Chip bearing device

Abstract

The utility model discloses a chip bearing device. The chip bearing device comprises a plurality of stacked bearing discs, a bearing surface and a cover body surface are respectively arranged on two sides of the bearing disc; a plurality of rows of bearing units are arranged on the bearing surface, and a plurality of rows of cover body units are arranged on the cover body surface; a first fixed supporting piece is arranged between the bearing units in the adjacent rows, and a second fixed supporting piece is arranged between the cover body units in the adjacent rows. The first fixed supporting piece abuts against the second fixed supporting piece of the adjacent layer of bearing disc. The plurality of stacked bearing discs can enable the device to utilize the space to the maximum in the vertical direction, so that more chips can be accommodated; the first fixing supporting piece and the second fixing supporting piece play a role in transmitting loads and dispersing stress in the stacking process, and the strength, the bearing capacity and the durability of the whole device are improved.

Description

Technical Field

[0001] The utility model relates to the field of chip carriers, and in particular to a chip carrying device. Background Art

[0002] A chip carrier tray is a plastic product used for chip carrying, transportation and encapsulation testing to prevent chips from being damaged and facilitate automated detection and installation. For example, the chip carrier tray disclosed in the publication number CN1553251A has a base, a convex part and a concave part. The convex part is arranged on the base. The concave part is formed on the other side of the base relative to the convex part. The convex part has a concave part, a first connecting part and a second connecting part. The first connecting part is a convex block arranged in the concave part. The second connecting part is also a convex block arranged in the concave part. The chip carrier tray can allow contaminant particles to fall into the concave space between the first connecting part and the second connecting part, avoiding the adhesion of contaminant particles to the chips and preventing the contaminant particles from damaging the chips. During the use of the chip carrier tray, through the stacking method, the convex part of one chip carrier tray and the concave part of another chip carrier tray form a receiving space for carrying chips. However, in actual applications, when multiple chip carrier trays are stacked, due to their own weight or external forces during transportation, the carrier trays are prone to deformation, and then the chips in the receiving space are damaged. Summary of the Invention

[0003] In order to overcome the defects in the above-mentioned prior art, a chip carrying device with a simple structure and convenient for chip transportation and storage is provided.

[0004] The technical solution of the utility model is as follows: A chip carrying device includes a plurality of stacked carrier trays; both sides of the carrier tray are a carrying surface and a cover surface respectively; a plurality of rows of carrying units are arranged on the carrying surface, and a plurality of rows of cover units are arranged on the cover surface; a first fixing support is arranged in the middle between adjacent rows of carrying units, and a second fixing support is arranged in the middle between adjacent rows of cover units; the first fixing support abuts against the second fixing support of the adjacent layer of carrier trays. The plurality of stacked carrier trays can enable the device to maximize the use of space in the vertical direction, so as to accommodate more chips; the first fixing support and the second fixing support play a role in transmitting loads and dispersing stresses during the stacking process, improving the strength of the whole device, as well as the load-bearing capacity and durability.

[0005] Preferably, the plurality of rows of carrying units and the plurality of rows of cover units are symmetrically arranged on both sides of the carrier tray, which is convenient for the carrying units to be matched and engaged with the cover units of the adjacent layer of carrier trays during stacking.

[0006] Preferably, the first fixing support is vertically arranged on the carrying surface, and the second fixing support is vertically arranged on the cover surface; the vertically arranged supports can more effectively resist the forces in the horizontal direction, thus providing higher stability.

[0007] Preferably, the shapes of the first fixed support member and the second fixed support member are both cylindrical, and the diameter of the first fixed support member is greater than that of the second fixed support member. The cylindrical design enables the fixed support members to form a stable support structure when stacked. Since the diameter of the first fixed support member is larger, it can provide a larger contact area and stronger support force, thereby ensuring the stability of the bearing unit during the stacking process.

[0008] Preferably, the bearing unit includes a first frame body and a first limiting plate; the cover unit includes a second frame body and a second limiting plate. When the bearing trays are stacked, the first frame body and the second frame body of the adjacent-layer bearing trays are used to bear the front and back sides of the chips, and the first limiting plate and the second limiting plate of the adjacent-layer bearing trays are used to prevent the displacement of the chips and protect the chips from damage.

[0009] Preferably, the first limiting plate is assembled in the middle of the two side edges of the first frame body, and the second limiting plate is assembled at both ends of the two side edges of the second frame body.

[0010] Preferably, the first limiting plate is assembled at both ends of the two side edges of the first frame body, and the second limiting plate is assembled in the middle of the two side edges of the second frame body.

[0011] Preferably, the first limiting plate is engaged with the second limiting plate of the adjacent-layer bearing tray. The engagement helps to form a tighter seal between the bearing unit and the cover unit, which can not only prevent pollutants such as dust and moisture from entering the device interior, but also keep the interior environment of the device clean and dry, providing better storage conditions for the chips.

[0012] Preferably, through holes are provided through the centers of the bearing unit and the correspondingly symmetrically arranged cover unit to prevent vacuum adsorption when the bearing trays are stacked, so as to prevent the chips from being adsorbed and falling off, causing damage. In addition, the design of the through holes at the centers maintains the symmetry of the bearing unit and the cover unit. This symmetry not only makes the device more aesthetically pleasing visually, but also helps to ensure the balance of the device when stressed. During stacking or transportation, the through holes at the centers can reduce the risk of deformation or damage caused by uneven stress.

[0013] Preferably, an inner cavity for accommodating the chips is formed between the bearing unit of the bearing tray and the cover unit of the adjacent-layer bearing tray; the total height of the first fixed support member and the second fixed support member of the adjacent-layer bearing tray is equal to the height of the inner cavity for accommodating the chips, ensuring the strengthening effect of the support members on the chip bearing device.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] A chip carrier device, in which the first fixed support on each carrier plate abuts against the second fixed support on the adjacent-layer carrier plate, plays a role in transmitting load and dispersing stress, enhancing the overall strength of the carrier device. When multiple chip carrier plates are stacked, the carrier plates will not be deformed due to their own weight or external forces during transportation, thereby damaging the chips in the inner cavity.

[0016] Other features and advantages of the present utility model will be disclosed in detail in the following specific embodiments and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present utility model will be further described below with reference to the drawings:

[0018] Figure 1 It is a schematic structural diagram of the bearing surface of the present utility model;

[0019] Figure 2 It is a schematic structural diagram of the cover surface of the present utility model;

[0020] Figure 3 It is a schematic side installation diagram of the carrier plate of the present utility model;

[0021] Figure 4 For Figure 3 The enlarged detail schematic diagram at A in

[0022] The description of the reference numerals in the drawings is as follows:

[0023] Carrier plate 1, bearing surface 11, cover surface 12, bearing unit 2, first fixed support 3, cover unit 4, second fixed support 5, first frame 21, first limiting plate 22, second frame 41, second limiting plate 42, through hole 6. SPECIFIC EMBODIMENTS

[0024] The technical solutions of the embodiments of the present utility model will be explained and described below with reference to the drawings of the embodiments of the present utility model. However, the following embodiments are only the preferred embodiments of the present utility model and not all of them. Based on the embodiments in the embodiments, other embodiments obtained by those skilled in the art without creative efforts all fall within the protection scope of the present utility model.

[0025] In the following description, terms such as "inner", "outer", "upper", "lower", "left", "right", etc. indicating directions or position relationships are only for the convenience of describing the embodiments and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the present utility model.

[0026] As Figures 1 to 4As shown in the figure, a chip carrier device includes a plurality of stacked carrier disks 1. By means of the plurality of stacked carrier disks 1, space can be maximally utilized in the vertical direction, thereby accommodating more chips. On both sides of the carrier disk 1 are a carrier surface 11 and a cover surface 12 respectively. A plurality of rows of carrier units 2 are provided on the carrier surface 11, and a plurality of rows of cover units 4 are provided on the cover surface 12; a first fixing support 3 is provided in the middle of adjacent rows of carrier units 2, and a second fixing support 5 is provided in the middle of adjacent rows of cover units 4; an inner cavity for accommodating chips is formed between the carrier unit 2 of the carrier disk 1 and the cover unit 4 of the adjacent layer of carrier disks 1; since the first fixing support 3 of the carrier disk 1 abuts against the second fixing support 5 of the adjacent layer of carrier disks 1, the stability of the entire device is improved, so that when a plurality of carrier disks 1 are stacked, deformation will not occur due to the self-weight of the chip carrier disk or the external force during transportation and loading, so as to protect the chips.

[0027] Among them, the plurality of rows of carrier units 2 and the plurality of rows of cover units 4 are symmetrically arranged on both sides of the carrier disk 1, which is convenient for the carrier unit to be matched and engaged with the cover unit of the adjacent layer of carrier disks during stacking.

[0028] The first fixing support 3 is vertically arranged on the carrier surface 11, and the second fixing support 5 is vertically arranged on the cover surface 12. Vertical arrangement can provide better stability and reduce shaking or tilting caused by external forces. The vertically installed first fixing support 3 and second fixing support 5 have better stress dispersion, improving the overall strength of the carrier disk.

[0029] Furthermore, the first fixing support 3 is located in the gap between a plurality of adjacent rows of carrier units 2 and is a columnar body extending upward from one side of the carrier surface 11 of the carrier disk 1; the second fixing support 5 is located in the gap between a plurality of adjacent rows of cover units 4 and is a columnar body extending downward from one side of the cover surface 12 of the carrier disk 1. In this embodiment, the shapes of both the first fixing support 3 and the second fixing support 5 are cylindrical, and the diameter of the first fixing support 3 is greater than the diameter of the second fixing support 5; the first fixing support 3 can provide a larger contact area and stronger supporting force, thereby ensuring the stability of the carrier disk 1 during the stacking process.

[0030] Among them, after the carrier unit 2 of the carrier disk 1 and the cover unit 4 of the adjacent layer of carrier disks 1 are stacked, the first fixing support 3 of the carrier disk 1 abuts against the second fixing support 5 of the adjacent layer of carrier disks 1. The sum of the heights of the above-mentioned first fixing support 3 and second fixing support 5 is equal to the gap height after the two carrier disks 1 are stacked, that is, the total height of the first fixing support 3 and the second fixing support 5 is equal to the height of the inner cavity for accommodating chips; the first fixing support 3 and the second fixing support 5 increase the contact points when the carrier disks 1 are stacked, improving the strength of the chip carrier device and avoiding deformation of the carrier disks 1 under their own weight or external forces.

[0031] Considering the self-weight problem of the carrier plate 1, multiple first fixing supports 3 and second fixing supports 5 are assembled and symmetrically arranged along the gaps between the carrier units 2 and the cover units 4 respectively, and their quantity can be set according to the strength of the carrier plate 1.

[0032] Among them, the carrier unit 2 includes a first frame 21 and a first limiting plate 22; the cover unit 4 includes a second frame 41 and a second limiting plate 42; the end face of the first frame 21 is used to carry the front side of the chip, and the end face of the second frame 41 of the adjacent-layer carrier plate 1 is used to carry the back side of the chip; the first limiting plate 22 and the second limiting plate 42 of the adjacent-layer carrier plate 1 cooperate to limit and fix the chip.

[0033] Furthermore, the first limiting plate 22 is assembled in the middle of the two sides of the first frame 21; the second limiting plate 42 is assembled at both ends of the two sides of the second frame 41. The first limiting plate 22 and the second limiting plate 42 of the adjacent-layer carrier plate 1 are engaged with each other. This prevents the carrier unit 2 and the cover unit 4 from moving relatively or being misaligned when subjected to external forces, thereby ensuring the stability of the entire device; it also prevents pollutants such as dust and moisture from entering the inner cavity for accommodating the chip, keeping the inner cavity of the device clean and dry, and providing better storage conditions for the chip.

[0034] Among them, through holes 6 penetrate through the centers of the carrier unit 2 and its corresponding symmetrically arranged cover unit 4. The through holes 6 penetrate through the central positions of the carrier unit 2 and the cover unit 4 to prevent vacuum adsorption when the carrier plates are stacked, so that the chip is adsorbed and then falls, causing damage.

[0035] During use, after storing the chips in all the carrier units 2 of the first carrier plate, place the second carrier plate on the first carrier plate. At this time, the cover unit 4 of the second carrier plate and the carrier unit 2 of the first carrier plate form an accommodation space for accommodating the chips. The first limiting plate 22 of the first carrier plate is engaged with the second limiting plate 42 of the second carrier plate, and the first fixing support 3 of the first carrier plate abuts against the second fixing support 5 of the second carrier plate, so that the carrier unit 2, the cover unit 3, and the chips together form a stable loading structure, and the chip loading device formed after multi-layer stacking will not be deformed due to its own weight and external forces.

[0036] The above is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that the present invention includes but is not limited to the content described in the drawings and the above specific implementation manner. Any modification that does not deviate from the functional and structural principles of the present invention will be included in the scope of the claims.

Claims

1. A chip carrier device, comprising a plurality of stacked carrier plates (1); characterized in that: The two sides of the carrier plate (1) are respectively a carrier surface (11) and a cover surface (12); a plurality of rows of carrier units (2) are arranged on the carrier surface (11), and a plurality of rows of cover units (4) are arranged on the cover surface (12); a first fixed support member (3) is arranged in the middle of the carrier units (2) in adjacent rows, and a second fixed support member (5) is arranged in the middle of the cover units (4) in adjacent rows; the first fixed support member (3) and the second fixed support member (5) of the carrier plate (1) in adjacent layers are in abutment with each other.

2. A chip carrier device according to claim 1, characterized in that: A plurality of rows of the carrying units (2) and a plurality of rows of the cover units (4) are symmetrically arranged on both sides of the carrying plate (1).

3. The chip carrier device according to claim 1, characterized in that: The first fixed support member (3) is arranged vertically on the bearing surface (11), and the second fixed support member (5) is arranged vertically on the cover surface (12).

4. The chip carrier device according to claim 1, characterized in that: The first fixed support member (3) and the second fixed support member (5) are both cylindrical in shape, and the diameter of the first fixed support member (3) is greater than the diameter of the second fixed support member (5).

5. The chip carrier device according to claim 1, characterized in that: The bearing unit (2) comprises a first frame (21) and a first limiting plate (22); the cover unit (4) comprises a second frame (41) and a second limiting plate (42).

6. A chip carrier device according to claim 5, characterized in that: The first limiting plate (22) is mounted on the middle of the two side edges of the first frame (21), and the second limiting plate (42) is mounted on the two ends of the two side edges of the second frame (41).

7. The chip carrier device according to claim 5, characterized in that: The first limiting plate (22) is mounted at both ends of two side edges of the first frame (21), and the second limiting plate (42) is mounted in the middle of two side edges of the second frame (41).

8. The chip carrier device according to claim 5, characterized in that: The first limiting plate (22) is engaged with the second limiting plate (42) of the adjacent layer of the carrier plate (1).

9. The chip carrier device according to claim 2, characterized in that: A through hole (6) is formed at the center of the bearing unit (2) and the corresponding symmetrically arranged cover unit (4).

10. The chip carrier device according to claim 1, characterized in that: An inner cavity for accommodating a chip is formed between the carrying unit (2) of the carrying plate (1) and the cover unit (4) of the adjacent layer of the carrying plate (1); the total height of the first fixed support member (3) and the second fixed support member (5) of the adjacent layer of the carrying plate (1) is equal to the height of the inner cavity for accommodating a chip.

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