Silicon wafer clamping mechanism

Abstract

The utility model discloses a silicon wafer clamping mechanism which comprises a positioning base, a servo motor, a connecting rod and a release clamp, a driving end of the servo motor is vertically and upwards connected with a rotating ring, one end of the connecting rod is hinged with the rotating ring, the other end of the connecting rod is hinged with the inner side of the release clamp, and a sliding support plate is fixed on the periphery of the positioning base. An arc-shaped groove is formed in the sliding supporting plate, a movable shaft is installed on the release clamp, the end of the movable shaft slides in the arc-shaped groove, and a clamping rotating wheel is installed on the release clamp. The silicon wafer clamping mechanism is used for carrying out centering treatment on the position of the silicon wafer, full preparation is made for subsequent probe connection and laser-induced passivation, the passivation precision is improved, and defective products are effectively reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer production, in particular to a silicon wafer clamping mechanism. Background Art

[0002] Due to the defects and surface activity of the material surface, solar silicon wafers are prone to adsorbing and reacting with external gases and water vapor, resulting in unstable surface life of photovoltaic cells, thereby affecting the photoelectric conversion efficiency. For crystalline silicon solar cells, the bulk carrier lifetime of the substrate silicon wafers has been continuously improved and is no longer the key factor restricting the improvement of cell efficiency. Instead, the influence of the grid line passivation on the cell surface on the conversion efficiency is becoming more and more obvious. The thinning of silicon wafers is an inevitable trend, and the resulting problem is serious surface recombination of the cells. Therefore, it is necessary to perform surface passivation on the grid lines on the silicon wafers. However, the existing silicon wafer tracks have inaccurate positioning of the front, back, left, and right positions of the silicon wafers, resulting in a decrease in the accuracy of subsequent probe connection and laser passivation, and generating defective products. Summary of the Utility Model

[0003] An object of the utility model is to provide a silicon wafer clamping mechanism, which drives the release clips around to move closer to the middle by a motor to center the silicon wafer, facilitating subsequent passivation processes.

[0004] To achieve this purpose, the utility model adopts the following technical solutions:

[0005] A silicon wafer clamping mechanism includes a positioning base, a servo motor, a connecting rod, and release clips. The driving end of the servo motor is vertically upward connected with a rotating ring. One end of the connecting rod is hinged to the rotating ring, and the other end of the connecting rod is hinged to the inner side of the release clip. Sliding support plates are fixed on the periphery of the positioning base. An arc-shaped groove is provided on the sliding support plates. A movable shaft is installed on the release clip, and the end of the movable shaft slides in the arc-shaped groove. A clamping runner is installed on the release clip.

[0006] As a preferred technical solution, a clamping guiding slide rail is fixed on the positioning base, and a clamping guiding slider is fixed at the lower end of the release clip. The clamping guiding slider slides on the clamping guiding slide rail.

[0007] As a preferred technical solution, a positioning mounting rod is provided at the upper end of the release clip. The clamping runners are distributed on the positioning mounting rod. A positioning groove and a positioning screw are installed on the positioning mounting rod. The positioning screw passes through the positioning groove and is locked on the release clip.

[0008] As a preferred technical solution, a scale is provided on the side of the release clip, and the lower end of the positioning mounting rod and the scale indicate the position of the positioning mounting rod.

[0009] As a preferred technical solution, a bearing is installed at the end of the movable shaft, and the bearing rolls in the arc-shaped groove.

[0010] As a preferred technical solution, a temporary storage track is fixed to the upper end of the positioning base.

[0011] The beneficial effects of the present utility model are as follows: A wafer clamping mechanism is provided. This wafer clamping mechanism is used to center the position of the wafer, making full preparations for subsequent probe connection and laser-induced passivation, improving the accuracy of passivation, and effectively reducing the generation of defective products. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The present utility model will be further described in detail below with reference to the drawings and embodiments.

[0013] Figure 1 It is a schematic diagram of the overall structure of a wafer clamping mechanism described in the embodiment.

[0014] Figure 1 In the figure:

[0015] 1, positioning base; 2, servo motor; 3, connecting rod; 4, release clip; 5, rotating ring; 6, sliding support plate; 7, arc-shaped groove; 8, movable shaft; 9, clamping runner; 10, clamping guide rail; 11, positioning mounting rod; 12, positioning groove; 13, scale; 14, bearing; 15, temporary storage track. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0016] The technical solution of the present utility model will be further described below in conjunction with the drawings and through specific embodiments.

[0017] As Figure 1 shown, in this embodiment, a wafer clamping mechanism includes a positioning base 1, a servo motor 2, a connecting rod 3, and a release clip 4. The driving end of the servo motor 2 is vertically upwardly connected to a rotating ring 5. One end of the connecting rod 3 is hinged to the rotating ring 5, and the other end of the connecting rod 3 is hinged to the inner side of the release clip 4. The periphery of the positioning base 1 is fixed with a sliding support plate 6. An arc-shaped groove 7 is provided on the sliding support plate 6. A movable shaft 8 is installed on the release clip 4, and the end of the movable shaft 8 slides in the arc-shaped groove 7. A clamping runner 9 is installed on the release clip 4.

[0018] The manipulator places the silicon wafer on the positioning base 1. At this time, the release clips 4 around expand outwards to make room for placing the silicon wafer. Then, the servo motor 2 drives the linkage rod 3 to pull towards the middle under the rotation action of the driving end. Under the movement of the linkage rod 3, the release clips 4 move closer to the middle of the positioning base 1. Since there is an arc groove 7 on the sliding support plate 6, the release clips 4 with movable shafts 8 are guided by the arc groove 7 and move towards the middle of the positioning base 1 while slowly lifting, so as to center and position the silicon wafer. The clamping rotating wheel 9 prevents the release clips 4 from rubbing against the periphery of the silicon wafer hard, effectively protecting the silicon wafer.

[0019] A clamping guiding slide rail 10 is fixed on the positioning base 1. A clamping guiding slider is fixed at the lower end of the release clip 4. The clamping guiding slider slides on the clamping guiding slide rail 10. During the movement of the release clip 4, in order to keep the release clip 4 moving straight towards the center, the sliding connection between the clamping guiding slider and the clamping guiding slide rail 10 is used for linear guiding.

[0020] A positioning installation rod 11 is arranged at the upper end of the release clip 4. The clamping rotating wheels 9 are distributed on the positioning installation rod 11. A positioning groove 12 and a positioning screw are installed on the positioning installation rod 11. After the positioning screw passes through the positioning groove 12, it is locked on the release clip 4. According to different silicon wafer sizes, the positioning screw can be loosened so that the positioning installation rod 11 can be adjusted in position on the release clip 4. After determining the position, the positioning screw is passed through the positioning groove 12 for locking.

[0021] A scale 13 is arranged on the side of the release clip 4. The lower end of the positioning installation rod 11 indicates the position of the positioning installation rod 11 corresponding to the scale 13. When changing the positioning installation rod 11 on the release clip 4, the position indicated by the scale 13 corresponding to the lower part of the positioning installation rod 11 also changes, and the amount of change can be accurately observed, which is convenient for controlling the common change position of the four sides.

[0022] A bearing 14 is installed at the end of the movable shaft 8. The bearing 14 rolls in the arc groove 7. By using the limited movement of the bearing 14 in the arc groove 7, it is controlled that when the movable shaft 8 pulls the release clip 4 outwards, it turns downwards, and when the release clip 4 moves inwards, it moves upwards closer, which is convenient for placing and positioning the silicon wafer.

[0023] A temporary storage track 15 is fixed at the upper end of the positioning base 1. When the silicon wafer is placed on the positioning base 1, the silicon wafer is supported by the temporary storage track 15 and waits for the release clips 4 around to clamp and position it.

[0024] It should be noted that the above specific implementation manners are only the preferred embodiments of the present invention and the applied technical principles. Within the technical scope disclosed by the present invention, any changes or substitutions that are easily conceivable by those skilled in the art should be covered within the protection scope of the present invention.

Claims

1. A silicon wafer clamping mechanism, characterized in that: It includes a positioning base, a servo motor, a connecting rod and a release clamp, the driving end of the servo motor is vertically connected to a rotating ring, one end of the connecting rod is hinged to the rotating ring, and the other end of the connecting rod is hinged to the inner side of the release clamp, a sliding support plate is fixed to the periphery of the positioning base, an arc groove is provided on the sliding support plate, a movable shaft is installed on the release clamp, the end of the movable shaft slides in the arc groove, and a clamping wheel is installed on the release clamp.

2. A silicon wafer clamping mechanism according to claim 1, characterized in that: A clamping guide rail is fixed on the positioning base, a clamping guide slider is fixed on the lower end of the release clamp, and the clamping guide slider slides on the clamping guide rail.

3. A silicon wafer clamping mechanism according to claim 1, characterized in that: A positioning mounting rod is arranged at the upper end of the release clamp, the clamping wheels are distributed on the positioning mounting rod, a positioning slot and a positioning screw are installed on the positioning mounting rod, and the positioning screw is locked on the release clamp after passing through the positioning slot.

4. A silicon wafer clamping mechanism according to claim 3, characterized in that: The side of the release clamp is provided with a scale, and the lower end of the positioning installation rod and the scale indicate the position of the positioning installation rod.

5. The silicon wafer clamping mechanism according to claim 1, characterized in that: A bearing is installed at the end of the movable shaft, and the bearing rolls in the arc groove.

6. The silicon wafer clamping mechanism according to claim 1, characterized in that: A temporary storage track is fixed to the upper end of the positioning base.

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