Atomization assembly and electronic atomization device

By providing a puncture part on the conductive thimble, directly contacting the electrode of the heating element, the problem of large contact resistance of the heating element in the prior art is solved, energy loss is reduced, and atomization performance is improved.

CN222916992UActive Publication Date: 2025-05-30SMOORE INTERNATIONAL HOLDINGS LIMITED
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Patent Information

Application Number
CN202421394603.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-18
Publication Date
2025-05-30
Estimated Expiration
2034-06-18

AI Technical Summary

Technical Problem

In the existing atomization device, the contact resistance of the heating element is large, resulting in large energy loss and affecting the atomization performance.

Method used

Atomization component is designed, including a heating element and a conductive thimble. The conductive thimble is provided with a punctured part on the surface of the conductive thimble, which is used to puncture the oxide film on the electrode surface of the heating element, directly contact the electrode, and reduce contact resistance.

Benefits of technology

By reducing the contact resistance of the electrode, the energy loss of the atomization assembly is reduced and the atomization performance is improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to an atomization assembly and an electronic atomization device.The atomization assembly comprises a heating piece and a conductive ejector pin, the heating piece is used for heating an aerosol generating substrate, and the conductive ejector pin is arranged on one side of the heating piece; wherein at least one puncturing part is convexly arranged on a part of the surface of the conductive ejector pin, and the puncturing part is used for being in contact with and electrically connected with the heating element. According to the atomization assembly, the conductive ejector pin can pierce the oxidation film on the surface of the electrode of the heating piece through the piercing part, so that the conductive ejector pin penetrates through the oxidation film to directly make contact with the metal part of the electrode, the contact resistance of the electrode is reduced, finally, the energy loss of the atomization assembly is reduced, and the atomization performance of the atomization assembly is improved.
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Description

Technical Field

[0001] The present application relates to the technical field of atomization, and particularly relates to an atomization component and an electronic atomization device. Background Art

[0002] An aerosol is a colloidal dispersion system formed by solid or liquid small particles dispersed and suspended in a gas medium. Since the aerosol can be absorbed by the human body through the respiratory system, it provides a new alternative absorption method for users. An atomization device refers to a device that forms an aerosol by heating or ultrasonic means a storable atomizable medium. The atomizable medium includes a liquid, a gel, a paste, or a solid aerosol generating matrix. Atomizing these media can deliver an inhalable aerosol to the user, replacing the conventional product form and absorption method.

[0003] However, in some existing atomization devices, a thimble is used to contact the heating element to supply power to the heating element. However, the current contact resistance of the heating element is relatively large, resulting in large energy loss of the atomization device and affecting the atomization performance of the atomization device. Summary of the Invention

[0004] Based on this, in view of the problem of relatively large contact resistance of the heating element, it is necessary to provide an atomization component and an electronic atomization device.

[0005] An atomization component includes a heating element and a conductive thimble. The heating element is used to heat an aerosol generating matrix, and the conductive thimble is disposed on one side of the heating element;

[0006] Wherein, at least one puncturing portion protrudes from a partial surface of the conductive thimble, and the puncturing portion is used to contact and electrically connect to the heating element.

[0007] In one embodiment, the heating element includes a substrate and an electrode disposed on one side surface of the substrate, and the puncturing portion punctures an oxide film on the surface of the electrode and is electrically connected to the electrode.

[0008] In one embodiment, the conductive thimble is provided with a plurality of the puncturing portions, and all the puncturing portions are arranged at intervals.

[0009] In one embodiment, all the puncturing portions are arranged in a matrix or unevenly dispersed arrangement.

[0010] In one embodiment, the conductive thimble includes a contact surface parallel to the side surface of the substrate where the electrode is disposed, and the puncturing portion protrudes from the contact surface.

[0011] In one embodiment, the conductive thimble has a central axis extending in a direction, and the central axis is perpendicular to one side surface of the substrate provided with the electrode. The piercing portion protrudes from one end of the conductive thimble facing the electrode.

[0012] In one embodiment, the cross-section of the conductive thimble perpendicular to its own axis is rectangular, arcuate or circular.

[0013] In one embodiment, the piercing portion is cubic, spherical, conical or cylindrical.

[0014] In one embodiment, the height of the piercing portion protruding from the surface of the conductive thimble is 0.1 mm - 0.3 mm.

[0015] An electronic atomization device includes the above atomization assembly. The electronic atomization device further includes a battery assembly, and the battery assembly is electrically connected to the atomization assembly.

[0016] For the above conductive thimble, the conductive thimble can pierce the oxide film on the surface of the electrode of the heating element through the piercing portion, so as to directly contact the metal part of the electrode through the oxide film. Therefore, the contact resistance of the electrode is reduced, and finally the energy loss of the atomization assembly is reduced, and the atomization performance of the atomization assembly is improved. Description of the Drawings

[0017] Figure 1 It is a schematic diagram of an atomization assembly according to an embodiment of the present application.

[0018] Figure 2 is Figure 1 The internal structure schematic diagram of the shown atomization assembly.

[0019] Figure 3 It is a schematic diagram of an atomization device according to an embodiment of the present application.

[0020] Figure 4 is Figure 3 The internal structure schematic diagram of the shown atomization device.

[0021] Figure 5 It is an assembly schematic diagram of a heating element and a conductive thimble according to an embodiment of the present application.

[0022] Figure 6 It is a schematic diagram of a conductive thimble of the prior art.

[0023] Figure 7 is Figure 6 The stress schematic diagram of the electrode of the heating element in the prior art shown in the simulation experiment.

[0024] Figure 8 It is a schematic diagram of the structure of a conductive thimble according to an embodiment of the present application.

[0025] Figure 9 Structural schematic diagram of the conductive thimble according to an embodiment of the present application.

[0026] Figure 10 Structural schematic diagram of the conductive thimble according to an embodiment of the present application.

[0027] Figure 11 Schematic diagram of the stress of the electrode of the heating element in a simulation experiment according to an embodiment of the present application.

[0028] Figure 12 Assembly schematic diagram of the heating element and the conductive thimble according to an embodiment of the present application.

[0029] Figure 13 Schematic diagram of a conductive thimble of the prior art.

[0030] Figure 14 is Figure 13 Schematic diagram of the stress of the electrode of the heating element in the simulation experiment of the prior art shown.

[0031] Figure 15 Structural schematic diagram of the conductive thimble according to an embodiment of the present application.

[0032] Figure 16 Schematic diagram of the stress of the electrode of the heating element in a simulation experiment according to an embodiment of the present application.

[0033] Explanation of reference numerals:

[0034] 100, electronic atomization device; 20, atomization assembly; 21, housing; 212, air flow channel; 214, liquid storage cavity; 23, heating element; 232, substrate; 234, heating body; 236, electrode; 25, conductive thimble; 258, piercing part; 40, power supply assembly. Detailed implementation manners

[0035] To make the above objects, features and advantages of the present application more obvious and understandable, the following will describe the detailed implementation manners of the present application with reference to the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0036] In the description of the present application, it should be understood that if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0037] In addition, if there are terms such as "first" and "second", these terms are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, if there is a term "plurality", the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0038] In the present application, unless otherwise clearly specified and limited, if there are terms such as "install", "connect", "join", "fix", etc., these terms should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0039] In the present application, unless otherwise clearly specified and limited, if there is a description such as a first feature being "on" or "under" a second feature, the meaning may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0040] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If present, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are only for illustrative purposes and do not represent the only implementation.

[0041] Referring to Figures 1 to 4 , an embodiment of the present application provides an electronic atomization device 100 for heating an aerosol-forming substrate to generate an aerosol for user use. The aerosol-forming substrate includes, but is not limited to, materials for medical, health care, health, and beauty purposes. For example, the aerosol-forming substrate is a liquid medicine or an oil.

[0042] The electronic atomization device 100 includes an atomization component 20 and a power supply component 40. The atomization component 20 is used to store the aerosol-forming substrate. The power supply component 40 is connected to one end of the atomization component 20 and is electrically connected to the atomization component 20. The atomization component 20 is used to heat and atomize the aerosol-forming substrate under the action of the electric energy of the power supply component 40. The aerosol-forming substrate is heated and atomized to generate an aerosol that flows out of the electronic atomization device 100 for the user to take.

[0043] Further, the atomization component 20 includes a housing 21, a heating element 23, and two conductive thimbles 25. The housing 21 has an atomization chamber, an air flow channel 212, and a liquid storage chamber 214. One end of the air flow channel 212 communicates with the atomization chamber, and the other end of the air flow channel 212 extends upward away from the atomization chamber and communicates with the external atmosphere. The liquid storage chamber 214 surrounds the liquid storage chamber 214 in the circumferential direction and communicates with the atomization chamber. The heating element 23 and the conductive thimble 25 are both received in the atomization chamber, and the heating element 23 is electrically connected to the power supply component 40 through the conductive thimble 25.

[0044] Thus, the aerosol-forming substrate is stored in the liquid storage chamber 214. During the use of the electronic atomization device 100, the aerosol-forming substrate in the liquid storage chamber 214 gradually enters the atomization chamber and contacts the heating element 23. The heating element 23 can heat the aerosol-forming substrate to generate an aerosol under the action of the electric energy of the power supply component 40. The aerosol in the atomization chamber can flow out through the air flow channel 212 for the user to take.

[0045] Please refer to Figure 5 , in some embodiments, the heating element 23 includes a substrate 232, a heating body 234, and an electrode 236.

[0046] The substrate 232 is in the shape of a cuboid, and the length direction of the substrate 232 extends along Figure 5 the X direction inFigure 5 extends in the Y direction, and the height direction of the substrate 232 extends along Figure 5 the Z direction in. The substrate 232 is formed of a hard porous structure such as porous ceramics, and has the characteristics of insulation, high temperature resistance, and stable chemical properties while being able to absorb and store the aerosol generation matrix.

[0047] The heating element 234 is provided on one surface of the substrate 232 in the height direction. The heating element 234 can be formed by a heating film or a heating wire, and the material forming the heating element 234 can be a material with good electrical conductivity such as metal.

[0048] The heating member 23 includes two electrodes 236, one positive and one negative. Both electrodes 236 are provided on the surface of the substrate 232 on the side where the heating element 234 is provided. The two electrodes 236 are located at opposite ends of the heating element 234 in the length direction of the substrate 232, and the two electrodes 236 are electrically connected to the two end portions of the heating element 234 respectively. The orthographic projection of each electrode 236 on the substrate 232 is rectangular. The length direction of the electrode 236 is parallel to the width direction of the substrate 232, the width direction of the electrode 236 is parallel to the length direction of the substrate 232, and the thickness direction of the electrode 236 is parallel to the height direction of the substrate 232. The two conductive thimbles 25 are respectively in contact with and electrically connected to the two electrodes 236, so as to be electrically connected to the heating member 23.

[0049] It can be understood that the shapes of the substrate 232, the heating element 234, and the electrode 236 are not limited, and can be set as needed to meet different atomization requirements.

[0050] As described in the background art, since there is a large amount of aerosol generation matrix in the working environment of the conductive thimble 25 and the heating member 23, there is a risk of corroding the conductive thimble 25 and the electrode 236. Therefore, in order to ensure the long-term stable operation of the atomization assembly 20, most of the conductive thimbles 25 and the electrode 236 rely on the oxide film on the surface for corrosion protection. However, most oxides are not conductive, so the contact resistance between the conductive thimble 25 and the electrode 236 will increase, and finally the energy loss of the atomization assembly 20 is large, affecting the atomization performance of the atomization assembly 20.

[0051] Based on the above problems, at least one piercing portion 258 protrudes from a part of the surface of the conductive thimble 25 of the present application, and the piercing portion 258 is used to contact and electrically connect to the electrode 236 of the heating member 23.

[0052] In this way, the conductive thimble 25 can pierce the oxide film on the surface of the electrode 236 of the heating member 23 through the piercing portion 258, so as to directly contact the metal part of the electrode 236 through the oxide film. Therefore, the contact resistance of the electrode 236 is reduced, and finally the energy loss of the atomization assembly 20 is reduced, and the atomization performance of the atomization assembly 20 is improved.

[0053] Specifically, the conductive ejector pin 25 is in a columnar structure, and a cross section of the conductive ejector pin 25 perpendicular to its own axis is rectangular, arched (ie, D-shaped) or circular.

[0054] like Figure 5 As shown, when the cross section of the conductive ejector pin 25 is rectangular, the conductive ejector pin 25 has a plane facing and parallel to a side surface of the substrate 232 on which the electrode 236 is provided as a contact surface, and the piercing portion 258 is protruded from the aforementioned contact surface and contacts the electrode 236 .

[0055] When the cross-section of the conductive ejector pin 25 is arcuate (D-shaped), the conductive ejector pin 25 includes a plane extending along the axial direction and an arcuate surface extending along the axial direction. The aforementioned plane faces and is parallel to a side surface of the substrate 232 on which the electrode 236 is provided and serves as a contact surface. The piercing portion 258 protrudes from the contact surface and contacts the electrode 236.

[0056] like Figure 12 As shown, when the cross section of the conductive ejector pin 25 is circular, the conductive ejector pin 25 has an outer circumferential surface surrounding its central axis in the circumferential direction, and an end surface 252 of an axial end of the conductive ejector pin 25 faces the electrode 236 to serve as a contact surface, and the piercing portion 258 is protruded from the contact surface.

[0057] It is understandable that the shape of the conductive ejector pin 25 is not limited thereto and can be configured as needed to meet electrical connection requirements. The piercing portion 258 is disposed on a side plane of the conductive ejector pin 25 facing the electrode 236 .

[0058] like Figures 8 to 10 As shown, in some embodiments, the conductive ejector pin 25 is provided with a plurality of piercing portions 258, and all the piercing portions 258 are arranged at intervals on the contact surface of the conductive ejector pin 25. The plurality of piercing portions 258 can simultaneously pierce the oxide film on the surface of the electrode 236 to contact and electrically connect with the electrode 236.

[0059] Further, the number of puncture portions 258 is 1-20, all puncture portions 258 can be arranged in a uniform matrix or in an unevenly dispersed arrangement, each puncture portion 258 can be in a cubic, spherical, conical or cylindrical shape, and the height of the puncture portion 258 protruding from the surface where it is located is 0.1mm-0.3mm. It can be understood that the number, shape and arrangement of the puncture portions 258 are not limited, and the contact area between each puncture portion 258 and the electrode 236 is smaller than the contact area between the conductive ejector 25 and the electrode 236 when the puncture portion 258 is not provided.

[0060] It should be noted that, based on the different disposition modes of the heating element 23 , the shapes of the conductive ejector pins 25 and the positional relationship with the heating element 23 , the piercing portion 258 may be disposed at different positions of the conductive ejector pins 25 .

[0061] Taking the conductive thimble 25 with a rectangular cross-section as an example: As Figure 8 shown, in some embodiments, the piercing portion 258 is provided on the side surface of the conductive thimble 25, and all the piercing portions 258 on the conductive thimble 25 are equally spaced and arranged at intervals along the axial direction of the conductive thimble 25. As Figure 10 shown, in another embodiment, multiple columns of piercing portions 258 are arranged at intervals along the width direction of the rectangular plane, and all the piercing portions 258 in each column of piercing portions 258 are equally spaced and arranged at intervals along the axial direction of the conductive thimble 25. As Figure 9 shown, in another embodiment, all the piercing portions 258 are arranged in an irregular and dispersed manner.

[0062] When the central axis of the conductive thimble is parallel to the width direction of the substrate and the side surface of the conductive thimble faces the electrode, a simulation test is carried out on the prior art and an embodiment of the present application. By pre-pressing the conductive thimble downward by 0.1 mm in the direction perpendicular to the substrate, the pressure on the electrode can be extracted. The pressure on the electrode 236 in the prior art is 13106 MPa (as Figure 6 、 Figure 7 shown), which is less than the pressure of 17225 MPa on the electrode 236 in an embodiment of the present application (as Figure 11 shown). Therefore, compared with the prior art, the piercing portion 258 of the present application can pierce the oxide film on the surface of the electrode 236 and be electrically connected to the electrode 236.

[0063] When the central axis of the conductive thimble is parallel to the height direction of the substrate and the first end surface of the conductive thimble faces the electrode, a simulation test is carried out on the prior art and an embodiment of the present application. By pre-pressing the conductive thimble downward by 0.1 mm in the direction perpendicular to the substrate, the pressure on the electrode can be extracted. The pressure on the electrode 236 in the prior art is 9004.7 MPa (as Figure 13 、 Figure 14 shown) which is less than the pressure of 12649 MPa on the electrode 236 in an embodiment of the present application (as Figure 16 shown). Therefore, the piercing portion 258 of the present application can pierce the oxide film on the surface of the electrode 236 and be electrically connected to the electrode 236.

[0064] For the above-mentioned conductive thimble 25, atomization assembly 20 and electronic atomization device 100, by providing the piercing portion 258 on the conductive thimble 25, the oxide film on the surface of the electrode 236 can be pierced, thereby reducing the contact resistance of the electrode 236. Under the condition of constant power, the energy loss of the atomization assembly 20 is effectively reduced, and the atomization performance of the electronic atomization device 100 is improved.

[0065] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the various technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as falling within the scope described in this specification.

[0066] The above-described embodiments merely represent several implementation manners of the present application. The description thereof is relatively specific and detailed, but it should not be construed as a limitation to the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. An atomizing assembly, characterized in that: It comprises a heating element and a conductive ejector pin, wherein the heating element is used to heat the aerosol-generating matrix, and the conductive ejector pin is arranged on one side of the heating element; Wherein, at least one puncture portion is protruding from a part of the surface of the conductive ejector pin, and the puncture portion is used to contact and electrically connect to the heating element.

2. The atomizer assembly according to claim 1, characterized in that: The heating element includes a substrate and an electrode disposed on a surface of one side of the substrate, and the piercing portion pierces an oxide film on the surface of the electrode and is electrically connected to the electrode.

3. The atomizer assembly according to claim 2, characterized in that: The conductive ejector pin is provided with a plurality of puncturing portions, and all the puncturing portions are arranged at intervals.

4. The atomizer assembly according to claim 3, characterized in that: All of the puncture parts are arranged in a matrix or in an unevenly dispersed arrangement.

5. The atomizer assembly according to claim 2, characterized in that: The conductive ejector pin comprises a contact surface which is parallel to a side surface of the substrate on which the electrode is provided, and the piercing portion is protruding from the contact surface.

6. The atomizer assembly according to claim 2, characterized in that: The conductive ejector pin has a central axis extending in one direction, the central axis is perpendicular to a side surface of the substrate on which the electrode is provided, and the piercing portion is protruding from one end of the conductive ejector pin facing the electrode.

7. The atomizer assembly according to claim 5 or 6, characterized in that: The cross section of the conductive ejector pin perpendicular to its own axis is rectangular, arched or circular.

8. The atomizer assembly according to claim 1, characterized in that: The puncture portion is in the shape of a cube, a sphere, a cone or a column.

9. The atomizer assembly according to claim 8, characterized in that: The puncture portion protrudes from the surface of the conductive ejector pin by a height of 0.1 mm to 0.3 mm.

10. An electronic atomization device, characterized in that: Comprising the atomization assembly as described in any one of claims 1 to 9, the electronic atomization device also includes a battery assembly, and the battery assembly is electrically connected to the atomization assembly.