Camera module
By penetrating the PCB board through the camera module, directly setting the photosensitive chip and filter, and optimizing the circuit structure, the problem of difficult to reduce the height of the existing module is solved, and the overall module height is effectively reduced.
Patent Information
- Application Number
- CN202421815144.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-30
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-07-30
AI Technical Summary
The existing camera modules are difficult to further reduce the module height while meeting the optical performance indicators. Conventional design and manufacturing processes can no longer reduce the module height under the unchanged total lens length TTL value.
By penetrating through the PCB board and directly setting the photosensitive chip on the shelf board, removing the filter bracket, and directly setting the filter on the photosensitive chip, designing a step structure for easy wiring connection, and optimizing the four-layer circuit structure of the PCB board to reduce the module height.
The overall height of the camera module is reduced, which is specifically manifested as the vertical height of the module drops by 0.55mm, and the shoulder height of the module that does not include the lens drops by 0.45mm, providing the lens with optical path space.
Smart Images
Figure CN222916125U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of lens modules, and specifically relates to a camera module. Background Art
[0002] At present, the imaging acquisition function is an important selling point of mobile phones. The optical performance requirements of camera modules are getting higher and higher, their structural dimensions are getting more and more complex, and the height of mobile phone cameras is also facing challenges. How to reduce the height of the module while meeting various performance indicators is also a very important consideration. Due to optical structure limitations, the minimum height of the TTL (Total Track Length) value of lenses on the market can no longer be further reduced under the premise of meeting optical performance. Conventional module design and manufacturing processes can no longer reduce the total height of the camera module while keeping the TTL value unchanged. Content of the Utility Model
[0003] The purpose of the utility model is to provide a camera module, which can at least solve some defects in the prior art.
[0004] To achieve the above purpose, the embodiment of the utility model provides the following technical solution: A camera module, including a PCB board, the PCB board is provided with a window penetrating through the PCB board, a placing board is arranged below the PCB board, the placing board seals the lower side of the window, a photosensitive chip is arranged on the placing board in the window, a filter is arranged on the photosensitive chip, and the photosensitive chip is electrically connected to the PCB board.
[0005] Further, the edge of the PCB board close to the photosensitive chip is in a stepped structure, and the lowest step surface of the stepped structure is electrically connected to the photosensitive chip through a wire harness.
[0006] Further, the lowest step surface of the stepped structure is at the same height as the top surface of the photosensitive chip.
[0007] Further, the PCB board is a four-layer circuit board, the first layer circuit, the second layer circuit, the third layer circuit and the fourth layer circuit of the PCB board are stacked in sequence from top to bottom, and the photosensitive chip is electrically connected to the second layer circuit.
[0008] Further, the first layer of circuit includes a first protective ink layer and a first circuit layer which are stacked from top to bottom. The second layer of circuit includes a second cover film and a second circuit layer which are stacked from top to bottom. The third layer of circuit includes a third circuit layer and a third cover film which are stacked from top to bottom. The fourth layer of circuit includes a fourth circuit layer and a fourth protective ink layer which are stacked from top to bottom. A first filling layer is provided between the first circuit layer and the second cover film. A flexible board substrate is provided between the second circuit layer and the third circuit layer. A second filling layer is provided between the third cover film and the fourth circuit layer. The fourth protective ink layer is provided on the placement board.
[0009] Further, a window is formed by penetrating the PCB board along the direction from the first protective ink layer to the fourth protective ink layer, and a stepped structure is formed at the second circuit layer.
[0010] Further, wire bonding points are provided on the second circuit layer.
[0011] Further, it further includes a lens holder provided on the PCB board and a lens provided on the lens holder. The lens is arranged facing the filter.
[0012] Further, the thickness of the filter is between 0.1 and 0.2 mm.
[0013] Further, the placement board is a steel plate.
[0014] Compared with the prior art, the beneficial effect of the present utility model is as follows: For a camera module, by penetrating the PCB board and directly providing the photosensitive chip on the placement board, the height of the module is reduced. Then, the filter is directly provided on the photosensitive chip, and the filter holder is removed, so as to obtain a space for avoidance in the vertical height of the module, and a space for the optical path of the lens to avoid descending is provided, thereby overall reducing the total height of the camera module. Description of the Drawings
[0015] Figure 1 It is a schematic diagram of a traditional camera module;
[0016] Figure 2 It is a schematic diagram of a camera module provided by an embodiment of the present utility model;
[0017] In the reference numerals: 1 - PCB board; 2 - placement board; 3 - photosensitive chip; 4 - filter; 5 - stepped structure; 6 - wire harness; 7 - lens holder; 8 - lens. Detailed Embodiments
[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0019] Please refer to Figure 2 , the embodiments of the present utility model provide a camera module, including a PCB board 1. The PCB board 1 is provided with a window penetrating through the PCB board 1. A placing board 2 is arranged below the PCB board 1. The placing board 2 blocks the lower side of the window. A photosensitive chip 3 is arranged on the placing board 2 in the window. A filter 4 is arranged on the photosensitive chip 3. The photosensitive chip 3 is electrically connected to the PCB board 1. In this embodiment, by penetrating the PCB board 1 and directly arranging the photosensitive chip 3 on the placing board 2, the height of the module is reduced. Then, the filter 4 is directly arranged on the photosensitive chip 3, removing the filter 4 bracket, obtaining a space for avoidance in the vertical height of the module, and providing a space for the optical path of the lens to avoid descending, thereby reducing the overall height of the camera module. Specifically, as Figure 1 shown, it is a schematic diagram of a traditional camera module. The height of the structure of this embodiment can be reduced by 0.55 mm compared with that of the traditional camera module, and the shoulder height of the module without the lens can be reduced by 0.45 mm. The entire PCB board 1 is arranged on the placing board 2, and the placing board 2 is for arranging the photosensitive chip 3. The photosensitive chip 3 can be arranged in the window. Preferably, the filter 4 is attached to the photosensitive chip 3. The filter 4 can reduce the thickness and size, but it needs to be reduced in combination with the area size of the photosensitive chip 3 to ensure that the IR (infrared) covers the photosensitive area. Preferably, a highly transparent flowing glue is used to bond the filter 4 to the surface of the photosensitive chip 3. Preferably, a lens with a shorter optical back focus is selected to match the photosensitive chip 3.
[0020] As an optimized solution of the embodiments of the present utility model, please refer to Figure 2 , an edge of the PCB board 1 close to the photosensitive chip 3 is in a stepped structure 5. The lowermost step surface of the stepped structure 5 is electrically connected to the photosensitive chip 3 through a wire harness 6. In this embodiment, designing the step can facilitate wire bonding connection and control the wire bonding height. Preferably, the height of the lowermost step surface of the stepped structure 5 is the same as the top surface of the photosensitive chip 3.
[0021] As an optimized solution of the embodiments of the present utility model, please refer to Figure 2, the PCB board 1 is a four-layer circuit board. The first-layer circuit, the second-layer circuit, the third-layer circuit, and the fourth-layer circuit of the PCB board 1 are stacked in sequence from top to bottom. The photosensitive chip 3 is electrically connected to the second-layer circuit. In this embodiment, the PCB board 1 is a common four-layer circuit board. A window is designed at the central position of the PCB board 1 to facilitate the electrical connection between the photosensitive chip 3 and the second-layer circuit.
[0022] To further optimize the above solution, the first-layer circuit includes a first protective ink layer and a first circuit layer stacked from top to bottom. The second-layer circuit includes a second cover film and a second circuit layer stacked from top to bottom. The third-layer circuit includes a third circuit layer and a third cover film stacked from top to bottom. The fourth-layer circuit includes a fourth circuit layer and a fourth protective ink layer stacked from top to bottom. A first filling layer is provided between the first circuit layer and the second cover film. A flexible board substrate is provided between the second circuit layer and the third circuit layer. A second filling layer is provided between the third cover film and the fourth circuit layer. The fourth protective ink layer is provided on the placement board 2. In this embodiment, the specific structure of the above-mentioned PCB board 1 is refined, and each layer of the circuit includes a multi-layer structure. Preferably, a window is formed through the PCB board 1 along the direction from the first protective ink layer to the fourth protective ink layer, and a step structure 5 is formed at the second circuit layer. Bonding pads are provided on the second circuit layer, and the bonding pads facilitate wire bonding.
[0023] As an optimized solution of the embodiment of the present utility model, please refer to Figure 2 , further including a lens holder 7 provided on the PCB board 1 and a lens 8 provided on the lens holder 7. The lens is arranged facing the filter 4. In this embodiment, by further providing components such as the lens holder 7 and the lens 8, a camera module can be obtained. The lens holder 7 and the lens are common components in traditional camera modules.
[0024] As an optimized solution of the embodiment of the present utility model, please refer to Figure 2 , the thickness of the filter 4 is between 0.1 and 0.2 mm. In this embodiment, the filter 4 is preferably 0.11 mm.
[0025] As an optimized solution of the embodiment of the present utility model, please refer to Figure 2 , the placement board 2 is a steel plate.
[0026] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.
Claims
1. A camera module, comprising a PCB board, characterized in that: The PCB board is provided with a window penetrating the PCB board, a shelf board is provided below the PCB board, the shelf board blocks the lower side of the window, a photosensitive chip is provided on the shelf board in the window, a filter is provided on the photosensitive chip, and the photosensitive chip is electrically connected to the PCB board.
2. A camera module as claimed in claim 1, characterized in that: The edge of the PCB board close to the photosensitive chip is in a step structure, and the lowest step surface of the step structure is electrically connected to the photosensitive chip through a wiring harness.
3. A camera module as claimed in claim 2, characterized in that: The lowest step surface of the step structure is at the same height as the top surface of the photosensitive chip.
4. A camera module as claimed in claim 1, characterized in that: The PCB board is a four-layer circuit board, and the first layer circuit, the second layer circuit, the third layer circuit and the fourth layer circuit of the PCB board are stacked in sequence from top to bottom, and the photosensitive chip is electrically connected to the second layer circuit.
5. A camera module as claimed in claim 4, characterized in that: The first layer circuit includes a first protective ink layer and a first circuit layer stacked from top to bottom, the second layer circuit includes a second covering film and a second circuit layer stacked from top to bottom, the third layer circuit includes a third circuit layer and a third covering film stacked from top to bottom, the fourth layer circuit includes a fourth circuit layer and a fourth protective ink layer stacked from top to bottom, a first filling layer is provided between the first circuit layer and the second covering film, a soft board substrate is provided between the second circuit layer and the third circuit layer, a second filling layer is provided between the third covering film and the fourth circuit layer, and the fourth protective ink layer is provided on the shelf.
6. A camera module as claimed in claim 5, characterized in that: The window is formed by penetrating the PCB board along the direction from the first protective ink layer to the fourth protective ink layer, and a step structure is formed at the second circuit layer.
7. A camera module as claimed in claim 5, characterized in that: The second circuit layer is provided with wiring points.
8. A camera module as claimed in claim 1, characterized in that: It also includes a lens holder arranged on the PCB board and a lens arranged on the lens holder, and the lens is arranged facing the filter.
9. A camera module as claimed in claim 1, characterized in that: The thickness of the filter is between 0.1 and 0.2 mm.
10. A camera module as claimed in claim 1, characterized in that: The shelf plate is a steel plate.