Chemical vapor deposition device

Abstract

The utility model relates to the technical field of display device manufacturing, and discloses a chemical vapor deposition device which is provided with a reaction chamber, the chemical vapor deposition device comprises a lower electrode and a plurality of supporting pins, the lower electrode is installed at the bottom of the reaction chamber, the supporting pins are arranged on the lower electrode in a penetrating mode, and the lower electrode can move in the length direction of the supporting pins; the correction assemblies are respectively arranged in the reaction chamber corresponding to each side surface of the glass substrate, each correction assembly comprises a transmission mechanism and a rolling piece, the transmission mechanism is connected with the lower electrode, and the transmission mechanism is connected with the rolling piece through a connecting piece; when the lower electrode ascends and descends, the lower electrode drives the transmission mechanism to drive the connecting piece and the rolling piece to be switched between a first posture and a second posture, when the rolling piece is in the first posture, the rolling piece abuts against the side face of the glass substrate, and when the rolling piece is in the second posture, the rolling piece is separated from the glass substrate. According to the utility model, the glass substrate can be corrected by rolling and abutting the rolling piece against the side surface of the glass substrate, so that the quality of a deposited film is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of display device manufacturing, in particular to a chemical vapor deposition device. Background Art

[0002] In the manufacturing process of display devices, CVD (Chemical Vapor Deposition) is widely used in the preparation of display panels. Chemical vapor deposition refers to the process of forming a deposition film by depositing a plasma formed after ionization of chemical gases on a glass substrate.

[0003] As Figure 1 shown, in the existing chemical vapor deposition device, a lower electrode 2' and support pins 3' are installed in the reaction chamber 1'. The support pins 3' include a support rod 31' and a handle 32' connected to the top of the support rod 31'. The support rod 31' passes through the lower electrode 2' and selectively contacts the bottom of the reaction chamber 1'. The lower electrode 2' can move up and down relative to the support rod 31'. Before chemical vapor deposition, first control the lower electrode 2' to descend so that there is a certain distance between the handle 32' of the support pin 3' and the lower electrode 2' (to facilitate the insertion of the manipulator). The bottom of the reaction chamber 1' supports the support rod 31'. Then the manipulator sends the glass substrate 4' into the reaction chamber 1' and places the glass substrate 4' on the handle 32'. After the manipulator withdraws, control the lower electrode 2' to rise and hold the handle 32' of the support pin 3'. The lower electrode 2' can continue to drive the support pin 3' and the glass substrate 4' to rise together until the shielding frame 5' covers the edge of the glass substrate 4' (at this time, there is a gap between the support rod 31' and the bottom of the reaction chamber 1', and the covered area of the glass substrate 4' is the non-film-forming area), and then start chemical vapor deposition.

[0004] The prior art has the following deficiencies: The thickness of the glass substrate 4' is very thin and the weight is light. When the manipulator places the glass substrate 4' on the support pin 3' and when the lower electrode 2' drives the glass substrate 4' to rise and fall, the glass substrate 4' is prone to shift, resulting in the formation of a deposition film in the non-film-forming area, causing the overall stress of the deposition film to change and fall off. In addition, the shifted glass substrate 4' is prone to breakage when moving in the reaction chamber 1', and may also damage the support pin 3', resulting in the need to replace the support pin 3', consuming manpower, financial resources and material resources. Summary of the Utility Model

[0005] The purpose of the present utility model is to provide a chemical vapor deposition device that can correct a shifted glass substrate and effectively improve the quality of the deposition film.

[0006] To achieve this purpose, the present utility model adopts the following technical solutions:

[0007] Provided is a chemical vapor deposition device having a reaction chamber. The chemical vapor deposition device further includes:

[0008] A lower electrode and a plurality of support pins for supporting a glass substrate. The lower electrode is movably installed at the bottom of the reaction chamber. The support pins penetrate through the lower electrode, and the lower electrode can move along the length direction of the support pins;

[0009] A correction assembly. The correction assembly is respectively provided corresponding to each side of the glass substrate in the reaction chamber. The correction assembly includes a transmission mechanism, a rolling member, and a connecting member. One end of the transmission mechanism is fixedly connected to the lower electrode, and the transmission mechanism is connected to the rolling member through the connecting member;

[0010] When the lower electrode rises or falls, the lower electrode can drive the transmission mechanism to drive the connecting member and the rolling member to switch between a first posture and a second posture. When the connecting member and the rolling member are in the first posture, the rolling member abuts against the side surface of the glass substrate. When the connecting member and the rolling member are in the second posture, the rolling member is separated from the glass substrate.

[0011] As a further solution of the chemical vapor deposition device, the rolling member includes a roller and a protective cover covering the roller. The roller is rotatably connected to the connecting member, the protective cover is fixedly connected to the outer wall of the roller, and the protective cover can roll along the side surface of the glass substrate.

[0012] As a further solution of the chemical vapor deposition device, the chemical vapor deposition device further includes a fixed seat. The fixed seat is installed on the chamber wall of the reaction chamber, and a first guiding structure for guiding in the vertical direction is provided on the fixed seat; the connecting member includes a first connecting rod arranged vertically and a second connecting rod arranged horizontally. The upper end of the first connecting rod is rotatably connected to the rolling member, the lower end of the first connecting rod is connected to the second connecting rod, the second connecting rod is in guiding cooperation with the first guiding structure, and one end of the second connecting rod away from the first connecting rod is connected to the transmission mechanism. When the lower electrode rises or falls, the lower electrode can drive the transmission mechanism to drive the second connecting rod to move along the first guiding structure. The second connecting rod can move towards the direction close to the glass substrate until the rolling member is in the first posture, or the second connecting rod can move towards the direction away from the glass substrate until the rolling member is in the second posture.

[0013] As a further solution of the chemical vapor deposition device, the transmission mechanism includes a first connecting rod and a second connecting rod. The first connecting rod includes a horizontally arranged first connecting portion and a vertically arranged second connecting portion. The first connecting portion and the second connecting portion are perpendicularly connected to form an L-shaped structure. The first connecting portion is fixedly connected to the lower electrode, and the second connecting portion is rotatably connected to the second connecting rod. One end of the second connecting rod away from the first connecting rod is rotatably connected to the second connecting rod. The lower electrode drives the first connecting portion to drive the second connecting portion to rise or fall. When the second connecting rod and the second connecting rod are in a straight line, the connecting member and the rolling member are in the first posture.

[0014] As a further solution of the chemical vapor deposition device, a second guiding structure is provided on the fixed seat. The transmission mechanism further includes a first bearing and a second bearing. The second connecting portion is in guiding cooperation with the second guiding structure. The second connecting portion is rotatably connected to the second connecting rod through the first bearing, and the second connecting rod is rotatably connected to the second connecting rod through the second bearing.

[0015] As a further solution of the chemical vapor deposition device, the chemical vapor deposition device further includes a cover body. The cover body covers one side of the fixed seat where the first bearing and the second bearing are installed. The first bearing, the second bearing, and the second connecting rod are received in the cover body. A first through hole for the second connecting portion to pass through is opened at the bottom of the cover body, and a second through hole for the second connecting rod to pass through is opened on one side of the cover body close to the lower electrode.

[0016] As a further solution of the chemical vapor deposition device, the first guiding structure is a guiding cylinder fixed at the second through hole. The second connecting rod passes through the guiding cylinder to connect the second connecting rod and the first connecting rod.

[0017] As a further solution of the chemical vapor deposition device, a plurality of rolling balls are embedded in the inner wall of the guiding cylinder. Part of the rolling balls protrude from the inner wall of the guiding cylinder and abut against the outer periphery of the second connecting rod.

[0018] As a further solution of the chemical vapor deposition device, the second guiding structure is a guide rail fixed on the fixed seat. The length of the guide rail extends in the vertical direction. The first bearing is fixedly connected with a guide wheel, and the guide wheel is in rolling cooperation with the guide rail.

[0019] As a further solution of the chemical vapor deposition device, the lower electrode includes an electrode plate and a lifting column. The lifting column is installed at the bottom of the reaction chamber. The top of the lifting column is fixedly connected to the central position of the electrode plate. The support pin passes through the electrode plate, and the transmission mechanism is fixedly connected to the lifting column.

[0020] As a further solution of the chemical vapor deposition device, a connecting ring is fixed to the outer periphery of the lifting column, and the connecting ring is fixedly connected to the first connecting rod.

[0021] Advantages of the present utility model compared with the prior art:

[0022] In the present utility model, a set of correction components are installed on each side of the glass substrate corresponding to the reaction chamber. The lower electrode can drive multiple sets of correction components simultaneously to correct the position of the glass substrate on the support pins. When each side of the glass substrate abuts against the rolling members of a set of correction components respectively, the position of the glass substrate is corrected. At this time, the lower electrode drives the support pins to drive the glass substrate to rise until it abuts against the shielding frame, so that the shielding frame can just shield the non-film-forming area of the glass substrate, avoiding the formation of unnecessary deposition films in the non-film-forming area of the glass substrate during the chemical vapor deposition process, which may cause the overall stress of the deposition film to change and fall off.

[0023] If the glass substrate is placed on the support pins and is not damaged, the correction components of the present utility model can be used with the lower electrode to correct the glass substrate. Description of the drawings

[0024] The following further describes the present utility model in detail with reference to the drawings and embodiments.

[0025] Figure 1 It is a cross-sectional view of a chemical vapor deposition device in the prior art.

[0026] Figure 2 It is a partial cross-sectional view of the chemical vapor deposition device according to the embodiment of the present utility model (when the lower electrode descends until the rolling members and the connecting members are in the second posture).

[0027] Figure 3 It is a partial cross-sectional view of the chemical vapor deposition device according to the embodiment of the present utility model (when the rolling members and the connecting members are in the first posture).

[0028] Figure 4 It is a partial cross-sectional view of the chemical vapor deposition device according to the embodiment of the present utility model (when the lower electrode ascends until the rolling members and the connecting members are in the second posture).

[0029] Figure 5 It is a schematic diagram of correcting a rectangular glass substrate according to the embodiment of the present utility model.

[0030] Figure 6 It is an assembly schematic diagram between the correction component and the fixed seat according to the embodiment of the present utility model.

[0031] Figure 7 It is an assembly structure schematic diagram of the fixed seat, the cover body and the base according to the embodiment of the present utility model.

[0032] Figure 8 Side view of the first guiding structure according to an embodiment of the present utility model.

[0033] Figure 9 Assembly schematic diagram of the second guiding structure, connecting shaft, guide wheel and the first bearing (viewed from the P-side perspective along Figure 6 ) according to an embodiment of the present utility model.

[0034] Figure 1 In:

[0035] 1', reaction chamber; 2', lower electrode; 3', support pin; 31', support rod; 32', handle; 4', glass substrate; 5', shielding frame.

[0036] Figures 2 to 9 In:

[0037] 1, reaction chamber; 2, lower electrode; 21, electrode plate; 22, lifting column; 23, connecting ring; 3, support pin; 4, correction assembly; 41, transmission mechanism; 411, first connecting rod; 4111, first connecting part; 4112, second connecting part; 412, second connecting rod; 413, first bearing; 414, second bearing; 415, guide wheel; 4151, rotating wheel; 416, connecting shaft; 42, rolling member; 421, roller; 422, protective cover; 43, connecting member; 431, first connecting rod; 432, second connecting rod; 5, shielding frame; 6, fixed seat; 71, first guiding structure; 711, guiding cylinder; 712, ball; 72, second guiding structure; 721, guiding groove; 722, limiting part; 8, cover body; 81, first through hole; 82, second through hole; 9, base;

[0038] 100, glass substrate. Detailed implementation manners

[0039] Referring to the embodiments described in detail below in conjunction with the drawings, the advantages and features of the present utility model and the methods for realizing them will become apparent. However, the present utility model is not limited to the embodiments disclosed below, but can be implemented in various different forms. The provision of this embodiment is only for the purpose of completing the disclosure of the present utility model and enabling those skilled in the art to fully understand the scope of the present utility model, and the present utility model is only defined by the scope of the claims. The same reference numerals represent the same components throughout the specification.

[0040] Hereinafter, the present utility model will be described in detail with reference to the drawings.

[0041] As Figures 2 to 9As shown in the figure, this embodiment provides a chemical vapor deposition device, which has a reaction chamber 1. The chemical vapor deposition device further includes a correction component 4, a lower electrode 2, and a plurality of support pins 3 for supporting a glass substrate 100.

[0042] The lower electrode 2 is movably installed at the bottom of the reaction chamber 1. The support pins 3 penetrate through the lower electrode 2, and the lower electrode 2 can move along the length direction of the support pins 3.

[0043] Inside the reaction chamber 1, correction components 4 are respectively provided corresponding to each side of the glass substrate 100. The correction component 4 includes a transmission mechanism 41, a rolling member 42, and a connecting member 43. The transmission mechanism 41 is fixedly connected to the lower electrode 2, and the transmission mechanism 41 is connected to the rolling member 42 through the connecting member 43.

[0044] Among them, the driving device for driving the lifting of the lower electrode 2 and its driving method are conventional technical means in the art, and will not be elaborated here. After the support pins 3 penetrate through the lower electrode 2, the bottom of the support pins 3 selectively contacts the bottom of the reaction chamber 1.

[0045] When the lower electrode 2 rises or falls, the lower electrode 2 can drive the transmission mechanism 41 to drive the connecting member 43 and the rolling member 42 to switch between a first posture ( Figure 3 ) and a second posture ( Figure 2 , Figure 4 ). When the connecting member 43 and the rolling member 42 are in the first posture, the rolling member 42 abuts against the side surface of the glass substrate 100; when the connecting member 43 and the rolling member 42 are in the second posture, the rolling member 42 is separated from the glass substrate 100.

[0046] The chemical vapor deposition device of this embodiment further includes a shielding frame 5 provided inside the reaction chamber 1. The shielding frame 5 is used to shield the non-film-forming area of the glass substrate 100.

[0047] In this embodiment, a set of correction components 4 are installed corresponding to each side of the glass substrate 100 inside the reaction chamber 1. Through the lower electrode 2, multiple sets of correction components 4 can be simultaneously driven to correct the position of the glass substrate 100 on the support pins 3.

[0048] In this embodiment, when the glass substrate 100 is placed on the support pins 3 and is not damaged, the correction component 4 of this embodiment can be used to correct the glass substrate 100 with the help of the lower electrode 2.

[0049] Of course, for the offset of the glass substrate 100 lifted by the manipulator, without considering efficiency, the correction component 4 of this embodiment can also be used to achieve correction with the help of the lower electrode 2, which will not be elaborated here.

[0050] In this embodiment, the vertical lifting force of the lower electrode 2 is converted into a horizontal force of the correction assembly 4, so as to correct the position of the glass substrate 100, fully reduce the quality problems caused by the offset of the glass substrate 100, and achieve the purpose of extending the maintenance cycle of the chemical vapor deposition device and saving costs.

[0051] In this embodiment, the rolling member 42 is abutted against the side surface of the glass substrate 100 to correct the position of the glass substrate 100. Compared with non-rolling abutment, the friction force received by the glass substrate 100 can be reduced, and the glass substrate 100 can be prevented from being damaged by the rolling member 42.

[0052] Next, taking the rectangular glass substrate 100 as an example, the chemical vapor deposition device of this embodiment will be further described in detail.

[0053] For the rectangular glass substrate 100, there are four groups of correction assemblies 4 in this embodiment. The four groups of correction assemblies 4 are respectively installed adjacent to the corners of the reaction chamber 1. Preferably, the four groups of correction assemblies 4 are symmetrically installed and distributed relative to the center of the glass substrate 100 so that the travel distances of the four groups of rolling members 42 are kept consistent. As Figure 5 shown, when the rolling members 42 of the four groups of correction assemblies 4 are respectively in rolling abutment with the four side surfaces of the glass substrate 100, the position correction of the glass substrate 100 can be completed.

[0054] Optionally, as Figure 6 shown, the rolling member 42 includes a roller 421 and a protective cover 422 covering the roller 421. The roller 421 is rotatably connected to the connecting member 43, and the protective cover 422 is fixedly connected to the outer wall of the roller 421. The protective cover 422 can roll along the side surface of the glass substrate 100. The protective cover 422 covers the roller 421, which can prevent the formation of a deposition film inside the roller 421 and affect its normal rolling.

[0055] As Figures 2 to 7As shown in the figure, the chemical vapor deposition apparatus of the present embodiment further includes a fixing base 6, which is installed on the chamber wall of the reaction chamber 1, and the fixing base 6 is spaced apart from the lower electrode 2. The fixing base 6 is provided with a first guiding structure 71 that guides in the vertical direction; the connecting member 43 includes a vertically arranged first connecting rod 431 and a horizontally arranged second connecting rod 432. The upper end of the first connecting rod 431 is rotatably connected to the rolling member 42, the lower end of the first connecting rod 431 is connected to the second connecting rod 432, and the second connecting rod 432 is in guiding cooperation with the first guiding structure 71. The end of the second connecting rod 432 away from the first connecting rod 431 is connected to the transmission mechanism 41. When the lower electrode 2 rises or falls, the lower electrode 2 can drive the transmission mechanism 41 to drive the second connecting rod 432 to move up and down along the first guiding structure 71. The second connecting rod 432 can move towards the direction close to the glass substrate 100 until the rolling member 42 is in the first posture, or the second connecting rod 432 can move towards the direction away from the glass substrate 100 until the rolling member 42 is in the second posture.

[0056] When the lower electrode 2 rises or falls, the lower electrode 2 drives each transmission mechanism 41 to push the second connecting rod 432 to drive the first connecting rod 431 and the rolling member 42 to move horizontally, thereby converting the vertical force when the lower electrode 2 rises and falls into the force for driving the connecting member 43 and the rolling member 42 to move horizontally.

[0057] For the rectangular glass substrate 100, the fixing base 6 is arranged on the chamber wall adjacent to the corner of the reaction chamber 1, which can reduce the resistance when the correction component 4 corrects the position of the glass substrate 100. Among them, the length of the first guiding structure 71 is determined according to the lifting height of the lower electrode 2. The stroke length when the lower electrode 2 moves from the lowest position to the highest position or from the highest position to the lowest position is the length of the first guiding structure 71. The installation height of the fixing base 6 and the installation height of the first guiding structure 71 are determined according to the actual situation, so that when the lower electrode 2 is at the lowest or highest point, it is appropriate to ensure that the rolling member 42 is spaced apart from the side surface of the glass substrate 100. For details, please refer to Figures 2 to 4 .

[0058] Furthermore, the transmission mechanism 41 includes a first connecting rod 411 and a second connecting rod 412. The first connecting rod 411 includes a horizontally arranged first connecting portion 4111 and a vertically arranged second connecting portion 4112. The first connecting portion 4111 and the second connecting portion 4112 are perpendicularly connected to form an L-shaped structure. The first connecting portion 4111 is fixedly connected to the lower electrode 2, and the second connecting portion 4112 is rotatably connected to the second connecting rod 412. The end of the second connecting rod 412 away from the first connecting rod 411 is rotatably connected to the second connecting rod 432. The lower electrode 2 drives the second connecting portion 4112 to rise or fall. When the second connecting rod 412 and the second connecting rod 432 are in a straight line, the connecting member 43 and the rolling member 42 are in the first posture.

[0059] Among them, the length of the second connecting portion 4112 can be determined according to the specific size of the glass substrate 100 and the distance between the rolling member 42 in the second posture and the side surface of the glass substrate 100. When the second link 412 and the second connecting rod 432 are in the same straight line, it is advisable that the rolling member 42 can rollingly abut against the side surface of the glass substrate 100 without causing excessive abutment to the glass substrate 100, and the details will not be elaborated here.

[0060] When the lower electrode 2 drives the first link 411 to rise or fall, correspondingly, the second link 412 rotates upward or downward relative to the rotation node of the second link 412 and the second connecting rod 432. The second link 412 simultaneously drives the second connecting rod 432 to horizontally move along the first guiding structure 71 in a direction close to or away from the glass substrate 100, thereby driving the first connecting rod 431 and the rolling member 42 to horizontally move. When the second link 412 and the second connecting rod 432 are in the same horizontal plane, the rolling member 42 is in the first posture, and the rolling members 42 of the four sets of correction components 4 simultaneously abut against the side surface of the glass substrate 100.

[0061] Optionally, a second guiding structure 72 is provided on the fixed seat 6. The transmission mechanism 41 further includes a first bearing 413 and a second bearing 414. The second connecting portion 4112 is in guiding cooperation with the second guiding structure 72. The second connecting portion 4112 is rotatably connected to the second link 412 through the first bearing 413, and the second link 412 is rotatably connected to the second connecting rod 432 through the second bearing 414. The use of a bearing structure can make the rotation of the second link 412 smoother. Among them, the first bearing 413 can be a ball bearing.

[0062] In order to minimize the corrosion of the transmission mechanism 41 exposed in the reaction chamber 1 by the reaction gas and affect the smooth transmission of each rotation node, in this embodiment, a cover 8 is provided to protect each rotation node of the transmission mechanism 41, as Figure 5 shown. The cover 8 covers the side of the fixed seat 6 where the first bearing 413 and the second bearing 414 are installed. The first bearing 413, the second bearing 414, and the second link 412 are received in the cover 8. A first through hole 81 for the second connecting portion 4112 to pass through is opened at the bottom of the cover 8, and a second through hole 82 for the second connecting rod 432 to pass through is opened on the side of the cover 8 close to the lower electrode 2.

[0063] Optionally, the first guiding structure 71 includes a guiding cylinder 711 fixed at the second through hole 82. The second connecting rod 432 passes through the guiding cylinder 711 to connect the second link 412 and the first connecting rod 431. The second connecting rod 432 can move along the length direction of the guiding cylinder 711 to approach or move away from the glass substrate 100.

[0064] Further, in order to make the movement of the second connecting rod 432 along the length direction of the guiding cylinder 711 smoother, in this embodiment, a plurality of balls 712 are embedded in the inner wall of the guiding cylinder 711. As Figure 8 shown, a part of the balls 712 protrudes from the inner wall of the guiding cylinder 711 and abuts against the outer periphery of the second connecting rod 432. When the second connecting rod 432 moves along the length direction of the guiding cylinder 711, it is in rolling connection with the balls 712 on the inner wall of the guiding cylinder 711, which can reduce the resistance of the horizontal movement of the second connecting rod 432.

[0065] In other embodiments, the first guiding structure 71 is not limited to a structure similar to the above-mentioned guiding cylinder 711, and can also be designed as a structure in which a sliding groove and a sliding block cooperate with each other, or a structure in which a roller and a guide rail are in rolling cooperation, and so on. Specifically, the second guiding structure 72 is a guide rail fixed to the fixed seat 6, the length of the guide rail extends in the vertical direction, the first bearing 413 is fixedly connected with a guide wheel 415, and the guide wheel 415 is in rolling cooperation with the guide rail. As Figure 9 shown, the guide wheel 415 includes two rotating wheels 4151 arranged at intervals, the two rotating wheels 4151 are connected to the first bearing 413 through a connecting shaft 416, and the rotating wheels 4151 can rotate around the axis of the connecting shaft 416. Correspondingly, the guide rail has a guide groove 721 and limiting portions 722 provided on two opposite groove walls of the guide groove 721, the length of the guide groove 721 extends in the vertical direction, and there is an interval between the two limiting portions 722 that can avoid the connecting shaft 416. One of the rotating wheels 4151 is located between the limiting portion 722 and the bottom of the guide groove 721, and the other rotating wheel 4151 is located on the side of the limiting portion 722 facing the first bearing 413. When the second connecting portion 4112 moves up and down, the two rotating wheels 4151 can be driven to reciprocate along the length direction of the guide rail through the first bearing 413.

[0066] In this embodiment, the lower electrode 2 includes an electrode plate 21 and a lifting column 22. The lifting column 22 is installed at the bottom of the reaction chamber 1, and the top of the lifting column 22 is fixedly connected to the central position of the electrode plate 21. The support pin 3 penetrates through the electrode plate 21, and the transmission mechanism 41 is fixedly connected to the lifting column 22. For the convenience of installation, in this embodiment, the first connecting rod 411 of the transmission mechanism 41 is fixedly connected to the lifting column 22. When the external driving device drives the lifting column 22 to lift, the first connecting rod 411 can be directly driven to lift.

[0067] Specifically, a connecting ring 23 is fixed to the outer periphery of the lifting column 22, and the connecting ring 23 is fixedly connected to the first connecting rod 411. The first connecting rods 411 of the four correction components 4 can be simultaneously connected to the connecting ring 23, improving the installation convenience of the correction components 4.

[0068] This embodiment further includes a base 9 fixed to the cavity wall to facilitate the installation of the fixing seat 6 and the cover 8. Specifically, the fixing seat 6 is fixed to one side of the base 9 and fixedly connected to the base 9.

[0069] The working principle of the chemical vapor deposition device of this embodiment is as follows: As Figure 2 shown, in the initial state, the rolling member 42 and the connecting member 43 are in the second posture. The manipulator sends the glass substrate 100 into the reaction chamber 1 and places it on the support pin 3. When the lower electrode 2 rises, the rolling member 42 first moves towards the direction close to the glass substrate 100. When the second link 412 and the second connecting rod 432 are in the same straight line, as Figure 3 shown, the connecting member 43 and the rolling member 42 are in the first posture. At this time, the rolling members 42 of all the correction assemblies 4 are simultaneously in contact with the respective side surfaces of the glass substrate 100, so that the position of the glass substrate 100 is corrected. When the lower electrode 2 continues to rise, the rolling member 42 moves away from the glass substrate 100 until the lower electrode 2 lifts the support pin 3 to drive the glass substrate 100 to move up until the glass substrate 100 abuts against the bottom of the shielding frame 5 (which can make the shielding frame 5 just shield the non-film-forming area of the glass substrate 100, avoiding the formation of unnecessary deposition films in the non-film-forming area of the glass substrate 100 during chemical vapor deposition, which may cause the overall stress of the deposition film to change and fall off. Next, chemical vapor deposition can be carried out), as Figure 4 shown. At this time, the connecting member 43 and the rolling member 42 are in the second posture, and the rolling member 42 is spaced apart from the glass substrate 100. After chemical vapor deposition is completed, the lower electrode 2 descends. The rolling member 42 first moves towards the direction close to the glass substrate 100. When the second link 412 and the second connecting rod 432 are in the same straight line, as Figure 3 shown, the connecting member 43 and the rolling member 42 are in the first posture. At this time, the rolling members 42 of all the correction assemblies 4 are simultaneously in contact with the respective side surfaces of the glass substrate 100, and the position of the glass substrate 100 after chemical vapor deposition is corrected again. When the lower electrode 2 continues to descend, the rolling member 42 moves away from the glass substrate 100 until the connecting member 43 and the rolling member 42 are in the second posture, as Figure 2 shown. At this time, there is a sufficient distance between the lower electrode 2 and the glass substrate 100, which is convenient for the manipulator to lift the glass substrate 100 and transfer it out of the reaction chamber 1.

[0070] Although the embodiments of the present invention have been described above with reference to the drawings, the present invention is not limited to the above embodiments, but can be manufactured in various forms, and those skilled in the art will understand that the present invention can be implemented in other specific forms without changing the technical spirit or basic characteristics of the present invention. Therefore, it should be understood that the above embodiments are exemplary in all aspects and not restrictive.

Claims

1. A chemical vapor deposition device having a reaction chamber, characterized in that: The chemical vapor deposition device also includes: A lower electrode and a plurality of support pins for supporting a glass substrate, wherein the lower electrode is movably mounted at the bottom of the reaction chamber, the support pins penetrate the lower electrode, and the lower electrode can move along the length direction of the support pins; A correction component, wherein each side of the reaction chamber corresponding to the glass substrate is provided with the correction component, and the correction component comprises a transmission mechanism, a rolling member and a connecting member, wherein the transmission mechanism is fixedly connected to the lower electrode, and the transmission mechanism is connected to the rolling member through the connecting member; When the lower electrode rises or falls, the lower electrode can drive the transmission mechanism to drive the connecting member and the rolling member to switch between a first posture and a second posture. When the connecting member and the rolling member are in the first posture, the rolling member abuts against the side of the glass substrate. When the connecting member and the rolling member are in the second posture, the rolling member is separated from the glass substrate.

2. The chemical vapor deposition device according to claim 1, characterized in that: The rolling element comprises a roller and a protective cover arranged on the roller, the roller is rotatably connected to the connecting element, the protective cover is fixedly connected to the outer wall of the roller, and the protective cover can roll along the side of the glass substrate.

3. The chemical vapor deposition device according to claim 1, characterized in that: The chemical vapor deposition device also includes a fixing seat, which is installed on the cavity wall of the reaction chamber, and the fixing seat is provided with a first guiding structure that plays a guiding role in the vertical direction; the connecting member includes a first connecting rod arranged vertically and a second connecting rod arranged horizontally, the upper end of the first connecting rod is rotatably connected to the rolling member, the lower end of the first connecting rod is connected to the second connecting rod, the second connecting rod is guided and matched with the first guiding structure, and the end of the second connecting rod away from the first connecting rod is connected to the transmission mechanism, when the lower electrode rises or falls, the lower electrode can drive the transmission mechanism to drive the second connecting rod to move along the first guiding structure, the second connecting rod can move toward the direction close to the glass substrate until the rolling member is in the first posture, or the second connecting rod can move toward the direction away from the glass substrate until the rolling member is in the second posture.

4. The chemical vapor deposition device according to claim 3, characterized in that: The transmission mechanism includes a first connecting rod and a second connecting rod, the first connecting rod includes a first connecting part arranged horizontally and a second connecting part arranged vertically, the first connecting part and the second connecting part are vertically connected to form an L-shaped structure, the first connecting part is fixedly connected to the lower electrode, the second connecting part is rotatably connected to the second connecting rod, the end of the second connecting rod away from the first connecting rod is rotatably connected to the second connecting rod, the lower electrode drives the first connecting part to drive the second connecting part to rise or fall, and when the second connecting rod and the second connecting rod are in a straight line, the connecting member and the rolling member are in the first posture.

5. The chemical vapor deposition device according to claim 4, characterized in that: A second guide structure is provided on the fixed seat, and the transmission mechanism also includes a first bearing and a second bearing. The second connecting portion is guided and cooperated with the second guide structure. The second connecting portion is rotatably connected to the second connecting rod through the first bearing, and the second connecting rod is rotatably connected to the second connecting rod through the second bearing.

6. The chemical vapor deposition device according to claim 5, characterized in that: The chemical vapor deposition device also includes a cover body, which is arranged on the side of the fixed seat where the first bearing and the second bearing are installed, and the first bearing, the second bearing and the second connecting rod are accommodated in the cover body. The bottom of the cover body is provided with a first through hole for the second connecting part to pass through, and the side of the cover body close to the lower electrode is provided with a second through hole for the second connecting rod to pass through.

7. The chemical vapor deposition device according to claim 6, characterized in that: The first guide structure is a guide cylinder fixed at the second through hole, and the second connecting rod passes through the guide cylinder to connect the second connecting rod and the first connecting rod.

8. The chemical vapor deposition device according to claim 7, characterized in that: A plurality of balls are embedded in the inner wall of the guide cylinder. The ball portions protrude from the inner wall of the guide cylinder and abut against the outer periphery of the second connecting rod.

9. The chemical vapor deposition device according to any one of claims 5 to 8, characterized in that: The second guide structure is a guide rail fixed on the fixed seat, the length of the guide rail extends in the vertical direction, the first bearing is fixedly connected with a guide wheel, and the guide wheel and the guide rail are in rolling cooperation.

10. The chemical vapor deposition device according to any one of claims 1 to 8, characterized in that: The lower electrode includes an electrode plate and a lifting column, the lifting column is installed at the bottom of the reaction chamber, the top of the lifting column is fixedly connected to the center position of the electrode plate, the supporting pin is penetrated through the electrode plate, and the transmission mechanism is fixedly connected to the lifting column.

Images