Chip mounting mechanism for integrated circuit processing

Abstract

The utility model discloses a chip mounting mechanism for integrated circuit processing, which comprises a fixing assembly and a positioning assembly, the fixing assembly comprises a placing moving plate, an electric telescopic rod, a clamping block, a protective rubber strip, a telescopic shaft, a spring piece and a shaft groove, and two side walls of the placing moving plate are respectively connected with two groups of conveying structures through connecting blocks; the inner walls of the two side plates of the top of the placing moving plate are connected with clamping blocks through a plurality of electric telescopic rods correspondingly, and protective rubber strips are installed in grooves formed in one sides of the clamping blocks. A plurality of telescopic shafts are fixed on the side wall, in the groove of the clamping block, of the protective rubber strip, and each telescopic shaft penetrates to the outside through a shaft groove formed in the clamping block; the surface wall of the telescopic shaft between the clamping block and the protective rubber strip is sleeved with a spring piece; according to the chip mounting mechanism, through cooperative arrangement of the protective rubber strip, the telescopic shaft and the spring piece on the fixing assembly, a circuit board without chip mounting can be effectively protected and buffered, and the phenomenon that the edge of a board of the circuit board is damaged is avoided.

Description

Technical Field

[0001] The utility model belongs to the technical field of integrated circuit processing equipment, and particularly relates to a chip mounting mechanism for integrated circuit processing. Background Art

[0002] An integrated circuit is a circuit with specific functions formed by integrating a certain number of common electronic components, such as resistors, capacitors, transistors, etc., and the connections between these components through semiconductor processes. It is a new type of semiconductor device. It is manufactured through semiconductor manufacturing processes such as oxidation, photolithography, diffusion, epitaxy, and aluminum evaporation. All the semiconductors, resistors, capacitors, etc. required to form a circuit with certain functions and the connecting wires between them are integrated on a small silicon chip, and then welded and encapsulated in a tube shell. When integrated circuits are processed and produced, with the rapid development of technology, chip mounters have replaced manual chip mounting, and the chip mounting mechanism components are an essential part of the chip mounter.

[0003] When an integrated circuit board is processed, when the chip mounting mechanism fixes and conveys the unmounted circuit board, it needs to clamp it. However, there are mostly no buffer components when the clamping block contacts the circuit board. When the clamping block clamps the circuit board, it will generate a large stress, resulting in the problem of damaging the circuit board material when the clamping block clamps the circuit board.

[0004] At the same time, the docking method of the pick-up head in the suction gun is mostly completed through threads. However, the pick-up head is a wear-prone part and needs to be replaced frequently. When disassembling and installing, if thread misalignment occurs, it will cause docking deviation, resulting in a decrease in the airtightness of this suction gun, affecting material picking, and may also occur thread misalignment and damage phenomena, leading to the problem of reducing the service life of the pick-up head. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a chip mounting mechanism for integrated circuit processing to solve the problems raised in the above background art.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A chip mounting mechanism for integrated circuit processing, including,

[0007] A frame, on the inner walls of the two side plates at the top of which there are installed opposite conveying structures;

[0008] A fixing component, which includes a placement moving plate, an electric telescopic rod, a clamping block, a protective rubber strip, a telescopic shaft, a spring piece, and a shaft groove. The two side walls of the placement moving plate are respectively connected to two groups of conveying structures through connecting blocks;

[0009] On the inner walls of the two side plates at the top of the placement moving plate, the clamping blocks are respectively connected through a plurality of electric telescopic rods, and a protective rubber strip is installed in the groove opened on one side of the clamping block;

[0010] A plurality of telescopic shafts are fixed on the side wall of the clamping block groove of the protective rubber strip, and each telescopic shaft penetrates to the outside through a shaft groove opened in the clamping block;

[0011] A spring piece is sleeved on the outer wall of the telescopic shaft between the clamping block and the protective rubber strip;

[0012] Preferably, an outer frame is arranged above the middle end of the frame, and an electric slideway capable of translating is transversely installed on the outer frame;

[0013] The bottom of the electric slideway is provided with a lifting assembly through an electric slider, and the electric slideway and the electric slider are matching components;

[0014] Preferably, the lifting assembly includes a lifting frame, a rack bar, a gear and a suction gun. The lifting frame is fixedly connected to the bottom wall of the electric slider; a gear is arranged inside the lifting frame, and two rack bars are respectively meshed on both sides of the gear; a suction gun is fixedly connected to the bottom wall of each rack bar;

[0015] Preferably, a disassembly and assembly component is arranged in the groove at the bottom of the suction gun. The disassembly and assembly component includes a sealing ring, a docking head, a metal sheet, a magnetic block and a material taking head. The material taking head is embedded in the groove at the bottom of the suction gun, and the material taking head and the magnetic block are in a docking structure;

[0016] Preferably, a circular magnetic block is fixed on the top wall of the material taking head; a metal sheet is fixed on the top wall of the groove at the bottom of the suction gun, and the metal sheet is circular and is in a magnetic adsorption structure with the magnetic block;

[0017] Preferably, a docking head is arranged at the middle position of the top of the material taking head, and the docking head is clamped with the bottom end of the air pipe in the suction gun; a sealing ring is embedded on the outer wall of the docking head and is filled between the inner walls of the docking head and the air pipe;

[0018] Preferably, the air pipe is arranged in the suction gun, and the bottom end of the air pipe is communicated with the groove at the bottom end of the suction gun;

[0019] The technical effects and advantages of the present utility model: For this patch mechanism, through the combined setting of the protective rubber strip, telescopic shaft and spring piece on the fixing component, it can effectively protect and buffer the unpatched circuit board, and avoid the phenomenon of damage to the edge of the circuit board plate;

[0020] It also utilizes the setting of the disassembly and assembly structure to change the docking method of the material taking head in the suction gun, changing the ordinary threaded docking to plug-in clamping docking. Furthermore, it avoids the phenomenon of docking deviation during threaded docking. And the plug-in clamping docking is more convenient than the threaded docking. There is no need to rotate the material taking head for multiple circles, only the plugging and unplugging steps are required, saving labor and time costs. Brief Description of the Drawings

[0021] Figure 1 It is a top view schematic diagram of the present utility model;

[0022] Figure 2 It is an installation schematic diagram of the electric slideway of the present utility model;

[0023] Figure 3 For the present utility model Figure 1 An enlarged schematic diagram at position A in it;

[0024] Figure 4 It is a front view sectional schematic diagram of the disassembly and assembly structure of the present utility model;

[0025] Figure 5 It is a front view sectional schematic diagram of the lifting assembly of the present utility model;

[0026] Figure 6 It is a top view sectional schematic diagram of the clamping block of the present utility model.

[0027] In the figure: 1, frame; 2, outer frame; 3, lifting assembly; 31, lifting frame; 32, rack bar; 33, gear; 34, suction gun; 4, electric slideway; 41, electric slider; 5, fixing assembly; 51, placing moving plate; 52, electric telescopic rod; 53, clamping block; 54, protective rubber strip; 55, telescopic shaft; 56, spring piece; 57, shaft groove; 6, conveying structure; 7, disassembly and assembly component; 71, sealing ring; 72, docking head; 73, metal sheet; 74, magnetic block; 75, picking head; 8, side rail; 9, servo motor; 10, threaded rod; 11, moving block. Detailed Description of the Preferred Embodiment

[0028] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0029] The present utility model provides a chip mounting mechanism for integrated circuit processing as shown in Figure 1 , Figure 3 and Figure 6 , which includes

[0030] A frame 1, on the inner walls of the two side plates at the top of which there are installed opposite conveying structures 6;

[0031] The fixing assembly 5 includes a placement plate 51, an electric telescopic rod 52, a clamping block 53, a protective rubber strip 54, a telescopic shaft 55, a spring sheet 56 and an axis groove 57. Both side walls of the placement plate 51 are connected to the two sets of conveying structures 6 through connecting blocks;

[0032] The inner walls of the two side plates on the top of the transfer plate 51 are connected to the clamping block 53 through multiple electric telescopic rods 52, and a protective rubber strip 54 is installed in the groove opened on one side of the clamping block 53;

[0033] The protective rubber strip 54 is fixed with a plurality of telescopic shafts 55 on the side wall of the groove in the clamping block 53, and each telescopic shaft 55 passes through a shaft groove 57 opened in the clamping block 53 to the outside;

[0034] A spring sheet 56 is sleeved on the surface wall of the telescopic shaft 55 between the clamping block 53 and the protective rubber strip 54;

[0035] Specifically, the external mechanical arm places the unmounted integrated circuit board on the placement and transfer plate 51, and then the electric telescopic rod 52 drives the clamping block 53 to extend and retract, thereby clamping the unmounted circuit board to fix its position;

[0036] Furthermore, when the clamping block 53 clamps the unmounted integrated circuit board, the protective rubber strip 54 will contact the edge of the circuit board instead of the clamping block 53, and cause the protective rubber strip 54 to move in the groove on one side of the clamping block 53, so that the telescopic shaft 55 is telescoped in the shaft groove 57, and the spring sheet 56 is deformed and compressed, providing the unmounted circuit board with a pre-set clamping force, so as to prevent the unmounted circuit board from being skewed when placed on the placement shift plate 51, resulting in the phenomenon of positional displacement of the unmounted circuit board after clamping; and the protective rubber strip 54 is made of rubber, and thus has a certain elastic potential energy, which can protect the integrated circuit board when it is clamped;

[0037] like Figure 1 , Figure 2 and Figure 5 As shown in the figure, an outer frame 2 is arranged above the middle end of the frame 1, and an electric slide 4 capable of translation is installed transversely on the outer frame 2;

[0038] Wherein, side rails 8 are fixed on the inner walls of both sides of the outer frame 2, and a servo motor 9 is installed at one end of the top of the two side rails 8, and the output shaft of the servo motor 9 is connected to the threaded rod 10 at the top of the side rail 8 to provide power therefor;

[0039] The electric slide 4 is provided with moving blocks 11 on both transverse end walls, and the two moving blocks 11 are respectively sleeved on the threaded rods 10;

[0040] The threaded rod 10 and the moving block 11 cooperate with each other and are threadedly connected therebetween;

[0041] Specifically, turn on the servo motor 9 to drive the threaded rod 10 to rotate. At the same time, the moving block 11 moves on the surface of the threaded rod 10 through the thread, and the rotation direction of the threaded rod 10 can determine the moving direction of the moving block 11. When the moving block 11 is moving, it can drive the electric slideway 4 to move on the Y-axis;

[0042] The bottom of the electric slideway 4 is installed with a lifting component 3 through an electric slider 41, and the electric slideway 4 and the electric slider 41 are mating components;

[0043] Furthermore, the electric slider 41 moves on the surface of the electric slideway 4 in the X-axis direction through its own function, and thus the electric slider 41 drives the lifting frame 31 at the bottom to move in the X-axis direction;

[0044] The lifting component 3 includes a lifting frame 31, a rack bar 32, a gear 33 and a suction gun 34. The lifting frame 31 is fixedly connected to the bottom wall of the electric slider 41; a gear 33 is arranged inside the lifting frame 31, and two rack bars 32 are respectively engaged on both sides of the gear 33; a suction gun 34 is fixedly connected to the bottom wall of each rack bar 32;

[0045] A motor is installed on the outer wall of the lifting frame 31, and the output shaft of the motor penetrates into the inside of the lifting frame 31 and is connected to the gear 33;

[0046] Specifically, the motor on the outer wall of the lifting frame 31 starts, causing the gear 33 to rotate. Then, the rack bars 32 on both sides of the gear 33 make lifting movements through meshing with the teeth of the gear 33. This movement is the Z-axis movement. Thus, the lifting rack bar 32 can drive the suction gun 34 to make lifting movements, and the suction gun 34 is connected to an external air pump through an air pipe, enabling the suction gun 34 to have the functions of picking up and discharging materials;

[0047] As Figure 4 and Figure 5 shown in, a disassembly and assembly component 7 is arranged in the groove at the bottom of the suction gun 34. The disassembly and assembly component 7 includes a sealing ring 71, a docking head 72, a metal sheet 73, a magnetic block 74 and a material taking head 75. The material taking head 75 is embedded in the groove at the bottom of the suction gun 34, and the material taking head 75 and the magnetic block 74 are in a docking structure; a circular magnetic block 74 is fixed on the top wall of the material taking head 75; a metal sheet 73 is fixed on the top wall of the groove at the bottom of the suction gun 34, and the metal sheet 73 is circular and has a magnetic adsorption structure with the magnetic block 74;

[0048] Among them, a docking head 72 is arranged at the middle position of the top of the material taking head 75, and the docking head 72 is clamped with the bottom end of the air pipe in the suction gun 34; a sealing ring 71 is embedded on the surface wall of the docking head 72 and is filled between the inner walls of the docking head 72 and the air pipe; the air pipe is arranged in the suction gun 34, and the bottom end of the air pipe is communicated with the groove at the bottom end of the suction gun 34;

[0049] Specifically, when the material taking head 75 needs to be replaced, just pull the material taking head 75 so that the magnetic block 74 and the metal sheet 73 are separated from the trachea of the joint 72 at the same time. Then the material taking head 75 leaves the groove at the bottom of the material suction gun 34, completing the disassembly;

[0050] Furthermore, align the material taking head 75 with the groove at the bottom of the material suction gun 34 and insert it. At the same time, the magnetic block 74 contacts the metal sheet 73. The position of the material taking head 75 is fixed by the magnetic adsorption of the magnetic block 74 and the metal sheet 73. Immediately afterwards, the joint 72 is inserted into the bottom of the internal trachea of the material suction gun 34 to achieve docking and connection. The sealing ring 71 on the surface of the joint 72 seals the connection between the sealing ring 71 and the trachea, avoiding air leakage. Thus, the installation of the material taking head 75 is realized;

[0051] Working principle: First, install this mechanism into a suitable chip mounter. Put the integrated circuit board onto the fixing component 5 through an external mechanical device. Then the conveying structure 6 drives the fixing component 5 to move inside the outer frame 2;

[0052] Secondly, through the Y-axis movement of the electric slideway 4, the X-axis movement of the electric slider 41, and the Z-axis movement of the rack bar 32, drive the material suction gun 34 to move to a suitable position for the material taking and placing processes;

[0053] Finally, the circuit board in the fixing component 5 is discharged by driving through the conveying structure 6.

[0054] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application.

[0055] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A chip placement mechanism for integrated circuit processing, characterized in that: include, The frame (1) has a conveying structure (6) mounted on the inner walls of the top two side panels; A fixing assembly (5), comprising a placement and transfer plate (51), an electric telescopic rod (52), a clamping block (53), a protective rubber strip (54), a telescopic shaft (55), a spring sheet (56) and an axis groove (57), and both side walls of the placement and transfer plate (51) are respectively connected to the two groups of conveying structures (6) through connecting blocks; The inner walls of the two side plates on the top of the placement and transfer plate (51) are connected to the clamping block (53) through a plurality of electric telescopic rods (52), and a protective rubber strip (54) is installed in a groove opened on one side of the clamping block (53); The protective rubber strip (54) has a plurality of telescopic shafts (55) fixed on the side wall of the groove in the clamping block (53), and each telescopic shaft (55) passes through a shaft groove (57) provided in the clamping block (53) to the outside; A spring sheet (56) is sleeved on the surface wall of the telescopic shaft (55) between the clamping block (53) and the protective rubber strip (54).

2. The chip placement mechanism for integrated circuit processing according to claim 1, characterized in that: An outer frame (2) is arranged above the middle end of the frame (1), and an electric slideway (4) capable of translation is installed transversely on the outer frame (2); A lifting assembly (3) is installed at the bottom of the electric slideway (4) via an electric slider (41), and the electric slideway (4) and the electric slider (41) are matching components.

3. The chip placement mechanism for integrated circuit processing according to claim 2, characterized in that: The lifting assembly (3) comprises a lifting frame (31), a rack rod (32), a gear (33) and a suction gun (34); the lifting frame (31) is fixedly connected to the bottom wall of the electric slider (41); a gear (33) is arranged inside the lifting frame (31), and two rack rods (32) are respectively meshed on both sides of the gear (33); and a suction gun (34) is fixedly connected to the bottom wall of each rack rod (32).

4. The chip placement mechanism for integrated circuit processing according to claim 3, characterized in that: A disassembly assembly (7) is arranged in the groove at the bottom of the suction gun (34), and the disassembly assembly (7) comprises a sealing ring (71), a docking joint (72), a metal sheet (73), a magnet block (74) and a material taking head (75). The material taking head (75) is embedded in the groove at the bottom of the suction gun (34), and the material taking head (75) and the magnet block (74) form a docking structure.

5. The chip placement mechanism for integrated circuit processing according to claim 4, characterized in that: A circular magnet block (74) is fixed on the top wall of the material taking head (75); a metal sheet (73) is fixed on the top wall of the bottom groove of the material suction gun (34), and the metal sheet (73) is circular and forms a magnetic adsorption structure with the magnet block (74).

6. The chip placement mechanism for integrated circuit processing according to claim 4, characterized in that: A docking joint (72) is provided at the middle position of the top of the material taking head (75), and the docking joint (72) is engaged with the bottom end of the air pipe in the material suction gun (34); a sealing ring (71) is embedded on the surface wall of the docking joint (72) and filled between the docking joint (72) and the inner wall of the air pipe.

7. The chip placement mechanism for integrated circuit processing according to claim 6, characterized in that: The air pipe is arranged in the suction gun (34), and the bottom end of the air pipe is connected to the groove at the bottom end of the suction gun (34).

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