Miniature surface-mounted eight-channel ultralow-capacitance electrostatic protection chip

Abstract

The utility model discloses a miniature surface-mounted eight-channel ultralow-capacitance electrostatic protection chip, and relates to the technical field of semiconductors. Four-channel ultra-low-capacitance unidirectional electrostatic protection chips are arranged on silver paste solders arranged on the left side and the right side of the GND end of the metal lead frame, and four open windows of the chip on the left side are electrically connected with a first pin, a second pin, an eighth pin and a ninth pin of the metal lead frame through metal wires respectively. The four windows of the right chip are electrically connected with the fourth pin, the fifth pin, the sixth pin and the seventh pin of the metal lead frame through metal wires respectively, and the third pin of the metal lead frame is connected with the GND end. The peripheries of the metal lead frame, the silver paste solder, the four-channel ultra-low-capacitance unidirectional electrostatic protection chip and the metal wires are half wrapped by epoxy resin. According to the utility model, eight high-speed signal channels are protected at the same time, signal distortion and interference are reduced, integrity and accuracy of signals are ensured, circuit wiring is simplified, circuit board space is saved, stability and reliability are realized, and cost is reduced.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor technology, and particularly relates to a micro surface-mount eight-channel ultra-low-capacitance electrostatic protection chip. Background Art

[0002] In current highly integrated and refined electronic devices, electrostatic protection has become an essential item, and ESD protection chips are a powerful tool to ensure the stable and reliable operation of electronic devices. The commonly seen ESD protection chips on the market are mostly single-channel, dual-channel, and four-channel; for some multi-signal channels, such as interfaces like LVDS, TTL, HDMI, USB-C, etc., multiple single-channel or dual-channel or four-channel ESD protection chips are required; if the space on the circuit board is limited, the simultaneous use of multiple ESD protection chips will occupy a large amount of circuit board area, the circuit wiring will be complicated, and it is easy to cause signal distortion or interference, and the cost of multiple ESD protection chips is relatively high. Based on this, it is particularly necessary to design a new type of micro surface-mount eight-channel ultra-low-capacitance electrostatic protection chip. Content of the Utility Model

[0003] Aiming at the deficiencies in the prior art, the purpose of the utility model is to provide a micro surface-mount eight-channel ultra-low-capacitance electrostatic protection chip, with a reasonable structural design, which simplifies the circuit wiring, saves the circuit space, reduces signal distortion and interference, improves the reliability and stability of the system, reduces the cost at the same time, and is easy to promote and use.

[0004] To achieve the above purpose, the utility model is realized through the following technical solutions: A micro surface-mount eight-channel ultra-low-capacitance electrostatic protection chip includes a metal lead frame, silver paste solder, four-channel ultra-low-capacitance unidirectional electrostatic protection chips, metal wires, and epoxy resin. Silver paste solders are respectively placed on the left and right sides of the GND end of the metal lead frame, and one four-channel ultra-low-capacitance unidirectional electrostatic protection chip is arranged on the silver paste solder on each side. Among them, the four chip openings of the four-channel ultra-low-capacitance unidirectional electrostatic protection chip on the left are electrically connected to the 1st, 2nd, 8th, and 9th pins of the metal lead frame through metal wires respectively, and the four chip openings of the four-channel ultra-low-capacitance unidirectional electrostatic protection chip on the right are electrically connected to the 4th, 5th, 6th, and 7th pins of the metal lead frame through metal wires respectively. The 3rd pin of the metal lead frame is connected to the GND end; the periphery of the metal lead frame, silver paste solder, four-channel ultra-low-capacitance unidirectional electrostatic protection chips, and metal wires is semi-wrapped with epoxy resin to form a micro surface-mount eight-channel ultra-low-capacitance electrostatic protection chip structure.

[0005] Preferably, pins 1, 2, 4, 5, 6, 7, 8, and 9 of the metal lead frame are eight unidirectional ultra-low-capacitance electrostatic protection channels. Respectively forming a path to the ground with the GND terminal, up to eight electrostatic protection channels can be provided for the interfaces of multiple high-speed signal channels by a single device at one time.

[0006] Preferably, pin 3 of the metal lead frame is connected to the GND terminal to form the ground point of the entire micro surface-mounted eight-channel ultra-low-capacitance electrostatic protection chip.

[0007] Preferably, the metal wire is one of silver alloy wire or gold wire.

[0008] The beneficial effects of the present utility model: This device can protect up to eight high-speed signal channels simultaneously, effectively reducing signal distortion and interference, ensuring the integrity and accuracy of the signal, simplifying the circuit wiring, greatly saving the circuit board space, making the system stable and reliable, reducing costs, and having a broad application prospect. Description of the Drawings

[0009] The present utility model will be described in detail below with reference to the drawings and specific embodiments;

[0010] Figure 1 is a schematic structural diagram of the present utility model;

[0011] Figure 2 is the internal circuit diagram of the present utility model. Specific Embodiments

[0012] In order to make the technical means, creative features, achieved purposes and effects of the present utility model easy to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0013] Refer to Figure 1-2, the present specific embodiment adopts the following technical solution: A micro surface-mount eight-channel ultra-low capacitance electrostatic protection chip, including a metal lead frame A, silver paste solder B, a four-channel ultra-low capacitance unidirectional electrostatic protection chip C, a metal wire D, and an epoxy resin E. The GND terminals on the left and right sides of the metal lead frame A are respectively provided with silver paste solder B, and one four-channel ultra-low capacitance unidirectional electrostatic protection chip C is arranged on the silver paste solder B on each side. Among them, the four chip openings of the four-channel ultra-low capacitance unidirectional electrostatic protection chip C on the left are respectively electrically connected to the 1st pin, 2nd pin, 8th pin, and 9th pin of the metal lead frame A through the metal wire D, and the four chip openings of the four-channel ultra-low capacitance unidirectional electrostatic protection chip C on the right are respectively electrically connected to the 4th pin, 5th pin, 6th pin, and 7th pin of the metal lead frame A through the metal wire D. The 3rd pin of the metal lead frame A is connected to the GND terminal; the periphery of the metal lead frame A, silver paste solder B, four-channel ultra-low capacitance unidirectional electrostatic protection chip C, and metal wire D is semi-wrapped with epoxy resin E to form a micro surface-mount eight-channel ultra-low capacitance electrostatic protection chip structure.

[0014] It should be noted that the metal wire D is made of one of silver alloy wire or gold wire.

[0015] In the present specific embodiment, the 1st pin, 2nd pin, 4th pin, 5th pin, 6th pin, 7th pin, 8th pin, and 9th pin of the metal lead frame A are eight unidirectional ultra-low capacitance electrostatic protection channels. Respectively, by forming a ground path with the GND terminal, a single device can provide up to eight electrostatic protection channels for the interfaces of multiple high-speed signal channels at one time. The 3rd pin of the metal lead frame A is connected to the GND terminal to form the ground connection point of the entire micro surface-mount eight-channel ultra-low capacitance electrostatic protection chip.

[0016] In the present specific embodiment, two four-channel ultra-low capacitance unidirectional electrostatic protection chips C are connected through the metal lead frame A, silver paste solder B, and metal wire D in a specified circuit connection, and then semi-wrapped with epoxy resin E to form an eight-channel ultra-low capacitance electrostatic protection channel, which can provide up to eight electrostatic protection channels for the interfaces of multiple high-speed signal channels by a single device at one time. Compared with multiple single-channel, dual-channel, and four-channel ESD protection chips, this device has the following technical advantages in circuits with multiple high-speed data transmission signal channels and limited space:

[0017] (1) Simplified design: Using a micro surface-mount eight-channel ultra-low capacitance electrostatic protection chip can reduce the number of components and wiring complexity, and simplify the circuit design and manufacturing process.

[0018] (2) Space saving: Eight ESD protection channels with the same performance are highly integrated within the package shape of the micro surface-mount, greatly saving the circuit board space.

[0019] (3) Performance consistency: The micro surface-mount eight-channel ultra-low capacitance electrostatic protection chip is manufactured on the same chip, with better performance consistency and batch stability.

[0020] (4) Efficient protection: The eight-channel ultra-low capacitance design can protect up to eight high-speed signal channels simultaneously. The ultra-low capacitance value can reduce signal distortion and interference, ensure signal integrity and accuracy, provide more comprehensive ESD protection, and improve the reliability and stability of the system.

[0021] (5) Cost-effectiveness: One micro surface-mount eight-channel ultra-low capacitance electrostatic protection chip can replace multiple traditional single-channel, dual-channel, and four-channel ESD protection chips. It is more cost-effective, greatly reduces costs, improves market competitiveness, and has broad market application prospects.

[0022] The above shows and describes the basic principles, main features, and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. The above embodiments and the descriptions in the specification only illustrate the principles of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed. The scope of protection claimed by the present utility model is defined by the appended claims and their equivalents.

Claims

1. A miniature surface mount eight-channel ultra-low capacitance electrostatic protection chip, characterized in that: It includes a metal lead frame (A), silver paste solder (B), a four-channel ultra-low capacitance unidirectional electrostatic protection chip (C), a metal wire (D) and an epoxy resin (E). Silver paste solder (B) is placed on the left and right sides of the GND end of the metal lead frame (A), and a four-channel ultra-low capacitance unidirectional electrostatic protection chip (C) is placed on the silver paste solder (B) on each side. The four chip opening windows of the four-channel ultra-low capacitance unidirectional electrostatic protection chip (C) on the left are respectively connected to the 1st, 2nd and 3rd pins of the metal lead frame (A) through the metal wire (D). Pins 8 and 9 are electrically connected, and the four chip windows of the four-channel ultra-low capacitance unidirectional electrostatic protection chip (C) on the right are electrically connected to pins 4, 5, 6, and 7 of the metal lead frame (A) through metal wires (D), and pin 3 of the metal lead frame (A) is connected to the GND terminal; the metal lead frame (A), silver paste solder (B), four-channel ultra-low capacitance unidirectional electrostatic protection chip (C) and metal wire (D) are half-wrapped with epoxy resin (E) to form a micro surface-mount eight-channel ultra-low capacitance electrostatic protection chip structure.

2. The micro surface mount eight-channel ultra-low capacitance electrostatic protection chip according to claim 1, characterized in that: Pins 1, 2, 4, 5, 6, 7, 8 and 9 of the metal lead frame (A) are eight unidirectional ultra-low capacitance electrostatic protection channels, which respectively form ground paths with the GND terminal.

3. The micro surface mount eight-channel ultra-low capacitance electrostatic protection chip according to claim 1, characterized in that: The three pins of the metal lead frame (A) are connected to the GND terminal to form the grounding point of the entire micro surface mount eight-channel ultra-low capacitance electrostatic protection chip.

4. The micro surface mount eight-channel ultra-low capacitance electrostatic protection chip according to claim 1, characterized in that: The metal wire (D) is a silver alloy wire or a gold wire.

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