Meltallizing protection jig for semiconductor physical sputtering deposition component
By designing a melting protection tool for semiconductor equipment components, the combined structure of the first cylinder, the round table and the third cylinder is used to protect the non-melting area, and solving the problems of tape being reused, insufficient manual accuracy and residual glue in the prior art, and achieving efficient protection effect and production efficiency.
Patent Information
- Application Number
- CN202422031678.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-21
- Publication Date
- 2025-05-30
- Estimated Expiration
- 2034-08-21
AI Technical Summary
Prior Art In the process of cleaning and regeneration of semiconductor equipment components, the shielding protection of non-solution areas in the dissolution process has problems such as unreusing tape, insufficient manual accuracy and residual glue.
A semiconductor physical sputtering deposition component molten protection device is designed, including a first cylinder, a round table and a third cylinder. The combination structure of these components enables protection of the non-melting area. The right-angle conical design of the third cylinder prevents the molten gun from being blocked.
It realizes efficient protection of non-melting areas of semiconductor equipment components, avoids poor dissolution and residual glue problems, reduces production costs, and improves the accuracy of the shielding area.
Smart Images
Figure CN222923207U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductors, and particularly relates to a thermal spraying protection fixture for semiconductor physical sputtering deposition components. Background Art
[0002] Currently, during the cleaning and regeneration process of semiconductor equipment components, in the thermal spraying process, it is necessary to shield and protect the non-thermal spraying areas of the components. Usually, manual high-temperature resistant tape is used for protection. When using thermal spraying tape for protection, according to the process requirements, the tape is pasted and cut according to the range to be shielded by the components. This method has the following three defects:
[0003] 1. The tape after thermal spraying cannot be reused, increasing production costs;
[0004] 2. Using manual tape cutting for protection, limited by manual operation, the accuracy of the shielded part range is insufficient, especially the edge positions of the protection are uneven, which will cause poor thermal spraying;
[0005] 3. A small amount of residual glue remains on the surface after using the high-temperature resistant tape, causing defects again, so improvement is needed. Content of the Utility Model
[0006] In view of the deficiencies of the prior art, the utility model provides a thermal spraying protection fixture for semiconductor physical sputtering deposition components, which solves the above problems.
[0007] To achieve the above objectives, the utility model is realized through the following technical solutions: A thermal spraying protection fixture for semiconductor physical sputtering deposition components, including a first cylinder, a frustum, and a third cylinder. The frustum is fixedly connected to the end of the first cylinder. The end plane of the frustum coincides with the end plane of the second cylinder. The third cylinder is detachably connected to the first cylinder, and one end of the third cylinder is in a right-angled cone shape.
[0008] Based on the above technical solutions, the utility model also provides the following optional technical solutions:
[0009] Further technical solution: A second threaded cylinder is fixedly connected to the third cylinder, and the second threaded cylinder is threadedly connected to a first threaded groove opened on the first cylinder.
[0010] Further technical solution: It further includes a second cylinder. One end of the second cylinder is fixedly connected to a first threaded cylinder, and the first threaded cylinder is threadedly connected to a first threaded groove opened on the first cylinder. The other end of the second cylinder is provided with a second threaded groove threadedly connected to the second threaded cylinder.
[0011] Further technical solution: A disc is sleeved outside the frustum, and the disc is threadedly connected to the frustum.
[0012] Further technical solution: A number of said discs are provided and they have the same inner diameter while the outer diameter increases progressively.
[0013] Further technical solution: A number of said second cylinders are provided and their lengths increase progressively.
[0014] Further technical solution: The thickness of the frustum is 3 mm, the overall height after the first cylinder and the third cylinder 4 are assembled is 8 mm, the distance from the inner circle of the frustum to the outer diameter of the disc with the smallest outer diameter is 9 mm, the height of the right-angled cone at the end of the third cylinder is 3 mm, and the thicknesses of the first cylinder, the second cylinder and the third cylinder are 1.5 mm.
[0015] Advantageous effects
[0016] The utility model provides a thermal spraying protection jig for semiconductor physical sputtering deposition components, and has the following advantageous effects compared with the prior art:
[0017] 1. In the present invention, first, the first cylinder is placed on the platform of the thermal spraying component to shield the non-thermal spraying positions, and it can play a role in carrying the jig. Secondly, the inner circles of the first cylinder, the frustum, the second cylinder and the third cylinder can protect the non-thermal spraying areas on the sides of the thermal spraying component. And since one end of the third cylinder is in the shape of a right-angled cone, it can prevent the thermal spraying gun from being blocked during the spraying process, and avoid that the contact edges between the inner circles of the first cylinder, the frustum, the second cylinder and the third cylinder and the thermal spraying component cannot be thermally sprayed to the required thickness. Description of the drawings
[0018] Figure 1 It is a three-dimensional structure schematic diagram of the utility model.
[0019] Figure 2 It is an overall structure schematic diagram of the utility model.
[0020] Figure 3 It is the utility model Figure 2 Schematic enlarged view of the structure of part A in.
[0021] Annotation of reference numerals: 1. First cylinder; 101. First thread groove; 2. Frustum; 3. Second cylinder; 301. Second thread groove; 302. First thread cylinder; 4. Third cylinder; 401. Second thread cylinder; 5. Disc. Detailed implementation manners
[0022] In order to make the purpose, technical solutions and advantages of the utility model clearer, the following further elaborates on the utility model in conjunction with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model.
[0023] The following describes the specific implementation of the present utility model in detail in conjunction with specific embodiments.
[0024] Please refer to Figures 1 to 3 , which is a spray protection fixture for a semiconductor physical sputtering deposition component provided by an embodiment of the present utility model, including a first cylinder 1, a frustum 2, and a third cylinder 4. The frustum 2 is fixedly connected to the end of the first cylinder 1. The end plane of the frustum 2 coincides with the end plane of the second cylinder 3. The third cylinder 4 is detachably connected to the first cylinder 1, and one end of the third cylinder 4 is in a right-angled cone shape;
[0025] Preferably, a second threaded cylinder 401 is fixedly connected to the third cylinder 4. The second threaded cylinder 401 is threadedly connected to a first threaded groove 101 opened on the first cylinder 1. The purpose of this setting is to enable the third cylinder 4 to be detachably connected to the first cylinder 1. Therefore, in some embodiments, the third cylinder 4 can also be detachably connected to the first cylinder 1 by a clamping method.
[0026] Preferably, a second cylinder 3 is further included. One end of the second cylinder 3 is fixedly connected with a first threaded cylinder 302. The first threaded cylinder 302 is threadedly connected to a first threaded groove 101 opened on the first cylinder 1. A second threaded groove 301 for threadedly connecting with the second threaded cylinder 401 is opened at the other end of the second cylinder 3. The purpose of this setting is to increase the depth of the entire fixture to enable spray processing of products of different specifications;
[0027] Preferably, a disc 5 is sleeved outside the frustum 2. The disc 5 is threadedly connected to the frustum 2. The purpose of this setting is to increase the shielding range of the frustum 2 to meet the spray ranges in different situations;
[0028] Preferably, several discs 5 are provided and their inner diameters are the same while their outer diameters are increasing. The purpose of this setting is to utilize multiple discs 5 of different specifications to meet the spray ranges in different situations;
[0029] Preferably, several second cylinders 3 are provided and their lengths are increasing. The purpose of this setting is to provide different depths for the fixture to achieve spray processing of products of different specifications.
[0030] Preferably, the thickness of the frustum 2 is 3 mm, the overall height after the first cylinder 1 and the third cylinder 4 are assembled is 8 mm, the distance from the inner circle of the frustum 2 to the outer diameter of the disc 5 with the smallest outer diameter is 9 mm, the height of the right-angled cone at the end of the third cylinder 4 is 3 mm, and the thicknesses of the first cylinder 1, the second cylinder 3, and the third cylinder 4 are 1.5 mm.
[0031] In the embodiment of the present utility model, first, the first cylinder 1 is placed on the platform of the thermal spraying component, and the non-thermal spraying positions are shielded, and it can play a role in carrying the jig. Secondly, the inner circles of the first cylinder 1, the frustum 2, the second cylinder 3 and the third cylinder 4 can protect the non-thermal spraying areas on the side of the thermal spraying component. And since one end of the third cylinder 4 is in a right-angled conical shape, it can prevent the thermal spraying gun from being blocked during the spraying process, avoiding that the contact edges between the inner circles of the first cylinder 1, the frustum 2, the second cylinder 3 and the third cylinder 4 and the thermal spraying component cannot be thermally sprayed to the required thickness.
[0032] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusively, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0033] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.
Claims
1. A semiconductor physical sputtering deposition component spray protection fixture, characterized in that: The invention comprises a first cylinder (1), a truncated cone (2) and a third cylinder (4); the truncated cone (2) is fixedly connected to the end of the first cylinder (1); the end plane of the truncated cone (2) coincides with the end plane of the second cylinder (3); the third cylinder (4) is detachably connected to the first cylinder (1); one end of the third cylinder (4) is in the shape of a right-angle cone.
2. The semiconductor physical sputtering deposition component spraying protection fixture according to claim 1, characterized in that: The third cylinder (4) is fixedly connected to a second threaded cylinder (401), and the second threaded cylinder (401) is threadedly connected to a first threaded groove (101) provided on the first cylinder (1).
3. The semiconductor physical sputtering deposition component spraying protection fixture according to claim 1, characterized in that: The invention also comprises a second cylinder (3), one end of which is fixedly connected to a first threaded cylinder (302), the first threaded cylinder (302) being threadedly connected to a first threaded groove (101) provided on the first cylinder (1), and the other end of the second cylinder (3) being provided with a second threaded groove (301) threadedly connected to a second threaded cylinder (401).
4. The semiconductor physical sputtering deposition component spraying protection fixture according to claim 1, characterized in that: The outer ring of the truncated table (2) is provided with a disc (5), and the disc (5) is threadedly connected to the truncated table (2).
5. The semiconductor physical sputtering deposition component spraying protection fixture according to claim 4, characterized in that: The discs (5) are provided in a plurality and have the same inner diameter and increasing outer diameters.
6. The semiconductor physical sputtering deposition component spraying protection fixture according to claim 3, characterized in that: A plurality of the second cylinders (3) are provided and their lengths increase gradually.
7. The semiconductor physical sputtering deposition component spraying protection fixture according to claim 1, characterized in that: The thickness of the truncated cone (2) is 3 millimeters, and the overall height of the first cylinder (1) and the third cylinder (4) after assembly is 8 millimeters.
8. The semiconductor physical sputtering deposition component spraying protection fixture according to claim 4, characterized in that: The distance from the inner circle of the truncated cone (2) to the outer diameter of the disk (5) with the smallest outer diameter is 9 mm, the height of the right-angle cone at the end of the third cylinder (4) is 3 mm, and the thickness of the first cylinder (1), the second cylinder (3) and the third cylinder (4) are all 1.5 mm.