Pitch type carrier plate lifting mechanism

Abstract

The utility model discloses a silicon wafer carrier plate, a supporting shaft mechanism, a lifting shaft mechanism and a power mechanism, wherein the supporting shaft mechanism, the lifting shaft mechanism and the power mechanism are arranged around the silicon wafer carrier plate in a double-group symmetrical or multi-surface combined manner. The lifting shaft mechanism is used as lifting power, the supporting shaft mechanism is used as a cache supporting position, the lifting shaft mechanism is driven to vertically move up and down in the working process, the silicon wafer carrier plate is lifted to the height of the adjacent upper layer from the bottom layer, at the moment, the silicon wafer carrier plate is supported by the supporting shaft, and the lifting shaft mechanism descends to the original position; through several times of reciprocation, the silicon wafer carrier plates are jacked to the uppermost position layer by layer, the purpose of lifting the silicon wafer carrier plates is achieved, the buffer space of the carrier plates can be effectively increased in a future production line, the equipment space can be effectively reduced, workshop space occupation can be reduced, and the silicon wafer carrier plate jacking device has great significance on future industry development and has good application prospects.

Description

Technical Field

[0001] The utility model relates to the field of vertical transfer equipment, in particular to a pitch-type carrier lifting mechanism. Background Art

[0002] Today, with the rapid development of photovoltaics, for the production line of photovoltaic cells, improving the production capacity of the whole line of equipment, reducing the equipment size and production cost has always been an unchanged topic in the entire history of photovoltaic development. With the continuous demand for large-size cells in the new market, the overall size of the equipment has gradually increased, and the hardware cost has also risen accordingly, and there are obstacles to reducing the cost of cells.

[0003] In the current mainstream CVD and PVD automatic loading and unloading equipment in the market, for the vertical transfer mechanism of the carrier, a power source such as a motor is mostly used to drive pulleys and sprockets for vertical transmission, so as to achieve the purpose of lifting the carrier between the upper and lower positions. Because the single lifting stroke and span of the carrier are relatively large, if such a mechanism is used, both the power and guiding mechanisms need to be relatively long, and the guide rails and power bases need to occupy a large amount of equipment space. This structure cannot well meet the needs of some space-compact occasions.

[0004] Therefore, it is necessary to design a new carrier lifting equipment, which can effectively reduce the equipment space, reduce the workshop space occupation, and has great significance for the future development of the industry and good application prospects. Summary of the Utility Model

[0005] In view of the above problems, the utility model provides a pitch-type carrier lifting mechanism, which can realize the long-distance vertical transfer of the carrier while performing short-stroke reciprocating motion, effectively reduce the space occupied by the internal structure of the equipment, reduce the equipment cost, and reduce the workshop space occupation.

[0006] To solve the above technical problems, the technical solution adopted by the utility model is: a pitch-type carrier lifting mechanism, including a silicon wafer carrier, a support shaft mechanism, a lifting shaft mechanism and a power mechanism, and the support shaft mechanism, the lifting shaft mechanism and the power mechanism are arranged around the silicon wafer carrier in a double-group symmetric or multi-sided combination form;

[0007] The support shaft mechanism includes a support base plate, a support shaft seat, a support shaft joint, a support branch shaft, a support branch block, a support cylinder, a support base, a support follower shaft, a support swing rod, a support swing joint, and a support swing arm. The support shaft seat is installed on the support base plate, and support shaft joints are provided at both the upper and lower ends of the support shaft seat. The support branch shaft is fixed through the support shaft joint, and a support branch block is installed on the support branch shaft. The support branch blocks are arranged in multiple layers. The support cylinder is connected to the support base, the support base is connected to the support swing rod through the support follower shaft, the support swing rod is connected to the support swing arm through the support swing joint, and the support swing arm is connected to the support branch shaft;

[0008] The lifting shaft mechanism includes a lifting seat plate, a lifting shaft seat, a lifting shaft joint, a lifting support shaft, a lifting support block, a lifting cylinder, a lifting base, a lifting follower shaft, a lifting swing rod, a lifting swing joint, and a lifting swing arm. The lifting shaft seat is installed on the lifting seat plate, and lifting shaft joints are provided at both the upper and lower ends of the lifting shaft seat. The lifting support shaft is fixed through the lifting shaft joint, and the lifting support block is installed on the lifting support shaft. The lifting support blocks are arranged in multiple layers. The lifting cylinder is connected to the lifting base, the lifting base is connected to the lifting swing rod through the lifting follower shaft, the lifting swing rod is connected to the lifting swing arm through the lifting swing joint, and the lifting swing arm is connected to the lifting support shaft;

[0009] The power mechanism includes a motor plate, a driving wheel, a chain, a driven wheel, a base plate, a motor, a lifting plate, a slider, and a guide rail. The motor plate is installed on the lower side of the base plate, the motor plate is connected to the motor, the driving wheel is installed on the motor, the driven wheel is installed on the upper side of the base plate, the chain connects the driving wheel and the driven wheel in series and is connected to the lifting plate. The slider and the guide rail are assembled into a set and fixed to the base plate, and the lifting plate is slidably connected to the base plate through the slider and the guide rail;

[0010] The lifting shaft mechanism is installed on the lifting plate of the power mechanism.

[0011] Further, the support shaft mechanism is a four-axis and four-layer structure, and the lifting shaft mechanism is a four-axis and five-layer structure.

[0012] Further, the support blocks and the lifting support blocks are both equally spaced, and the spacing of the support blocks is the same as the spacing of the lifting support blocks.

[0013] Further, the vertical movement stroke of the power mechanism is greater than the spacing of the support blocks each time.

[0014] Further, the power mechanism can also adopt pneumatic drive or hydraulic drive, and the transmission methods include screw drive, lead screw drive, belt drive, rocker, and eccentric wheel shaft.

[0015] From the above description of the structure of the present invention, compared with the prior art, the present invention has the following advantages:

[0016] The present invention adopts a pitch-type lifting transmission form, uses multi-layer staggered reciprocating motion to lift the carrier plate layer by layer, can effectively increase the buffer space of the carrier plate in the future production line, can effectively reduce the equipment space, reduce the occupation of the workshop space, has great significance for the future development of the industry, has a good application prospect. When the CVD or PVD main equipment fails and stops during the actual production process, this technology can effectively solve the problem of rapid discharge of the carrier plate and avoid the "wafer damage" situation caused by the inability to discharge the wafers in time. Description of the Drawings

[0017] The accompanying drawings, which form a part of this application, are used to provide a further understanding of the present utility model. The schematic embodiments and descriptions thereof of the present utility model are used to explain the present utility model and shall not constitute an improper limitation to the present utility model. In the drawings:

[0018] Figure 1 is the axonometric view of the overall structure of the present utility model;

[0019] Figure 2 is the axonometric view of the avoidance position of the support shaft mechanism of the present utility model;

[0020] Figure 3 for the present utility model Figure 2 side view structure diagram;

[0021] Figure 4 is the axonometric view of the avoidance position of the lifting shaft mechanism of the present utility model;

[0022] Figure 5 for the present utility model Figure 4 side view structure diagram;

[0023] Figure 6 is the schematic diagram of the power mechanism of the present utility model;

[0024] Figure 7 is the working schematic diagram of the present utility model for lifting the second silicon wafer carrier;

[0025] Figure 8 is the working schematic diagram of the present utility model for placing the second silicon wafer carrier;

[0026] Figure 9 is the working schematic diagram of the present utility model for lifting the silicon wafer carrier to the uppermost position. Detailed implementation manners

[0027] In order to make the objectives, technical solutions and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0028] Embodiment

[0029] Referring to Figures 1-6 , a pitch-type carrier lifting mechanism includes a silicon wafer carrier 01, a support shaft mechanism 100, a lifting shaft mechanism 200, and a power mechanism 300. The support shaft mechanism 100, the lifting shaft mechanism 200, and the power mechanism 300 are symmetrically arranged in double groups around the silicon wafer carrier 01;

[0030] The support shaft mechanism 100 includes a support base plate 101, a support shaft seat 102, a support shaft joint 103, a support branch shaft 104, a support branch block 105, a support cylinder 111, a support base 112, a support follower shaft 113, a support swing rod 114, a support swing joint 115, and a support swing arm 116. The support base plate 101 is provided with the support shaft seat 102. Both the upper and lower ends of the support shaft seat 102 are equipped with the support shaft joints 103. The support branch shaft 104 is fixed through the support shaft joints 103. The support branch block 105 is installed on the support branch shaft 104. The support branch blocks 105 are arranged in multiple layers. The support cylinder 111 is connected to the support base 112. The support base 112 is connected to the support swing rod 114 through the support follower shaft 113. The support swing rod 114 is connected to the support swing arm 116 through the support swing joint 115. The support swing arm 116 is connected to the support branch shaft 104. The support shaft mechanism 100 is a four-axis and four-layer structure;

[0031] The lifting shaft mechanism 200 includes a lifting base plate 201, a lifting shaft seat 202, a lifting shaft joint 203, a lifting branch shaft 204, a lifting branch block 205, a lifting cylinder 211, a lifting base 212, a lifting follower shaft 213, a lifting swing rod 214, a lifting swing joint 215, and a lifting swing arm 216. The lifting base plate 201 is provided with the lifting shaft seat 202. Both the upper and lower ends of the lifting shaft seat 202 are equipped with the lifting shaft joints 203. The lifting branch shaft 204 is fixed through the lifting shaft joints 203. The lifting branch block 205 is installed on the lifting branch shaft 204. The lifting branch blocks 205 are arranged in multiple layers. The lifting cylinder 211 is connected to the lifting base 212. The lifting base 212 is connected to the lifting swing rod 214 through the lifting follower shaft 213. The lifting swing rod 214 is connected to the lifting swing arm 216 through the lifting swing joint 215. The lifting swing arm 216 is connected to the lifting branch shaft 204. The lifting shaft mechanism 200 is a four-axis and five-layer structure;

[0032] The power mechanism 300 includes a motor plate 301, a driving wheel 302, a chain 303, a driven wheel 304, a base plate 305, a motor 306, a lifting plate 311, a slider 312, and a guide rail 313. The motor plate 301 is installed on the lower side of the base plate 305. The motor plate 301 is connected to the motor 306. The driving wheel 302 is installed on the motor 306. The driven wheel 304 is installed on the upper side of the base plate 305. The chain 303 connects the driving wheel 302 and the driven wheel 304 in series and is connected to the lifting plate 311. The slider 312 and the guide rail 313 are assembled as a set and fixed to the base plate 305. The lifting plate 311 is slidably connected to the base plate 305 through the slider 312 and the guide rail 313;

[0033] The lifting shaft mechanism 200 is installed on the lifting plate 311 of the power mechanism.

[0034] The support blocks 105 and the lifting blocks 205 are distributed at equal intervals. The interval between the support blocks 105 is the same as the interval between the lifting blocks 205 . The vertical movement stroke of the power mechanism 300 each time is greater than the interval between the support blocks 105 .

[0035] During the work process, Figure 2 , Figure 3 As shown, first, the first silicon wafer carrier 01 is placed at the waiting position of the bottom layer.

[0036] The lifting cylinder 211 is in an extended state, driving the lifting base 212 to move to the left; at the same time, the lifting base 212 moves the lifting swing rod 214 to the left through the lifting follower shaft 213, and swings the lifting swing arm 216 to the left by a certain angle through the lifting swing joint 215; as the angle of the lifting swing arm 216 changes, the lifting support shaft 204 also rotates to the left by a certain angle at the original axis position, driving the lifting support block 205 to move to the side to the avoidance position.

[0037] The motor 306 lowers the lifting plate 311 together with the lifting shaft mechanism 200 to the bottom position through the chain 303; the upper end surface of the lifting support block 205 on the lifting support shaft 204 is lower than the lower end surface of the first silicon wafer carrier 01.

[0038] The lifting cylinder 211 returns to the retracted state, driving the lifting base 212 to move to the right; at the same time, the lifting base 212 moves the lifting swing rod 214 to the right through the lifting follower shaft 213, and swings the lifting swing arm 216 to the right by a certain angle through the lifting swing joint 215; as the angle of the lifting swing arm 216 changes, the lifting support shaft 204 also rotates to the right by a certain angle at the original axial position, driving the lifting support block 205 to move sideways to the working position.

[0039] At the same time, the support cylinder 111 is in an extended state, driving the support base 112 to move to the left; at the same time, the support base 112 moves the support swing rod 114 to the left through the support follower shaft 113, and swings the support swing arm 116 to the left by a certain angle through the support swing joint 115; as the angle of the support swing arm 116 changes, the support shaft 104 also rotates to the left by a certain angle at the original axis position, driving the support block 105 to move sideways to an avoidance position.

[0040] Then as Figure 4 , Figure 5 As shown, the motor 306 lifts the lifting plate 311 together with the lifting shaft mechanism 200 to the top layer position through the chain 303; during the process, the lifting support block 205 on the lifting support shaft 204 will lift the first silicon wafer carrier 01 to a certain height; at this time, the lower end surface of the first silicon wafer carrier 01 is higher than the upper end surface of the support block 105 on the support shaft 104.

[0041] The support cylinder 111 returns to the contracted state, driving the support base 112 to move to the right; at the same time, the support base 112 moves the support swing rod 114 to the right through the support follower shaft 113, and swings the support swing arm 116 to the right by a certain angle through the support swing joint 115; as the angle of the support swing arm 116 changes, the support shaft 104 also rotates to the right by a certain angle at the original axis position, driving the support block 105 to move sideways to the working position.

[0042] The motor 306 lowers the lifting plate 311 together with the lifting shaft mechanism 200 by a short distance through the chain 303, and the lifting support block 205 on the lifting support shaft 204 places the first silicon wafer carrier 01 on the upper end surface of the supporting support block 105 on the supporting support shaft 104.

[0043] Then, the lifting cylinder 211 is in the extended state again, driving the lifting base 212 to move to the left; at the same time, the lifting base 212 moves the lifting swing rod 214 to the left through the lifting follower shaft 213, and swings the lifting swing arm 216 to the left by a certain angle through the lifting swing joint 215; as the angle of the lifting swing arm 216 changes, the lifting support shaft 204 also rotates to the left by a certain angle at the original axis position, driving the lifting support block 205 to move to the side to the avoidance position.

[0044] like Figure 7 As shown, the second silicon wafer carrier 01 is placed at the waiting position of the bottom layer.

[0045] The motor 306 lowers the lifting plate 311 together with the lifting shaft mechanism 200 to the bottom position through the chain 303; the upper end surface of the lifting block 205 of the lifting layer on the lifting support shaft 204 is lower than the lower end surface of the first silicon wafer carrier 01, and the upper end surface of the lifting block 205 of the supporting layer on the lifting support shaft 204 is lower than the lower end surface of the second silicon wafer carrier 01.

[0046] The lifting cylinder 211 returns to the retracted state, driving the lifting base 212 to move to the right; at the same time, the lifting base 212 moves the lifting swing rod 214 to the right through the lifting follower shaft 213, and swings the lifting swing arm 216 to the right by a certain angle through the lifting swing joint 215; as the angle of the lifting swing arm 216 changes, the lifting support shaft 204 also rotates to the right by a certain angle at the original axial position, driving the lifting support block 205 to move sideways to the working position.

[0047] The motor 306 lifts the lifting plate 311 together with the lifting shaft mechanism 200 a short distance through the chain 303, and the lifting support block 205 of the lifting layer on the lifting support shaft 204 pushes the first silicon wafer carrier 01 away from the upper end surface of the supporting support block 105 of the supporting layer on the supporting support shaft 104.

[0048] Next, the support cylinder 111 is in the extended state, driving the support base 112 to move to the left; at the same time, the support base 112 moves the support swing rod 114 to the left through the support follower shaft 113, and swings the support swing arm 116 to the left by a certain angle through the support swing joint 115; as the angle of the support swing arm 116 changes, the support shaft 104 also rotates to the left by a certain angle at the original axis position, driving the support block 105 to move to the side to the avoidance position.

[0049] Next, as Figure 8 shown, the motor 306 lifts the lifting plate 311 together with the lifting shaft mechanism 200 to the top layer position through the chain 303; during the process, the support blocks on the support layer and the lifting layer of the lifting shaft 204 respectively lift the second silicon wafer carrier 01 and the first silicon wafer carrier 01 to a certain height; the lower end surfaces of the support block and the second silicon wafer carrier 01 are respectively higher than the upper end surfaces of the support blocks 105 on the support layer and the lifting layer of the support shaft 104.

[0050] The support cylinder 111 returns to the contracted state, driving the support base 112 to move to the right; at the same time, the support base 112 moves the support swing rod 114 to the right through the support follower shaft 113, and swings the support swing arm 116 to the right by a certain angle through the support swing joint 115; as the angle of the support swing arm 116 changes, the support shaft 104 also rotates to the right by a certain angle at the original axis position, driving the support block 105 to move to the side to the working position.

[0051] The motor 306 lowers the lifting plate 311 together with the lifting shaft mechanism 200 by a small distance through the chain 303, and the support blocks on the support layer and the lifting layer of the lifting shaft 204 respectively place the second silicon wafer carrier 01 and the first silicon wafer carrier 01 on the upper end surfaces of the support blocks 105 on the support layer and the lifting layer of the support shaft 104.

[0052] Next, the lifting cylinder 211 is in the extended state again, driving the lifting base 212 to move to the left; at the same time, the lifting base 212 moves the lifting swing rod 214 to the left through the lifting follower shaft 213, and swings the lifting swing arm 216 to the left by a certain angle through the lifting swing joint 215; as the angle of the lifting swing arm 216 changes, the lifting shaft 204 also rotates to the left by a certain angle at the original axis position, driving the lifting block 205 to move to the side to the avoidance position.

[0053] The third silicon wafer carrier 01 is placed at the waiting material position on the bottom layer.

[0054] According to the above mode, as Figure 9As shown, the silicon wafer carrier 01 is lifted one by one to the highest designed height and enters the next working station; the designed height can be significantly greater than the vertical movement stroke each time, and the lifting mechanism occupies a small space.

[0055] This utility model adopts a pitch-type lifting drive form, utilizes multi-layer staggered reciprocating motion to lift the carrier layer by layer, can effectively increase the buffer space of the carrier in future production lines, can effectively reduce the equipment space, reduce the workshop space occupation, has great significance for the future development of the industry, has a good application prospect, and when the CVD or PVD main equipment fails and stops during the actual production process, this technology can effectively solve the problem of rapid discharge of the carrier and avoid the "wafer damage" situation caused by the inability to discharge the wafer in time.

[0056] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A pitch type carrier lifting mechanism, characterized in that: It comprises a silicon wafer carrier (01), a support shaft mechanism (100), a lifting shaft mechanism (200) and a power mechanism (300), wherein the support shaft mechanism (100), the lifting shaft mechanism (200) and the power mechanism (300) are arranged in a double-group symmetrical or multi-faceted combination around the silicon wafer carrier (01); The support shaft mechanism (100) comprises a support seat plate (101), a support shaft seat (102), a support shaft joint (103), a support shaft (104), a support support block (105), a support cylinder (111), a support base (112), a support follower shaft (113), a support swing rod (114), a support swing joint (115), and a support swing arm (116). The support seat plate (101) is mounted with the support shaft seat (102), and the upper and lower ends of the support shaft seat (102) are both provided with support shaft joints (103). ), the support shaft (104) is fixed by a support shaft joint (103), a support block (105) is mounted on the support shaft (104), the support block (105) is arranged in multiple layers, a support cylinder (111) is connected to a support base (112), the support base (112) is connected to a support swing rod (114) by a support follower shaft (113), the support swing rod (114) is connected to a support swing arm (116) by a support swing joint (115), and the support swing arm (116) is connected to the support shaft (104); The lifting shaft mechanism (200) comprises a lifting seat plate (201), a lifting shaft seat (202), a lifting shaft joint (203), a lifting support shaft (204), a lifting support block (205), a lifting cylinder (211), a lifting base (212), a lifting follower shaft (213), a lifting swing rod (214), a lifting swing joint (215), and a lifting swing arm (216). The lifting seat plate (201) is mounted with a lifting shaft seat (202), and the lifting shaft seat (202) is provided with a lifting shaft joint (203) at both the upper and lower ends. 3), the lifting support shaft (204) is fixed by a lifting shaft joint (203), a lifting support block (205) is installed on the lifting support shaft (204), the lifting support block (205) is arranged in multiple layers, the lifting cylinder (211) is connected to the lifting base (212), the lifting base (212) is connected to the lifting swing rod (214) through the lifting follower shaft (213), the lifting swing rod (214) is connected to the lifting swing arm (216) through the lifting swing joint (215), and the lifting swing arm (216) is connected to the lifting support shaft (204); The power mechanism (300) comprises a motor plate (301), a driving wheel (302), a chain (303), a driven wheel (304), a base plate (305), a motor (306), a lifting plate (311), a slider (312), and a guide rail (313). The motor plate (301) is installed on the lower side of the base plate (305), the motor plate (301) is connected to the motor (306), and the motor (306) is equipped with a driving wheel. The driving wheel (302) and the driven wheel (304) are installed on the upper side of the base plate (305), the chain (303) connects the driving wheel (302) and the driven wheel (304) in series, and is connected to the lifting plate (311), the slider (312) and the guide rail (313) are assembled as a whole, and are fixed to the base plate (305), and the lifting plate (311) is slidably connected to the base plate (305) through the slider (312) and the guide rail (313); The lifting shaft mechanism (200) is installed on the lifting plate (311) of the power mechanism.

2. A pitch type carrier lifting mechanism according to claim 1, characterized in that: The support shaft mechanism (100) is a four-shaft four-layer structure, and the lifting shaft mechanism (200) is a four-shaft five-layer structure.

3. The pitch type carrier lifting mechanism according to claim 1, characterized in that: The support blocks (105) and the lifting blocks (205) are distributed at equal intervals, and the spacing between the support blocks (105) is the same as the spacing between the lifting blocks (205).

4. A pitch type carrier lifting mechanism according to claim 3, characterized in that: The vertical movement stroke of the power mechanism (300) each time is greater than the spacing between the support blocks (105).

5. The pitch type carrier lifting mechanism according to claim 1, characterized in that: The power mechanism (300) may also be driven by air pressure or hydraulic pressure, and the transmission modes include screw drive, screw drive, belt drive, rocker, and eccentric wheel shaft.

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