both will lead to insufficient connection force between the metal layer and the substrate, causing the metal layer to detach, which affects the service life of electronic devices. To solve such problems, an IC packaging substrate structure is proposed to improve the stability of the connection between the metal layer and the substrate. Summary of the Utility Model

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art.

[0004] Therefore, the utility model provides an IC packaging substrate structure, which has the advantages of increasing the firmness of the connection between the metal layer and the substrate and improving the service life of electronic devices.

[0005] According to the IC packaging substrate structure of the embodiment of the utility model, it includes: a substrate, two metal layers, a connection layer and two welding layers; through holes are formed in the substrate along the thickness direction, the two metal layers are respectively located on both sides of the substrate, both ends of the through holes are respectively connected to the two metal layers, the connection layer is filled inside the through holes, both ends of the connection layer respectively contact the two metal layers, and the two welding layers are respectively arranged on the two metal layers.

[0006] According to an embodiment of the utility model, protective layers are formed on both sides of the substrate, the protective layers surround the metal layers and are in contact with the metal layers.

[0007] According to an embodiment of the utility model, the thickness of the protective layer is the same as that of the metal layer.

[0008] According to an embodiment of the utility model, the protective layer is an insulating solder resist ink.

[0009] According to an embodiment of the utility model, the connection layer is made of the same material as the metal layer.

[0010] According to an embodiment of the utility model, the substrate is glass-based.

[0011] According to an embodiment of the utility model, the opening direction of the through hole is perpendicular to the surface of the substrate.

[0012] According to an embodiment of the present utility model, the through hole is a circular hole or an oval hole.

[0013] The beneficial effects of the present utility model are as follows: The present utility model adopts the method of opening through holes in the substrate, combines a connection layer with the substrate, and connects two metal layers at both ends of the connection layer. The connection layer increases the connection area with the substrate, improves the firmness of the connection between the metal layer and the substrate, ensures the service life of the electronic device, and at the same time avoids increasing the volume of the substrate to meet the size requirements of the electronic device.

[0014] Other features and advantages of the present utility model will be described in the following description, and in part, will become obvious from the description, or will be understood by implementing the present utility model.

[0015] To make the above objects, features, and advantages of the present utility model more obvious and understandable, the following specifically enumerates preferred embodiments and, in conjunction with the accompanying drawings, is described in detail as follows. Description of the Drawings

[0016] The above and / or additional aspects and advantages of the present utility model will become obvious and easy to understand from the following description of the embodiments with reference to the drawings, where:

[0017] Figure 1 is a schematic side cross-sectional view of the overall structure of the present utility model;

[0018] Reference Numerals:

[0019] 1. Substrate; 2. Metal layer; 3. Connection layer; 4. Welding layer; 5. Protective layer. Detailed Embodiment

[0020] The embodiments of the present utility model are described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present utility model and should not be construed as a limitation of the present utility model.

[0021] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model. In addition, the features defined as "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, unless otherwise specified, the meaning of "a plurality" is two or more.

[0022] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and defined, the terms "mounted", "connected" and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0023] The following specifically describes the IC package carrier structure of the embodiment of the present utility model with reference to the drawings.

[0024] As Figure 1 shown, the IC package carrier structure according to the embodiment of the present utility model includes: a substrate 1, two metal layers 2, a connection layer 3 and two solder layers 4; through holes are formed in the substrate 1 along the thickness direction, the two metal layers 2 are respectively located on both sides of the substrate 1, both ends of the through holes are respectively connected to the two metal layers 2, the connection layer 3 is filled inside the through holes, both ends of the connection layer 3 respectively contact the two metal layers 2, and the two solder layers 4 are respectively provided on the two metal layers 2.

[0025] In this embodiment, by opening through holes in the substrate 1, the connection layer 3 is combined with the substrate 1, and both ends of the connection layer 3 are connected to the two metal layers 2. The connection area with the substrate 1 is increased through the connection layer 3, the firmness of the connection between the metal layer 2 and the substrate 1 is improved, the service life of the electronic device is ensured, and at the same time, the increase in the volume of the substrate 1 is avoided to meet the size requirements of the electronic device.

[0026] Protective layers 5 are formed on both sides of the substrate 1. The protective layers 5 surround the metal layers 2 and are in contact with the metal layers 2. The thickness of the protective layers 5 is the same as the thickness of the metal layers 2. The protective layers 5 are insulating solder resists; the substrate 1 is glass-based.

[0027] In this embodiment, the insulating solder paste contains resin, which can form good adhesion to glass and metal. Therefore, the protective layer 5 further increases the connection firmness between the metal layer 2 and the substrate 1. At the same time, the insulating solder paste avoids the damage of the chemical agent to the metal layer 2 during the subsequent preparation process, and avoids the phenomenon that the chemical agent causes the separation of the metal layer 2 from the substrate 1. At the same time, the insulating solder paste plays a protective role for the substrate 1, reducing the phenomenon of cracking when the substrate 1 is impacted or vibrated.

[0028] Using a glass substrate as the substrate 1 improves the stability of the substrate 1 and reduces the deformation of the substrate 1 during shaking, resulting in the detachment of the welded parts on the substrate 1.

[0029] The connection layer 3 and the metal layer 2 are made of the same material, so as to be prepared simultaneously. While reducing the process flow, the connection firmness between the connection layer 3 and the metal layer 2 is increased.

[0030] The opening direction of the through hole is perpendicular to the surface of the substrate 1 to ensure the minimization of the opening size and the firmness of the substrate 1.

[0031] The through hole is a circular hole or a waist-shaped hole. Specifically, the corresponding through hole structure can be selected according to the size and shape of the substrate 1. The circular hole can be used when the substrate 1 is in a rectangular structure or an equilateral polygon structure, and the waist-shaped hole can be used when the substrate 1 is in a rectangular shape or other structures. In this way, while ensuring the firmness of the substrate 1, the cross-sectional area of the through hole is ensured, so as to avoid that the connection layer 3 is only formed on both sides of the substrate 1 due to the small through hole during preparation, and the connection between the connection layer 3 and the two metal layers 2 cannot be formed in the through hole, ensuring the connection of the connection layer 3 to the two metal layers 2.

[0032] In the description of this specification, the descriptions with reference to the terms "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0033] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and purposes of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. An IC packaging substrate structure, characterized in that: include: A substrate (1), wherein the substrate (1) is provided with through holes along a thickness direction; Two metal layers (2), the two metal layers (2) are respectively located on two sides of the substrate (1), and the two ends of the through hole are respectively connected to the two metal layers (2); A connecting layer (3), the connecting layer (3) is filled in the through hole, and two ends of the connecting layer (3) are respectively in contact with two metal layers (2); Two welding layers (4), the two welding layers (4) are respectively arranged on the two metal layers (2).

2. The IC package carrier structure according to claim 1, characterized in that: Protective layers (5) are formed on both sides of the substrate (1); the protective layers (5) surround the metal layer (2) and are in contact with the metal layer (2).

3. The IC package carrier structure according to claim 2, characterized in that: The thickness of the protective layer (5) is the same as the thickness of the metal layer (2).

4. The IC package carrier structure according to claim 2, characterized in that: The protective layer (5) is insulating welding ink.

5. The IC package carrier structure according to claim 1, characterized in that: The connecting layer (3) and the metal layer (2) are made of the same material.

6. The IC package carrier structure according to claim 1, characterized in that: The substrate (1) is glass-based.

7. The IC package carrier structure according to claim 1, characterized in that: The opening direction of the through hole is perpendicular to the surface of the substrate (1).

8. The IC package carrier structure according to claim 1, characterized in that: The through hole is a circular hole or a waist-shaped hole.

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