Electronic device with detachable expansion card
By using heat dissipation fin parts design to replace the aluminum extruded slide rails in existing electronic devices, the problem of the slide rails occupying space and hindering heat dissipation is solved, and the effect of reducing costs and improving heat dissipation efficiency is achieved.
Patent Information
- Application Number
- CN202421921439.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-09
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-08-09
AI Technical Summary
In existing electronic devices, the aluminum extruded slide rail acts as a supporting element for the expansion card, occupying the space of the motherboard, hindering heat dissipation, and increasing material and processing costs.
The existing heat dissipation fin parts design replaces the slide rail, and the sliding grooves of the expansion card module are embedded through the fixed plate to support and fix the expansion card module to avoid additional components and improve heat dissipation efficiency.
Reduces material costs, improves heat dissipation efficiency, simplifies installation time, and removes the heat dissipation elements on the main circuit board without removing the expansion card.
Smart Images
Figure CN222916418U_ABST
Abstract
Description
Technical Field
[0001] The present utility model relates to an electronic device, in particular to an electronic device with a detachable expansion card. Background Art
[0002] The hardware components of many electronic devices or computer devices include a motherboard, and many electronic components are arranged on the motherboard to execute programs and transmit signals. With the rapid development of technology and the improvement of living standards, the performance requirements of many electronic devices are getting higher and higher and the functional requirements are becoming more and more diverse. Therefore, sufficient storage space is also required to store a large amount of data. In order to prevent the situation of insufficient storage space in the electronic device, a detachable expansion card (such as an M.2 solid-state drive) has been developed at present to be selected and replaced according to the storage space requirements.
[0003] In the existing technology, an aluminum extrusion rail is arranged on the motherboard of the electronic device as a support component for the expansion card, and the aluminum extrusion rail has a groove. When the expansion card is arranged on the electronic device, the circuit board of the expansion card can slide into the groove through the groove, so that the expansion card can be fixed on the motherboard and connected to the motherboard. However, with the miniaturization of electronic products, the size and design space of the motherboard are limited. When the aluminum extrusion rail is arranged on the motherboard, electronic components cannot be designed and configured at the position of the aluminum extrusion rail. And the aluminum extrusion rail is only a support component and not an original component on the motherboard. That is to say, the aluminum extrusion rail is an additional part, which increases the material cost and the inventory cost, especially the cost increase is particularly obvious in industrial standard products. Due to the characteristics of small quantity and variety of industrial standard products, the aluminum extrusion rail needs to amortize the production cost of the upper die, and the parts after CNC post-processing will also generate quite high processing costs. In addition, the circuit layout and electronic components of the motherboard are complex and numerous. Under the high-performance operation of the electronic device, the motherboard needs a good heat dissipation mechanism. When the aluminum extrusion rail is arranged on the motherboard, the aluminum extrusion rail will block part of the space of the motherboard and then affect the air flow, thereby reducing the heat dissipation efficiency.
[0004] Therefore, it is necessary to develop a new type of electronic device with a detachable expansion card, and use the existing heat sink fins of the original electronic device to replace the design of the rail to solve the problems of the prior art and cost. Summary of the Utility Model
[0005] In view of this, the purpose of the present utility model is to provide an electronic device with a detachable expansion card, which has a simple structure, is convenient for operation and maintenance, effectively overcomes the defects of the prior art, reduces the material cost, improves the efficiency and reduces the installation man-hours.
[0006] To achieve the above purpose, the present utility model discloses an electronic device with a detachable expansion card, which is characterized by comprising:
[0007] A housing having a hole;
[0008] A first heat dissipation element disposed on one side of the housing and including a groove structure, the groove structure forming a receiving space corresponding to the hole and including a side wall;
[0009] A fixing plate disposed on the side wall, the fixing plate including a first convex post and a second convex post protruding into the receiving space; and
[0010] An expansion card module detachably disposed on one side of the housing and including a second heat dissipation element, the second heat dissipation element including a first sliding groove and a second sliding groove, the first sliding groove corresponding to the first convex post, the second sliding groove being parallel to the first sliding groove and corresponding to the second convex post;
[0011] Wherein, the second heat dissipation element is used to pass through the hole and the first convex post and the second convex post respectively move in the first sliding groove and the second sliding groove at the same time so that the expansion card module is disposed on one side of the housing.
[0012] Wherein, the second heat dissipation element includes a third sliding groove and a fourth sliding groove, the third sliding groove communicates with the first sliding groove, the fourth sliding groove communicates with the second sliding groove, and there is an angle between the first sliding groove and the third sliding groove and between the second sliding groove and the fourth sliding groove.
[0013] Wherein, the angle is 45 degrees.
[0014] Wherein, the third sliding groove has a first inclined surface so that the first convex post abuts against the first inclined surface after the expansion card module is disposed on one side of the housing.
[0015] Wherein, the fourth sliding groove has a second inclined surface so that the second convex post abuts against the second inclined surface after the expansion card module is disposed on one side of the housing.
[0016] Wherein, the second heat dissipation element includes a heat dissipation fin, and the third sliding groove has an opening, and the heat dissipation fin is located at the edge of the opening.
[0017] Wherein, the housing includes a support guiding structure disposed at the edge of the hole and corresponding to the first convex post so that the support guiding structure moves in the first sliding groove when the expansion card module is disposed on one side of the housing.
[0018] Wherein, the expansion card module includes a mounting plate having a first surface, and the second heat dissipation element is disposed on the first surface.
[0019] Wherein, the expansion card module includes a handle, the mounting plate has a second surface opposite to the first surface, and the handle is disposed on the second surface.
[0020] Wherein, the fixing plate is a metal plate.
[0021] In summary, for the electronic device with a detachable expansion card of the present utility model, the heat dissipation element of the expansion card module can be directly embedded into the sliding groove of the heat dissipation element of the expansion card module through the fixing plate disposed on the existing heat dissipation element to support and fix the expansion card module. No additional components need to be provided on the main circuit board of the electronic device, thereby reducing the material cost. Moreover, for the electronic device with a detachable expansion card of the present utility model, the expansion card module is fixed in a suspended manner, so that the components disposed on the main circuit board will not be affected by the blockage of other supporting components and thus affect the air flow, thereby improving the heat dissipation efficiency. In addition, for the electronic device with a detachable expansion card of the present utility model, the heat dissipation element on the main circuit board can be directly disassembled without disassembling the expansion card, thereby improving the efficiency and reducing the installation man-hours. Description of the Drawings
[0022] Figure 1 Shows a schematic structural diagram of an electronic device with a detachable expansion card according to a specific embodiment of the present utility model.
[0023] Figure 2 Shows Figure 1 exploded view of the electronic device with a detachable expansion card.
[0024] Figure 3 Shows Figure 1 side view of the expansion card module.
[0025] Figure 4A , Figure 4B and Figure 4C Shows a schematic cross-sectional structural diagram of the expansion card module of the electronic device with a detachable expansion card according to a specific embodiment of the present utility model during installation.
[0026] Figure 5A and Figure 5B Shows a schematic cross-sectional structural diagram of the first heat dissipation element of the electronic device with a detachable expansion card according to a specific embodiment of the present utility model during disassembly.
[0027] Figure 5C Shows Figure 5B schematic cross-sectional structural diagram of the electronic device with a detachable expansion card from another angle. Detailed Description of the Embodiment
[0028] In order to make the advantages, spirit and features of the present utility model easier and more clearly understood, subsequent detailed descriptions and discussions will be made with specific embodiments and with reference to the accompanying drawings. It should be noted that these specific embodiments are only representative specific embodiments of the present utility model, and the specific methods, devices, conditions, materials, etc. exemplified therein are not intended to limit the present utility model or the corresponding specific embodiments. Also, the devices in the drawings are only used to express their relative positions and are not drawn according to their actual proportions. This is stated first for clarification.
[0029] In the description of this specification, the description with reference to terms such as "a specific embodiment", "another specific embodiment" or "partial specific embodiments" means that the specific features, structures, materials or characteristics described in connection with the embodiment are included in at least one embodiment of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments.
[0030] Please refer to Figure 1 and Figure 2 . Figure 1 FIG. shows a schematic structural diagram of an electronic device E with a detachable expansion card according to a specific embodiment of the present utility model. Figure 2 FIG. shows Figure 1 an exploded view of the electronic device E with a detachable expansion card, where Figure 2 the exploded view of Figure 1 does not show the expansion card module. As Figure 2 shown, in this specific embodiment, the electronic device E with a detachable expansion card includes a housing 1, a first heat dissipation element 2, a fixing plate 3, a main circuit board 4, and an expansion card module 5. The first heat dissipation element 2 is disposed on the main circuit board 4, the fixing plate 3 is fixed to the first heat dissipation element 2, and the assembled first heat dissipation element 2, fixing plate 3, and main circuit board 4 are disposed on the same side of the housing 1. The expansion card module 5 is detachably disposed on the housing 1. In practice, the electronic device E with a detachable expansion card can be an embedded computer. And the expansion card module 5 can be a storage device, for example: a solid state drive of an M.2 module. The main circuit board 4 can be the main board of the electronic device E with a detachable expansion card, and a plurality of electronic components can be disposed on the main circuit board 4. The size of the first heat dissipation element 2 can correspond to the size of the main circuit board 4, and the first heat dissipation element 2 can be disposed on the main circuit board 4 by means of screwing for heat dissipation.
[0031] In this specific embodiment, the housing 1 has a hole 11. In practice, the housing 1 is the casing of an electronic device E with a detachable expansion card and can be a sheet metal part. The housing 1 can form a cavity to accommodate the first heat dissipation element 2, the fixing plate 3, and the main circuit board 4. The hole 11 can be formed on the side of the housing 1 of the electronic device E with a detachable expansion card, and the hole 11 communicates with the cavity. Further, the housing 1 includes a support guiding structure 12 disposed at the edge of the hole 11. In practice, the support guiding structure 12 can be formed by bending sheet metal. As Figure 2 shown, in this specific embodiment, the housing 1 includes two support guiding structures 12. The two support guiding structures 12 are arranged opposite to each other, and the support guiding structure 12 protrudes towards the cavity.
[0032] In this specific embodiment, the first heat dissipation element 2 includes a groove structure 21. The groove structure 21 forms an accommodation space 210 and includes a first side wall 211A and a second side wall 211B that are opposite to each other. In practice, the shape and size of the groove structure 21 can correspond to the shape and size of the hole 11 of the housing 1. And, after the first heat dissipation element 2 is disposed in the housing 1, the position of the groove structure 21 can correspond to the position of the hole 11.
[0033] In this specific embodiment, the electronic device E with a detachable expansion card includes two fixing plates 3 respectively disposed on the first side wall 211A and the second side wall 211B of the first heat dissipation element 2. In practice, the fixing plate 3 can be an L-shaped metal plate and can be fixed to the groove structure 21 by means of locking. The two fixing plates 3 can be symmetrically disposed on the first side wall 211A and the second side wall 211B. Further, each fixing plate 3 includes a first convex column 31A and a second convex column 31B, and the first convex column 31A and the second convex column 31B are staggered from each other. After the fixing plate 3 is fixed to the first heat dissipation element 2, the first convex column 31A and the second convex column 31B protrude into the accommodation space 210. In practice, the first convex columns 31A and the second convex columns 31B of the two fixing plates 3 can also be symmetrically disposed. In addition, after the first heat dissipation element 2 is disposed in the housing 1, the first convex column 31A corresponds to the support guiding structure 12 of the housing 1, and the first convex column 31A and the support guiding structure 12 are on the same horizontal straight line.
[0034] Please refer to Figure 1 and Figure 3 . Figure 3 shows Figure 1 a side view of the expansion card module 5. As Figure 1 and Figure 3As shown, in this specific embodiment, the expansion card module 5 includes a mounting plate 50, a second heat dissipation element 51, a circuit board 52, and a handle 53. The mounting plate 50 has a first surface 501 and a second surface 502 that face each other. The second heat dissipation element 51 is disposed on the circuit board 52 and fixed to the first surface 501 of the mounting plate 50, while the handle 53 is fixed to the second surface 502 of the mounting plate 50. In practice, a plurality of electronic components can be disposed on the circuit board 52, and the second heat dissipation element 51 can be disposed on the circuit board 52 by means of screwing for heat dissipation. The dimensions of the hole 11 of the foregoing housing 1 and the accommodating space 210 of the groove structure 21 of the first heat dissipation element 2 can correspond to the dimensions of the second heat dissipation element 51. The handle 53 can be disposed on the mounting plate 50 by means of locking, welding, etc. for the user to hold, thereby driving the movement of the expansion card module 5.
[0035] In this specific embodiment, the second heat dissipation element 51 includes a first sliding groove 511 and a second sliding groove 512. The first sliding groove 511 and the second sliding groove 512 are horizontally parallel to each other and recess inward from the side surface of the second heat dissipation element 51. In practice, the dimensions of the first convex post 31A and the support guiding structure 12 can correspond to the dimensions of the first sliding groove 511, and the dimensions of the second convex post 31B can correspond to the dimensions of the second sliding groove 512. Further, the positions of the first convex post 31A and the support guiding structure 12 can correspond to the position of the first sliding groove 511, and the position of the second convex post 31B can correspond to the position of the second sliding groove 512.
[0036] It should be noted that Figure 3 Only a side view of one side of the expansion card module 5 is shown. In this specific embodiment, the other side of the expansion card module 5 also includes a first sliding groove and a second sliding groove. That is to say, the expansion card module 5 includes two sets of symmetrically arranged first sliding grooves 511 and second sliding grooves 512.
[0037] Please refer to Figure 4A 、 Figure 4B and Figure 4C . Figure 4A 、 Figure 4B and Figure 4C are, in sequence, the cross-sectional structure diagrams of the expansion card module 5 of the electronic device E with a detachable expansion card in a specific embodiment of the present invention during installation. As Figure 4AAs shown, when the expansion card module 5 is installed, the user can hold the handle 53 of the expansion card module 5 and pass the end of the second heat dissipation element 51 through the hole 11 of the housing 1. At this time, the support guiding structure 12 of the housing 1 can be embedded in the first sliding groove 511 and move in the first sliding groove 511. And when the support guiding structure 12 is embedded in the first sliding groove 511, the support guiding structure 12 can limit the second heat dissipation element 51 to move only in the horizontal direction. Then, as Figure 4B shown, when the expansion card module 5 continues to move into the accommodation space 210 of the groove structure 21 of the first heat dissipation element 2, the first convex post 31A of the fixing plate 3 can be embedded in the first sliding groove 511 and move in the first sliding groove 511, and the second convex post 31B can be embedded in the second sliding groove 512 and move in the second sliding groove 512. At this time, the support guiding structure 12, the first convex post 31A and the second convex post 31B can support the second heat dissipation element 51 at the same time, so that the second heat dissipation element 51 will not move towards the main circuit board 4 due to gravity and weight. Finally, as Figure 4C shown, when the second heat dissipation element 51 is completely arranged in the groove structure 21 of the first heat dissipation element 2, the mounting plate 50 can contact and be fixed on the housing 1 to install the expansion card module 5 on the electronic device. In addition, the expansion card module 5 further includes a plug 521 arranged on the circuit board 52, and the main circuit board 4 includes a socket 41. When the mounting plate 50 can contact and be fixed on the housing 1, the plug 521 will also be engaged with the socket 41 at the same time, so that signals can be transmitted between the expansion card module 5 and the main circuit board 4. In practice, the size of the mounting plate 50 can be larger than the size of the hole 11 of the housing 1. The mounting plate 50 and the housing 1 can include at least one corresponding through hole, and the mounting plate 50 can be fixed on the housing 1 by screwing.
[0038] It should be noted that Figures 4A to 4C only the installation side view of one side of the expansion card module 5 is shown. In practice, the installation process, position structure and connection relationship of the other side of the expansion card module are Figures 4A to 4C substantially the same, and will not be elaborated here.
[0039] When the expansion card module 5 is disassembled, the user can first remove the screws between the mounting plate 50 and the housing 1, and then hold the handle 53 and pull the expansion card module 5 outwards. At this time, the second convex post 31B can move in the second sliding groove 512 and disengage from the second sliding groove 512, then the first convex post 31A can move in the first sliding groove 511 and disengage from the first sliding groove 511, and finally the support guiding structure 12 can move in the first sliding groove 511 and disengage from the first sliding groove 511.
[0040] Therefore, the electronic device with a detachable expansion card of the present utility model can directly embed the sliding groove of the heat dissipation element of the expansion card module through the fixing plate provided on the existing heat dissipation element to support and fix the expansion card module, and no additional components need to be provided on the main circuit board of the electronic device, thereby reducing the material cost. Moreover, the electronic device with a detachable expansion card of the present utility model fixes the expansion card module in a suspended manner, so that the components provided on the main circuit board will not be affected by the blocking of other support components and affect the air flow, thereby improving the heat dissipation efficiency.
[0041] Please refer to Figure 5A , Figure 5B and Figure 5C . Figure 5A and Figure 5B show a schematic cross-sectional structure diagram of the first heat dissipation element 2 of the electronic device E with a detachable expansion card according to a specific embodiment of the present utility model when disassembled. Figure 5C Show Figure 5B The electronic device E with a detachable expansion card is shown in a schematic cross-sectional structure diagram from another angle. As Figure 5A and Figure 5B shown, in this specific embodiment, the second heat dissipation element 51 further includes a third sliding groove 513 and a fourth sliding groove 514. The third sliding groove 513 communicates with the first sliding groove 511, and the fourth sliding groove 514 communicates with the second sliding groove 512. In practice, the third sliding groove 513 and the fourth sliding groove 514 are arranged horizontally and parallel to each other and are recessed inward from the side surface of the second heat dissipation element 51. Further, the third sliding groove 513 has a first inclined surface 5130, and the fourth sliding groove 514 has a second inclined surface 5140. When the expansion card module 5 is disposed in the housing 1 (as Figure 4C shown), the first convex post 31A of the fixing plate 3 abuts against the first inclined surface 5130, so that the first convex post 31A can support the second heat dissipation element 51. Similarly, the second convex post 31B of the fixing plate 3 also abuts against the second inclined surface 5140 of the fourth sliding groove 514 at the same time.
[0042] Further, in this specific embodiment, there is an angle G between the first sliding groove 511 and the third sliding groove 513 and between the second sliding groove 512 and the fourth sliding groove 514. In practice, the angle G can be 45 degrees, but is not limited thereto. As Figure 5A shown, when the first heat dissipation element 2 is disassembled, the user can first remove the screw between the first heat dissipation element 2 and the main circuit board 4, and then the user can directly move the first heat dissipation element 2 at the angle G. At this time, the first convex post 31A of the fixing plate 3 can move in the third sliding groove 513, and the second convex post 31B can move in the fourth sliding groove 514 at the same time. As Figure 5B and Figure 5CAs shown, when the first heat dissipation element 2 continuously moves, the second protrusion 31B and the first protrusion 31A can sequentially disengage from the third sliding groove 513 and the fourth sliding groove 514 to detach the first heat dissipation element 2 from the main circuit board 4.
[0043] It should be noted that since the expansion card module 5 is fixed to the housing 1 through the mounting plate 50, the expansion card module 5 will not move towards the direction of the main circuit board 4. Therefore, the first heat dissipation element 2 can be directly detached without detaching the expansion card module 5. And, Figures 5A to 5C Only the disassembly side view of one side of the first heat dissipation element 2 is shown. In practice, the disassembly process, position structure, and connection relationship of the other side of the first heat dissipation element are Figures 5A to 5C substantially the same and will not be elaborated here.
[0044] In addition, in this specific embodiment, the second heat dissipation element 51 includes heat dissipation fins 515. The third sliding groove 513 has an opening 5131, and the heat dissipation fins 515 are disposed at the edge of the opening 5131. In practice, as Figure 5B and Figure 5C shown, the side surface of the heat dissipation fins 515 can be used as the installation reference surface, and the side surface of the heat dissipation fins 515 can form a continuous surface with the first inclined surface 5130 of the third sliding groove 513. Therefore, when the first heat dissipation element 2 is installed, the first protrusion 31A of the fixing plate 3 can first adhere to the side surface of the heat dissipation fins 515, and then pass through the opening 5131 along the continuous surface to be embedded in the third sliding groove 513. Similarly, the second protrusion 31B can also adhere to the side surface of the heat dissipation fins 515 at the same time, and then be embedded in the fourth sliding groove 514 along the continuous surface.
[0045] In summary, the electronic device with a detachable expansion card of the present utility model can directly embed the sliding groove of the heat dissipation element of the expansion card module through the fixing plate provided on the existing heat dissipation element to support and fix the expansion card module. No additional components need to be provided on the main circuit board of the electronic device, thereby reducing the material cost. And, the electronic device with a detachable expansion card of the present utility model fixes the expansion card module in a suspended manner, so that the components provided on the main circuit board will not be affected by the blocking of other supporting components and the air flow will not be affected, thereby improving the heat dissipation efficiency. In addition, the electronic device with a detachable expansion card of the present utility model can directly detach the heat dissipation element on the main circuit board without detaching the expansion card, thereby improving the efficiency and reducing the installation man-hours.
[0046] Through the detailed description of the above preferred specific embodiments, it is hoped that the features and spirit of the present invention can be more clearly described, rather than limiting the scope of the present invention by the above-disclosed preferred specific embodiments. On the contrary, the purpose is to hope to cover various changes and equivalent arrangements within the scope of the patent scope to be applied for by the present invention. Therefore, the scope of the patent scope applied for by the present invention should be interpreted as broadly as possible according to the above description, so as to cover all possible changes and equivalent arrangements.
Claims
1. An electronic device with a detachable expansion card, characterized in that Include: A housing having a hole; A first heat dissipation element is disposed on one side of the housing and includes a groove structure, the groove structure forms a receiving space corresponding to the hole and includes a side wall; A fixing plate, disposed on the side wall, the fixing plate comprising a first protruding column and a second protruding column protruding into the accommodating space; as well as An expansion card module is detachably disposed on one side of the housing and includes a second heat dissipation element, the second heat dissipation element includes a first sliding groove and a second sliding groove, the first sliding groove corresponds to the first convex column, and the second sliding groove is parallel to the first sliding groove and corresponds to the second convex column; The second heat dissipation element is used to pass through the hole and the first protrusion and the second protrusion move in the first sliding groove and the second sliding groove respectively and simultaneously so that the expansion card module is arranged on one side of the shell.
2. The electronic device with a detachable expansion card as claimed in claim 1, wherein: The second heat dissipation element includes a third sliding groove and a fourth sliding groove, the third sliding groove is connected to the first sliding groove, the fourth sliding groove is connected to the second sliding groove, and there is an angle between the first sliding groove and the third sliding groove and between the second sliding groove and the fourth sliding groove.
3. The electronic device with a detachable expansion card as claimed in claim 2, wherein: The angle is 45 degrees.
4. The electronic device with a detachable expansion card as claimed in claim 2, wherein: The third sliding groove has a first inclined surface so that when the expansion card module is arranged on one side of the shell, the first protruding column abuts against the first inclined surface.
5. The electronic device with a detachable expansion card as claimed in claim 2, wherein: The fourth sliding groove has a second inclined surface so that when the expansion card module is arranged on one side of the shell, the second protruding column abuts against the second inclined surface.
6. The electronic device with a detachable expansion card as claimed in claim 2, wherein: The second heat dissipation element includes a heat dissipation fin, and the third sliding groove has an opening, and the heat dissipation fin is located at the edge of the opening.
7. The electronic device with a detachable expansion card as claimed in claim 1, wherein: The shell includes a support guide structure, which is arranged at the edge of the hole and corresponds to the first protrusion so that when the expansion card module is arranged on one side of the shell, the support guide structure moves in the first sliding groove.
8. The electronic device with a detachable expansion card as claimed in claim 1, wherein: The expansion card module includes a mounting plate having a first surface, and the second heat dissipation element is arranged on the first surface.
9. The electronic device with a detachable expansion card as claimed in claim 8, wherein: The expansion card module comprises a handle, the mounting plate has a second surface opposite to the first surface, and the handle is arranged on the second surface.
10. The electronic device with a detachable expansion card as claimed in claim 1, wherein: The fixing plate is a metal plate.