VPX power supply heat dissipation structure

Abstract

The utility model provides a VPX power supply heat dissipation structure which is applied to VPX equipment comprising a VPX power supply and a processor mainboard, the heat dissipation structure comprises a heat dissipation shell used for accommodating the VPX power supply and a plurality of heat dissipation copper pipes arranged around the heat dissipation shell, a plurality of groups of heat dissipation fins are arranged on the periphery of the VPX power supply, and the heat dissipation copper pipes are arranged on the periphery of the VPX power supply. The heat dissipation structure further comprises a first heat dissipation fan and a first movable baffle which are arranged in the second direction of the processor mainboard, and the first movable baffle is arranged at the position, away from the first heat dissipation fan, of the processor mainboard and extends in the first direction so as to be matched with heat dissipation holes formed in the heat dissipation shell to dissipate heat of the VPX power supply. According to the scheme provided by the utility model, the movable baffle is arranged, so that the heat dissipation fan can simultaneously dissipate heat of the power supply and the processor, the heat dissipation structure can realize a good heat dissipation effect in a limited space, and the flowing path of air generated by the heat dissipation fan is optimized on the premise of not occupying excessive extra space; and the heat dissipation management efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation of electronic devices, and particularly relates to a heat dissipation structure for a VPX power supply. Background Art

[0002] The VPX power supply is a standard, usually referring to the power supply standard of VPX electronic devices. VPX (VITA 46) is an open standard for electronic modules, especially suitable for high-performance computing and communication applications. VPX devices usually integrate a processor motherboard and a power supply unit, and the heat generated during their operation needs to be effectively dissipated to ensure the stable operation of the devices.

[0003] Currently, the heat dissipation solutions for power supplies in VPX devices usually include heat dissipation fans and heat sinks, which are used to manage the heat of the devices through air cooling. However, the traditional heat dissipation structure has a low space utilization rate, is difficult to be effectively arranged in the limited internal space of the device, is prone to hot spot problems due to uneven heat dispersion, and lacks an intelligent thermal management system, having certain limitations. Summary of the Utility Model

[0004] In order to overcome the defects of the above-mentioned prior art, the utility model provides a heat dissipation structure for a VPX power supply, which is applied to a VPX device including a VPX power supply and a processor motherboard. The heat dissipation structure includes a heat dissipation housing for accommodating the VPX power supply and a plurality of heat dissipation copper tubes arranged around the heat dissipation housing. The top of the heat dissipation housing includes a heat dissipation surface in a undulating shape, and the heat dissipation copper tubes are embedded in the heat dissipation surface;

[0005] The heat dissipation housing further includes a detachably arranged side plate and a bottom plate for arranging the VPX power supply. A plurality of groups of heat dissipation fins are arranged around the VPX power supply. The heat dissipation fins, the heat dissipation surface and the heat dissipation copper tubes form at least one heat dissipation channel;

[0006] The heat dissipation structure further includes a plurality of first heat dissipation fans and a first movable baffle. The heat dissipation housing is arranged in a first direction of the processor motherboard, and the first heat dissipation fans are arranged in a second direction of the processor motherboard;

[0007] A plurality of heat dissipation holes are formed on both the side of the heat dissipation housing facing the processor motherboard and the side away from the processor motherboard. The first movable baffle is arranged at a position on the processor motherboard away from the first heat dissipation fans and extends along the first direction.

[0008] Furthermore, the heat dissipation structure further includes a plurality of second heat dissipation fans and a second movable baffle arranged on the top of the processor motherboard. The second movable baffle is arranged at a position on the processor motherboard close to the first heat dissipation fans and extends along the first direction.

[0009] Preferably, the second movable baffle is composed of a plurality of rotatable heat dissipation fins.

[0010] Furthermore, the heat dissipation structure further includes a first control module, a second control module, a first temperature sensor disposed on the VPX power supply, and a second temperature sensor disposed on the processor main board;

[0011] The first control module is respectively connected to the second temperature sensor, the first movable baffle, and the second heat dissipation fan;

[0012] The second control module is respectively connected to the first temperature sensor, the second temperature sensor, and the second movable baffle.

[0013] Optionally, the side plate is detachably connected to the heat dissipation housing through magnetic attraction members, buckles, and / or screws.

[0014] Preferably, the heat dissipation structure includes at least three heat dissipation copper tubes, and the heat dissipation copper tubes are arranged in parallel around the heat dissipation housing.

[0015] Preferably, the heat dissipation fins include aluminum sheets and / or copper sheets, and the surface area of the connection between the VPX power supply and the heat dissipation fins accounts for 50%-80% of the total surface area of the VPX power supply.

[0016] Optionally, the heat dissipation surface includes a wavy heat dissipation surface, a scaly heat dissipation surface, a serrated heat dissipation surface, and / or a heat dissipation surface with alternating protrusions and grooves.

[0017] Preferably, the first movable baffle is disposed on the processor main board in a liftable manner.

[0018] Optionally, the heat dissipation holes are in a long strip shape and / or a diagonal line shape, and the heat dissipation holes are arranged in parallel.

[0019] The present utility model has at least the following beneficial effects:

[0020] The heat dissipation structure proposed by the present utility model adopts a heat dissipation housing and heat dissipation copper tubes arranged around it. The design of the heat dissipation surface with undulations at the top and the heat dissipation copper tubes effectively increases the heat dissipation surface area and improves the heat dissipation efficiency. The heat dissipation channels formed by the heat dissipation fins, the heat dissipation surface, and the heat dissipation copper tubes contribute to the rapid and effective conduction and dissipation of heat, realizing the thermal management of the power supply and the processor, enhancing the control and guidance of air flow, effectively utilizing the limited space inside the device while ensuring the heat dissipation performance, improving the heat dissipation efficiency and reliability of the device, and being suitable for coping with complex working environments and high-performance requirements;

[0021] Furthermore, the solution proposed by the present utility model also uses a second cooling fan to target larger hot spots on the processor motherboard, which can increase the heat removal speed. By setting a temperature sensor and two control modules connected to the temperature sensor, precise control of the cooling system can be achieved to maximize the cooling efficiency. The second movable baffle is composed of rotatable heat sinks, and the angle and position of the heat sinks can be adjusted according to the actual situation to meet different cooling requirements. The various shapes of the heat dissipation surface can increase the heat dissipation surface area and enhance the heat exchange effect with the air in the environment.

[0022] Thus, the present utility model proposes a VPX power supply cooling structure. The solution proposed by the present utility model enables the cooling fan to simultaneously cool the power supply and the processor by setting a movable baffle, and enables the cooling structure to achieve a good cooling effect in a limited space. Without occupying too much additional space, the flow path of the cooling fan's formed air is optimized, and the efficiency of heat dissipation management is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0024] Figure 1 It is an exploded structure example diagram of the heat dissipation housing;

[0025] Figure 2 It is a schematic diagram of the working state of the cooling structure when both the power supply and the processor are at normal temperature;

[0026] Figure 3 It is a schematic diagram of the working state of the cooling structure when the power supply is at normal temperature and the processor is at high temperature;

[0027] Figure 4 It is a schematic diagram of the working state of the cooling structure when the power supply is at high temperature and the processor is at normal temperature;

[0028] Figure 5 It is a schematic diagram of the working state of the cooling structure when both the power supply and the processor are at high temperature;

[0029] Figure 6 It is a top view of the processor motherboard;

[0030] Figure 7 It is a partial module structure schematic diagram of the VPX power supply cooling structure.

[0031] REFERENCE NUMERALS

[0032] 1-VPX power supply; 2-heat dissipation housing; 3-processor main board; 4-first heat dissipation fan; 5-second heat dissipation fan; 6-first movable baffle; 7-second movable baffle; 11-heat dissipation fins; 12-first temperature sensor; 21-heat dissipation copper pipe; 22-heat dissipation surface; 23-side plate; 24-bottom plate; 25-heat dissipation holes; 31-second temperature sensor; 61-first control module; 71-heat sink; 72-second control module; 231-screw hole. Detailed implementation manners

[0033] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0034] Hereinafter, various embodiments of the present invention will be described more comprehensively. The present invention can have various embodiments, and adjustments and changes can be made therein. However, it should be understood that there is no intention to limit the various embodiments of the present invention to the specific embodiments disclosed herein, but the present invention should be understood to cover all adjustments, equivalents, and / or alternative solutions falling within the spirit and scope of the various embodiments of the present invention.

[0035] Hereinafter, the term "comprising" or "may comprise" that can be used in various embodiments of the present invention indicates the presence of the disclosed functions, operations, or elements, and does not limit the addition of one or more functions, operations, or elements. In addition, as used in various embodiments of the present invention, the terms "comprising", "having" and their cognates are only intended to indicate a specific feature, number, step, operation, element, component, or combination of the foregoing items, and should not be construed as first excluding the existence or addition of the possibility of one or more other features, numbers, steps, operations, elements, components, or combinations of the foregoing items.

[0036] In various embodiments of the present invention, the expression "or" or "at least one of A or / and B" includes any combination or all combinations of the words listed simultaneously. For example, the expression "A or B" or "at least one of A or / and B" may include A, may include B, or may include both A and B.

[0037] The expressions (such as "first", "second", etc.) used in various embodiments of the present utility model may modify various constituent elements in the various embodiments, but do not limit the corresponding constituent elements. For example, the above expressions do not limit the order and / or importance of the elements. The above expressions are only used for the purpose of distinguishing one element from other elements. For example, the first user device and the second user device indicate different user devices, although both are user devices. For example, without departing from the scope of the various embodiments of the present utility model, the first element may be referred to as the second element, and similarly, the second element may also be referred to as the first element.

[0038] It should be noted that: in the present utility model, unless otherwise clearly specified and defined, terms such as "installation", "connection", "fixation", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium; it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0039] In the present utility model, those of ordinary skill in the art need to understand that the terms indicating orientation or positional relationship in the text are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present utility model.

[0040] The terms used in the various embodiments of the present utility model are only for the purpose of describing specific embodiments and are not intended to limit the various embodiments of the present utility model. As used herein, the singular form is also intended to include the plural form unless the context clearly indicates otherwise. Unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the various embodiments of the present utility model belong. The terms (such as those defined in a general dictionary) will be interpreted as having the same meaning as the contextual meaning in the relevant technical field and will not be interpreted as having an idealized meaning or an overly formal meaning unless clearly defined in the various embodiments of the present utility model.

[0041] Embodiment 1

[0042] Please refer to Figures 1-5, in this embodiment, a VPX power supply heat dissipation structure is proposed, which is applied to a VPX device including a VPX power supply 1 and a processor motherboard 3. The heat dissipation structure includes a heat dissipation housing 2 for accommodating the VPX power supply 1 and several heat dissipation copper tubes 21 arranged around the heat dissipation housing 2. The top of the heat dissipation housing 2 includes a heat dissipation surface 22 in a undulating shape, and the heat dissipation copper tubes 21 are embedded in the heat dissipation surface 22; preferably, the heat dissipation structure includes at least three heat dissipation copper tubes 21, and each of the heat dissipation copper tubes 21 is arranged parallel to the heat dissipation housing 2. In actual application, users can determine the number of heat dissipation copper tubes 21 in the heat dissipation structure according to the heat dissipation requirements;

[0043] The heat dissipation housing 2 further includes a detachable side plate 23 and a bottom plate 24 for setting the VPX power supply 1. Several groups of heat dissipation fins 11 are arranged around the VPX power supply 1. The heat dissipation fins 11, the heat dissipation surface 22 and the heat dissipation copper tubes 21 form at least one heat dissipation channel;

[0044] Specifically, the heat dissipation structure further includes several first heat dissipation fans 4 and a first movable baffle 6. The heat dissipation housing 2 is arranged in a first direction of the processor motherboard 3, the first heat dissipation fans 4 are arranged in a second direction of the processor motherboard 3. A plurality of heat dissipation holes 25 are opened on both the side of the heat dissipation housing 2 facing the processor motherboard 3 and the side away from the processor motherboard 3. The first movable baffle 6 is arranged at a position on the processor motherboard 3 away from the first heat dissipation fans 4 and extends along the first direction. Thus, the first heat dissipation fans 4 can simultaneously dissipate heat from both the processor motherboard 3 and the VPX power supply 1 through the first movable baffle 6;

[0045] Optionally, the heat dissipation holes 25 are in a long strip shape and / or a diagonal shape and each of the heat dissipation holes 25 is arranged in parallel, so as to ensure that the heat dissipation wind formed by the heat dissipation fans can evenly pass through the inside of the heat dissipation housing 2 to dissipate heat from the VPX power supply 1.

[0046] In this embodiment, the heat dissipation structure includes a plurality of first heat dissipation fans 4 arranged side by side, and the distances between adjacent first heat dissipation fans 4 are the same to ensure that the generated heat dissipation wind is relatively uniform.

[0047] Optionally, the side plate 23 is detachably connected to the heat dissipation housing 2 through a magnetic part, a buckle and / or a screw. In this embodiment, screw holes 231 are provided on the side plate 23 so that the side plate 23 can be detachably connected to the heat dissipation housing 2 through screws.

[0048] Preferably, the heat dissipation fins 11 include aluminum sheets and / or copper sheets. Both aluminum sheets and copper sheets have good thermal conductivity and can effectively transfer heat from the VPX power supply 1 to the heat dissipation surface. Further, the surface area of the VPX power supply 1 connected to the heat dissipation fins 11 accounts for 50%-80% of the total surface area of the VPX power supply 1 to maximize the heat dissipation effect of the heat dissipation fins 11 on the VPX power supply 1 and avoid local overheating.

[0049] Optionally, the heat dissipation surface 22 includes a wavy heat dissipation surface, a scaly heat dissipation surface, a serrated heat dissipation surface, and / or a heat dissipation surface with alternating protrusions and grooves. The case where the heat dissipation surface 22 includes a serrated heat dissipation surface is shown in the accompanying drawings of the specification. Figures 1-5 It should be noted that the processor motherboard 3 is used to install a processor. The processor can be connected to the circuit on the processor motherboard 3 through a socket, and the circuit can enable communication between the processor and other components on the processor motherboard 3.

[0050] Specifically, the included angle between the first direction and the second direction is not less than 90°, so that the heat dissipation air generated by the first heat dissipation fan 4 can extend towards the heat dissipation housing 2 through the first movable baffle 6 after acting on the processor motherboard 3. In this embodiment, the first movable baffle 6 is disposed on the processor motherboard 3 in a liftable manner.

[0051] Optionally, the VPX devices to which the VPX power supply heat dissipation structure proposed in this embodiment can be applied include, but are not limited to, VPX computers, rack-mounted servers, or space application devices.

[0052] Furthermore, please refer to

[0053] , the VPX power supply heat dissipation structure further includes a plurality of second heat dissipation fans 5. The second heat dissipation fans 5 are disposed on the top of the processor motherboard 3 to ensure heat dissipation of the processor when the temperature of the processor is relatively high. Figure 6

[0054] Preferably, the VPX power supply heat dissipation structure further includes a first temperature sensor 12 disposed on the VPX power supply 1 and a second temperature sensor 31 disposed on the processor motherboard 3.

[0055] Figure 7 Furthermore, the VPX power supply heat dissipation structure further includes a second movable baffle 7. The second movable baffle 7 is disposed on the processor motherboard 3 near the first heat dissipation fan 4 and extends along the first direction, so that the first heat dissipation fan 4 can also dissipate heat from the VPX power supply 1 through the second movable baffle 7. Refer to , the VPX power supply heat dissipation structure further includes:

[0056] A first control module 61, the first control module 61 is respectively connected to the second temperature sensor 31, the first movable baffle 6, and the second heat dissipation fans 5; the first control module 61 can be used to adjust the lifting of the first movable baffle 6, the on / off and working power of the second heat dissipation fans 5;

[0057] A second control module 72, the second control module 72 is respectively connected to the first temperature sensor 12, the second temperature sensor 31, and the second movable baffle 7; the second control module 72 can be used to adjust the rotation of each heat dissipation fin 71 in the second movable baffle 7.

[0058] Preferably, the second movable baffle 7 is composed of a plurality of rotatable heat dissipation fins 71. By forming the second movable baffle 7 with the heat dissipation fins 71, the heat dissipation area can be effectively increased and the heat dissipation effect can be improved, and the heat dissipation structure proposed in this embodiment can adjust the heat dissipation efficiency by changing the angles of the heat dissipation fins 71.

[0059] In a specific embodiment, if the first control module 61 confirms through the second temperature sensor 31 that the temperature of the processor does not exceed the preset second temperature value, the second fan is turned off and the first movable baffle 6 is raised;

[0060] If the first control module 61 confirms through the second temperature sensor 31 that the temperature of the processor exceeds the preset second temperature value, the second fan is turned on and the first movable baffle 6 is lowered;

[0061] If the second control module 72 confirms through the first temperature sensor 12 that the temperature of the VPX power supply 1 does not exceed the preset first temperature value, and confirms through the second temperature sensor 31 that the temperature of the processor does not exceed the preset second temperature value, all the heat dissipation fins 71 forming the second movable baffle 7 are rotated to be parallel to the air outlet direction directly facing the first heat dissipation fan 4;

[0062] If the second control module 72 confirms through the first temperature sensor 12 that the temperature of the VPX power supply 1 does not exceed the preset first temperature value, and confirms through the second temperature sensor 31 that the temperature of the processor exceeds the preset second temperature value, the heat dissipation fins 71 forming the second movable baffle 7 are rotated by a preset angle in the first direction; it should be noted that the preset angle of rotation of the heat dissipation fins 71 can be determined based on the temperature of the VPX power supply 1 and the temperature of the processor motherboard 3;

[0063] If the second control module 72 confirms through the first temperature sensor 12 that the temperature of the VPX power supply 1 exceeds the preset first temperature value, and confirms through the second temperature sensor 31 that the temperature of the processor does not exceed the preset second temperature value, the heat dissipation fins 71 forming the second movable baffle 7 are rotated by a preset angle in the first direction;

[0064] If the second control module 72 confirms through the first temperature sensor 12 that the temperature of the VPX power supply 1 exceeds the preset first temperature value, and confirms through the second temperature sensor 31 that the temperature of the processor exceeds the preset second temperature value, all the heat dissipation fins 71 forming the second movable baffle 7 are kept in the direction extending in the first direction.

[0065] Thus, please refer to Figure 2, when the temperature of the VPX power supply 1 does not exceed the preset first temperature value and the temperature of the processor does not exceed the preset second temperature value, the second fan is in the off state, the first movable baffle 6 rises, and all the heat sinks 71 of the second movable baffle 7 rotate to be parallel to the air outlet direction directly facing the first cooling fan 4. At this time, the VPX device can simultaneously dissipate heat from the VPX power supply 1 and the processor through the first fan, the first movable baffle 6, and the heat sinks 71 parallel to the air outlet direction directly facing the first cooling fan 4;

[0066] Please refer to Figure 3 , when the temperature of the VPX power supply 1 does not exceed the preset first temperature value and the temperature of the processor exceeds the preset second temperature value, the second fan is in the on state, the first movable baffle 6 descends, and the heat sinks 71 forming the second movable baffle 7 rotate a preset angle in the first direction. At this time, the VPX device can dissipate heat from the VPX power supply 1 through the first fan and the heat sinks 71 maintaining the direction extending in the first direction, and can jointly dissipate heat from the processor through the first fan, the second fan, and the heat sinks 71 parallel to the air outlet direction directly facing the first cooling fan 4;

[0067] Please refer to Figure 4 , when the temperature of the VPX power supply 1 exceeds the preset first temperature value and the temperature of the processor does not exceed the preset second temperature value, the second fan is in the off state, the first movable baffle 6 rises, and the heat sinks 71 forming the second movable baffle 7 rotate a preset angle in the first direction. At this time, the VPX device can simultaneously dissipate heat from the VPX power supply 1 and the processor through the first fan, the first movable baffle 6, and the heat sinks 71;

[0068] Please refer to Figure 5 , when the temperature of the VPX power supply 1 exceeds the preset first temperature value and the temperature of the processor exceeds the preset second temperature value, the second fan is in the on state, the first movable baffle 6 descends, and all the heat sinks 71 forming the second movable baffle 7 maintain the direction extending in the first direction. At this time, the VPX device can dissipate heat from the VPX power supply 1 through the first fan and the second baffle, and can dissipate heat from the processor through the second fan.

[0069] Through the above settings, the VPX power supply heat dissipation structure proposed in this embodiment can realize intelligent thermal management of the power supply and the processor through the first control module 61 and the second control module 72.

[0070] It should be noted that the VPX power supply heat dissipation structure proposed in this embodiment can be used together with other heat dissipation devices already disclosed in the prior art to achieve a better heat dissipation effect. By combining the heat dissipation structure proposed in this embodiment with existing heat dissipation devices such as heat pipe technology or thermal management mechanisms, the heat transfer management and heat dissipation ability of the VPX power supply can be further improved.

[0071] In summary, the present utility model proposes a VPX power supply heat dissipation structure. The solution proposed by the present utility model enables the cooling fan to simultaneously dissipate heat from both the power supply and the processor by setting up a movable baffle, and enables the heat dissipation structure to achieve a good heat dissipation effect within a limited space. Without occupying too much additional space, the flow path of the air formed by the cooling fan is optimized, and the efficiency of heat dissipation management is improved.

[0072] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A VPX power supply heat dissipation structure, characterized in that: Applied to a VPX device including a VPX power supply and a processor motherboard, the heat dissipation structure includes a heat dissipation housing for accommodating the VPX power supply and a plurality of heat dissipation copper tubes arranged around the heat dissipation housing, the top of the heat dissipation housing includes an undulating heat dissipation surface, and the heat dissipation copper tubes are embedded in the heat dissipation surface; The heat dissipation housing further comprises a detachable side plate and a bottom plate for setting the VPX power supply, a plurality of groups of heat dissipation fins are arranged around the VPX power supply, and the heat dissipation fins, the heat dissipation surface and the heat dissipation copper tube form at least one heat dissipation channel; The heat dissipation structure further includes a plurality of first heat dissipation fans and a first movable baffle, the heat dissipation housing is arranged in a first direction of the processor mainboard, and the first heat dissipation fan is arranged in a second direction of the processor mainboard; A plurality of heat dissipation holes are provided on a side of the heat dissipation housing facing the processor mainboard and a side of the heat dissipation housing away from the processor mainboard. The first movable baffle is arranged on the processor mainboard at a position away from the first heat dissipation fan and extends along the first direction.

2. The VPX power supply heat dissipation structure according to claim 1, characterized in that: The invention also includes a plurality of second cooling fans and a second movable baffle plate arranged on the top of the processor mainboard. The second movable baffle plate is arranged on the processor mainboard at a position close to the first cooling fan and extends along the first direction.

3. The VPX power supply heat dissipation structure according to claim 2, characterized in that: The second movable baffle is composed of a plurality of rotatable heat sinks.

4. The VPX power supply heat dissipation structure according to claim 2, characterized in that: Also includes a first control module, a second control module, a first temperature sensor disposed on the VPX power supply, and a second temperature sensor disposed on the processor motherboard; The first control module is respectively connected to the second temperature sensor, the first movable baffle and the second cooling fan; The second control module is respectively connected to the first temperature sensor, the second temperature sensor and the second movable baffle.

5. The VPX power supply heat dissipation structure according to claim 1, characterized in that: The side plate is detachably connected to the heat dissipation housing via magnetic elements, buckles and / or screws.

6. The VPX power supply heat dissipation structure according to claim 1, characterized in that: The heat dissipation structure includes at least three heat dissipation copper tubes, and each of the heat dissipation copper tubes is arranged in parallel around the heat dissipation housing.

7. The VPX power supply heat dissipation structure according to claim 1, characterized in that: The heat sink fins include aluminum sheets and / or copper sheets, and the surface area of ​​the VPX power supply connected to the heat sink fins accounts for 50%-80% of the total surface area of ​​the VPX power supply.

8. The VPX power supply heat dissipation structure according to claim 1, characterized in that: The heat dissipation surface includes a wavy heat dissipation surface, a scaly heat dissipation surface, a serrated heat dissipation surface, and / or a heat dissipation surface with protrusions and grooves interlaced.

9. The VPX power supply heat dissipation structure according to claim 1, characterized in that: The first movable baffle is movably disposed on the processor mainboard.

10. The VPX power supply heat dissipation structure according to claim 1, characterized in that: The heat dissipation holes are in the shape of long strips and / or oblique lines, and the heat dissipation holes are arranged in parallel.

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