Package structure

Abstract

The utility model provides a packaging structure, which is provided with a chip layer, a rewiring layer and a protection layer which are sequentially stacked, the rewiring layer is provided with an end part and a transition part which are connected, the protection layer is provided with a base part and an extension part which are connected, the base part is electrically connected with the end part, and the extension part is electrically connected with the chip layer. The extension part covers at least part of the surface of the transition part and is electrically connected with the transition part. According to the utility model, the problems that the thickness of the existing packaging structure is large, and if the thickness is reduced by adopting a windowing structure, the bonding stability is poor are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a packaging structure. Background Art

[0002] The description in this part only provides background information related to the disclosure of the utility model, and does not constitute prior art.

[0003] In the field of existing chip packaging technology, with the development of the market, the design requirements for chips are gradually changing. The packaging structure of traditional chips usually adopts WLCSP packaging (Wafer Level Chip Scale Packaging, WLCSP), that is, wafer-level chip scale packaging. To achieve the miniaturization of the chip, redistribution (RDL) and ball mounting are required between the chip and the substrate frame to adapt to the assembly space inside the chip. However, due to the limitations of existing processes, the height of the ball mounting often cannot be further reduced, which leads to the thickness of the package being greater than the size of the chip, restricting the further development of chip miniaturization. At the same time, in the traditional chip packaging structure, in order to reduce the thickness of the ball mounting, a technical solution of connecting the PCB board through a window structure in the packaging structure to reduce the thickness is proposed; however, using a window structure in the packaging structure is often affected by the size of the end of the redistribution layer, and the bonding stability is poor, which will reduce the connection stability between the packaging structure and the PCB board, resulting in the frequent detachment of the packaging structure from the PCB board. Therefore, this solution is only applicable to relatively stable installation scenarios and cannot be directly installed in equipment structures in environments with strong vibration and movement, so its scope of application is limited; at the same time, when using a window structure during the filling of the encapsulant, flow voids are usually caused, resulting in voids inside the packaging structure.

[0004] It should be noted that the above introduction of the technical background is only for the convenience of clearly and completely explaining the technical solution of the utility model and facilitating the understanding of those skilled in the art. It cannot be considered that the above technical solutions are well-known to those skilled in the art just because these solutions are described in the background art part of the utility model. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a packaging structure, which solves the problems that the existing packaging structure has a large thickness, and using a window structure to reduce the thickness will lead to poor bonding stability.

[0006] The above implementation purpose of the utility model is mainly achieved by the following technical solutions:

[0007] The utility model provides a packaging structure, which has a chip layer, a redistribution layer, and a protective layer that are sequentially stacked.

[0008] The redistribution layer has connected end portions and transition portions, the protective layer is provided with connected base portions and extension portions, the base portions are electrically connected to the end portions, and the extension portions cover at least part of the surface of the transition portions and are electrically connected to the transition portions.

[0009] In a specific embodiment, the extension portions are connected to the outer periphery of the base portions, and the extension portions extend away from the outer periphery of the base portions.

[0010] In a specific embodiment, traces are further provided in the redistribution layer, the end portions are formed at one end of the traces, the transition portions are connected between the end portions and the traces, and the extending direction of the extension portions forms an angle with the extending direction of the traces.

[0011] In a specific embodiment, the angle is greater than 0° and less than 90°, or the angle is equal to 0°.

[0012] In a specific embodiment, the extension portions and the base portions are integrally formed, and the width of the extension portions gradually narrows in the direction away from the base portions.

[0013] In a specific embodiment, the centers of the base portions and the centers of the end portions are concentrically arranged, and the covering areas of the extension portions are located within the surface profiles of the end portions and within the surface profiles of the transition portions.

[0014] In a specific embodiment, the outer sides of the extension portions are parallel to the inner sides of the adjacent transition portions, and / or the outer sides of the base portions are parallel to the inner sides of the end portions. In a specific embodiment, the side edges of the extension portions are tangentially connected to the outer periphery of the base portions, and the angle formed by the two side edges of the extension portions is less than or equal to 90°.

[0015] In a specific embodiment, the redistribution layer has a plurality of the end portions, the plurality of end portions are arranged at intervals, a plurality of the transition portions and a plurality of the base portions are respectively connected to the plurality of end portions correspondingly, a plurality of the extension portions correspondingly cover a plurality of the transition portions, and the extending directions of the extension portions adjacent to each other in the protective layer are arranged at a certain angle.

[0016] In a specific embodiment, the extending directions of the extension portions adjacent to each other are arranged in opposite directions.

[0017] Compared with the prior art, the technical solution of the present utility model has the following characteristics and advantages:

[0018] For the encapsulation structure provided by the present utility model, the combination of the base portion and the extension portion of the protective layer increases the connection area and connection method between the window structure and the PCB board, which is beneficial to improving the connection stability between the encapsulation structure and the PCB board; furthermore, the redistribution layer adopts the structure of an end portion and a transition portion, and at the same time, the extension portion covers and connects at least part of the surface of the transition portion, which can further increase the connection stability between the protective layer and the redistribution layer, and overall improve the installation stability of the encapsulation structure. Description of the Drawings

[0019] Figure 1 It is a connection structure diagram between the encapsulation structure of the present utility model and the PCB board;

[0020] Figure 2 It is a structure diagram of the encapsulation structure of the present utility model;

[0021] Figure 3 It is a connection structure diagram of the first embodiment of the redistribution layer and the protective layer of the encapsulation structure of the present utility model;

[0022] Figure 4 It is a connection structure diagram of the second embodiment of the redistribution layer and the protective layer of the encapsulation structure of the present utility model;

[0023] Figure 5 It is a spacing diagram of the redistribution layer and the protective layer of the encapsulation structure of the present utility model;

[0024] Figure 6 It is an angle diagram of the first embodiment of the redistribution layer and the protective layer of the encapsulation structure of the present utility model;

[0025] Figure 7 It is an angle diagram of the second embodiment of the redistribution layer and the protective layer of the encapsulation structure of the present utility model;

[0026] Figure 8 It is an arrangement diagram of the first embodiment of the encapsulation structure of the present utility model;

[0027] Figure 9 It is an arrangement diagram of the second embodiment of the encapsulation structure of the present utility model.

[0028] Description of the Reference Numerals in the Drawings:

[0029] 1. Chip layer;

[0030] 2. Redistribution layer; 21. End portion; 22. Transition portion; 23. Trace;

[0031] 3. Protective layer; 31. Base portion; 32. Extension portion;

[0032] 4. PCB board;

[0033] 5. Solder paste

[0034] S1, the distance between the outer side of the extension part and the inner side of the adjacent transition part;

[0035] S2, the distance between the outer side of the base part and the inner side of the end part;

[0036] S3, the distance between two adjacent base parts;

[0037] A1, the angle between the extending direction of the extension part and the extending direction of the trace;

[0038] A2, the angle formed by the two side edges of the extension part. Detailed implementation manners

[0039] In order to enable those skilled in the art to better understand the technical solutions in the present utility model, the following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0040] It should be noted that when an element is referred to as being "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only embodiments.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present utility model belongs. The terms used in the description of the present utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0042] As Figures 1 to 4 shown, the present utility model provides a packaging structure, which has a chip layer 1, a redistribution layer 2 and a protective layer 3 that are sequentially stacked;

[0043] The redistribution layer 2 has a connected end part 21 and a transition part 22. The protective layer 3 is provided with a connected base part 31 and an extension part 32. The base part 31 is electrically connected to the end part 21, and the extension part 32 covers at least part of the surface of the transition part 22 and is electrically connected to the transition part 22.

[0044] The packaging structure provided by the present utility model adjusts the connection structure between the redistribution layer 2 and the protective layer 3, making the connection between the redistribution layer 2 and the protective layer 3 tighter, and also making the connection between the protective layer 3 and the PCB board 4 tighter, improving the tensile stress that the packaging structure can withstand when placed on the PCB board 4 and enhancing the installation stability of the packaging structure.

[0045] In the packaging structure provided by the present utility model, the combination of the base portion 31 and the extension portion 32 of the protective layer 3 increases the connection area and connection method between the opening structure and the PCB board 4, which is beneficial to improving the connection stability between the packaging structure and the PCB board 4; furthermore, the redistribution layer 2 adopts the structure of the end portion 21 and the transition portion 22, and at the same time, the extension portion 32 covers and connects at least part of the surface of the transition portion 22, which can further increase the connection stability between the protective layer 3 and the redistribution layer 2 and overall enhance the installation stability of the packaging structure.

[0046] As Figure 2 and Figure 3 shown, specifically in this embodiment, the packaging structure includes a chip layer 1 for placing chips, a redistribution layer 2 provided with metal rewiring, and a protective layer 3 provided with an opening structure. In this embodiment, there are multiple traces 23 in the redistribution layer 2. One ends of the multiple traces 23 are respectively connected to the output points of the chips, and the other ends of the multiple traces 23 are respectively connected to multiple end portions 21 in the redistribution layer 2. The end portions 21 and the transition portions 22 in the redistribution layer 2 are formed on the surface of the redistribution layer 2, and each end portion 21 is used to connect each base portion 31 of the protective layer 3; in this embodiment, the protective layer 3 has multiple base portions 31. The base portions 31 penetrate through the protective layer 3. One end of the base portion 31 is electrically connected to the end portion 21, and the other end of the base portion 31 is exposed on the surface of the protective layer 3 for connecting to the PCB board 4 to output the signals of the chips; the base portion 31 of this embodiment is formed on the surface of the end portion 21 and is electrically connected to the surface of the end portion 21. In other embodiments, the base portion 31 can also be partially formed on the surface of the end portion 21, and no specific limitation is made thereto.

[0047] As Figure 3As shown, in this embodiment, the transition portion 22 is formed on the outer periphery of the end portion 21, and the transition portion 22 is connected between the end portion 21 and the routing 23. In other embodiments, the transition portion 22 may also be formed on the outer periphery of the end portion 21, and the transition portion 22 extends away from the end portion 21 from the outer periphery of the end portion 21. There is no specific limitation on this; the end portion 21 and the transition portion 22 of this embodiment are electrically connected, and the base portion 31 and the extension portion 32 are electrically connected; the extension portion 32 of this embodiment is formed on the outer periphery of the base portion 31, and the extension portion 32 extends away from the base portion 31 from the outer periphery of the base portion 31. In other embodiments, the extension portion 32 may also be arranged to surround the outer periphery of the base portion 31, or the extension portion 32 is connected to the base portion 31 through a certain connection structure. There is no specific limitation on this; the extension portion 32 of this embodiment penetrates through the protective layer 3, and one end of the extension portion 32 is electrically connected to the transition portion 22. In other embodiments, one end of the extension portion 32 may also be electrically connected to the transition portion 22 and the end portion 21. There is no specific limitation on this; in this embodiment, the other end of the extension portion 32 is exposed on the surface of the protective layer 3 for connection to the PCB board 4; the extension portion 32 of this embodiment is formed on the surface of the transition portion 22 and is electrically connected to the surface of the transition portion 22. In other embodiments, a part of the structure of the extension portion 32 may also be formed on the surface of the transition portion 22, and the extension portion 32 is electrically connected to the part of the surface of the transition portion 22 covered by the extension portion 32. There is no specific limitation on the connection manner between the extension portion 32 and the transition portion 22, with the limitation that the extension portion 32 is electrically connected to the transition portion 22 through the surface covering the transition portion 22.

[0048] As Figure 3 and Figure 4 shown, in a specific embodiment, the extension portion 32 is connected to the outer periphery of the base portion 31, and the extension portion 32 extends away from the base portion 31 from the outer periphery of the base portion 31.

[0049] For the encapsulation structure provided by the present utility model, through the extension portion 32 connected to the outer periphery of the base portion 31, in this embodiment, the connection area between the extension portion 32 and the transition portion 22 can be increased, that is, the connection stability between the protective layer 3 and the redistribution layer 2 can be increased; further, the extension portion 32 extending outward can also increase the connection area between the protective layer 3 and the PCB board 4, and increase the connection stability between the encapsulation structure and the PCB board 4.

[0050] For the encapsulation structure provided by the present utility model, the extension portion 32 is configured to extend radially outward, which is beneficial to the glue application process during the fixation of the encapsulation structure and the PCB board 4, and improves the fluidity of the glue liquid between the protective layer 3 and the PCB board 4; furthermore, the outwardly extending extension portion 32 is respectively connected to the PCB board 4 and the transition portion 22. Since the extension direction of the extension portion 32 is not fixed, the connection stability of the encapsulation structure and the PCB board 4 under various vibration environments can be improved, as well as the connection stability in all directions between the protective layer 3 and the redistribution layer 2.

[0051] As Figure 3 and Figure 4 shown, specifically in this embodiment, the extension portion 32 is disposed on the outer periphery of the base portion 31. One end of the extension portion 32 is connected to the outer periphery of the base portion 31, and the other end of the extension portion 32 extends radially outward from the outer periphery of the base portion 31. The extension portion 32 of this embodiment generally extends outward in the shape of the tail tip of a water droplet. In other embodiments, the extension portion 32 can also be rectangular, triangular, etc., and no specific limitation is made thereto; the connection between the extension portion 32 and the base portion 31 is smoothly connected, that is, there is no included angle at the connection between the extension portion 32 and the base portion 31, which is convenient for the glue liquid to flow smoothly during the glue application process of the encapsulation structure and the PCB board 4, and avoids the generation of bubbles and unfilled holes.

[0052] As Figure 3 and Figure 4 shown, in a specific embodiment, there is also a trace 23 in the redistribution layer 2. The end portion 21 is formed at one end of the trace 23, and the transition portion 22 is connected between the end portion 21 and the trace 23. The extension direction of the extension portion 32 is set at an included angle with the extension direction of the trace 23.

[0053] For the encapsulation structure provided by the present utility model, by disposing the transition portion 22 between the trace 23 and the end portion 21, the problem of poor connection stability between the trace 23 and the end portion 21 caused by the direct connection of the end portion 21 and the trace 23 can be avoided. Further, the connection between the transition portion 22 and the end portion 21 can increase the connection area between the redistribution layer 2 and the protective layer 3, and improve the connection stability between the redistribution layer 2 and the protective layer 3. Furthermore, the extension direction of the extension portion 32 is set at a certain included angle with the extension direction of the trace 23, which can flexibly adjust the extension direction of the extension portion 32 while ensuring the area size of the connection surface between the extension portion 32 and the transition portion 22, and improve the connection stability of the encapsulation structure and the PCB board 4 under various vibration environments.

[0054] Specifically, in this embodiment, the extending direction of the trace 23 is the projection of the direction in which the trace 23 extends outward from the outer periphery of the end portion 21 on the surface of the redistribution layer 2. The transition portion 22 is connected between the trace 23 and the end portion 21. That is, the direction of the trace 23 defines the connection orientation between the transition portion 22 and the end portion 21. In this embodiment, the transition portion 22 is generally a structure extending outward from the outer periphery of the end portion 21. In other embodiments, the transition portion 22 can also be a structure protruding outward from the outer periphery of the end portion 21, and no specific limitation is made thereto; in this embodiment, the width of the transition portion 22 is gradually narrowed in the direction away from the end portion 21, so as to more smoothly connect the trace 23 and improve the connection stability between the trace 23 and the end portion 21. In other embodiments, the width of the transition portion 22 can also be set to remain unchanged in the direction away from the end portion 21, and no specific limitation is made thereto.

[0055] As Figure 3 , Figure 4 and Figure 7 shown, in this embodiment, the extending direction of the extension portion 32 is limited by covering at least a part of the surface of the transition portion 22. The extending direction of the extension portion 32 can be set at a certain angle with the extending direction of the trace 23. That is, the extension portion 32 in this embodiment can be set to be different from the extending direction of the trace 23. In a specific implementation manner, the included angle A1 is greater than 0° and less than 90°, or the included angle A1 is equal to 0°; that is, in a specific embodiment herein, the included angle A1 between the extending direction of the extension portion 32 and the extending direction of the trace 23 can be 0°, that is, the extending direction of the extension portion 32 is the same as the extending direction of the trace 23, so as to maximize the area of the surface of the transition portion 22 covered by the extension portion 32 and improve the connection stability between the extension portion 32 and the redistribution layer 2. In other embodiments herein, the included angle A1 between the extending direction of the extension portion 32 and the extending direction of the trace 23 is not 0°, but the extension portion 32 is integrally formed on the surface of the transition portion 22. That is, within a certain angle range of the included angle A1 between the extending direction of the extension portion 32 and the extending direction of the trace 23, the surface area of the transition portion 22 covered by the extension portion 32 is the same. In this embodiment, the selection of the extending direction of the extension portion 32 has more freedom; in another embodiment, the included angle A1 between the extending direction of the extension portion 32 and the extending direction of the trace 23 is not 0°, and a part of the surface of the extension portion 32 covers the surface of the transition portion 22. That is, within the included angle range greater than 0° and less than 90° of the included angle A1 between the extending direction of the extension portion 32 and the extending direction of the trace 23, the surface area of the transition portion 22 covered by the extension portion 32 is different, and no specific limitation is made to the extending and covering situation of the extension portion 32.

[0056] In the embodiments herein, as Figure 4As shown, the extension part 32 is integrally formed on the end part 21 and the transition part 22. That is, the part of the extension part 32 close to the base part 31 is formed on the surface of the end part 21, and the part of the extension part 32 far from the base part 31 is formed on the surface of the transition part 22. In another embodiment, the part of the extension part 32 close to the base part 31 is formed on the surface of the end part 21, and only a part of the part of the extension part 32 far from the base part 31 is formed on the surface of the transition part 22. In other embodiments, there is no specific limitation on the connection relationship between the extension part 32 and the transition part 22; in the embodiments herein, the included angle between the extending direction of the extension part 32 and the extending direction of the wiring 23 is limited by the connection area between the extension part 32 and the transition part 22 and the connection area between the extension part 32 and the end part 21. In other embodiments, the included angle between the extending direction of the extension part 32 and the extending direction of the wiring 23 may not be limited by the connection area between the extension part 32 and the transition part 22, and there is no specific limitation on the magnitude of the included angle between the extending direction of the extension part 32 and the extending direction of the wiring 23.

[0057] As Figure 3 and Figure 4 shown, in a specific embodiment, the extension part 32 and the base part 31 are integrally formed, and the width of the extension part 32 is gradually narrowed along the direction away from the base part 31.

[0058] In the encapsulation structure provided by the present utility model, the extension part 32 and the base part 31 are integrally formed, that is, the extension part 32 is smoothly connected to the outer periphery of the base part 31, which can improve the connection stability between the extension part 32 and the base part 31. At the same time, it can also avoid the occurrence of corners and connection points at the connection between the extension part 32 and the base part 31, resulting in problems such as voids during the dispensing process between the encapsulation structure and the PCB board 4, which is more conducive to improving the connection stability between the encapsulation structure and the PCB board 4. At the same time, the width of the extension part 32 is gradually narrowed along the direction away from the base part 31, that is, it can further improve the fluidity of the dispensing between the encapsulation structure and the PCB board 4 during the dispensing process.

[0059] As Figure 1 shown, in the embodiments herein, during the process of mounting the encapsulation structure on the PCB board 4, first, a layer of solder paste 5 needs to be coated on the surface of the protective layer 3. The solder paste 5 will be formed on the surfaces of the base part 31 and the extension part 32. That is, the shapes of the base part 31 and the extension part 32 define the shape of the solder paste 5. The encapsulation structure is soldered to the pins on the PCB board 4 through the solder paste 5 to realize the connection relationship between the encapsulation structure and the PCB board 4. Further, a sealing adhesive is dropped between the protective layer 3 and the PCB board 4 to stabilize the connection relationship between the encapsulation structure and the PCB board 4.

[0060] As Figure 3 and Figure 4As shown, specifically in this embodiment, the extension portion 32 and the base portion 31 are integrally formed, that is, the outer periphery of the extension portion 32 is smoothly connected to the outer periphery of the base portion 31. The width of the extension portion 32 is the width of the projection of the extension portion 32 on the surface of the protective layer 3. The width of the extension portion 32 is gradually narrowed in the direction away from the base portion 31, that is, the outer contour of the extension portion 32 forms a surface for the smooth flow of the glue. In a specific embodiment, the base portion 31 is a circular structure, and the extension portion 32 is connected to the outer periphery of the base portion 31. The width of the extension portion 32 gradually narrows from the diameter of the base portion 31 to 0 mm in the direction away from the base portion 31, that is, the base portion 31 and the extension portion 32 together form a water droplet-shaped structure. In other embodiments, the extension portion 32 and the base portion 31 may also form other structures, which are not specifically limited herein. In this embodiment, the extension portion 32 and the base portion 31 form a water droplet-shaped structure, so that the solder paste 5 is also in a water droplet-shaped structure, which is beneficial to the flow of the glue between multiple solder pastes 5, and at the same time, it can avoid the generation of voids in the glue due to the influence of the solder paste structure, further improving the connection stability between the encapsulation structure and the PCB board 4.

[0061] As Figure 3 and Figure 4 shown, in a specific embodiment, the center of the base portion 31 is concentric with the center of the end portion 21, and the coverage area of the extension portion 32 is located within the surface contour of the end portion 21 and within the surface contour of the transition portion 22.

[0062] For the encapsulation structure provided by the present invention, by concentrically setting the center of the base portion 31 with the center of the end portion 21, the problem of stress imbalance caused by the eccentric setting of the base portion 31 and the end portion 21 can be avoided, that is, when the connection between the encapsulation structure and the PCB board 4 is subjected to tensile stress, the problem of unstable connection between the base portion 31 and the end portion 21 due to the eccentric setting can be avoided. Further, the coverage area of the extension portion 32 is located within the surface contour of the end portion 21 and within the surface contour of the transition portion 22, that is, the extension portion 32 is formed on the surface of the end portion 21 and the surface of the transition portion 22, increasing the connection area between the protective layer 3 and the redistribution layer 2, and further improving the connection stability between the protective layer 3 and the redistribution layer 2.

[0063] Specifically, in this embodiment, the base portion 31 is generally cylindrical, and the surface of the end portion 21 is generally circular. In other embodiments, the base portion 31 can also be cube-shaped, and the surface of the end portion 21 can also be square-shaped, without specific limitations in this regard. In this embodiment, one end of the extension portion 32 is connected to the outer periphery of the base portion 31, and the other end of the extension portion 32 extends radially outward from the outer periphery of the base portion 31. While the center of the base portion 31 is concentric with the center of the end portion 21, the coverage area of the extension portion 32 should also be within the surface contour of the end portion 21, that is, the coverage area of the base portion 31 is within the surface contour of the end portion 21, so that part of the structures of the base portion 31 and the extension portion 32 are formed on the surface of the end portion 21. Among them, a part of the structure of the extension portion 32 is formed on the surface of the transition portion 22, and another part of the structure of the extension portion 32 is formed on the surface of the end portion 21, improving the connection stability between the protective layer 3 and the redistribution layer 2.

[0064] As Figure 5 shown, in a specific embodiment, the outer side of the extension portion 32 is parallel to the inner side of the adjacent transition portion 22, and / or the outer side of the base portion 31 is parallel to the inner side of the end portion 21.

[0065] For the encapsulation structure provided by the present utility model, by restricting the outer side of the extension portion 32 to be parallel to the inner side of the transition portion 22 or the outer side of the base portion 31 to be parallel to the inner side of the end portion 21, the connection force between the protective layer 3 and the redistribution layer 2 can be made more balanced.

[0066] Specifically, in this embodiment, the outer side of the extension portion 32 and the inner side of the adjacent transition portion 22 are both straight line segments. The fact that the outer side of the extension portion 32 is parallel to the inner side of the adjacent transition portion 22 means that the projection line of the outer side of the extension portion 32 on the surface of the transition portion 22 is parallel to the inner side of the transition portion 22. In other embodiments, the outer side of the extension portion 32 and the inner side of the adjacent transition portion 22 are non-straight line segments. The fact that the outer side of the extension portion 32 is parallel to the inner side of the adjacent transition portion 22 means that the projection line of the outer side of the extension portion 32 on the surface of the transition portion 22 can coincide with the corresponding inner side of the transition portion 22 after magnification and translation.

[0067] Specifically, in this embodiment, the surface of the end portion 21 is circular, the base portion 31 is cylindrical, the outer side of the base portion 31 and the inner side of the end portion 21 are both arc line segments. The fact that the outer side of the base portion 31 is parallel to the inner side of the end portion 21 means that the projection line of the outer side of the base portion 31 on the surface of the end portion 21 can coincide with the inner side of the end portion 21 after magnification and translation.

[0068] In another embodiment of the present invention, the distance S1 between the outer side of the extension portion 32 and the inner side of the adjacent transition portion 22 is the same everywhere, and / or the distance S2 between the outer side of the base portion 31 and the inner side of the end portion 21 is the same everywhere.

[0069] For the packaging structure provided by the present utility model, by restricting the distance between the outer side of the extension portion 32 and the inner side of the transition portion 22, and the distance S2 between the outer side of the base portion 31 and the inner side of the end portion 21, the connection force between the protective layer 3 and the redistribution layer 2 can be made more balanced, and the connection stability between the protective layer 3 and the redistribution layer 2 is improved.

[0070] Specifically, in this embodiment, the distance S1 between the outer side of the extension portion 32 and the inner side of the adjacent transition portion 22 is the distance between the projection line of the outer side of the extension portion 32 on the surface of the transition portion 22 and the inner side of the transition portion 22, that is, by restricting the distance, the connection force at the connection between the extension portion 32 and the transition portion 22 is evenly distributed on the surface of the transition portion 22; in a specific embodiment, the width of the extension portion 32 gradually narrows in the direction away from the base portion 31, restricting the distance S1 between the outer side of the extension portion 32 and the inner side of the transition portion 22 to be equal everywhere, that is, restricting the width of the transition portion 22 to also gradually narrow in the direction away from the end portion 21, which can improve the connection stability between the trace 23 and the transition portion 22. Similarly, in another specific embodiment, the surface of the end portion 21 is circularly arranged, and the base portion 31 is cylindrically arranged. Restricting the distance S2 between the inner side of the end portion 21 and the outer side of the base portion 31 to be equal everywhere realizes the even distribution of the connection force at the connection between the base portion 31 and the end portion 21 on the surface of the end portion 21, which can improve the connection stability between the end portion 21 and the base portion 31. In other embodiments, the shapes of the end portion 21 and the base portion 31 are not specifically limited.

[0071] In a specific embodiment, the distance S1 between the outer side of the extension portion 32 and the inner side of the adjacent transition portion 22 is greater than or equal to 5 μm and less than or equal to 100 μm; and / or the distance S2 between the outer side of the base portion 31 and the inner side of the end portion 21 is greater than or equal to 5 μm and less than or equal to 100 μm.

[0072] The encapsulation structure provided by the present utility model restricts the distance S1 between the outer side of the extension part 32 and the inner side of the adjacent transition part 22, and restricts the distance S2 between the outer side of the base part 31 and the inner side of the end part 21, which can avoid the problem that the distance S1 between the outer side of the extension part 32 and the inner side of the adjacent transition part 22 is too large, and the distance S2 between the outer side of the base part 31 and the inner side of the end part 21 is too large, resulting in too few corresponding pin numbers of the encapsulation structure, wasting a lot of space, and resulting in poor connection stability between the protective layer 3 and the redistribution layer 2, and poor connection stability between the encapsulation structure and the PCB board 4; it can also avoid the problem that the distance S1 between the outer side of the extension part 32 and the inner side of the adjacent transition part 22 is too small, and the distance S2 between the outer side of the base part 31 and the inner side of the end part 21 is too small, resulting in poor connection stability between the redistribution layer 2 and the protective layer 3 when the encapsulation structure is connected to the PCB board 4 and subjected to vibration tensile stress.

[0073] Specifically, in this embodiment, the distance S1 between the outer side of the extension part 32 and the inner side of the adjacent transition part 22 is equal everywhere, and the distance S2 between the outer side of the base part 31 and the inner side of the end part 21 is equal everywhere, that is, the outer side of the extension part 32 is parallel to the inner side of the adjacent transition part 22, and the outer side of the base part 31 and the inner side of the end part 21 are concentrically arranged. In this embodiment, the outer side of the base part 31 is circular, and the inner side of the end part 21 is also circular. The two outer sides of the extension part 32 are tangentially connected to the outer circumference of the base part 31, and the two inner sides of the transition part 22 are tangentially connected to the outer circumference of the end part 21. In this embodiment, the projected distance on the surface of the transition part 22 between any outer side of the extension part 32 and the inner side of its adjacent transition part 22 is greater than or equal to 5 μm and less than or equal to 100 μm; in this embodiment, the difference between the radius of the outer side of the base part 31 and the radius of the inner side of the end part 21 is greater than or equal to 5 μm and less than or equal to 100 μm.

[0074] As Figure 6 shown, in a specific embodiment, the side of the extension part 32 is tangentially connected to the outer circumference of the base part 31, and the included angle A2 formed by the two sides of the extension part 32 is less than or equal to 90°.

[0075] The encapsulation structure provided by the present utility model makes the side of the extension part 32 tangentially connected to the outer periphery of the base part 31, so that under the premise of meeting the fluidity of the epoxy resin dispensing, the area of the extension part 32 is increased as much as possible, enabling the encapsulation structure to be more closely connected to the PCB board 4; further, the included angle A2 formed by the two sides of the extension part 32 is set to be less than or equal to 90°. When the extension part 32 and the base part 31 are combined into a water droplet shape, that is, under the premise of ensuring the fluidity of the epoxy resin dispensing, and considering two scenarios where the extension part 32 is formed on the surface of the transition part 22, or the extension part 32 is formed on the surfaces of the transition part 22 and the end part 21, the area of the extension part 32 is increased as much as possible, enabling the encapsulation structure to be more closely connected to the PCB board 4.

[0076] Specifically, in this embodiment, the outer side of the base part 31 forms a circle, the inner side of the end part 21 also forms a circle, the two outer sides of the extension part 32 are tangentially connected to the outer periphery of the base part 31, and the two inner sides of the transition part 22 are tangentially connected to the outer periphery of the end part 21. That is, the combination of the end part 21 and the transition part 22 is roughly in the shape of a water droplet, and the combination of the base part 31 and the extension part 32 is also roughly in the shape of a water droplet. Using the same structural shape is beneficial to improving the connection stability between the protective layer 3 and the redistribution layer 2; in other embodiments, there is no limitation on the combined shape of the end part 21 and the transition part 22 in the redistribution layer 2, and there is also no limitation on the combined shape of the base part 31 and the extension part 32 in the protective layer 3, with the formation of the base part 31 on the surface of the end part 21 as a limitation, and the formation of the extension part 32 on the surfaces of the end part 21 and the transition part 22, or the extension part 32 being formed only on the surface of the transition part 22 as a limitation.

[0077] In this embodiment, on the basis that the extension part 32 is formed on the surfaces of the end part 21 and the transition part 22, or the extension part 32 is formed only on the surface of the transition part 22, in order to increase the area of the extension part 32 as much as possible, setting the included angle A2 formed by the two sides of the extension part 32 to be less than or equal to 90° can increase the extension distance of the extension part 32, making the area of the extension part 32 increase as much as possible. The smaller the included angle A2, the farther the extension distance of the extension part 32, and the larger the area of the extension part 32.

[0078] As Figure 8 and Figure 9 shown, in a specific embodiment, the redistribution layer 2 has a plurality of end parts 21, the plurality of end parts 21 are arranged at intervals, a plurality of transition parts 22 and a plurality of base parts 31 are respectively connected to the plurality of end parts 21 correspondingly, and a plurality of extension parts 32 respectively cover the plurality of end parts 21. The extension directions of two adjacent extension parts 32 in the protective layer 3 are set at an angle.

[0079] The encapsulation structure provided by the present utility model arranges a plurality of ends 21 on the surface of the redistribution layer 2 of the encapsulation structure according to a certain rule, so that the base part 31 and the extension part 32 of the protective layer 3 can also be arranged on the surface of the protective layer 3 according to a certain rule. Furthermore, the solder paste 5 generated by surface treatment of the encapsulation structure can also be arranged according to a certain rule. Therefore, during the potting process, the glue can flow smoothly in the space between the protective layer 3 and the PCB board 4, avoiding the problem of difficult glue flow and void generation caused by irregular arrangement of the solder paste 5, and enhancing the connection stability between the encapsulation structure and the PCB board 4.

[0080] As Figure 8 and Figure 9 shown, specifically in this embodiment, a plurality of ends 21 are distributed on the surface of the redistribution layer 2, and the plurality of ends 21 are arranged at intervals. In this embodiment, the plurality of ends 21 are divided into two groups, and the plurality of ends 21 in each group are arranged at intervals along the same straight line. In other embodiments, the plurality of ends 21 can also be divided into one group or three groups, with the limitation that the plurality of ends 21 are evenly distributed. In this embodiment, after the positions of the respective ends 21 are fixed, a plurality of transition parts 22 and a plurality of base parts 31 are correspondingly connected to the respective ends 21, wherein the positions where the respective transition parts 22 are connected to the outer periphery of the respective ends 21 are restricted by the arrangement of a plurality of traces 23, and the respective base parts 31 are formed on the surfaces of the respective ends 21, and the respective extension parts 32 are correspondingly connected to the outer periphery of the respective base parts 31 and extend in a direction away from the base parts 31.

[0081] In this embodiment, the extending directions of adjacent extension parts 32 are arranged at a certain angle. The angle between the extending directions of adjacent extension parts 32 can be any angle between 0° and 180°, and no specific limitation is made thereto; in this embodiment, no limitation is made to the angle between the extending directions of adjacent extension parts 32, which can enable the extending directions of the extension parts 32 to be designed according to the direction of the vibration force that the encapsulation structure may be subjected to, so as to improve the connection stability between the encapsulation structure and the PCB board 4 under the vibration environment in all directions; in this embodiment, the plurality of ends 21 are divided into two groups, so the plurality of extension parts 32 are also divided into two groups, and the plurality of extension parts 32 in each group are arranged at intervals along the same straight line. In a specific embodiment, taking one extension part 32 as the center, the different-group extension parts 32 adjacent to the extension part 32 are arranged at intervals between the same-group extension parts 32 adjacent to the extension part 32 and the extension part 32. Therefore, in this embodiment, the extending directions of two adjacent extension parts 32 are arranged at a certain angle, which means that the extending direction of the extension part 32 forms a certain angle with the extending direction of the adjacent extension part 32 in a different group; in another specific embodiment, the plurality of ends 21 are divided into one group, and the plurality of extension parts 32 in the same group are also arranged at intervals along the same straight line. In this embodiment, the extending directions of adjacent extension parts 32 are arranged at a certain angle, which means that the extending direction of the extension part 32 forms a certain angle with the extending direction of the adjacent extension part 32 in the same group.

[0082] The adjacent extension parts 32 can refer to either the adjacent extension parts 32 in the same group or the adjacent extension parts 32 in different groups corresponding to the extension parts 32 in this group; in other embodiments, the multiple end parts 21 can also be divided into a group, and the adjacent extension parts 32 only refer to the adjacent extension parts 32 in the same group.

[0083] As Figure 8 and Figure 9 shown, in a specific embodiment, the extension directions of two adjacent extension parts 32 are set in opposite directions.

[0084] For the packaging structure provided by the present utility model, by setting the extension directions of the adjacent extension parts 32 in opposite directions, it can be ensured that the extension directions of the adjacent solder pastes 5 generated by surface treatment of the packaging structure are also set in opposite directions. This not only can reduce the distance between two adjacent solder pastes 5, improve the compactness of the solder paste 5 arrangement on the surface of the packaging structure, and be applicable to smaller chip packaging structures, but also can enable the glue liquid to flow smoothly in the space between the protective layer 3 and the PCB board 4 regardless of the direction of dripping during the glue dripping process, avoiding the generation of glue dripping cavities; and enhancing the connection stability between the packaging structure and the PCB board 4.

[0085] As Figure 8 and Figure 9As shown, specifically in this embodiment, the multiple end portions 21 are divided into two groups, and the multiple end portions 21 in each group are arranged at intervals along the same straight line. Therefore, the multiple extension portions 32 are also divided into two groups, and the multiple extension portions 32 in each group are arranged at intervals along the same straight line. With one extension portion 32 as the center, the adjacent extension portions 32 in different groups are arranged at intervals between the adjacent extension portions 32 in the same group adjacent to this extension portion 32 and this extension portion 32. Therefore, in this embodiment, the extension directions of two adjacent extension portions 32 are arranged in opposite directions, which means that the extension direction of the extension portion 32 is arranged in the opposite direction to the extension direction of the adjacent extension portion 32 in a different group; in other embodiments, the multiple end portions 21 are divided into one group, and the multiple end portions 21 are arranged at intervals along the same straight line. Further, the multiple extension portions 32 are also arranged at intervals along the same straight line. In this embodiment, the extension directions of two adjacent extension portions 32 are arranged in opposite directions, which means that the extension direction of the extension portion 32 is arranged in the opposite direction to the extension direction of the adjacent extension portion 32 in the same group; in yet another embodiment, the multiple end portions 21 can also be divided into two groups, and the multiple extension portions 32 in each group are arranged at intervals along the same straight line. With one extension portion 32 as the center, the adjacent extension portions 32 in different groups corresponding to this extension portion 32 are arranged at intervals between the adjacent extension portions 32 in the same group as this extension portion 32 and this extension portion 32. However, in this embodiment, the extension directions of two adjacent extension portions 32 are arranged in opposite directions, which means that the extension direction of the extension portion 32 is arranged in the opposite direction to the extension direction of the adjacent extension portion 32 in the same group; no specific limitation is imposed on the extension direction of the adjacent extension portion 32 in a different group from this extension portion 32.

[0086] Such as Figure 8 and Figure 9As shown, specifically in this embodiment, the distance S3 between two adjacent base parts 31 is greater than or equal to 0.4 mm. In this embodiment, the multiple end parts 21 are divided into two groups, and the multiple end parts 21 in each group are arranged at intervals along the same straight line. Therefore, the multiple base parts 31 are also divided into two groups, and the multiple base parts 31 in each group are arranged at intervals along the same straight line. With one base part 31 as the center, the different-group extension parts 32 adjacent to the extension part 32 are arranged at intervals between the same-group extension parts 32 adjacent to the extension part 32 and the extension part 32. Therefore, in this embodiment, the distance S3 between two adjacent base parts 31 being greater than or equal to 0.4 mm means that the distance S3 between the base part 31 and its adjacent base part 31 in a different group is greater than or equal to 0.4 mm, and the distance S3 between the base part 31 and its adjacent base part 31 in the same group is greater than or equal to 0.4 mm; in other embodiments, the multiple end parts 21 are divided into one group, and the multiple end parts 21 are arranged at intervals along the same straight line. Then, the multiple base parts 31 are also arranged at intervals along the same straight line. In this embodiment, the distance S3 between two adjacent base parts 31 being greater than or equal to 0.4 mm means that the distance S3 between the base part 31 and its adjacent base part 31 in the same group is greater than or equal to 0.4 mm. In yet another embodiment, the multiple end parts 21 can also be divided into two groups, and the multiple base parts 31 in each group are arranged at intervals along the same straight line. With one base part 31 as the center, the different-group extension parts 32 adjacent to the extension part 32 are arranged at intervals between the same-group extension parts 32 adjacent to the extension part 32 and the extension part 32. Therefore, in this embodiment, the distance S3 between two adjacent base parts 31 being greater than or equal to 0.4 mm means that the distance S3 between the base part 31 and its adjacent base part 31 in the same group is greater than or equal to 0.4 mm. Therefore, in other embodiments, no specific limitation is imposed on the extension direction of the adjacent extension parts 32 in a different group from the extension part 32.

[0087] In the specific embodiments described above, the purpose, technical solutions, and beneficial effects of the present utility model have been further described in detail. It should be understood that the above description is only for the specific embodiments of the present utility model and does not limit the protection scope of the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A packaging structure, comprising a chip layer, a redistribution layer and a protection layer stacked in sequence, characterized in that: The rewiring layer has an end portion and a transition portion connected to each other, and the protective layer has a base portion and an extension portion connected to each other, the base portion is electrically connected to the end portion, and the extension portion covers at least a portion of the surface of the transition portion and is electrically connected to the transition portion.

2. The packaging structure according to claim 1, characterized in that: The extension portion is connected to the outer periphery of the base portion, and the extension portion is extended from the outer periphery of the base portion in a direction away from the base portion.

3. The packaging structure according to claim 2, characterized in that: A routing line is also provided in the redistribution layer, the end portion is formed at one end of the routing line, the transition portion is connected between the end portion and the routing line, and the extension direction of the extension portion is arranged at an angle to the extension direction of the routing line.

4. The packaging structure according to claim 3, characterized in that: The angle is greater than 0° and less than 90°, or the angle is equal to 0°.

5. The packaging structure according to claim 2 or 3, characterized in that: The extension portion is integrally formed with the base portion, and a width of the extension portion is gradually narrowed in a direction away from the base portion.

6. The packaging structure according to claim 5, characterized in that: The center of the base portion is concentrically arranged with the center of the end portion, and the coverage area of ​​the extension portion is located within the surface contour of the end portion and within the surface contour of the transition portion.

7. The packaging structure according to claim 6, characterized in that: The outer side edge of the extension portion is arranged in parallel with the inner side edge of the adjacent transition portion, and / or the outer side edge of the base portion is arranged in parallel with the inner side edge of the end portion.

8. The packaging structure according to claim 6, characterized in that: The side edge of the extension portion is tangentially connected to the outer periphery of the base portion, and the angle formed by the two side edges of the extension portion is less than or equal to 90°.

9. The packaging structure according to any one of claims 1 to 3, characterized in that: The rewiring layer has a plurality of end portions, the plurality of end portions are arranged at intervals, the plurality of transition portions and the plurality of base portions are respectively connected to the plurality of end portions, the plurality of extension portions respectively cover the plurality of transition portions, and the extension directions of the extension portions adjacent to each other in the protective layer are arranged at a certain angle.

10. The packaging structure according to claim 9, characterized in that: The extending directions of two adjacent extending portions are arranged in opposite directions.

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