Disk repairing device and disk repairing equipment

Abstract

The utility model discloses a disc repairing device and disc repairing equipment. The disc repairing device comprises a disc and a repairing structure arranged on the disc. A plurality of gears arranged at intervals extend from the outer side face of the disc in the radial direction of the disc. The trimming structure is annularly arranged along the edge of the surface of the disc and is adjacent to the gear of the disc. The trimming structure protrudes outwards along the surface perpendicular to the disc. The trimming structure sequentially comprises a trimming body and a trimming block in the direction from the center of the disc to the edge of the disc, the trimming body comprises a supporting table and a sunken area sunken downwards along the surface of the supporting table, and the trimming block is arranged in the sunken area. And a gap is formed between the supporting table and the finishing block. In the finishing process, the supporting table makes contact with the polishing pad, stress of the finishing block in the vertical direction can be shared, excessive abrasion to the polishing pad is avoided, meanwhile, the pressure borne by the finishing block in the vertical direction is smaller, and the service life of the finishing block is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, and particularly relates to a disk dresser and a disk dressing device. Background Art

[0002] In the process of wafer manufacturing, the wafer will undergo grinding and polishing treatment to make its surface flat. Currently, wafer grinding and polishing are completed by a Chemical Mechanical Polishing (CMP) device. The existing CMP device includes at least one grinding head / polishing head for adsorbing the wafer, and the grinding head / polishing head rotates relative to the grinding pad / polishing pad during the grinding process to grind and polish the wafer.

[0003] Since the CMP process is to bring the surface of the wafer into contact with the grinding surface of the grinding pad, and then flatten the surface of the wafer through the relative movement between the surface of the wafer and the grinding surface of the grinding pad. Therefore, the flatness of the surface of the grinding pad / polishing pad is crucial for controlling the surface morphology of the wafer. In the prior art, a special disk dresser is generally used to process the surface of the grinding pad / polishing pad to make the surface of the grinding pad / polishing pad flat and reach a certain surface roughness. As the polishing process continues, polishing residues such as broken silicon chips and polishing liquid crystals will be embedded in the grinding pad / polishing pad. At this time, it is necessary to use a disk dresser to trim the grinding pad / polishing pad to remove the broken silicon chips and polishing liquid crystals, etc., and reduce the defective phenomena such as polishing scratches caused by foreign objects. Summary of the Invention

[0004] In view of the above-mentioned disadvantages of the prior art, the purpose of the utility model is to provide a disk dresser and a disk dressing device to avoid excessive trimming of the grinding pad or polishing pad, and at the same time improve the service life of the disk dresser.

[0005] To achieve the above purpose and other related purposes, the utility model provides a disk dresser, including:

[0006] A disk;

[0007] A dressing structure, which is circumferentially arranged along the edge of the surface of the disk, and the dressing structure protrudes outward perpendicular to the surface of the disk; the dressing structure sequentially includes a dressing body and a dressing block along the direction from the center to the edge of the disk, the dressing body includes a support table and a concave area that is recessed downward along the surface of the support table, and the dressing block is arranged in the concave area; in the direction perpendicular to the surface of the disk, there is a distance between the support table and the dressing block.

[0008] Optionally, the range of the distance is between -100 μm and 200 μm.

[0009] Optionally, the disk extends radially along the outer side surface of the disk with a plurality of spaced gears, and the dressing structure is adjacent to the gears of the disk.

[0010] Optionally, the dressing block sequentially includes a support layer, an adhesive layer, and abrasive particles adhered to the adhesive layer in a vertical direction from the bottom surface of the concave area to the horizontal plane where the tabletop of the support platform is located.

[0011] Optionally, the dressing block further includes a height adjustment layer, and the height adjustment layer is disposed between the support layer and the bottom surface of the concave area.

[0012] Optionally, the disc includes a front surface and a back surface which are oppositely arranged, and the dressing structure is disposed on the front surface and / or the back surface of the disc.

[0013] Optionally, the number of the dressing structures is multiple, and the multiple dressing structures are arranged at intervals circumferentially along the edge of the disc; or the number of the dressing structures is 1, and the dressing structure extends circumferentially along the outer extension of the disc to form a closed annular structure.

[0014] The present utility model further provides a disc dressing device, including:

[0015] An upper grinding disc;

[0016] A lower grinding disc, coaxially arranged with the upper grinding disc;

[0017] A sun gear, disposed at the central position of the lower grinding disc and coaxially arranged with the lower grinding disc;

[0018] An external gear, disposed at the edge position of the lower grinding disc and coaxially arranged with the lower grinding disc;

[0019] At least two disc dressers, in contact with the lower grinding disc, the gear of each disc dresser meshes with the external gear and also meshes with the gear of the sun gear, and the diameter of the disc of the disc dresser is equal to the diameter difference between the sun gear and the external gear, and the disc dresser is the above-mentioned disc dresser.

[0020] Optionally, the dressing structure of the disc dresser is disposed on the front surface or the back surface of the disc of the disc dresser, the front surface of at least one disc dresser corresponds to the upper grinding disc, and the back surface of at least one disc dresser corresponds to the upper grinding disc.

[0021] Optionally, the dressing structure of the disc dresser is disposed on both the front surface and the back surface of the disc at the same time.

[0022] Compared with the prior art, the disc dresser and the disc dressing device described in the present utility model at least have the following beneficial effects:

[0023] The disk trimmer of the present utility model includes a disk and a trimming structure disposed on the disk. Among them, the trimming structure is circumferentially arranged along the edge of the surface of the disk. The trimming structure protrudes outward perpendicular to the surface of the disk. The trimming structure sequentially includes a trimming body and a trimming block in the direction from the center to the edge of the disk. The trimming body includes a support platform and a recessed area that is recessed downward along the surface of the support platform. The trimming block is disposed in the recessed area. In the direction perpendicular to the surface of the disk, there is also a gap between the support platform and the trimming block. In the trimming structure of the present utility model, a support platform is provided. Through the setting of the support platform and the gap, during the trimming process, the support platform contacts the polishing pad, thereby sharing the force on the trimming block in the vertical direction, avoiding excessive wear on the polishing pad. At the same time, the vertical pressure borne by the trimming block is smaller, improving the service life of the trimming block. The support platform serves as a parallelism standard for the polishing pad, enabling the polishing pad to be trimmed flatter. The support platform is disposed on the inner side of the disk near the center, and the trimming block is disposed on the side near the edge. Thus, the trimming block can trim the inner and outer edge regions of the polishing pad, and the trimming range is wider.

[0024] The disk trimming device of the present utility model includes the above-mentioned disk trimmer and also has the technical effects of the above-mentioned disk trimmer. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a top view structural schematic diagram of the disk trimmer in the embodiment of the present utility model;

[0026] Figure 2 is along Figure 1 a cross-sectional view taken along the B-B' direction in

[0027] Figure 3 is Figure 2 a horizontally enlarged view of the trimming structure at A in

[0028] Figure 4 is a structural schematic diagram of the trimming of the abrasive by the trimming structure in the embodiment of the present utility model;

[0029] Figure 5 is a structural schematic diagram of the disk trimming device in the embodiment of the present utility model.

[0030] LIST OF REFERENCE NUMERALS:

[0031] 10 Disk

[0032] 11 Gear

[0033] 101 Front surface

[0034] 102 Back surface

[0035] 20 Trimming structure

[0036] 21 Trimming body

[0037] 211 Support platform

[0038] 212 Concave area

[0039] 22 Dressing block

[0040] 221 Height adjustment layer

[0041] 222 Support layer

[0042] 223 Bonding layer

[0043] 224 Abrasive particles

[0044] 30 Lower grinding disc

[0045] 40 Sun gear

[0046] 50 Outer gear

[0047] 60 Object to be ground

[0048] 100 Disc dresser Detailed implementation manners

[0049] The following specific embodiments illustrate the implementation manners of the present utility model. Those skilled in this technology can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. The present utility model can also be implemented or applied through other different specific implementation manners. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0050] It should be noted that the drawings provided in the embodiments of the present utility model only illustrate the basic concept of the present utility model in a schematic manner. Although only the components related to the present utility model are shown in the drawings, rather than being drawn according to the number, shape, and size of the components in actual implementation, the forms, quantities, and proportions of the components in actual implementation can be changed arbitrarily, and the layout form of the components may also be more complex. The structures, proportions, sizes, etc. shown in the drawings of the specification are only used to cooperate with the content disclosed in the specification for those skilled in this technology to understand and read, and are not used to limit the limiting conditions that can be implemented in this application. Therefore, they do not have technical essential significance. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present utility model can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in this application.

[0051] In the double-sided polishing process of silicon wafers, polishing pads are attached to the upper and lower platens. Polishing liquid is introduced into the upper platen. The silicon wafers are installed on the planetary gears. Through the movement of the upper and lower platens, the sun gear, and the planetary gears, the purpose of double-sided polishing is achieved. After the polishing pads are attached to the upper and lower platens, a special pad conditioner is required to treat the surface of the polishing pads to make the surface of the polishing pads flat and reach a certain surface roughness. As the polishing process continues, polishing residues such as broken silicon chips and polishing liquid crystals will be embedded in the polishing pads. At this time, the pad conditioner needs to be used to trim the polishing pads to remove broken silicon chips and polishing liquid crystals, etc., and reduce defects such as polishing scratches caused by foreign objects.

[0052] The inventors' research found that the diamond particles in the existing pad conditioner directly contact and rub against the polishing pad under pressure. The surface abrasive grains of the pad conditioner are in high-intensity contact with the polishing pad, and the surface of the polishing pad peels off layer by layer. As the pad conditioner continues to move, the newly exposed surface of the polishing pad will also be trimmed off, resulting in excessive wear of the polishing pad. The reason for the analysis is that the diamond particles on the pad conditioner directly contact the surface of the polishing pad. The polishing pad is subjected to the pressure in the vertical direction (Z) and the friction force in the horizontal direction (XY) of the diamond particles. The force in the vertical direction will continuously wear and thin the polishing pad, the sharp diamond particles will wear and become blunt, and the service lives of both the polishing pad and the diamond pad conditioner will become shorter.

[0053] To solve the problems in the background technology and the above technical problems, this embodiment provides a pad conditioner and a pad conditioning device. The pad conditioner can trim each position of the polishing pad, will not cause excessive wear to the polishing pad, and can improve the service life of the diamond particles on the pad conditioner at the same time.

[0054] The following will introduce the present utility model in detail with specific embodiments.

[0055] Embodiment 1

[0056] This embodiment provides a pad conditioner. Refer to Figures 1 to 3, the disk refiner includes a disk 10 and a dressing structure 20 disposed on the disk 10. Among them, the dressing structure 20 is circumferentially arranged along the edge of the surface of the disk 10. The dressing structure 20 protrudes outward perpendicular to the surface of the disk 10. The dressing structure 20 sequentially includes a dressing body 21 and a dressing block 22 along the direction from the center to the edge of the disk 10. The dressing body 21 includes a support platform 211 and a recessed area 212 that is recessed downward along the surface of the support platform 211. The dressing block 22 is disposed in the recessed area 212. In the direction perpendicular to the surface of the disk 10, there is also a spacing between the support platform 211 and the dressing block 22. In this embodiment, the support platform 211 is provided in the dressing structure 20. Through the setting of the support platform 211 and the spacing, during the dressing process, the support platform 211 contacts the polishing pad, thereby sharing the force of the dressing block 22 in the vertical direction and avoiding excessive wear on the polishing pad. At the same time, the support platform 211 serves as a parallelism standard for polishing the polishing pad, enabling the polishing pad to be polished flatter. The support platform 211 is provided on the inner side of the disk 10 close to the center, and the dressing block 22 is provided on the side close to the edge. Thus, the dressing block 22 can dress the inner and outer edge areas of the polishing pad, and the dressing range is wider.

[0057] Specifically, referring to Figure 1 and 2 , the disk refiner 100 includes a disk 10. The disk 10 includes a front surface 101 and a back surface 102 that are oppositely arranged, and an outer side surface that connects the front surface 101 and the back surface 102 in the thickness direction of the disk 10. The disk refiner 100 can be driven by a gear 11 structure or other structures to achieve contact with the polishing pad and subsequent grinding. In this embodiment, a plurality of spaced gears 11 extend radially from the outer side surface of the disk 10 along the disk 10. The dressing structure 20 is adjacent to the gears 11 of the disk 10. The gear 11 is used to mesh with the gear 11 on the disk refining device to move under the drive of the meshing gears 11 and grind and dress the surface of the object to be ground. Optionally, the center of the disk 10 can be provided as a hollow structure, that is, the disk 10 can be annular; it can also be a solid structure. The specific structure of the disk 10 in this embodiment is not limited. And, the disk refiner in this embodiment can be applied to a single-sided polishing device or a double-sided polishing device, and the present invention is not limited thereto.

[0058] Referring to Figure 1 , the dressing structure 20 is circumferentially arranged along the surface of the disk 10 and is adjacent to the gears 11 of the disk 10. The dressing structure 20 protrudes outward perpendicular to the surface of the disk 10, that is, the dressing structure 20 protrudes from the surface of the disk 10. The dressing structure 20 can be fitted into the disk 10 structure or can be integrally formed with the disk 10 structure. Referring to Figure 4, during grinding, the dressing block 22 of the dressing structure 20 is in contact with the protruding part of the object 60 to be ground, so as to planarize the surface of the object 60 to be ground. And, referring to Figure 2 , the dressing structure 20 can be separately provided on the front surface 101 of the disk 10, or separately provided on the back surface 102 of the disk 10, or can be provided on both the front surface 101 and the back surface 102 of the disk 10 at the same time. This embodiment does not limit this.

[0059] Referring to Figure 3 , along the direction from the center to the edge of the disk 10, the dressing structure 20 sequentially includes a dressing body 21 and a dressing block 22. The dressing body 21 includes a support platform 211 and a concave area 212 that is recessed downward along the surface of the support platform 211. The dressing block 22 is arranged in the concave area 212. Optionally, the material of the dressing body 21 is diamond material. The dressing block 22 sequentially includes a support layer 222, an adhesive layer 223, and abrasive grains 224 bonded to the adhesive layer 223 in the vertical direction from the bottom surface of the concave area 212 of the dressing body 21 to the horizontal plane where the tabletop of the support platform 211 is located. Among them, the support layer 222 plays a supporting role for the entire dressing block 22. In order to fixedly arrange the abrasive grains 224 on the surface of the support layer 222, an adhesive layer 223 is also provided on the support layer 222, and the abrasive grains 224 are dispersed on the surface of the adhesive layer 223. Optionally, the material of the support layer 222 is stainless steel material. A protective layer can be plated on the surfaces of the dressing body 21 and the abrasive grains 224. This protective layer can be Teflon material or other similar materials to protect the surfaces of the dressing body 21 and the abrasive grains 224 and prevent metal contamination. In this embodiment, the abrasive grains 224 are diamond grains. The size of the diamond grains is 75-200 mesh. Optionally, the height of the entire adjustment block is 0 mm-0.5 mm. Optionally, the area of the support platform 211 is 0.6-1.5 times the surface area of all diamond grains. It should be noted that the parallel error between the tabletop of the support platform 211 of the dressing structure 20 and the surface on the other side of the dressing structure 20 relative to the support platform 211 is less than 50 μm. The flatness error of the tabletop of the support platform 211 of the dressing structure 20 is less than 50 μm.

[0060] Referring to Figure 2 , 3 Or 4, along the direction perpendicular to the front surface 101 of the disk 10, there is a spacing H1 between the support platform 211 and the dressing block 22, and the range of this spacing H1 is between -100 μm and 200 μm. Optionally, a height adjustment layer 221 is further provided between the support layer 222 and the bottom surface of the concave area 212. This height adjustment layer 221 is a gasket layer, and the thickness of this gasket layer can be controlled to adjust the distance of the spacing. In this embodiment, the size of the spacing is controlled to prevent excessive dressing of the polishing pad.

[0061] In this embodiment, referring to Figure 3 or 4, the height of the support table 211 is higher than that of the dressing block 22, so that during grinding, the support table 211 contacts the polishing pad first and bears the vertical pressure. When the support table 211 contacts the polishing pad, it is compressed under the action of force. The pressure between the diamond particles and the polishing pad is relatively small, and the vertical pressure on the diamond particles is small. The main force acting on the contact area between the polishing pad and the diamond particles is the horizontal frictional force. The polishing pad is dressed under the horizontal frictional force of the diamond particles, and foreign matters on the polishing pad are removed, and the surface becomes fluffy. Since the vertical pressure on the diamond particles is small, the pad is not easily thinned excessively, that is, it is not easily worn. Since the diamond particles are subjected to a smaller vertical force, the service life of the dresser is extended. The tabletop of the support table 211 on the dresser can be used as a standard parallel plane for the polishing pad, which makes the polishing pad flatter. Using the dresser in this embodiment for dressing, the dressing process is more stable. The polishing pad is initially dressed with a relatively large pressure and a long time to make the polishing pad flat. During the dressing in the polishing process, a relatively small pressure and a short time can be used for dressing to maintain the polishing efficiency of the polishing pad.

[0062] Embodiment 2

[0063] This embodiment provides a dresser device. Referring to Figure 5 , the dresser device includes an upper grinding disc (not shown in the figure), a lower grinding disc 30, a sun gear 40, an outer gear 50, and at least two dressers 100. The dresser 100 among them is the dresser in Embodiment 1, and the structure of this dresser will not be described in detail here.

[0064] Specifically, referring to Figure 5, in this disk repair device, the diameter of the upper polishing disk is equal to the diameter of the lower polishing disk 30, and the axial direction of the upper polishing disk is the same as the axial direction of the lower polishing disk 30. A polishing pad is provided in both the upper polishing disk and the lower polishing disk 30. The sun gear 40 and the external gear 50 are both located between the upper polishing disk and the lower polishing disk 30. The axial direction of the sun gear 40 and the axial direction of the external gear 50 are both the same as the axial direction of the lower polishing disk 30. The sun gear 40 is located in the inner region of the external gear 50. The diameter of the disk 10 of at least two disk repairers 100 is equal to the diameter difference between the sun gear 40 and the external gear 50. During the dressing process, the gears 11 of the disk repairer 100 are respectively engaged with the sun gear 40 and the external gear 50. The sun gear 40 drives the disk repairer 100 to revolve around the axis of the sun gear 40, and at the same time, the axis of the disk repairer 100 rotates itself, driving the dressing structure 20 to move relative to the upper and lower polishing disks 30. The end face of the dressing block 22 of the disk repairer 100 rubs against the end faces of the upper polishing disk and the lower polishing disk 30, repairs the end faces of the upper polishing disk and the lower polishing disk 30, improves the parallelism between the upper polishing disk and the lower polishing disk 30, prevents the parallelism between the upper polishing disk and the lower polishing disk 30 from decreasing and affecting the grinding accuracy, and further realizes the flatness dressing of the polishing pads on the upper and lower polishing disks 30. And, since the dressing block 22 in this embodiment is arranged at the edge position of the disk 10, the edge areas of the upper and lower polishing pads can be dressed, and the dressing range is wider.

[0065] Referring to Figure 5 , the number of the disk repairers 100 in the disk repair device is at least 2 or more. For example: it can be 2, 3, 4, 5, etc. Among them, the thickness difference between the disk repairers 100 in the disk repair device is less than 200 μm. In this embodiment, the number of the disk repairers 100 is 4.

[0066] Optionally, referring to Figure 2 , the dressing structure 20 of the disk repairer 100 is arranged on the front surface 101 or the back surface 102 of the disk 10 of the disk repairer. The front surface 101 of at least one disk repairer 100 corresponds to the upper polishing disk, and the back surface 102 of at least one disk repairer 100 corresponds to the upper polishing disk. In this way, even if the dressing structure 20 of the disk repairer 100 is only arranged on one side of the disk repairer, the upper and lower polishing disks can be dressed at the same time.

[0067] Optionally, referring to Figure 2 , of course, the dressing structure 20 of the disk repairer can also be arranged on the disk repairer at the same time, that is, on the front surface 101 and the back surface 102 of the disk 10. In this way, when installing the disk repairer, there is no need to install each disk repairer specially, and the dressing of the upper and lower polishing disks 30 can also be realized at the same time.

[0068] This embodiment includes the disk repairer in Embodiment 1 and also has the technical effects of the disk repairer in Embodiment 1.

[0069] The above embodiments are only illustrative of the principles and effects of the present utility model, and are not intended to limit the present utility model. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present utility model. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present utility model should still be covered by the claims of the present utility model.

Claims

1. A disk repairing device, characterized in that: include: disc; A trimming structure is arranged in a ring shape along the edge of the surface of the disc, and the trimming structure protrudes outward along a surface perpendicular to the disc; the trimming structure includes a trimming body and a trimming block in sequence along the direction from the center to the edge of the disc, the trimming body includes a support platform and a recessed area recessed downward along the surface of the support platform, and the trimming block is arranged in the recessed area; along the direction perpendicular to the surface of the disc, there is a distance between the support platform and the trimming block.

2. The dish repairing device according to claim 1, characterized in that: The range of the spacing is between -100 μm and 200 μm.

3. The dish repairing device according to claim 1, characterized in that: The disc has a plurality of gears arranged at intervals extending from the outer side surface of the disc along the radial direction of the disc, and the trimming structure is adjacent to the gears of the disc.

4. The dish repairing device according to claim 1, characterized in that: The trimming block comprises a supporting layer, a bonding layer and abrasive particles bonded to the bonding layer in sequence in a vertical direction from the bottom surface of the recessed area to a horizontal plane where a table surface close to the supporting table is located.

5. The dish repairing device according to claim 4, characterized in that: The trimming block further includes a height adjustment layer, and the height adjustment layer is arranged between the support layer and the bottom surface of the recessed area.

6. The dish repairing device according to claim 1, characterized in that: The disc comprises a front side and a back side which are arranged opposite to each other, and the trimming structure is arranged on the front side and / or the back side of the disc.

7. The dish repairing device according to claim 1, characterized in that: There are multiple trimming structures, which are arranged circumferentially at intervals along the edge of the disk, or there is one trimming structure, which extends circumferentially along the outer extension of the disk and closes to form an annular structure.

8. A disk repair device, characterized in that: include: Upper grinding disc; A lower grinding disc, arranged coaxially with the upper grinding disc; A sun gear is arranged at the center of the lower grinding disc and is coaxial with the lower grinding disc; An external gear is arranged at the edge of the lower grinding disc and is coaxial with the lower grinding disc; At least two disc repairers are in contact with the lower grinding disc, the gear of each disc repairer is meshed with the external gear and the gear of the sun gear, and the disc diameter of the disc repairer is equal to the diameter difference between the sun gear and the external gear. The disc repairer is the disc repairer according to any one of claims 1 to 7.

9. The disk repairing device according to claim 8, characterized in that: The trimming structure of the repairer is arranged on the front or back of the circular disc of the repairer, the front of at least one repairer corresponds to the upper grinding disc, and the back of at least one repairer corresponds to the upper grinding disc.

10. The disk repairing device according to claim 8, characterized in that: The trimming structure of the disc trimmer is arranged on the front and back sides of the disc at the same time.

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