Jig for CSP (Chip Scale Package) film coating

Abstract

The utility model relates to the technical field of electronic chip packaging production equipment, in particular to a jig for CSP (Chip Scale Package) film covering, which comprises a carrying table and a substrate positioning assembly for positioning a substrate, the film positioning assembly is used for positioning the epoxy resin film; the clamping section is located between the second baffle and the first baffle and used for clamping the edge of the base plate, the base plate positioning assembly and the film positioning assembly are arranged to position the base plate and the epoxy resin film respectively, positioning and pasting of the epoxy resin film are facilitated, the risk that pasting deviation is prone to occurring in the manual film pasting process is reduced, and the film pasting efficiency is improved. And the film covering efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic chip packaging production equipment, in particular to a fixture for CSP packaging film covering. Background Art

[0002] In the CSP packaging of surface acoustic wave devices, there is a process of laminating an epoxy resin film. During the film covering process, since the size of the epoxy resin film to be laminated is smaller than the semi-finished substrate to be covered with the film, and its texture is relatively soft, it is easy to cause misalignment during lamination. Content of the Utility Model

[0003] The purpose of the utility model is to solve the above technical problems and propose a fixture for CSP packaging film covering.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] Design a fixture for CSP packaging film covering, including a carrier table, and also including

[0006] A substrate positioning component, which is used to position the substrate. Among them, the substrate positioning component includes two adjacent first baffles arranged on the carrier table. The first baffle is provided with a first positioning edge, and the two first positioning edges are perpendicular to each other to form an angle one. The height H of the first baffle is greater than the thickness T of the substrate;

[0007] A film positioning component, which is used to position the epoxy resin film. Among them, the film positioning component includes second baffles respectively arranged on the first baffles. The second baffle is provided with a second positioning edge, and the two second positioning edges are perpendicular to each other to form an angle two;

[0008] A clamping interval, which is located between the second baffle and the first baffle and is used to clamp the edge of the substrate.

[0009] Further, it also includes an adjustment component, which is used to adjust the position of the film positioning component on the substrate positioning component. Among them, the adjustment component includes a support plate connected to the bottom of the carrier table, a translation plate connected to the film positioning component, a limiting part for fixing the translation plate at different positions on the support plate, and a guiding part for guiding the movement of the translation plate.

[0010] Further, the limiting part includes a mounting block arranged on the support plate, a sliding hole penetrating the translation plate, and a positioning bolt passing through the sliding hole and screwed with the mounting block.

[0011] Further, it also includes a pointer arranged on the mounting block and a scale arranged on the translation plate.

[0012] Further, the guiding portion includes a hanging plate provided at one end of the translation plate and a sliding rod provided on the mounting block and slidably engaged with the hanging plate.

[0013] Further, a return spring is connected between the hanging plate and the mounting block.

[0014] A jig for CSP package film coating proposed by the present utility model has the beneficial effects that: by setting a substrate positioning component and a film positioning component to position the substrate and the epoxy resin film respectively, it is convenient for the positioning and pasting of the epoxy resin film, reduces the risk of easy deviation during the manual film coating process, and improves the film coating efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic structural diagram of the present utility model;

[0016] Figure 2 is another schematic structural diagram of the present utility model;

[0017] Figure 3 is a schematic diagram of the film positioning component;

[0018] Figure 4 is a top view of the film positioning component;

[0019] Figure 5 is a schematic diagram of the adjustment component; DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments.

[0021] Referring to Figures 1-5 an embodiment of the present utility model, which discloses a jig for CSP package film coating, including a stage 1, and further including

[0022] a substrate positioning component 2 for positioning a substrate 3. Among them, the substrate positioning component 2 includes two adjacent first baffles 201 provided on the stage 1. A first positioning edge 202 is provided on the first baffle 201. The two first positioning edges 202 are perpendicular to each other to form an included angle one 203. The height H of the first baffle 201 is greater than the thickness T of the substrate 3. Preferably, in this embodiment, the tabletop of the stage 1 can be provided with a special coating or wrapping material, which is beneficial to reducing the damage to the bottom pads of the substrate 3. After the substrate 3 contacts the first baffle 201, the included angle one 203 positions the substrate 3;

[0023] The film positioning assembly 4 is used to position the epoxy resin film 5 on the substrate 3. Among them, the film positioning assembly 4 includes a second baffle 401 respectively arranged on the first baffle 201. A second positioning edge 402 is provided on the second baffle 401. The two second positioning edges 402 are perpendicular to each other to form an included angle two 403. After the epoxy resin film 5 contacts the second baffle 401, the included angle two 403 positions the epoxy resin film 5.

[0024] The clamping interval 6 is located between the second baffle 401 and the first baffle 201 and is used to clamp the edge of the substrate 3. Preferably, the height H in this embodiment is in the range of 0.1 - 1 mm. The height H of the first baffle 201 is greater than the thickness T of the substrate 3, which is convenient for the substrate 3 to be inserted into the clamping interval 6, but does not exceed the total thickness of the finished product to prevent the epoxy resin film 5 from also being inserted into the above clamping interval 6, resulting in misalignment.

[0025] In this utility model, by setting the substrate positioning assembly 2 and the film positioning assembly 4 to position the substrate 3 and the epoxy resin film 5 respectively, it is convenient for the positioning and pasting of the epoxy resin film 5, reduces the risk of easy misalignment during the manual film pasting process, and improves the film pasting efficiency.

[0026] In an optional implementation manner of this utility model, an adjustment assembly 7 is further included, which is used to adjust the position of the film positioning assembly 4 on the substrate positioning assembly 2. Among them, the adjustment assembly 7 includes a support plate 701 connected to the bottom of the carrier 1, a translation plate 702 connected to the film positioning assembly 4, a limiting part 703 for fixing the translation plate 702 at different positions on the support plate 701, and a guiding part 704 for guiding the movement of the translation plate 702. By adjusting the position of the translation plate 702 through the limiting part 703, the film positioning assembly 4 is limited to different positions to use substrates 3 of different sizes. Through the setting of the guiding part 704, the stability of the movement of the translation plate 702 is ensured, and the film positioning assembly 4 is prevented from shifting during the process of adjusting the position.

[0027] In an optional implementation manner of this utility model, the limiting part 703 includes a mounting block 7031 arranged on the support plate 701, a sliding hole 7032 penetrating the translation plate 702, and a positioning bolt 7033 passing through the sliding hole 7032 and screwed to the mounting block 7031. Preferably, the top of the mounting block 7031 in this embodiment is in sliding fit with the bottom of the translation plate 702. By passing the positioning bolt 7033 through the sliding hole 7032 and screwing it to the mounting block 7031, the position of the translation plate 702 can be fixed.

[0028] In an optional implementation manner of this utility model, a pointer 7034 arranged on the mounting block 7031 and a scale 7035 arranged on the translation plate 702 are further included. Through the pointer 7034 and the scale 7035, the user can accurately adjust the moving distance of the translation plate 702 during actual use, improving work efficiency.

[0029] In an alternative embodiment of the present utility model, the guiding portion 704 includes a hanging plate 7041 provided at one end of the translation plate 702 and a sliding rod 7042 provided on the mounting block 7031 and slidably engaged with the hanging plate 7041. Through the sliding engagement between the sliding rod 7042 and the hanging plate 7041, the movement of the translation plate 702 can be guided to prevent the translation plate 702 from shifting during movement.

[0030] In an alternative embodiment of the present utility model, a return spring 7043 is connected between the hanging plate 7041 and the mounting block 7031. By providing the return spring 7043, after the positioning bolt 7033 releases the position fixing of the translation plate 702, the hanging plate 7041 can be quickly reset.

[0031] The above is only the preferred specific embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution and the inventive concept of the present utility model, makes equivalent substitutions or changes, and should be covered within the protection scope of the present utility model.

Claims

1. A fixture for CSP packaging film coating, comprising a carrier (1), characterized in that: Also includes A substrate positioning assembly (2) for positioning a substrate (3), wherein the substrate positioning assembly (2) comprises two first baffles (201) adjacently arranged on the carrier (1), the first baffles (201) being provided with first positioning edges (202), the two first positioning edges (202) being perpendicular to each other to form an angle 1 (203), and the height H of the first baffles (201) being greater than the thickness T of the substrate (3); A film positioning assembly (4) for positioning an epoxy resin film (5), wherein the film positioning assembly (4) comprises second baffles (401) respectively arranged on the first baffles (201), the second baffles (401) being provided with second positioning edges (402), and the two second positioning edges (402) being perpendicular to each other to form an angle 2 (403); A clamping zone (6) is located between the second baffle plate (401) and the first baffle plate (201) and is used for clamping the edge of the substrate (3).

2. The jig for CSP packaging film coating according to claim 1, characterized in that: It also includes an adjustment component (7) for adjusting the position of the membrane positioning component (4) on the substrate positioning component (2), wherein the adjustment component (7) includes a support plate (701) connected to the bottom of the carrier (1), a translation plate (702) connected to the membrane positioning component (4), a limiting portion (703) for fixing the translation plate (702) at different positions on the support plate (701), and a guiding portion (704) for guiding the movement of the translation plate (702).

3. The jig for CSP packaging film coating according to claim 2, characterized in that: The limiting portion (703) comprises a mounting block (7031) arranged on the support plate (701), a sliding hole (7032) penetrating the translation plate (702), and a positioning bolt (7033) passing through the sliding hole (7032) and screwed to the mounting block (7031).

4. The jig for CSP packaging film coating according to claim 3, characterized in that: It also includes a pointer (7034) arranged on the mounting block (7031) and a scale (7035) arranged on the translation plate (702).

5. The jig for CSP packaging film coating according to claim 3, characterized in that: The guide portion (704) comprises a hanging plate (7041) arranged at one end of the translation plate (702), and a sliding rod (7042) arranged on the mounting block (7031) and slidably matched with the hanging plate (7041).

6. The jig for CSP packaging film coating according to claim 5, characterized in that: A return spring (7043) is connected between the hanging plate (7041) and the mounting block (7031).

Images