Liquid cooling heat dissipation assembly, operation and liquid cooling heat dissipation unit and supercomputer server

Abstract

The utility model provides a liquid cooling heat dissipation assembly, an operation and liquid cooling heat dissipation unit and a supercomputing server, the liquid cooling heat dissipation assembly is used in the supercomputing server, and the liquid cooling heat dissipation assembly comprises a bottom shell and a top plate; the bottom shell comprises a bottom plate, a side wall, a flow channel partition wall and cooling fins which are integrally formed; the side wall is located on the upper surface of the bottom plate and arranged in an annular shape, and a cooling liquid flow channel is formed in the annular shape. The runner partition wall is located in the side wall, one end of the runner partition wall is connected with the side wall, the other end of the runner partition wall does not make contact with any part of the side wall, and the runner is divided into multiple sub-runners communicating with one another; the number of the heat dissipation fins is multiple, and the heat dissipation fins are distributed in all the sub-flow channels. The top plate covers the upper surfaces, away from the bottom plate, of the side walls to completely cover the flow channels, and the faces, away from the bottom plate, of the cooling fins are attached to the top plate. The product provided by the utility model can be efficiently produced, is easy to assemble and has an excellent heat dissipation effect.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid cooling and heat dissipation of electronic equipment, and in particular to a liquid cooling and heat dissipation component, a computing and liquid cooling and heat dissipation unit, and a supercomputing server. Background Art

[0002] Liquid cooling is often used in high-computing electronic devices (such as supercomputing servers). In order to meet the high computing power requirements, these electronic devices usually have multiple computing boards built in, and each computing board has multiple high-performance chips. The cumulative heat generated by these high-performance chips when working is considerable. At this time, a liquid cooling device that is close to the computing board can be used to achieve efficient heat dissipation.

[0003] As the market demand for liquid cooling devices for high-computing-power electronic devices grows day by day, there is an urgent need for a liquid cooling device that can be efficiently produced, easily assembled, and reliable to use. Utility Model Content

[0004] Based on the above situation, the main purpose of the present invention is to provide a liquid cooling and heat dissipation component, a computing and liquid cooling and heat dissipation unit and a supercomputing server, which can meet the above needs.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0006] In a first aspect, the utility model provides a liquid cooling and heat dissipation component, the liquid cooling and heat dissipation component is used for a supercomputing server, the supercomputing server includes a computing board and a liquid cooling and heat dissipation component, the computing board includes a plurality of chip band groups, and the liquid cooling and heat dissipation component includes a bottom shell and a top plate;

[0007] The bottom shell includes a bottom plate, a side wall, a flow channel partition wall and heat dissipation fins;

[0008] The side wall is located on the upper surface of the bottom plate and is arranged in an annular shape, and a flow channel for the coolant is formed in the annular shape;

[0009] The number of the flow channel partition wall is at least one, the flow channel partition wall is located inside the side wall, one end of the flow channel partition wall is connected to the side wall, and the other end does not contact any part of the side wall, and the flow channel partition wall divides the flow channel into a plurality of sub-flow channels that are interconnected;

[0010] The number of the heat dissipation fins is multiple and distributed in each of the sub-flow channels;

[0011] The bottom plate, side wall, flow channel partition wall and heat dissipation fins are integrally formed;

[0012] The top plate covers the upper surface of the side wall away from the bottom plate to completely cover the flow channel, and the side of each heat dissipation fin away from the bottom plate is in contact with the top plate;

[0013] When the liquid-cooling heat dissipation component is used in a supercomputing server, the computing board is attached to the bottom plate or the top plate of the liquid-cooling heat dissipation component, and the arrangement positions of the multiple chip band groups on the computing board correspond to the arrangement areas of the flow channels in the liquid-cooling heat dissipation component.

[0014] Preferably, a plurality of bottom rib groups are provided on the lower surface of the bottom plate, the number of the bottom rib groups is the same as the number of the sub-flow channels, and the plurality of bottom rib groups and the plurality of sub-flow channels are arranged in a one-to-one correspondence in the thickness direction of the bottom plate.

[0015] Preferably, a plurality of groups of top rib groups are provided on the upper surface of the top plate, the number of the top rib groups is the same as the number of the sub-flow channels, and the plurality of groups of top rib groups and the plurality of sub-flow channels are arranged in a one-to-one correspondence in the thickness direction of the top plate.

[0016] Preferably, each group of bottom ribs and top ribs includes three ribs;

[0017] In each group of bottom convex ribs and each group of top convex ribs, the spacing between each two adjacent convex ribs is the same, and the maximum distance between the two convex ribs farthest apart is equal to the width of the sub-channel corresponding to the group of convex ribs.

[0018] Preferably, the number of the sub-flow channels is 4; in each sub-flow channel, 5 rows of heat dissipation fins are arranged in the same extension direction as the sub-flow channel.

[0019] Preferably, within each sub-channel, a plurality of heat dissipation fin groups are arranged at intervals along the extension direction of the sub-channel.

[0020] Preferably, at least one set of positioning structures is provided between the upper surface of the side wall and the top plate, so as to accurately position the top plate at a corresponding position on the upper surface of the side wall;

[0021] The positioning structure includes two positioning protrusions located on the upper surface of the side wall and two positioning grooves located at corresponding positions of the top plate.

[0022] Preferably, the bottom plate is in the shape of an elongated strip, the side wall comprises two short side sub-side walls and two long side sub-side walls, and the two positioning protrusions are both located on the upper surface of the same short side sub-side wall.

[0023] Preferably, the flow channel partition wall and the long side sub-side wall are arranged side by side;

[0024] The positioning structure further comprises positioning posts and positioning holes. Positioning posts are arranged on the upper surfaces of each flow channel partition wall and each long side sub-wall, and positioning holes corresponding to the positioning posts are arranged on the top plate.

[0025] Preferably, the flow channel partition walls are multiple and arranged in parallel, and the multiple sub-flow channels are parallel to each other and connected in sequence.

[0026] Preferably, the number of the chip strip groups is the same as the number of the sub-flow channels, and each chip strip group includes 3 chip strips;

[0027] When the liquid cooling heat dissipation assembly is used in a supercomputing server, each chip strip is fitted with the bottom ribs on the bottom plate in a one-to-one correspondence, or is fitted with the top ribs on the top plate in a one-to-one correspondence.

[0028] In a second aspect, the utility model provides a computing and liquid cooling unit, comprising a computing board and the liquid cooling assembly as described above, wherein the computing board is located on the upper surface of the top plate and / or on the lower surface of the bottom plate.

[0029] In a third aspect, the utility model provides a supercomputing server, comprising the liquid cooling and heat dissipation component as described above or the computing and liquid cooling and heat dissipation unit as described above.

[0030] In the liquid cooling heat dissipation assembly provided by the utility model, the bottom plate, side wall, flow channel partition wall and heat dissipation fins are integrally formed, and then the assembly itself can be completed by covering the top plate on the upper surface of the side wall away from the bottom plate. When it is used in the scenario of heat dissipation in conjunction with the computing board, the liquid cooling heat dissipation assembly can quickly absorb the heat from the computing board through the flow of the coolant in the sub-flow channel. The utility model can fully ensure the reliability of the use of the liquid cooling heat dissipation assembly, and is also very convenient for the efficient production and assembly of the liquid cooling heat dissipation assembly.

[0031] Other beneficial effects of the utility model will be explained through the introduction of specific technical features and technical solutions in the specific implementation manner. Through the introduction of these technical features and technical solutions, those skilled in the art should be able to understand the beneficial technical effects brought about by the technical features and technical solutions. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

[0033] Figure 1 A schematic diagram of the three-dimensional structure of a preferred embodiment of the liquid cooling heat dissipation component (matching the liquid inlet interface and the liquid outlet interface of the coolant) provided by the utility model;

[0034] Figure 2A schematic diagram of a three-dimensional structure of a preferred embodiment of the top plate provided by the utility model;

[0035] Figure 3 A schematic diagram of the three-dimensional structure of a preferred embodiment of the upper surface of the bottom shell provided by the utility model;

[0036] Figure 4 A schematic diagram of a three-dimensional structure of a preferred embodiment of the lower surface of the bottom shell provided by the utility model;

[0037] Figure 5 A schematic diagram of a three-dimensional cross-sectional structure of a preferred embodiment of a liquid cooling heat dissipation component provided by the utility model.

[0038] Description of Figure Numbers:

[0039] Label name Label name Label name 100 roof 200 Bottom shell 250 Sidewall 110 Top rib group 210 Bottom rib group 260 Channel partition wall 111 Top rib 211 Bottom rib 270 Runner 120 Positioning slot 220 Positioning bump 271 Sub-channel 130 Positioning hole 230 Positioning column 280 Heat sink 300 Liquid outlet 240 Base Plate 400 Liquid inlet interface DETAILED DESCRIPTION

[0040] The present invention is described below based on embodiments, but the present invention is not limited to these embodiments. In the following detailed description of the present invention, some specific details are described in detail. In order to avoid confusing the essence of the present invention, known methods, processes, procedures, and components are not described in detail.

[0041] In addition, persons of ordinary skill in the art will appreciate that the drawings provided herein are for illustration purposes and are not necessarily drawn to scale.

[0042] Unless the context clearly requires otherwise, throughout the specification and claims, the words "include", "comprising" and similar words should be interpreted in an inclusive sense rather than an exclusive or exhaustive sense; that is, in the sense of "including but not limited to".

[0043] In the description of the present invention, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of the present invention, unless otherwise specified, the meaning of "plurality" is two or more.

[0044] [Explanation] In the present utility model, the top plate is defined as being located "above" the bottom shell, rather than below it. All concepts related to "above" and "below" in the text refer to the above definition of "above".

[0045] The side of the bottom shell facing the top plate is defined as its "upper surface", and the side of the bottom shell facing away from the top plate is defined as its "lower surface".

[0046] First, see Appendix Figure 1-5The utility model provides a liquid cooling and heat dissipation component, which is used for a supercomputing server. The supercomputing server includes a computing board and a liquid cooling and heat dissipation component. The computing board includes a plurality of chip band groups. The liquid cooling and heat dissipation component includes a bottom shell 200 and a top plate 100.

[0047] The bottom case 200 includes a bottom plate 240, a side wall 250, a flow channel partition wall 260 and heat dissipation fins 280;

[0048] The side wall 250 is located on the upper surface of the bottom plate 240 and is arranged in an annular shape, and a flow channel 270 of the cooling liquid is formed in the annular shape;

[0049] The number of the flow channel partition wall 260 is at least one. The flow channel partition wall 260 is located inside the side wall 250, and one end of the flow channel partition wall 260 is connected to the side wall 250, and the other end does not contact any part of the side wall 250. The flow channel partition wall 260 divides the flow channel 270 into a plurality of sub-flow channels 271 that are interconnected.

[0050] The number of the heat dissipation fins 280 is multiple and distributed in each of the sub-channels 271;

[0051] The bottom plate 240, the side wall 250, the flow channel partition wall 260 and the heat dissipation fins 280 are integrally formed;

[0052] The top plate 100 covers the upper surface of the side wall 250 away from the bottom plate 240 to completely cover the flow channel 270 , and a surface of each heat dissipation fin 280 away from the bottom plate 240 is in contact with the top plate 100 .

[0053] Specifically, the liquid cooling heat dissipation component in the present invention is generally used for heat dissipation of high computing power computing equipment (i.e., supercomputing servers). In the working state, the liquid cooling heat dissipation component is attached to the computing power board in the supercomputing server. The liquid cooling heat dissipation component is assembled by covering a top plate 100 and a bottom shell 200. A flow channel 270 is provided in the bottom shell 200. The flow channel 270 is used for the coolant to flow therein to take away the heat generated by the computing power board attached to the liquid cooling heat dissipation component when working (combined with the attached Figure 1 It can be seen that the coolant can enter from the liquid inlet interface 400 assembled and connected to the liquid cooling heat dissipation component, and can flow out from the liquid outlet interface 300 assembled and connected to the liquid cooling heat dissipation component). For ease of assembly, the top plate 100 and the bottom shell 200 can each be integrally formed. In this way, even if the bottom shell 200 includes multiple functional components, there is no need to assemble these functional components one by one on site before closing the top cover, which effectively improves the assembly efficiency of the liquid cooling heat dissipation component.

[0054] In order to form the flow channel 270, the bottom shell 200 includes a bottom plate 240 and a side wall 250, and the side wall 250 is located on the upper surface of the bottom plate 240 and is arranged in an annular shape, so that the flow channel 270 of the coolant is obtained in the annular shape.

[0055] Because it is realized that the flow rate of the coolant is also closely related to the heat dissipation efficiency, the side wall 250 of the bottom shell 200 also includes at least one flow channel partition wall 260 to divide the flow channel 270 into a plurality of interconnected sub-flow channels 271. Because the flow channel cross-sectional area of ​​the sub-flow channel 271 is significantly smaller than that of the flow channel 270, the flow rate of the coolant can be significantly increased, thereby effectively improving the heat dissipation efficiency. The provision of the flow channel partition wall 260 also helps to increase the contact area between the coolant and the bottom shell 200, thereby helping the heat exchange between the coolant and the liquid-cooled heat dissipation component to be carried out more quickly and fully. The flow channel partition wall 260 can be conveniently designed and formed in a manner that one end is connected to the side wall 250 and the other end does not contact any part of the side wall, which is also convenient for molding the relevant parts of the side wall 250 and the flow channel partition wall 260 during the one-piece molding process of the bottom shell 200.

[0056] In order to further improve the heat exchange efficiency, a heat dissipation fin 280 is provided in each sub-channel 271. The heat dissipation fin 280 can increase the contact area between the bottom shell 200 and the coolant, which has the effect of significantly improving the heat exchange efficiency; and the heat dissipation fin 280 can also squeeze the coolant, thereby helping to further increase the flow rate of the coolant, thereby further improving the cooling efficiency; in addition, the heat dissipation fin 280 can also enhance the structural strength of the bottom shell 200 and reduce the noise generated by the flow of coolant. While the number, shape, thickness and length of the heat dissipation fins 280 remain basically unchanged, the higher the height of the heat dissipation fins 280, the larger the contact area between the heat dissipation fins 280 and the coolant will be. Therefore, the utility model also allows the side of the heat dissipation fins 280 facing away from the bottom plate 240 to fit with the top plate 100 after the top plate 100 is covered on the bottom shell 200, that is, the height of the heat dissipation fins 280 reaches the same height as the flow channel 270, which further improves the efficiency of heat conduction and heat dissipation, and at the same time helps to reduce the occurrence of turbulence during the flow of the coolant.

[0057] In the liquid cooling heat dissipation assembly provided by the utility model, the bottom plate 240, the side wall 250, the flow channel partition wall 260 and the heat dissipation fins 280 are integrally formed, and then the top plate 100 is covered on the upper surface of the side wall 250 away from the bottom plate 240, and the assembly of the assembly itself can be completed. When it is applied to the scene of heat dissipation with the computing board in the supercomputing server, the liquid cooling heat dissipation assembly can quickly absorb the heat from the computing board through the flow of the coolant in the sub-flow channel 271. The utility model can fully ensure the reliability of the use of the liquid cooling heat dissipation assembly, and is also very convenient for the efficient production and assembly of the liquid cooling heat dissipation assembly.

[0058] Preferably, see in particular the attached Figure 4 and 5 A plurality of bottom rib groups 210 are provided on the lower surface of the bottom plate 240 , the number of the bottom rib groups 210 is the same as the number of the sub-channels 271 , and the plurality of bottom rib groups 210 and the plurality of sub-channels 271 are arranged in one-to-one correspondence in the thickness direction of the bottom plate 240 .

[0059] By providing a bottom rib group 210 on the lower surface of the bottom plate 240, it is possible to facilitate accurate fitting of the bottom rib group 210 with the chip strip group on the upper surface of the lower computing board fitted thereto. The number of the bottom rib groups 210 may be the same as the number of the chip strip groups on the lower computing board, and if the number of bottom ribs in each group of bottom ribs is M, the number of chip strips in each group of chip strips may also be M. When the bottom plate 240 is fitted to the lower computing board, the bottom ribs 211 and the chip strips may be fitted one by one. By making the number of bottom rib groups 210 the same as the number of sub-channels 271, and arranging the multiple bottom rib groups 210 and the multiple sub-channels 271 in one-to-one correspondence in the thickness direction of the bottom plate 240, each bottom rib group 210 can have a sub-channel corresponding to its position. In this way, the heat emitted by the chip belt group of the lower computing board during operation can be conducted through the bottom rib group 210 correspondingly fitted thereto. Through this path, the heat can be more quickly and directly transmitted to the corresponding sub-channel 271 to be absorbed by the coolant, thereby significantly improving the heat dissipation efficiency.

[0060] Preferably, see in particular the attached Figure 2 and 5 A plurality of top rib groups 110 are provided on the upper surface of the top plate 100 , the number of the top rib groups 110 is the same as the number of the sub-flow channels 271 , and the plurality of top rib groups 110 and the plurality of sub-flow channels 271 are arranged in one-to-one correspondence in the thickness direction of the top plate 100 .

[0061] By providing a top rib group 110 on the upper surface of the top plate 100, it is possible to facilitate accurate fitting of the top rib group 110 with the chip strip group on the lower surface of the upper computing board fitted thereto. The number of top rib groups 110 can be the same as the number of chip strip groups on the upper computing board, and if the number of top ribs in each group of top ribs is N, then the number of chip strips in each group of chip strips can also be N. When the top plate 100 is fitted to the upper computing board, the top ribs and the chip strips can be fitted one by one. By making the number of top rib groups 110 the same as the number of sub-channels 271, and arranging the multiple top rib groups 110 and the multiple sub-channels 271 in one-to-one correspondence in the thickness direction of the top plate 100, each top rib group 110 can have a sub-channel 271 corresponding to its position. In this way, the heat emitted by the chip belt group of the upper computing board during operation can be conducted through the top rib group 110 correspondingly fitted thereto. Through this path, the heat can be more quickly and directly transmitted to the corresponding sub-channel 271 to be absorbed by the coolant, thereby significantly improving the heat dissipation efficiency.

[0062] Preferably, see in particular the attached Figure 5 , each of the bottom rib group 210 and the top rib group 110 includes three ribs;

[0063] In each bottom rib group 210 and each top rib group 110 , the spacing between each two adjacent ribs is the same, and the maximum distance between the two farthest ribs is equal to the width of the sub-channel 271 corresponding to the rib group.

[0064] Taking the case where the ribs are arranged left and right as an example, in each group of ribs, the maximum distance between the two ribs that are farthest apart is usually the distance from the leftmost side of the leftmost rib to the rightmost side of the rightmost rib, and this distance defines the width of the group of ribs. By setting as above, the width of each group of ribs can be made the same as the width of the sub-channel 271 corresponding to the group of ribs, so that the coolant in the sub-channel 271 can completely flow and cover the position area corresponding to each group of ribs, thereby making the liquid cooling heat dissipation component have a more sufficient heat dissipation effect on the chip strips of the upper computing board and the lower computing board attached thereto.

[0065] Preferably, see in particular the attached Figure 3 , the number of the sub-channels 271 is 4; in each sub-channel 271 , 5 rows of heat dissipation fins 280 are arranged in the same extension direction as the sub-channel 271 .

[0066] The above arrangement can reduce the flow resistance of the coolant in the flow channel 270, and fully ensure the liquid cooling and heat dissipation effect of the computing board that fits the liquid cooling and heat dissipation component. In this case, the computing board can be provided with 3 chip strips at the corresponding positions of each sub-flow channel 271. This corresponding relationship in quantity can make the heat dissipation effect of each chip strip as uniform as possible, thereby making the temperature of each chip strip as consistent as possible.

[0067] Preferably, within each sub-channel 271 , a plurality of heat dissipation fin groups are arranged at intervals along the extension direction of the sub-channel 271 .

[0068] By arranging the heat dissipation fins 280 in each sub-channel 271 in groups and intervals, turbulence generated when the coolant flows can be effectively prevented. Turbulence often leads to the generation of bubbles. The utility model can significantly avoid the reduction in heat dissipation efficiency caused by bubbles through the above arrangement.

[0069] Preferably, see in particular the attached Figure 1-4 At least one set of positioning structures is provided between the upper surface of the side wall 250 and the top plate 100 to accurately position the top plate at a corresponding position on the upper surface of the side wall;

[0070] The positioning structure includes two positioning protrusions 220 located on the upper surface of the side wall and two positioning grooves 120 located at corresponding positions of the top plate.

[0071] Considering the requirement of quick assembly of the top plate 100, the utility model provides a positioning structure between the upper surface of the side wall 250 of the bottom shell 200 and the top plate 100, so as to quickly and accurately position and install the top plate 100 at the corresponding position on the bottom shell 200. The positioning structure includes two positioning protrusions 220 located on the upper surface of the side wall 250 and two positioning grooves 120 located at the corresponding position of the top plate, which can achieve a good positioning effect in a simple structural form and is also very convenient for production and manufacturing.

[0072] Preferably, see in particular the attached Figure 3 The bottom plate 240 is in the shape of a long strip, the side wall 250 includes two short side sub-side walls and two long side sub-side walls, and the two positioning protrusions 220 are both located on the upper surface of the same short side sub-side wall.

[0073] At this time, it is obvious that the two positioning grooves 120 corresponding to the two positioning protrusions 220 are also located on the same short side of the top plate 100, which can facilitate the manufacture of the two positioning grooves 120 and the two positioning protrusions 220, and also facilitate the quick installation of the top plate 100, because it is only necessary to align the sides where the two positioning grooves 120 of the top plate 100 are located with the side wall of the bottom shell 200 where the two positioning protrusions 220 are provided, so as to complete the overall positioning of the top plate 100.

[0074] Preferably, see in particular the attached Figure 2 and 3 , the flow channel partition wall 260 is arranged side by side with the long side sub-side wall;

[0075] The positioning structure further includes positioning posts 230 and positioning holes 130 . A positioning post 230 is disposed on the upper surface of each flow channel partition wall 260 and each long side sub-side wall, and a positioning hole 130 corresponding to the positioning post 230 is disposed on the top plate 100 .

[0076] Through the above arrangement, the positioning effect between the top plate 100 and the bottom shell 200 can be further improved, and the positioning structure completed by the positioning column 230 and the positioning hole 130 is simple in form, easy to manufacture, and also convenient for smooth assembly between the top plate and the bottom shell.

[0077] Preferably, the flow channel partition walls 260 are multiple and arranged in parallel, and the multiple sub-flow channels 271 are parallel to each other and connected in sequence.

[0078] Through the above arrangement, the coolant can be guided in parallel, and its flow direction is clear and regular. It is also convenient for the manufacture of the bottom shell 200. The arrangement of the above sub-channels 271 also makes the heat dissipation effect easier to predict, which is convenient for the design of the liquid-cooled heat dissipation component.

[0079] Preferably, the number of the chip strip groups is the same as the number of the sub-flow channels 271, and each chip strip group includes 3 chip strips;

[0080] When the liquid cooling heat dissipation assembly is used in a supercomputing server, each chip strip is fitted one-to-one with the bottom ribs on the bottom plate 240 , or is fitted one-to-one with the top ribs on the top plate 100 .

[0081] Through the above arrangement, the heat generated by the chip belt of the computing board during operation can be quickly and smoothly conducted to the inside of the liquid cooling and heat dissipation component through the bottom convex rib or the top convex rib attached thereto, and absorbed by the coolant, thereby further improving the heat dissipation efficiency of the computing board.

[0082] In a second aspect, the utility model provides a computing and liquid cooling unit, comprising a computing board and the liquid cooling assembly as described above, wherein the computing board is located on the upper surface of the top plate and / or on the lower surface of the bottom plate.

[0083] In a third aspect, the utility model provides a supercomputing server, comprising the liquid cooling and heat dissipation component as described above or the computing and liquid cooling and heat dissipation unit as described above.

[0084] Those skilled in the art will appreciate that, without conflict, the above-mentioned preferred solutions can be freely combined and superimposed.

[0085] It should be understood that the above-mentioned embodiments are merely illustrative and not restrictive. Without departing from the basic principles of the present invention, various obvious or equivalent modifications or substitutions that can be made by technicians in this field to the above details will be included in the scope of the claims of the present invention.

Claims

1. A liquid cooling and heat dissipation component, the liquid cooling and heat dissipation component is used for a supercomputing server, the supercomputing server comprises a computing board and a liquid cooling and heat dissipation component, the computing board comprises a plurality of chip band groups, characterized in that: The liquid cooling and heat dissipation assembly comprises a bottom shell (200) and a top plate (100); The bottom shell (200) comprises a bottom plate (240), a side wall (250), a flow channel partition wall (260) and heat dissipation fins (280); The side wall (250) is located on the upper surface of the bottom plate (240) and is arranged in an annular shape, and a flow channel (270) for a cooling liquid is formed in the annular shape; The number of the flow channel partition wall (260) is at least one, the flow channel partition wall (260) is located inside the side wall (250), one end of the flow channel partition wall is connected to the side wall (250), and the other end does not contact any part of the side wall, and the flow channel partition wall (260) divides the flow channel (270) into a plurality of sub-flow channels (271) that are interconnected; The number of the heat dissipation fins (280) is plural and distributed in each of the sub-flow channels (271); The bottom plate (240), the side wall (250), the flow channel partition wall (260) and the heat dissipation fins (280) are integrally formed; The top plate (100) covers the upper surface of the side wall (250) facing away from the bottom plate (240) to completely cover the flow channel (270), and a surface of each heat dissipation fin (280) facing away from the bottom plate (240) is in contact with the top plate (100); When the liquid cooling and heat dissipation component is used in a supercomputing server, the computing board is arranged on a bottom plate (240) or a top plate (100) of the liquid cooling and heat dissipation component, and the arrangement positions of the multiple groups of chip band groups on the computing board correspond to the arrangement areas of the flow channels (270) in the liquid cooling and heat dissipation component.

2. The assembly according to claim 1, characterized in that A plurality of bottom rib groups (210) are provided on the lower surface of the bottom plate (240), the number of the bottom rib groups (210) being the same as the number of the sub-flow channels (271), and the plurality of bottom rib groups (210) and the plurality of sub-flow channels (271) being arranged in a one-to-one correspondence in the thickness direction of the bottom plate (240).

3. The assembly according to claim 2, characterized in that A plurality of groups of top convex rib groups (110) are provided on the upper surface of the top plate (100), the number of the top convex rib groups (110) being the same as the number of the sub-flow channels (271), and the plurality of groups of top convex rib groups (110) and the plurality of sub-flow channels (271) being provided in a one-to-one correspondence in the thickness direction of the top plate (100).

4. The assembly according to claim 3, characterized in that Each of the bottom convex rib group (210) and the top convex rib group (110) includes three convex ribs; In each group of bottom rib groups (210) and each group of top rib groups (110), the spacing between each two adjacent ribs is the same, and the maximum distance between the two ribs farthest apart is equal to the width of the sub-channel (271) corresponding to the group of ribs.

5. The assembly according to claim 1, characterized in that The number of the sub-flow channels (271) is 4; in each sub-flow channel (271), 5 rows of heat dissipation fins (280) are arranged in the same extension direction as the sub-flow channel.

6. The assembly according to claim 1, characterized in that In each sub-channel (271), a plurality of heat dissipation fin groups are arranged at intervals along the extension direction of the sub-channel (271).

7. The assembly according to claim 1, characterized in that At least one set of positioning structures is provided between the upper surface of the side wall (250) and the top plate (100) to accurately position the top plate at a corresponding position on the upper surface of the side wall; The positioning structure comprises two positioning protrusions (220) located on the upper surface of the side wall and two positioning grooves (120) located at corresponding positions of the top plate.

8. The assembly according to claim 7, characterized in that The bottom plate (240) is in the shape of an elongated strip, the side wall (250) comprises two short side sub-side walls and two long side sub-side walls, and the two positioning protrusions (220) are both located on the upper surface of the same short side sub-side wall.

9. The assembly according to claim 8, characterized in that The flow channel partition wall (260) is arranged side by side with the long side sub-side wall; The positioning structure further comprises a positioning column (230) and a positioning hole (130); a positioning column (230) is arranged on the upper surface of each flow channel partition wall (260) and each long side sub-wall, and a positioning hole (130) corresponding to the positioning column (230) is arranged on the top plate (100).

10. The assembly according to claim 1, characterized in that The flow channel partition walls (260) are multiple and arranged in parallel, and the multiple sub-flow channels (271) are parallel to each other and connected in sequence.

11. The assembly according to claim 4, characterized in that The number of the chip strip groups is the same as the number of the sub-flow channels (271), and each chip strip group includes 3 chip strips; When the liquid cooling and heat dissipation component is used in a supercomputing server, each chip strip is fitted one-to-one with the bottom convex ribs on the bottom plate (240), or is fitted one-to-one with the top convex ribs on the top plate (100).

12. A computing and liquid cooling unit, characterized in that: It comprises a computing board and a liquid cooling and heat dissipation assembly as described in any one of claims 1 to 11, wherein the computing board is located on the upper surface of the top plate and / or on the lower surface of the bottom plate.

13. A supercomputing server, characterized in that: It comprises the liquid cooling and heat dissipation component as described in any one of claims 1 to 11 or the computing and liquid cooling and heat dissipation unit as described in claim 12.

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