Wire-to-board welding-free connector

Abstract

The utility model discloses a wire-to-board welding-free connector, which relates to the technical field of electronic accessories and comprises a metal shell, a plastic part, a first wire pressing part and a second wire pressing part. According to the utility model, the first lock catch part and the second lock catch part are buckled with the plastic part, so that the first wire pressing part and the second wire pressing part are respectively connected with the core wire in a pressing manner, and the core wire is connected with the circuit board in a pressing manner instead of being welded on the circuit board, so that the risk that a bonding pad of the circuit board falls off can be effectively avoided; and meanwhile, the crimping force can fully ensure the smooth connection of the core wire end and the circuit board bonding pad, and the data line manufactured by adopting the wire-to-board welding-free connector can improve the production efficiency, save time and labor, improve the yield and simplify the performance detection steps, thereby greatly reducing the processing cost and the production difficulty.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic accessories, and particularly relates to a wire-to-board solderless connector. Background Art

[0002] As the transmission rates of many data cables are getting higher and higher, in order to ensure the transmission rate, there are relatively high requirements not only for the welding between the connector and the circuit board, but also for the welding between the circuit board and the cable core wire. It is required not only that there is no false soldering between the cable core wire and the circuit board, but also that the solder joints are smooth and round.

[0003] Due to the requirements of performance parameters, the area of the solder pads on the corresponding circuit board is often very small. If there is a slight carelessness during welding, the solder pads will directly fall off. At the same time, it is very difficult to ensure that the welding ends of the cable core wires do not extend beyond the solder pads of the circuit board. Because the length of the core wire exposed from the cable is short, relatively large torsional stress will be generated accordingly. The relatively large torsional stress will cause the welding ends of the cable core wires to easily extend beyond the solder pads of the circuit board. At the same time, even if the welding is completely qualified, if the stress is not restricted, the torsional stress of the cable core wire itself will also pull off the welded solder pads.

[0004] There are many practical difficulties in producing such high-speed data cables. Even with the help of special welding machines, auxiliary wire clamps, dispensing machines for reinforcement, etc., the production difficulty is still very high. It is not only time-consuming and laborious, but also very difficult to ensure the yield rate. Finally, it is necessary to select qualified products through a full inspection method. Therefore, the cost of high-speed data cables is relatively high in terms of processing cost, yield rate cost, and full inspection cost. Content of the Utility Model

[0005] The main purpose of the utility model is to propose a wire-to-board solderless connector, aiming to improve the fixing method between the core wire of the data cable and the circuit board.

[0006] To achieve the above object, the wire-to-board solderless connector proposed by the utility model includes:

[0007] A metal housing, including a fixing part, a first locking part and a second locking part. The first locking part is rotatably connected to the fixing part, the second locking part is rotatably connected to the fixing part, and the fixing part is hollowly arranged to form an installation space;

[0008] A plastic part, the plastic part is inserted into the installation space. Multiple first wire grooves and multiple second wire grooves are respectively opened on the opposite sides of the plastic part, and a circuit board installation chamber is opened in the middle of the plastic part. The multiple first wire grooves and the multiple second wire grooves are respectively communicated with the circuit board installation chamber;

[0009] The first wire pressing part is connected to the first locking part and is used for pressing the core wires in a plurality of the first wire grooves;

[0010] The second wire pressing part is connected to the second locking part and is used for pressing the core wires in a plurality of the second wire grooves;

[0011] Wherein, the first locking part and the second locking part can respectively rotate relative to the fixing part so that the plastic part is clamped between the first locking part and the second locking part.

[0012] In an embodiment, first buckling platforms are respectively and prominently arranged on opposite sides of the plastic part, a first buckling groove adapted to the first buckling platform is formed in the first locking part, second buckling platforms are respectively and prominently arranged on opposite sides of the plastic part, and a second buckling groove adapted to the second buckling platform is formed in the second locking part.

[0013] In an embodiment, a plurality of first wire pressing platforms are prominently arranged on the first wire pressing part, the plurality of first wire pressing platforms correspond to the plurality of first wire grooves one by one, a plurality of second wire pressing platforms are prominently arranged on the second wire pressing part, and the plurality of second wire pressing platforms correspond to the plurality of second wire grooves one by one.

[0014] In an embodiment, the first wire pressing platform and the second wire pressing platform are arc-shaped.

[0015] In an embodiment, the first wire pressing platform and the second wire pressing platform are used for elastically pressing the core wires in the first wire groove and the second wire groove.

[0016] In an embodiment, the width of the first wire groove on the side away from the circuit board installation cabin is greater than the width of the side of the first wire groove communicating with the circuit board installation cabin, and the width of the second wire groove on the side away from the circuit board installation cabin is greater than the width of the side of the second wire groove communicating with the circuit board installation cabin.

[0017] In an embodiment, the plastic part includes a first wire placing part and a second wire placing part which are connected to each other. A plurality of the first wire grooves are formed in the first wire placing part, a plurality of the second wire grooves are formed in the second wire placing part, the circuit board installation cabin is formed between the first wire placing part and the second wire placing part, a first clamping platform is arranged on the side of the first wire placing part close to the metal shell, a first clamping opening adapted to the first clamping platform is formed in the fixing part, a second clamping platform is arranged on the side of the second wire placing part close to the metal shell, and a second clamping opening adapted to the second clamping platform is formed in the fixing part.

[0018] In one embodiment, a plurality of first injection holes are formed in the area of the first locking portion corresponding to the first wire pressing portion, and the first wire pressing portion passes through the first injection holes and is injection-molded on opposite sides of the first locking portion; a plurality of second injection holes are formed in the area of the second locking portion corresponding to the second wire pressing portion, and the second wire pressing portion passes through the second injection holes and is injection-molded on opposite sides of the second locking portion.

[0019] In one embodiment, a connecting plate is provided on the second locking portion, a convex locking portion is formed by protruding of the connecting plate, and a clamping groove adapted to the convex locking portion is provided on the first locking portion; or

[0020] A connecting plate is provided on the first locking portion, a convex locking portion is formed by protruding of the connecting plate, and a clamping groove adapted to the convex locking portion is provided on the second locking portion.

[0021] In one embodiment, the first locking portion is rotatably connected to the fixing portion through a first connecting rib, and the second locking portion is rotatably connected to the fixing portion through a second connecting rib.

[0022] In one embodiment, the first locking portion is provided with a glue injection hole, and / or the second locking portion is provided with a glue injection hole.

[0023] In the present utility model, the first locking portion and the second locking portion are used to buckle with the plastic part, so that the first wire pressing portion and the second wire pressing portion respectively press the core wire. By pressing the core wire on the circuit board, it replaces welding the core wire on the circuit board, which can effectively avoid the risk of the circuit board pad falling off. At the same time, the pressing force can fully ensure the smoothness when the core wire end is connected to the circuit board pad. The data cable made of the present wire-to-board solderless connector can improve production efficiency, save time and effort, improve the yield rate, simplify the performance detection steps, thereby greatly reducing the processing cost and production difficulty. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0025] Figure 1 is a schematic structural diagram of the wire-to-board solderless connector provided by the present utility model;

[0026] Figure 2 is Figure 1 exploded view of;

[0027] Figure 3It is a schematic structural diagram of a plastic part;

[0028] Figure 4 It is an exploded view of a metal housing, a first wire pressing part and a second wire pressing part;

[0029] Figure 5 It is a schematic structural diagram of a data cable;

[0030] Figure 6 It is an exploded view of the data cable;

[0031] Figure 7 It is a schematic structural diagram of a circuit board;

[0032] Figure 8 It is a schematic structural diagram of a plug.

[0033] Explanation of the reference numerals in the drawings:

[0034] 100, wire-to-board solderless connector; 1, metal housing; 11, fixing part; 111, installation space; 112, first bayonet; 113, second bayonet; 12, first locking part; 121, first buckle groove; 122, first injection molding through hole; 123, connecting plate; 124, convex buckle part; 13, second locking part; 131, second buckle groove; 132, second injection molding through hole; 133, card slot; 14, first connecting rib; 15, second connecting rib; 16, glue injection hole; 2, plastic part; 21, first wire placement part; 211, first wire groove; 212, first clamping platform; 22, second wire placement part; 221, second wire groove; 222, second clamping platform; 24, circuit board installation compartment; 25, first buckle platform; 26, second buckle platform; 3, first wire pressing part; 31, first wire pressing platform; 4, second wire pressing part; 41, second wire pressing platform; 200, data cable; 6, cable; 61, core wire; 7, circuit board; 71, first electrical connection disk; 72, second electrical connection disk; 8, plug; 81, metal terminal.

[0035] The realization, functional features and advantages of the purpose of the present utility model will be further described with reference to the embodiments and the accompanying drawings. Specific embodiments

[0036] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

[0037] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present utility model, the directional indications are only used to explain the relative positional relationship, movement conditions, etc. between components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0038] In addition, if there are descriptions such as "first", "second", etc. involved in the embodiments of the present utility model, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second" may explicitly or implicitly include at least one such feature. In addition, if "and / or" or "and / or" appears throughout the text, its meaning includes three parallel scenarios. Taking "A and / or B" as an example, it includes scenario A, or scenario B, or the scenario where both A and B are satisfied simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement it. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0039] As the transmission rates of many data lines are getting higher and higher, for example, the transmission rate of USB4 is 40 Gbps. To ensure the transmission rate, there are not only relatively high requirements for the soldering between the connector and the circuit board, but also very high requirements for the soldering between the circuit board and the cable core wire. It is not only required that there is no false soldering between the cable core wire and the circuit board, but also the solder joints should be smooth and round, and at the same time, it is necessary to ensure that the welding end of the cable core wire does not extend beyond the solder pad of the circuit board. To meet the rate performance requirements, the length of the core wire exposed from the cable should be as short as possible.

[0040] Due to the requirements of performance parameters, the area of the corresponding solder pads on the circuit board is often very small, and common sizes are such as 2*0.4 mm and 1.5*0.3 mm. With such a small solder pad area, if there is a little carelessness during soldering, it will easily cause the solder pads to fall off directly, and at the same time, it is very difficult to ensure that the welding end of the cable core wire does not extend beyond the solder pad of the circuit board. Since the length of the core wire exposed from the cable is short, relatively large torsional stress will be generated accordingly. The relatively large torsional stress will cause the welding end of the cable core wire to very easily extend beyond the solder pad of the circuit board. At the same time, even if the soldering is completely qualified, if the stress cannot be restricted, the torsional stress of the cable core wire itself will also pull off the soldered solder pad.

[0041] There are many practical difficulties in producing this high-speed data cable. Even with the aid of a dedicated soldering machine, auxiliary wire clamps, dispensing machines for reinforcement, etc., the production difficulty remains very high. It not only takes a lot of labor and time, but also it is very difficult to ensure the yield rate. Finally, it is necessary to select qualified products through a full inspection method. Therefore, the cost of high-end data cables is more about processing costs, yield rate costs, and full inspection costs. The raw material cost is not the most important price factor instead.

[0042] In view of this, the present utility model proposes a wire-to-board solderless connector 100.

[0043] Please refer to Figures 1 to 3 , in an embodiment of the present utility model, the wire-to-board solderless connector 100 includes a metal housing 1, a plastic part 2, a first wire pressing part 3, and a second wire pressing part 4. The metal housing 1 includes a fixing part 11, a first locking part 12, and a second locking part 13. The first locking part 12 is rotatably connected to the fixing part 11, and the second locking part 13 is rotatably connected to the fixing part 11. The fixing part 11 is hollowly arranged to form an installation space 111. The plastic part 2 is inserted into the installation space 111. A plurality of first wire grooves 211 and a plurality of second wire grooves 221 are respectively formed on opposite sides of the plastic part 2. A circuit board installation chamber 24 is formed in the middle of the plastic part 2. The plurality of first wire grooves 211 and the plurality of second wire grooves 221 are respectively communicated with the circuit board installation chamber 24. The first wire pressing part 3 is connected to the first locking part 12 and is used for pressing the core wires in the plurality of first wire grooves 211. The second wire pressing part 4 is connected to the second locking part 13 and is used for pressing the core wires in the plurality of second wire grooves 221. Among them, the first locking part 12 and the second locking part 13 are respectively pressed and can rotate relative to the fixing part 11 so that the plastic part 2 is clamped between the first locking part 12 and the second locking part 13.

[0044] It should be noted that the metal housing 1 of the wire-to-board solderless connector 100 includes a fixing part 11, a first locking part 12, and a second locking part 13. Among them, the first locking part 12 and the second locking part 13 are respectively rotatably connected to the fixing part 11. The rotational connection between the first locking part 12 and the second locking part 13 and the fixing part 11 can be realized by connecting through a rotating shaft. The rotational connection between the first locking part 12 and the second locking part 13 and the fixing part 11 can also be realized through the ductility of the metal housing 1, so that the metal housing 1 can be bent but not broken. No specific limitation is made here. Among them, when the first locking part 12 and the second locking part 13 are respectively rotatably connected to the fixing part 11 to realize the buckling of the first locking part 12 and the second locking part 13 with the fixing part 11 respectively.

[0045] Further, the first locking portion 12 and the second locking portion 13 are respectively rotatably connected to the fixing portion 11 herein. This is considered in the production process. After the metal housing 1 and the plastic part 2 are assembled, the cores 61 of multiple cables 6 need to be placed into multiple first wire grooves 211 and multiple second wire grooves 221 of the plastic part 2. Therefore, during the wire placement process, the first locking portion 12 needs to be in an open state relative to the first wire grooves 211, that is, an angle is formed between the first locking portion 12 and the multiple first wire grooves 211, and this angle is at least greater than 30°. This allows sufficient space between the first locking portion 12 and the multiple first wire grooves 211 to place the cores 61. Similarly, during the wire placement process, the second locking portion 13 also needs to be in an open state relative to the second wire grooves 221, that is, an angle is formed between the second locking portion 13 and the multiple second wire grooves 221, and this angle is at least greater than 30°. This allows sufficient space between the second locking portion 13 and the multiple second wire grooves 221 to place the cores 61.

[0046] More specifically, after the cores 61 are placed into the multiple first wire grooves 211 and the multiple second wire grooves 221, the first locking portion 12 and the second locking portion 13 can be respectively latched with the plastic part 2, thereby realizing the assembly of the wire-to-board solderless connector 100. When the first locking portion 12 is latched with the plastic part 2, the multiple first wire grooves 211 of the plastic part 2 are covered by the first locking portion 12, and the multiple second wire grooves 221 of the plastic part 2 are covered by the second locking portion 13. Thus, the cores 61 placed in the multiple first wire grooves 211 are crimped by the first crimping portion 3 on the first locking portion 12, and the cores 61 placed in the multiple second wire grooves 221 are crimped by the second crimping portion 4 on the second locking portion 13. The number of the first connecting ribs 14 can be one, two, or multiple, and the number of the second connecting ribs 15 can be one, two, or multiple. No specific limitation is made here.

[0047] It should be noted that in the wire-to-board solderless connector 100, an angle is formed between the first locking portion 12 and the plastic part 2, so that there is sufficient space on the side of the multiple first wire grooves opened on the plastic part 2 away from the plastic part 2 to place the multiple cores 61 into the multiple first wire grooves 211. An angle is also formed between the second locking portion 13 and the plastic part 2, so that there is sufficient space on the side of the multiple second wire grooves 221 opened on the plastic part 2 away from the plastic part 2 to place the multiple cores 61 into the multiple second wire grooves 221. Among them, making the wire-to-board solderless connector 100 into the wire-to-board solderless connector 100 first facilitates the manufacturer to place the cores 61 into the multiple first wire grooves 211 and the multiple second wire grooves 221 respectively when producing the wire-to-board solderless connector 100. The number of the first wire grooves 211 can be three, four, or more, and the number of the second wire grooves 221 can be three, four, or more.

[0048] In this embodiment, the included angle between the first locking portion 12 and the plastic part 2 is set at 90°, and the included angle between the second locking portion 13 and the plastic part 2 is set at 90°. In this way, it is convenient to install the plastic part 2 in the fixing portion 11, and it is also convenient to place the plurality of core wires 61 into the plurality of first wire grooves 211 and the plurality of second wire grooves 221 respectively.

[0049] It should be further noted that, in order to better fix the core wires 61 of the data cable 200, a circuit board 7 is provided in the circuit board installation compartment 24. The plurality of core wires 61 are respectively placed into the plurality of first wire grooves 211 and the plurality of second wire grooves 221, and the plurality of core wires 61 are respectively crimped to opposite sides of the circuit board 7 through the first crimping portion 3 and the second crimping portion 4. Specifically, the plurality of core wires 61 are crimped on the electrical connection pads of the circuit board 7. Among them, the core wires 61 can be exposed from the notch of the first wire groove 211, or the core wires 61 can be completely located inside the first wire groove 211. Among them, the first crimping portion 3 and the first locking portion 12 are formed by hot pressing, that is, at least the connection surface of the first crimping portion 3 and the first locking portion 12 is heated during the pressing process. Since the material of the first crimping portion 3 is plastic, the contact surfaces of the first crimping portion 3 and the first locking portion 12 will slightly melt, and the first crimping portion 3 and the first locking portion 12 are fixed together after cooling. Similarly, the second crimping portion 4 and the second locking portion 13 are formed by hot pressing, that is, at least the connection surface of the second crimping portion 4 and the second locking portion 13 is heated during the pressing process. Since the material of the second crimping portion 4 is plastic, the contact surfaces of the second crimping portion 4 and the second locking portion 13 will slightly melt, and the second crimping portion 4 and the second locking portion 13 are fixed together after cooling.

[0050] The technical solution of the present utility model replaces soldering the core wires 61 to the circuit board 7 by crimping the core wires 61 to the circuit board 7, which can effectively avoid the risk of the circuit board solder pads falling off. At the same time, the crimping force can fully ensure the smoothness when the end of the core wire 61 is connected to the circuit board solder pad. The data cable 200 made of the wire-to-board solderless connector 100 can improve production efficiency, save time and effort, improve the yield rate, simplify the performance detection steps, and thus greatly reduce the processing cost and production difficulty.

[0051] Optionally, please refer to Figures 1 to 4 , first buckle platforms 25 are respectively protrudingly arranged on opposite sides of the plastic part 2, a first buckle groove 121 adapted to the first buckle platform 25 is formed in the first locking portion 12, second buckle platforms 26 are respectively protrudingly arranged on opposite sides of the plastic part 2, and a second buckle groove 131 adapted to the first buckle platform 25 is formed in the second locking portion 13.

[0052] In the previous embodiment, it has been described that when the first connecting rib 14 is bent, the first locking portion 12 can be fastened to the plastic part 2. The first fastening platforms 25 are respectively protrudingly arranged on the opposite sides of the plastic part 2. The number of the first fastening platforms 25 on each side of the plastic part 2 can be one, two, or multiple. The first locking portion 12 is provided with a first fastening groove 121 adapted to the first fastening platform 25, and the number of the first fastening grooves 121 is the same as that of the first fastening platforms 25. Of course, in other embodiments, it can also be that the fastening platforms are provided on the first locking portion 12, and the fastening grooves adapted to the fastening platforms are provided on the plastic part 2.

[0053] Similarly, in the above embodiment, it has been described that when the second connecting rib 15 is bent, the second locking portion 13 can be fastened to the plastic part 2. The second fastening platforms 26 are respectively protrudingly arranged on the opposite sides of the plastic part 2. The number of the second fastening platforms 26 on each side of the plastic part 2 can be one, two, or multiple. The second locking portion 13 is provided with a second fastening groove 131 adapted to the second fastening platform 26, and the number of the second fastening grooves 131 is the same as that of the first fastening platforms 25. Of course, in other embodiments, it can also be that the fastening platforms are provided on the second locking portion 13, and the fastening grooves adapted to the fastening platforms are provided on the plastic part 2.

[0054] In one embodiment, please refer to Figure 1 , a plurality of first wire pressing platforms 31 are protrudingly arranged on the first wire pressing portion 3, and the plurality of first wire pressing platforms 31 correspond to a plurality of the first wire grooves 211 one by one. A plurality of second wire pressing platforms 41 are protrudingly arranged on the second wire pressing portion 4, and the plurality of second wire pressing platforms 41 correspond to a plurality of the second wire grooves 221 one by one.

[0055] The first wire pressing portion 3 includes a plurality of first wire pressing platforms 31 arranged at intervals. After the core wire 61 is placed in the first wire groove 211, the first wire groove 211 communicates with the circuit board installation compartment 24, so that the first wire pressing platform 31 can press the core wire 61 in the first wire groove 211 onto the circuit board 7 in the circuit board installation compartment 24. The arrangement of the first wire pressing platform 31 can make the pressing effect between the core wire 61 and the pad of the circuit board 7 better. The second wire pressing portion 4 includes a plurality of second wire pressing platforms 41 arranged at intervals. After the core wire 61 is placed in the second wire groove 221, the second wire groove 221 communicates with the circuit board installation compartment 24, so that the second wire pressing platform 41 can press the core wire 61 in the second wire groove 221 onto the circuit board 7 in the circuit board installation compartment 24. The arrangement of the second wire pressing platform 41 can make the pressing effect between the core wire 61 and the pad of the circuit board 7 better.

[0056] In one embodiment, please refer to Figure 1 , the first wire pressing platform 31 and the second wire pressing platform 41 are arranged in an arc shape.

[0057] It should be noted that both the first wire pressing table 31 and the second wire pressing table 41 can be set to be arc-shaped. In this way, it is convenient for multiple first wire pressing tables 31 and multiple second wire pressing tables 41 to respectively press multiple core wires 61, so that the fixing effect of multiple first wire pressing tables 31 and multiple second wire pressing tables 41 on multiple core wires 61 is better. In addition, in other embodiments, multiple first wire pressing tables 31 can be arranged in an arc shape, or multiple second wire pressing tables 41 can be arranged in an arc shape.

[0058] In one embodiment, please refer to Figure 1 , the first wire pressing table 31 and the second wire pressing table 41 are used to elastically press the core wires 61 in the first wire groove 211 and the second wire groove 221.

[0059] It should be noted that according to the above embodiments, when the first wire pressing table 31 and the second wire pressing table 41 are arranged in an arc shape, when multiple first wire pressing tables 31 and multiple second wire pressing tables 41 respectively extend into multiple first wire grooves 211 and multiple second wire grooves 221, in order to make multiple first wire pressing tables 31 and multiple second wire pressing tables 41 cooperate more closely with multiple first wire grooves 211 and multiple second wire grooves 221, the first wire pressing table 31 and multiple second wire pressing tables 41 are elastically deformed when pressing the core wires 61, so as to achieve a better pressing effect of multiple first wire pressing tables 31 and multiple second wire pressing tables 41 on the core wires 61.

[0060] In one embodiment, please refer to Figure 1 , the width of the first wire groove 211 on the side away from the circuit board installation compartment 24 is greater than the width of the first wire groove 211 on the side communicating with the circuit board installation compartment 24, and the width of the second wire groove 221 on the side away from the circuit board installation compartment 24 is greater than the width of the second wire groove 221 on the side communicating with the circuit board installation compartment 24.

[0061] Specifically, the first wire groove 211 has a length and a width, and the width of the first wire groove 211 is less than the length of the first wire groove 211. Specifically, the width direction of the first wire groove 211 is consistent with the radial direction of the core wire 61 located within the first wire groove 211. The width of the first wire groove 211 on the side far from the first side of the circuit board mounting compartment 24 is greater than the width of the first wire groove 211 on the side communicating with the circuit board mounting compartment 24, facilitating the placement of the core wire 61 within the first wire groove 211 and also having a limiting effect on the first wire pressing platform 31. Additionally, the second wire groove 221 also has a length and a width, and the width of the second wire groove 221 is less than the length of the second wire groove 221. Specifically, the width direction of the second wire groove 221 is consistent with the radial direction of the core wire 61 located within the second wire groove 221. The width of the second wire groove 221 on the side far from the circuit board mounting compartment 24 is greater than the width of the second wire groove 221 on the side communicating with the circuit board mounting compartment 24, facilitating the placement of the core wire 61 within the second wire groove 221 and also having a limiting effect on the second wire pressing platform 41.

[0062] In one embodiment, please refer to Figure 2 , the plastic part 2 includes a first wire placing portion 21 and a second wire placing portion 22 that are connected to each other. A plurality of the first wire grooves 211 are formed in the first wire placing portion 21, and a plurality of the second wire grooves 221 are formed in the second wire placing portion 22. The circuit board mounting compartment 24 is formed between the first wire placing portion 21 and the second wire placing portion 22. A first clamping platform 212 is provided on one side of the first wire placing portion 21 close to the metal housing 1, and a first clamping opening 112 adapted to the first clamping platform 212 is formed in the fixing portion 11. A second clamping platform 222 is provided on one side of the second wire placing portion 22 close to the metal housing 1, and a second clamping opening 113 adapted to the second clamping platform 222 is formed in the fixing portion 11.

[0063] Specifically, the first wire placing portion 21, the second wire placing portion 22, and the connecting plate can be formed by secondary injection molding or integrally formed. Among them, a plurality of the first wire grooves 211 are formed in the first wire placing portion 21, and a plurality of the second wire grooves 221 are formed in the second wire placing portion 22. Considering making the assembly between the metal housing 1 and the plastic part 2 more firm, a first clamping platform 212 is provided on one side of the first wire placing portion 21 close to the metal housing 1, and a first clamping opening 112 adapted to the first clamping platform 212 is provided on the fixing portion 11, so that the first clamping platform 212 and the first clamping opening 112 are buckled to fix the metal housing 1 and the plastic part 2 together. Further, a second clamping platform 222 is provided on one side of the second wire placing portion 22 close to the metal housing 1, and a second clamping opening 113 adapted to the second clamping platform 222 is provided on the fixing portion 11, so that the second clamping platform 222 and the second clamping opening 113 are buckled to further enhance the fixing effect between the metal housing 1 and the plastic part 2.

[0064] In this embodiment, the number of the first clamping platforms 212 and the first clamping openings 112 is set to one, but is not limited thereto. The number of the first clamping platforms 212 and the first clamping openings 112 can be two or more. In addition, in this embodiment, the number of the second clamping platforms 222 and the second clamping openings 113 is two, but is not limited thereto. The number of the second clamping platforms 222 and the second clamping openings 113 can be one or more. Among them, in this embodiment, both the adapted first clamping platforms 212 and the first clamping openings 112 are provided, and the adapted second clamping platforms 222 and the second clamping openings 113 are also provided. Of course, in other embodiments, only the adapted first clamping platforms 212 and the first clamping openings 112 can be provided, or only the adapted second clamping platforms 222 and the second clamping openings 113 can be provided.

[0065] In one embodiment, please refer to Figure 1 , a plurality of first injection molding through holes 122 are formed in a region of the first locking portion 12 corresponding to the first wire pressing portion 3, and the first wire pressing portion 3 passes through the first injection molding through holes 122 and is injection molded on opposite sides of the first locking portion 12; a plurality of second injection molding through holes 132 are formed in a region of the second locking portion 13 corresponding to the second wire pressing portion 4, and the second wire pressing portion 4 passes through the second injection molding through holes 132 and is injection molded on opposite sides of the second locking portion 13.

[0066] It should be noted that the first injection molding through holes 122 facilitate the first wire pressing portions 3 on opposite sides of the first locking portion 12 to be injection molded into a whole, and the second injection molding through holes 132 facilitate the second wire pressing portions 4 on opposite sides of the second locking portion 13 to be injection molded into a whole, so that the fixing strength between the first wire pressing portion 3 and the second wire pressing portion 4 and the first locking portion 12 and the second locking portion 13 is better.

[0067] In one embodiment, please refer to Figure 4 , the first locking portion 12 is provided with a glue injection hole 16, and / or the second locking portion 13 is provided with a glue injection hole 16.

[0068] It should be noted that it can be that the first locking portion 12 is provided with a glue injection hole 16, or the second locking portion 13 is provided with a glue injection hole 16, or both the first locking portion 12 and the second locking portion 13 are provided with glue injection holes 16. The above are all optional embodiments of this embodiment. In this embodiment, the glue injection hole 16 is arranged in a round hole. Of course, the glue injection hole 16 can also be arranged in a square hole, which is not specifically limited herein. This glue injection hole 16 is used to fill the remaining space in the metal housing 1 after a plurality of first wire pressing platforms 31 and a plurality of second wire pressing platforms 41 press the core wires 61, ensuring the insulation characteristics between the core wires 61 and the metal housing 1.

[0069] In one embodiment, please refer to Figure 1, a connecting plate 123 is provided on the first locking portion 12, a protruding buckle portion 124 is formed on the connecting plate 123, and a card slot 133 adapted to the protruding buckle portion 124 is provided on the second locking portion 13; or a connecting plate 123 is provided on the second locking portion 13, a protruding buckle portion 124 is formed on the connecting plate 123, and a card slot 134 adapted to the protruding buckle portion 124 is provided on the first locking portion 12.

[0070] Considering that in order to further ensure the buckling connection strength between the first locking portion 12 and the second locking portion 13, so as to ensure that the crimping strength of the core wire 61 in the first wire groove 211 and the core wire 61 in the second wire groove 221 is sufficient. For this reason, in this embodiment, a protruding buckle portion 124 and a card slot 133 that are buckled and matched are also provided, wherein the protruding buckle portion 124 and the card slot 133 correspond one by one. The protruding buckle portion 124 and the card slot 133 can be provided with one, or can be provided with two, or can be provided with more. In this embodiment, the protruding buckle portion 124 and the card slot 133 are respectively provided with two, so that the first locking portion 12 and the second locking portion 13 can have better buckling strength. Among them, in order to make the protruding buckle portion 124 and the card slot 133 easier to cooperate during buckling, a connecting plate 123 is provided on the first locking portion 12, and the protruding buckle portion 124 is provided on the connecting plate 123 to facilitate the adaptation between the protruding buckle portion 124 and the card slot 133.

[0071] Among them, the wire-to-board solderless connector 100 proposed in the above embodiment is used for the data cable 200. Since the data cable 200 adopts all the technical solutions of the above all embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be elaborated one by one here. The data cable 200 further includes a cable 6 and a circuit board 7. The cable 6 includes a plurality of core wires 61. A plurality of the core wires 61 are respectively placed in a plurality of the first wire grooves 211, and a plurality of the core wires 61 are respectively placed in a plurality of the second wire grooves 221; the circuit board 7 is installed in the circuit board installation compartment 24, and a plurality of first electrical connection pads 71 and a plurality of second electrical connection pads 72 are respectively provided on opposite sides of the circuit board 7; wherein, the first crimping portion 3 crimps the plurality of core wires 61 in the plurality of first wire grooves 211 on the plurality of first electrical connection pads 71 respectively, and the second crimping portion 4 crimps the plurality of core wires 61 in the plurality of second wire grooves 221 on the plurality of second electrical connection pads 72 respectively.

[0072] In one embodiment, please refer to Figure 1 and Figure 7, the slot widths of the multiple first wire grooves 211 corresponding to the regions of the multiple first electrical connection pads 71 are smaller than the widths of the first electrical connection pads 71, and the slot widths of the multiple second wire grooves 221 corresponding to the regions of the multiple second electrical connection pads 72 are smaller than the widths of the second electrical connection pads 72.

[0073] Specifically, in order to ensure the crimping effect between the core wire 61 and the first electrical connection pad 71 and the second electrical connection pad 72, reduce unnecessary tests, thereby increasing the detection cost, the width of the first electrical connection pad 71 is made greater than the slot width of the corresponding first wire groove 211, and the width of the second electrical connection pad 72 is made greater than the slot width of the corresponding second wire groove 221. In this way, the conduction effect between the core wire 61 and the first electrical connection pad 71 and the second electrical connection pad 72 can be ensured, and unnecessary test costs can be reduced.

[0074] In one embodiment, please refer to Figure 5 , Figure 6 and Figure 8 , the wire-to-board solderless connector 100 further includes a plug 8. The plug 8 is connected to the metal housing 1. One end of the plug 8 close to the metal housing 1 is connected with a plurality of metal terminals 81, and the circuit board 7 is connected to the plurality of metal terminals 81.

[0075] Specifically, the plug 8 in this embodiment is a type-c plug 8, but it is not limited thereto. The plug 8 can also be an HDMI plug 8, and no specific limitation is made here. It should be noted that the plug 8 is fastened by the metal housing 1 to achieve connection with the metal housing 1. The multiple metal terminals 81 in the plug 8 are soldered to the circuit board 7, so that the multiple metal terminals 81 are electrically connected to the circuit board 7, and signals can be transmitted from the multiple metal terminals 81 to the circuit board 7. Corresponding pads are provided on the circuit board 7 for the multiple metal terminals 81.

[0076] The above are only exemplary embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent structural transformation made under the technical concept of the present invention by using the content of the specification and drawings of the present invention, or directly / indirectly applied in other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. A wire-to-board solderless connector (100), characterized in that: include: A metal shell (1) comprises a fixing portion (11), a first locking portion (12) and a second locking portion (13), wherein the first locking portion (12) is rotatably connected to the fixing portion (11), the second locking portion (13) is rotatably connected to the fixing portion (11), and the fixing portion (11) is hollow to form an installation space (111); A plastic part (2), the plastic part (2) being inserted into the installation space (111), a plurality of first wire grooves (211) and a plurality of second wire grooves (221) being respectively provided on opposite sides of the plastic part (2), a circuit board installation chamber (24) being provided in the middle of the plastic part (2), and the plurality of first wire grooves (211) and the plurality of second wire grooves (221) being respectively connected to the circuit board installation chamber (24); A first wire pressing portion (3), connected to the first locking portion (12), and used for pressing a plurality of core wires in the first wire grooves (211); A second wire pressing portion (4), connected to the second locking portion (13), and used for pressing a plurality of core wires in the second wire grooves (221); The first locking portion (12) and the second locking portion (13) can respectively rotate relative to the fixing portion (11) so that the plastic part (2) is clamped between the first locking portion (12) and the second locking portion (13).

2. The wire-to-board solderless connector (100) according to claim 1, characterized in that: The plastic part (2) is provided with first buckle platforms (25) on opposite sides thereof, the first locking portion (12) is provided with a first buckle groove (121) adapted to the first buckle platform (25), the plastic part (2) is provided with second buckle platforms (26) on opposite sides thereof, and the second locking portion (13) is provided with a second buckle groove (131) adapted to the second buckle platform (26).

3. The wire-to-board solderless connector (100) according to claim 2, characterized in that: The first wire pressing portion (3) is protrudingly provided with a plurality of first wire pressing platforms (31), and the plurality of first wire pressing platforms (31) correspond one-to-one to the plurality of first wire grooves (211); the second wire pressing portion (4) is protrudingly provided with a plurality of second wire pressing platforms (41), and the plurality of second wire pressing platforms (41) correspond one-to-one to the plurality of second wire grooves (221).

4. The wire-to-board solderless connector (100) according to claim 3, characterized in that: The first wire pressing platform (31) and the second wire pressing platform (41) are used to elastically press the core wire (61) in the first wire groove (211) and the second wire groove (221).

5. The wire-to-board solderless connector (100) according to claim 3, characterized in that: The width of the first wire groove (211) at a side away from the circuit board installation chamber (24) is greater than the width of the first wire groove (211) at a side connected to the circuit board installation chamber (24), and the width of the second wire groove (221) at a side away from the circuit board installation chamber (24) is greater than the width of the second wire groove (221) at a side connected to the circuit board installation chamber (24).

6. The wire-to-board solderless connector (100) according to claim 3, characterized in that: The plastic part (2) comprises a first wiring portion (21) and a second wiring portion (22) connected to each other, a plurality of the first wiring grooves (211) are provided in the first wiring portion (21), a plurality of the second wiring grooves (221) are provided in the second wiring portion (22), the circuit board installation chamber (24) is provided between the first wiring portion (21) and the second wiring portion (22), a first clamping platform (212) is provided on a side of the first wiring portion (21) close to the metal shell (1), the fixing portion (11) is provided with a first clamping port (112) adapted to the first clamping platform (212), a second clamping platform (222) is provided on a side of the second wiring portion (22) close to the metal shell (1), and the fixing portion (11) is provided with a second clamping port (113) adapted to the second clamping platform (222).

7. The wire-to-board solderless connector (100) according to claim 3, characterized in that: A plurality of first injection molding vias (122) are provided in an area of ​​the first locking portion (12) corresponding to the first wire pressing portion (3), and the first wire pressing portion (3) is injection-molded on two opposite sides of the first locking portion (12) through the first injection molding vias (122); a plurality of second injection molding vias (132) are provided in an area of ​​the second locking portion (13) corresponding to the second wire pressing portion (4), and the second wire pressing portion (4) is injection-molded on two opposite sides of the second locking portion (13) through the second injection molding vias (132).

8. The wire-to-board solderless connector (100) according to claim 1, characterized in that: The first locking portion (12) is provided with a connecting plate (123), the connecting plate (123) protrudes to form a convex buckle portion (124), and the second locking portion (13) is provided with a slot (133) adapted to the convex buckle portion (124); or The second locking portion (13) is provided with a connecting plate (123), the connecting plate (123) protrudes to form a convex buckle portion (124), and the first locking portion (12) is provided with a slot (134) adapted to the convex buckle portion (124).

9. The wire-to-board solderless connector (100) according to claim 1, characterized in that: The first locking portion (12) is rotatably connected to the fixing portion (11) via a first connecting rib (14), and the second locking portion (13) is rotatably connected to the fixing portion (11) via a second connecting rib (15).

10. The wire-to-board solderless connector according to claim 1, characterized in that: The first locking portion (12) is provided with a glue injection hole (16), and / or the second locking portion (13) is provided with a glue injection hole (16).

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