PCB bonding pad heat dissipation structure capable of improving heat dissipation effect

Abstract

The utility model discloses a PCB bonding pad heat radiation structure capable of improving heat radiation effect, comprising a PCB and a bonding pad heat radiation body, the PCB comprises a PCB substrate, a lower bonding pad and an upper bonding pad; the lower bonding pad is arranged at the lower end of the PCB substrate, and the upper bonding pad is arranged at the upper end of the PCB substrate; the upper bonding pad is provided with a flexible part, the bonding pad heat dissipation body is arranged on the flexible part, and the thickness of the bonding pad heat dissipation body is smaller than or equal to 500 microns; the PCB is provided with a laser hole formed by laser, and the laser hole penetrates through the part, corresponding to the bonding pad radiator, of the flexible part; the laser hole is filled with a copper body. According to the utility model, the bending effect of the flexible part of the upper bonding pad can be prevented from being influenced, and the heat dissipation effect of the upper bonding pad can be improved; and moreover, processing and manufacturing are facilitated, and the manufacturing cost can be reduced.

Description

Technical Field

[0001] The utility model relates to the field of pad heat dissipation structures, and particularly relates to a PCB board pad heat dissipation structure for improving heat dissipation effect. Background Art

[0002] With the development of technology, PCB boards are widely used in various electronic products. Some commonly used PCB boards often include a PCB substrate, a lower pad, and an upper pad; the lower pad is arranged at the lower end of the PCB substrate, and the upper pad is arranged at the upper end of the PCB substrate. However, the problem that the heat dissipation effect of the upper pad is poor due to insufficient heat dissipation of the upper pad often occurs.

[0003] In order to solve the problem of poor heat dissipation effect of the upper pad, although some industries adopt heat dissipation devices on the upper pad to solve the heat dissipation problem of the upper pad by means of the heat dissipation devices. However, since the upper pad is often provided with a flexible part, the addition of the heat dissipation device easily affects the bending effect of the flexible part of the upper pad. Summary of the Utility Model

[0004] In order to overcome the deficiencies of the prior art, the purpose of the utility model is to provide a PCB board pad heat dissipation structure for improving heat dissipation effect, which can avoid affecting the bending effect of the flexible part of the upper pad and improve the heat dissipation effect of the upper pad at the same time.

[0005] The purpose of the utility model is achieved by adopting the following technical solutions:

[0006] A PCB board pad heat dissipation structure for improving heat dissipation effect, comprising a PCB board and a pad heat dissipation body. The PCB board includes a PCB substrate, a lower pad, and an upper pad; the lower pad is arranged at the lower end of the PCB substrate, and the upper pad is arranged at the upper end of the PCB substrate; the upper pad is provided with a flexible part, the pad heat dissipation body is arranged on the flexible part, and the thickness of the pad heat dissipation body ≤ 500um; laser holes formed by laser are arranged on the PCB board, and the laser holes extend to the part of the flexible part corresponding to the pad heat dissipation body; the laser holes are filled with copper bodies.

[0007] The laser holes extend from the lower pad to the upper pad.

[0008] The ratio of the diameter of the pad heat dissipation body to the diameter of the upper pad is 2 / 3 - 9 / 10.

[0009] The diameter of the pad heat dissipation body is 0.2 - 1.8mm.

[0010] The pad heat dissipation body is a copper column.

[0011] The ratio of the diameter of the laser holes to the diameter of the upper pad is 1 / 6 - 1 / 20.

[0012] The diameter of the laser hole is 0.05 - 0.1 mm.

[0013] The thickness of the PCB board ≤ 0.2 mm.

[0014] The thickness of the pad heat sink is 300 um.

[0015] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0016] A pad heat dissipation structure of a PCB board for improving heat dissipation effect provided by the present utility model, which is based on the use of a PCB board and a pad heat sink, and is provided with laser holes formed by laser on the PCB board. The laser holes penetrate through the part of the flexible part corresponding to the pad heat sink, and copper bodies are filled in the laser holes. At the same time, the pad heat sink is arranged on the flexible part, and the thickness of the pad heat sink is set to ≤ 500 um. While avoiding affecting the bending effect of the upper pad flexible part, the heat dissipation effect of the upper pad can be improved; moreover, it is convenient for processing and production, and the production cost can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic structural diagram of the present utility model;

[0018] Figure 2 is a sectional view of the present utility model;

[0019] Figure 3 is an exploded view of the present utility model;

[0020] Among them, 10, PCB board; 11, PCB substrate; 12, lower pad; 13, upper pad; 14, flexible part; 15, laser hole; 16, copper body; 20, pad heat sink. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] Next, in combination with the drawings and specific embodiments, the present utility model will be further described. It should be noted that, on the premise of no conflict, the following-described embodiments or technical features can be arbitrarily combined with each other to form new embodiments.

[0022] Such as Figures 1-3As shown in the figure, a PCB pad heat dissipation structure for improving heat dissipation effect includes a PCB board 10 and a pad heat dissipation body 20. The PCB board 10 includes a PCB substrate 11, a lower pad 12 and an upper pad 13. The lower pad 12 is arranged at the lower end of the PCB substrate 11, and the upper pad 13 is arranged at the upper end of the PCB substrate 11. The upper pad 13 is provided with a flexible part 14, and the pad heat dissipation body 20 is arranged on the flexible part 14. The thickness P of the pad heat dissipation body 20 is ≤ 500um. A laser hole 15 formed by laser cutting is arranged on the PCB board 10, and the laser hole 15 extends to the part of the flexible part 14 corresponding to the pad heat dissipation body 20. The laser hole 15 is filled with a copper body 16. Specifically, the laser hole 15 extends from the lower pad 12 to the upper pad 13.

[0023] During use, the copper body 16 in the laser hole 15 can play an electrical conduction role and also has a heat conduction effect. Moreover, by arranging the pad heat dissipation body 20 on the flexible part 14, the heat generated when the upper pad 13 works can be conducted to the pad heat dissipation body 20 and dissipated through the pad heat dissipation body 20, thereby improving the heat dissipation effect of the upper pad 13. Therefore, on the basis of using the PCB board 10 and the pad heat dissipation body 20, a laser hole 15 formed by laser cutting is arranged on the PCB board 10. The laser hole 15 penetrates the part of the flexible part 14 corresponding to the pad heat dissipation body 20, and the laser hole 15 is filled with a copper body 16. At the same time, the pad heat dissipation body 20 is arranged on the flexible part 14, and the thickness of the pad heat dissipation body 20 is set to ≤ 500um, so that the flexible part 14 provided with the pad heat dissipation body 20 can be bent, which can avoid affecting the bending effect of the flexible part 14 of the upper pad 13 and improve the heat dissipation effect of the upper pad 13 at the same time.

[0024] Preferably, the ratio of the diameter of the pad heat dissipation body 20 to the diameter of the upper pad 13 is 2 / 3 - 9 / 10. By reasonably setting the ratio of the diameter of the pad heat dissipation body 20 to the diameter of the upper pad 13, it can avoid affecting the bending effect of the flexible part 14 of the upper pad 13 and effectively ensure the contact area between the upper pad 13 and the pad heat dissipation body 20, so as to further improve the heat dissipation effect of the upper pad.

[0025] The diameter of the pad heat dissipation body 20 is 0.2 - 1.8mm. As the most preferred embodiment of the present invention, the diameter of the pad heat dissipation body 20 is 1.0mm, which can increase the contact area between the upper pad 13 and the pad heat dissipation body 20, improve the heat dissipation effect of the upper pad and reduce the cost at the same time.

[0026] Preferably, the pad heat sink 20 is a copper column. By using a copper column as the pad heat sink 20, the heat of the upper pad 13 can be effectively dissipated while the cost can be reduced.

[0027] As the most preferred embodiment of the present invention, the pad heat sink 20 can be a copper column formed by electroplating on the flexible part 14 of the upper pad 13, which is convenient for processing and forming.

[0028] Preferably, the ratio of the diameter of the laser hole 15 to the diameter of the upper pad 13 is 1 / 6 - 1 / 20. By setting the ratio of the diameter of the laser hole 15 to the diameter of the upper pad 13 to 1 / 6 - 1 / 20, the size of the copper body 16 can be correspondingly set.

[0029] As the most preferred embodiment of the present invention, the ratio of the diameter of the laser hole 15 to the diameter of the upper pad 13 is 1 / 10, so as to reasonably set the size of the copper body 16 correspondingly, so that the copper body 16 can have corresponding functional effects while avoiding affecting the bending effect of the upper pad 13.

[0030] Preferably, the diameter of the laser hole 15 is 0.05 - 0.1 mm. As the most preferred embodiment of the present invention, the diameter of the laser hole 15 is 0.08 mm, so that the copper body 16 filled in the laser hole 15 can have corresponding functional effects while avoiding affecting the bending effect of the upper pad 13 and being convenient for processing.

[0031] Specifically, the thickness of the PCB board 10 ≤ 0.2 mm.

[0032] As the most preferred embodiment of the present invention, the thickness of the pad heat sink 20 is 300 um, so as to ensure its heat dissipation effect while being convenient for processing and manufacturing.

[0033] The above embodiments are only the preferred embodiments of the present invention and cannot be used to limit the scope of protection of the present invention. Any non-substantial changes and substitutions made by those skilled in the art on the basis of the present invention belong to the scope of protection required by the present invention.

Claims

1. A PCB pad heat dissipation structure for improving heat dissipation effect, characterized in that: The invention comprises a PCB board and a pad heat sink, wherein the PCB board comprises a PCB substrate, a lower pad and an upper pad; the lower pad is arranged at the lower end of the PCB substrate, and the upper pad is arranged at the upper end of the PCB substrate; the upper pad is provided with a flexible portion, the pad heat sink is arranged on the flexible portion, and the thickness of the pad heat sink is ≤500um; a laser hole formed by laser opening is provided on the PCB board, and the laser hole extends to the position of the flexible portion corresponding to the pad heat sink; the laser hole is filled with a copper body.

2. The PCB pad heat dissipation structure for improving heat dissipation effect as claimed in claim 1, characterized in that: The laser hole extends from the lower pad to the upper pad.

3. The PCB pad heat dissipation structure for improving heat dissipation effect as claimed in claim 1, characterized in that: The ratio of the diameter of the pad heat sink to the diameter of the upper pad is 2 / 3-9 / 10.

4. The PCB pad heat dissipation structure for improving heat dissipation effect as claimed in claim 3, characterized in that: The diameter of the pad heat sink is 0.2-1.8 mm.

5. The PCB pad heat dissipation structure for improving heat dissipation effect as claimed in claim 1 or 3, characterized in that: The pad heat sink is a copper column.

6. The PCB pad heat dissipation structure for improving heat dissipation effect as claimed in claim 1, characterized in that: The ratio of the diameter of the laser hole to the diameter of the upper pad is 1 / 6-1 / 20.

7. The PCB pad heat dissipation structure for improving heat dissipation effect as claimed in claim 6, characterized in that: The diameter of the laser hole is 0.05-0.1 mm.

8. The PCB pad heat dissipation structure for improving heat dissipation effect as claimed in claim 1, characterized in that: The thickness of the PCB board is ≤0.2 mm.

9. The PCB pad heat dissipation structure for improving heat dissipation effect as claimed in claim 1, characterized in that: The thickness of the pad heat sink is 300um.

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