Electroplating device

Abstract

The utility model relates to the technical field of electroplating of semiconductor equipment, in particular to an electroplating device. The electroplating device comprises an electroplating bath and a turbulent flow mechanism, electroplating liquid is arranged in the electroplating bath, and the to-be-electroplated product and the anode plate are immersed in the electroplating liquid; the turbulent flow mechanism is arranged in the electroplating bath and located between the to-be-electroplated product and the anode plate, the turbulent flow mechanism comprises an adjusting part and a plurality of turbulent flow banners, an electroplating liquid channel is formed between every two adjacent turbulent flow banners, and the adjusting part is configured to adjust the size of the channel. According to the electroplating device, the size of the electroplating liquid channel formed between every two adjacent turbulent flow banners is adjusted through the adjusting piece, the flow speed and the uniform flow field of the electroplating liquid are adjusted, and therefore the electroplating device can be used for electroplating to-be-electroplated products of different specifications, the electroplating uniformity and efficiency are improved, and the universality of the electroplating device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment electroplating, in particular to an electroplating device. Background Art

[0002] In recent years, with the rapid development of the semiconductor industry, the electroplating process has been more and more widely used in the semiconductor industry. The electroplating process can provide process support such as coating of various materials and preparation of conductive metals for the manufacture of semiconductor chips. The electroplating process is to use the oxidation-reduction reaction of electrochemical deposition to perform electrochemical deposition on a wafer to form a metal coating and metal wiring.

[0003] Generally, an electroplating device is used to perform the above electroplating process. The electroplating device includes an electroplating tank. An electroplating solution is provided in the electroplating tank. The product to be electroplated and the anode plate are both immersed in the electroplating solution. The anode plate is connected to the positive pole of the power supply, and the product to be electroplated is connected to the negative pole of the power supply to complete the formation of a coating on the surface of the product to be electroplated. In order to improve the uniformity of the coating, a flow disturbance mechanism is usually provided. The flow disturbance mechanism includes a plurality of flow disturbance strips arranged at intervals, and the plurality of flow disturbance strips are used to ensure the uniformity of the flow field.

[0004] For the existing flow disturbance mechanism for a uniform flow field, the spacing and angle of the flow disturbance strips are fixed and unchanged, and it can only be used for products to be electroplated with specific specifications. When it is necessary to electroplate products to be electroplated with different specifications, the corresponding flow disturbance mechanism needs to be replaced, resulting in disadvantages such as poor versatility, cumbersome operation, and low electroplating efficiency of the electroplating device.

[0005] Therefore, there is an urgent need for an electroplating device to solve the above problems. Summary of the Utility Model

[0006] The purpose of the utility model is to provide an electroplating device. By adjusting the angle between the flow disturbance strips and the vertical direction through an adjusting member, that is, adjusting the size of the channel formed between two adjacent flow disturbance strips, the electroplating device can electroplate products to be electroplated with different specifications, improve the uniformity and efficiency of electroplating, and improve the versatility of the electroplating device.

[0007] To achieve the above purpose, the following technical solutions are provided:

[0008] An electroplating device, comprising:

[0009] An electroplating tank, in which an electroplating solution is provided, and the product to be electroplated and the anode plate are immersed in the electroplating solution;

[0010] A flow disturbance mechanism, which is arranged in the electroplating tank and is located between the product to be electroplated and the anode plate. The flow disturbance mechanism includes an adjusting member and a plurality of flow disturbance strips. A channel for the electroplating solution is formed between two adjacent flow disturbance strips, and the adjusting member is configured to adjust the size of the channel.

[0011] As an alternative, the spoiler strip includes a first part and a second part connected to each other. The spoiler mechanism further includes a frame. The first part is rotatably connected to the frame, the adjusting member is rotatably connected to the second part, a sliding groove is formed in the frame, and the adjusting member is slidably engaged with the sliding groove.

[0012] As an alternative, the spoiler mechanism further includes:

[0013] a connecting member, and the adjusting member is detachably connected to the frame through the connecting member.

[0014] As an alternative, the spoiler mechanism further includes:

[0015] a guiding member, the guiding member is arranged at both ends of the spoiler strip, a guiding groove is formed in the frame, and the guiding member is inserted into the guiding groove and can slide along the guiding groove.

[0016] As an alternative, the electroplating device further includes a driving mechanism configured to drive the spoiler mechanism to reciprocate vertically.

[0017] As an alternative, the electroplating device further includes:

[0018] a shielding plate, the shielding plate is arranged in the electroplating tank and located between the spoiler mechanism and the anode plate. A plurality of through holes are formed in the shielding plate, and the plurality of through holes are arranged in an array.

[0019] As an alternative, the electroplating device further includes an ultrafiltration membrane, and the ultrafiltration membrane is arranged between the shielding plate and the anode plate.

[0020] As an alternative, the electroplating tank includes an electroplating chamber and overflow chambers arranged on both sides of the electroplating chamber.

[0021] As an alternative, the electroplating tank further includes a liquid inlet chamber, a liquid inlet pipe is arranged in the liquid inlet chamber, the liquid inlet pipe includes a main pipe and a plurality of branch pipes communicated with the main pipe, and a plurality of liquid inlet holes are formed below the branch pipes.

[0022] As an alternative, a partition is arranged between the electroplating chamber and the overflow chambers and the liquid inlet chamber, and a plurality of connecting holes arranged in an array are formed in the partition to enable the liquid inlet chamber to communicate with the electroplating chamber.

[0023] Compared with the prior art, the beneficial effects of the present utility model are:

[0024] The electroplating device provided by the present utility model includes an electroplating tank and a flow disturbance mechanism. An electroplating solution is provided in the electroplating tank, and the product to be electroplated and the anode plate are immersed in the electroplating solution. The flow disturbance mechanism is arranged in the electroplating tank and located between the product to be electroplated and the anode plate. The flow disturbance mechanism includes an adjusting member and a plurality of flow disturbance strips. A channel for the electroplating solution is formed between two adjacent flow disturbance strips, and the adjusting member is configured to adjust the size of the channel. By adjusting the size of the channel for the electroplating solution formed between two adjacent flow disturbance strips, the flow rate and uniform flow field of the electroplating solution are adjusted. Therefore, the electroplating device can electroplate products to be electroplated with different specifications, improving the uniformity and efficiency of electroplating and enhancing the versatility of the electroplating device. Description of the Drawings

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments of the present utility model. Obviously, the following-described drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on the content of the embodiments of the present utility model and these drawings.

[0026] Figure 1 Structural schematic diagram of the electroplating device provided by the embodiment of the present utility model;

[0027] Figure 2 Cross-sectional view of the electroplating device provided by the embodiment of the present utility model;

[0028] Figure 3 Structural schematic diagram of the flow disturbance structure provided by the embodiment of the present utility model;

[0029] Figure 4 Structural schematic diagram of the flow disturbance strip provided by the embodiment of the present utility model;

[0030] Figure 5 Partial structural schematic diagram of the electroplating device provided by the embodiment of the present utility model.

[0031] Reference Signs:

[0032] 100, electroplating device;

[0033] 10, electroplating tank; 11, electroplating chamber; 12, overflow chamber; 13, liquid inlet chamber; 14, partition; 15, liquid inlet pipe; 151, main pipe; 152, branch pipe;

[0034] 20, flow disturbance mechanism; 21, frame; 211, chute; 212, guiding groove; 22, flow disturbance strip; 221, first part; 222, second part; 23, adjusting member; 24, connecting member; 25, guiding member;

[0035] 30, shielding plate;

[0036] 200. Product to be electroplated; 300. Fixture; 400. Anode plate. Detailed implementation manners

[0037] To make the above objects, features, and advantages of the present application more obvious and understandable, the following will describe the detailed implementation manners of the present application with reference to the accompanying drawings. Many specific details are set forth in the following description to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0038] In the description of the present application, it should be understood that if terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the accompanying drawings. These are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application.

[0039] In addition, if terms such as "first" and "second" appear, these terms are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present application, if the term "plural" appears, the meaning of "plural" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0040] In the present application, unless otherwise clearly specified and limited, if terms such as "install", "connect", "connection", "fix", etc. appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0041] In this application, unless otherwise clearly specified and defined, when a first feature is described as being "on" or "under" a second feature or the like, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or simply indicates that the first feature has a lower horizontal height than the second feature.

[0042] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If so, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in this application are only for the purpose of illustration and do not represent the only implementation.

[0043] As Figure 1 and Figure 2 shown, this embodiment provides an electroplating device 100. The electroplating device 100 includes an electroplating tank 10. An electroplating solution is provided in the electroplating tank 10. The product to be electroplated 200 and the anode plate 400 are immersed in the electroplating solution; the anode plate 400 is connected to the positive pole of the power supply, and the product to be electroplated 200 is connected to the negative pole of the power supply to complete the formation of a coating on the surface of the product to be electroplated 200.

[0044] The product to be electroplated 200 is disposed in the electroplating tank 10 through a fixture 300. The fixture 300 includes two clamping frames, and the two clamping frames jointly clamp the product to be electroplated 200.

[0045] To improve the uniformity of the coating, as Figure 2 and Figure 3 shown, the electroplating device 100 further includes a flow disturbance mechanism 20 and a driving mechanism (not shown in the figure). The driving mechanism is configured to drive the flow disturbance mechanism 20 to reciprocate in the vertical direction to ensure the uniformity of the flow field during the electroplating process by the flow disturbance mechanism 20.

[0046] Specifically, the flow disturbance mechanism 20 includes a plurality of flow disturbance strips 22 arranged at intervals in the height direction of the electroplating tank 10. The plurality of flow disturbance strips 22 are used to increase the flow rate of the electroplating solution and control the flow field, maintain an appropriate flow rate and a uniform flow field, and improve the electroplating uniformity of the product to be electroplated 200.

[0047] The existing flow disturbance mechanism 20 for a uniform flow field has fixed spacing and angles of the flow disturbance strips 22, and can only be used for electroplating products 200 of specific specifications. When electroplating products 200 of different specifications are needed, the corresponding flow disturbance mechanism 20 needs to be replaced, resulting in disadvantages such as poor versatility, cumbersome operation, and low electroplating efficiency of the electroplating device 100.

[0048] To solve the above problems, as Figures 2 - 4 shown, the flow disturbance mechanism 20 provided in this embodiment further includes an adjusting member 23. A channel for the electroplating solution is formed between two adjacent flow disturbance strips 22, and the adjusting member 23 is configured to adjust the size of this channel. By adjusting the size of the channel for the electroplating solution formed between two adjacent flow disturbance strips 22, the flow rate of the electroplating solution and the uniform flow field are adjusted. Therefore, the electroplating device 100 can electroplate electroplating products 200 of different specifications, improving the uniformity and efficiency of electroplating and enhancing the versatility of the electroplating device 100. It should be noted that for each electroplating product 200 of a specific specification, the required channel size is different. The optimal channel size value is obtained through verification by the staff, and the verification method is prior art and will not be elaborated here.

[0049] Specifically, as Figures 2 - 4 shown, the flow disturbance strip 22 includes a first part 221 and a second part 222 connected to each other. The flow disturbance mechanism 20 further includes a frame 21. The first part 221 is rotatably connected to the frame 21, the adjusting member 23 is rotatably connected to the second part 222, and a sliding groove 211 is formed on the frame 21. The adjusting member 23 is slidably engaged with the sliding groove 211. By sliding the adjusting member 23 in the sliding groove 211, the spacing between all adjacent second parts 222 (i.e., the size of the channel) is adjusted synchronously, improving the adjustment efficiency.

[0050] Optionally, the flow disturbance mechanism 20 further includes a connecting member 24. The adjusting member 23 is detachably connected to the frame 21 through the connecting member 24, facilitating the quick disassembly and assembly of the adjusting member 23 and the frame 21. Specifically, the connecting member 24 is a bolt, and the bolt is threadedly connected to the adjusting member 23. By adjusting the depth of the bolt screwed into the adjusting member 23, the position of the adjusting member in the sliding groove 211 is adjusted, so as to adjust the size of the channel between two adjacent flow disturbance strips 22.

[0051] Optionally, the number of the adjusting members 23 is two, and the two adjusting members 23 are respectively arranged at both ends of the flow disturbance strip 22 in the length direction, realizing synchronous adjustment of both ends of the flow disturbance strip 22.

[0052] As Figure 3As shown, the spoiler mechanism 20 further includes a guide member 25. The guide member 25 is disposed at both ends of the second portion 222 of the spoiler strip 22. A guide groove 212 is formed on the frame 21. The guide member 25 is inserted into the guide groove 212 and can slide along the guide groove 212, making the second portion 222 move more smoothly and smoothly during the movement.

[0053] As Figure 2 shown, the electroplating device 100 further includes a shielding plate 30. The shielding plate 30 is disposed in the electroplating tank 10 and is located between the spoiler mechanism 20 and the anode plate 400. A plurality of through holes are formed on the shielding plate 30, and the plurality of through holes are arranged in an array for balanced flow, which helps to further improve the uniformity of the plating layer.

[0054] Since the aperture of the through holes of the shielding plate 30 is fixed, when it is necessary to improve the electroplating uniformity, only by changing the diameter of the through holes of the shielding plate 30 can it be improved, which greatly increases the processing difficulty and cost.

[0055] To solve the above problems, the electroplating device 100 further includes an ultrafiltration membrane. The ultrafiltration membrane is disposed between the shielding plate 30 and the anode plate 400. The ultrafiltration membrane is made of polytetrafluoroethylene material, which has good acid and alkali resistance and filtration performance, can filter certain impurities, and prevent the impurities from binding on the surface of the product to be electroplated 200. Driven by the pressure difference on both sides of the ultrafiltration membrane, the role of balancing the flow field is achieved through the pores uniformly distributed on the surface of the ultrafiltration membrane. The adjustability of the flow field is increased through the double combination of the shielding plate 30 and the ultrafiltration membrane.

[0056] As Figure 2 shown, the electroplating tank 10 includes an electroplating chamber 11 and overflow chambers 12 disposed on both sides of the electroplating chamber 11. The overflow chambers 12 are used to receive the excess electroplating solution in the electroplating chamber 11.

[0057] As Figure 2 and Figure 5 shown, the electroplating tank 10 further includes a liquid inlet chamber 13. An inlet pipe 15 is disposed in the liquid inlet chamber 13. The inlet pipe 15 includes a main pipe 151 and a plurality of branch pipes 152 connected to the main pipe 151. A plurality of liquid inlet holes are formed below the branch pipes 152 to slow down the impact of the electroplating solution and prevent the local flow rate of the electroplating solution at the main pipe 151 from being too large.

[0058] A partition plate 14 is disposed between the electroplating chamber 11 and the overflow chamber 12 and the liquid inlet chamber 13. A plurality of connection holes arranged in an array are formed on the partition plate 14 to communicate the liquid inlet chamber 13 with the electroplating chamber 11. The electroplating solution enters the electroplating chamber 11 through the plurality of connection holes on the partition plate 14, making the flow of the electroplating solution more stable.

[0059] Note that in the description of this specification, the description referring to the reference terms "some embodiments", "other embodiments", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0060] The above is only the preferred embodiment of the present utility model and the technical principles applied. Those skilled in the art will understand that the present utility model is not limited to the specific embodiments described herein. Various obvious changes, re-adjustments, and substitutions can be made by those skilled in the art without departing from the protection scope of the present utility model. Therefore, although the present utility model has been described in more detail through the above embodiments, the present utility model is not limited to the above embodiments. Without departing from the concept of the present utility model, more other equivalent embodiments can be included, and the scope of the present utility model is determined by the scope of the appended claims.

Claims

1. An electroplating device, characterized in that include: An electroplating tank (10), wherein the electroplating tank (10) is provided with an electroplating solution, and the product to be electroplated (200) and the anode plate (400) are immersed in the electroplating solution; A spoiler mechanism (20), wherein the spoiler mechanism (20) is arranged in the electroplating tank (10) and is located between the product to be electroplated (200) and the anode plate (400), the spoiler mechanism (20) comprises an adjusting member (23) and a plurality of spoiler strips (22), a channel for the electroplating solution is formed between two adjacent spoiler strips (22), and the adjusting member (23) is configured to adjust the size of the channel.

2. The electroplating device according to claim 1, characterized in that: The spoiler strip (22) comprises a first part (221) and a second part (222) connected to each other, the spoiler mechanism (20) further comprises a frame (21), the first part (221) is rotatably connected to the frame (21), the adjustment member (23) is rotatably connected to the second part (222), a slide groove (211) is provided on the frame (21), and the adjustment member (23) is slidably matched with the slide groove (211).

3. The electroplating device according to claim 2, characterized in that: The spoiler mechanism (20) further comprises: A connecting member (24), wherein the adjusting member (23) is detachably connected to the frame (21) via the connecting member (24).

4. The electroplating device according to claim 2, characterized in that: The spoiler mechanism (20) further comprises: Guide members (25), the guide members (25) being arranged at both ends of the spoiler strip (22), the frame (21) being provided with guide grooves (212), the guide members (25) being inserted into the guide grooves (212) and being able to slide along the guide grooves (212).

5. The electroplating device according to claim 1, characterized in that: The electroplating device further comprises a driving mechanism, wherein the driving mechanism is configured to drive the flow-disturbing mechanism (20) to move back and forth in a vertical direction.

6. The electroplating device according to any one of claims 1 to 5, characterized in that: The electroplating device also includes: A shielding plate (30), the shielding plate (30) being arranged in the electroplating tank (10) and between the spoiler mechanism (20) and the anode plate (400), the shielding plate (30) being provided with a plurality of through holes, the plurality of through holes being arranged in an array.

7. The electroplating device according to claim 6, characterized in that: The electroplating device further comprises an ultrafiltration membrane, wherein the ultrafiltration membrane is arranged between the shielding plate (30) and the anode plate (400).

8. The electroplating device according to any one of claims 1 to 5, characterized in that: The electroplating tank (10) comprises an electroplating chamber (11) and overflow chambers (12) arranged on both sides of the electroplating chamber (11).

9. The electroplating device according to claim 8, characterized in that: The electroplating tank (10) further comprises a liquid inlet chamber (13), wherein a liquid inlet pipe (15) is arranged in the liquid inlet chamber (13), wherein the liquid inlet pipe (15) comprises a main pipe (151) and a plurality of branch pipes (152) connected to the main pipe (151), and a plurality of liquid inlet holes are provided below the branch pipes (152).

10. The electroplating device according to claim 9, characterized in that: A partition (14) is provided between the electroplating chamber (11) and the overflow chamber (12) and the liquid inlet chamber (13), and a plurality of connection holes arranged in an array are provided on the partition (14) so ​​as to enable communication between the liquid inlet chamber (13) and the electroplating chamber (11).

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